Page 1
HD74AC259
8-bit Addressable Latch
Description
The HD74AC259 is a high-speed 8-bit addressable latch designed for general purpose storage applications
in digital systems. It is a multifunctional device capable or storing single line data in eight addressable
latches, and also a 1-of-8 decoder and demultiplexer with active HIGH outputs. The device also
incorporates an active LOW Common Clear for resetting all latches, as well as an active LOW Enable.
Features
• Serial-to-Parallel Conversion
• Eight Bits of Storage with Output of Each Bit Available
• Random (Addressable) Data Entry
• Active High Demultiplexing or Decoding Capability
• Easily Expandable
• Common Clear
• Outputs Source/Sink 24 mA
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HD74AC259
Pin Arrangement
Logic Symbol
A
A1
A2
Q0
Q1
Q2
Q3
GND
A0
1
0
2
3
4
5
6
7
8
(Top view)
ED
16
15
14
13
12
11
10
CC
V
MR
E
D
7
Q
Q6
Q5
9
Q4
A1
A2
Pin Names
A0 – A2Address Inputs
D Data Inputs
E Enable Input (Active LOW)
MR Master Reset (Active LOW)
Q0 – Q7Latch Outputs
2
MR Q0 Q1 Q2
Q
3Q4Q5Q6Q7
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Logic Diagram
HD74AC259
Q7
Q6
Q5
MR
Q4
A
2
A1
A0
D
E
Q3
Q2
Q1
Q0
3
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HD74AC259
Function Table
Inputs Outputs
Operating Mode MR E DA
Master reset L H X XXXLLLLLLLL
Demultiplex L L d LLLQ = dLLLLLLL
(Active HIGH L L d H L L L Q = d LLLLLL
Decoder when L L d L H L L L Q = d LLLLL
D = H) LLdHHLLLLQ = dLLLL
LLdLLHLLLLQ = dLLL
LLdHLHLLLLLQ = dLL
LLdLHHLLLLLLQ = dL
LLdHHHLLLLLLLQ = d
Store (Do nothing) H H X XXXq0q1q2q3q4q5q6q
Addressable latch H L d LLLQ = dq1q2q3q4q5q6q
HLdHLLq0Q = d q
HLd LHLq0q1Q = d q
HLd HHLq0q1q2Q = d q
HLdLLHq0q1q2q3Q = d q
HLd HLHq0q1q2q3q4Q = d q
HLd LHHq0q1q2q3q4q5Q = d q
HLd HHHq0q1q2q3q4q5q6Q = d
H : High Voltage Level
L : Low Voltage Level
X : Immaterial
d : High or Low data one setup time prior to the Low-to-High Enable transition.
q : Lower case letters indicate the state of the referenced output established during the last cycle in
which it was addressed or cleared.
A1A2Q0Q1Q2Q3Q4Q5Q6Q
0
q
q
q
2
3
4
q
3
4
4
q
5
6
q
q
5
6
q
q
5
6
q
5
6
6
7
7
7
q
7
q
7
q
7
q
7
q
7
7
DC Characteristics (unless otherwise specified)
Item Symbol Max Unit Condition
Maximum quiescent supply current I
Maximum quiescent supply current I
4
CC
CC
80 µAV
8.0 µAV
= VCC or ground, VCC = 5.5 V,
IN
Ta = Worst case
= VCC or ground, VCC = 5.5 V,
IN
Ta = 25°C
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AC Characteristics: HD74AC259
HD74AC259
Item Symbol V
Maximum clock f
max
Ta = +25°C
C
= 50 pF
L
(V)*1Min Typ Max Min Max Unit
CC
3.3 65 — — 60 — MHz
Ta = –40°C to +85°C
CL = 50 pF
frequency 5.0 110 — — 95 —
Propagation delay t
MR to Q
n
Propagation delay t
Dn to Q
n
Propagation delay t
Dn to Q
n
Propagaion delay t
An to Q
n
Propagation delay t
An to Q
n
Propagation delay t
PHL
PLH
PHL
PLH
PHL
PLH
3.3 1.0 8.5 14.5 1.0 16.5 ns
5.0 1.0 6.5 9.0 1.0 10.5
3.3 1.0 7.0 10.5 1.0 12.0 ns
5.0 1.0 5.5 7.5 1.0 8.5
3.3 1.0 7.0 10.5 1.0 12.0 ns
5.0 1.0 5.5 7.5 1.0 8.5
3.3 1.0 11.5 18.5 1.0 21.5 ns
5.0 1.0 8.0 11.5 1.0 14.0
3.3 1.0 11.5 18.5 1.0 21.0 ns
5.0 1.0 8.0 11.5 1.0 13.5
3.3 1.0 9.0 15.0 1.0 17.0 ns
E to Q 5.0 1.0 6.5 9.0 1.0 10.5
Propagation delay t
E to Q
n
PHL
3.3 1.0 9.0 14.0 1.0 16.0 ns
5.0 1.0 6.5 8.5 1.0 10.0
Note: 1. Voltage Range 3.3 is 3.3 V ± 0.3 V
Voltage Range 5.0 is 5.0 V ± 0.5 V
5
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HD74AC259
AC Operating Requirements: HD74AC259
Ta = –40°C
Ta = +25°C
C
= 50 pF
L
Item Symbol V
Setup time, HIGH or LOW t
su
(V)*1Typ Guaranteed Minimum Unit
CC
3.3 1.0 3.5 3.5 ns
D to E 5.0 0.0 3.0 3.0
Hold time, HIGH or LOW t
h
3.3 0.5 2.0 2.0 ns
D to E 5.0 0.5 2.0 2.0
Setup time, HIGH or LOW t
su
3.3 1.0 6.0 7.0 ns
An to E 5.0 0.0 4.5 5.0
Hold time, HIGH or LOW t
h
3.3 –3.0 0.0 0.0 ns
An to E 5.0 –1.0 0.0 0.0
Pulse width t
w
3.3 3.0 5.5 7.0 ns
5.0 3.0 4.5 5.0
Note: 1. Voltage Range 3.3 is 3.3 V ± 0.3 V
Voltage Range 5.0 is 5.0 V ± 0.5 V
to +85°C
CL = 50 pF
Capacitance
Item Symbol Typ Unit Condition
Input capacitance C
Power dissipation capacitance C
IN
PD
4.5 pF VCC = 5.5 V
3.5 pF VCC = 5.0 V
6
Page 7
19.20
20.00 Max
16 9
1.3
Unit: mm
6.30
7.40 Max
81
1.11 Max
2.54 ± 0.25
0.48 ± 0.10
5.06 Max
2.54 Min
0.51 Min
Hitachi Code
JEDEC
EIAJ
Weight
7.62
+ 0.13
0.25
– 0.05
0° – 15°
(reference value)
DP-16
Conforms
Conforms
1.07 g
Page 8
16
Unit: mm
10.06
10.5 Max
9
5.5
1
0.80 Max
1.27
*0.42 ± 0.08
0.40 ± 0.06
*Dimension including the plating thickness
Base material dimension
8
0.12
0.10 ± 0.10
0.15
M
2.20 Max
7.80
0.20 ± 0.04
*0.22 ± 0.05
0.70 ± 0.20
Hitachi Code
JEDEC
EIAJ
(reference value)
Weight
+ 0.20
– 0.30
1.15
0° – 8°
FP-16DA
—
Conforms
0.24 g
Page 9
16
Unit: mm
9.9
10.3 Max
9
1
1.27
0.635 Max
*0.42 ± 0.08
0.40 ± 0.06
*Dimension including the plating thickness
Base material dimension
8
0.25
+ 0.11
– 0.04
0.14
0.15
3.95
1.75 Max
M
6.10
1.08
0.20 ± 0.03
*0.22 ± 0.03
+ 0.67
0.60
– 0.20
Hitachi Code
JEDEC
EIAJ
Weight
+ 0.10
– 0.30
0° – 8°
(reference value)
FP-16DN
Conforms
Conforms
0.15 g
Page 10
16 9
18
+ 0.08
*0.22
– 0.07
0.20 ± 0.06
5.00
5.30 Max
0.65 Max
0.65
0.13
Unit: mm
4.40
1.0
M
6.40 ± 0.20
0.10
1.10 Max
*Dimension including the plating thickness
Base material dimension
0.15 ± 0.04
*0.17 ± 0.05
+0.03
–0.04
0.07
0° – 8°
Hitachi Code
JEDEC
EIAJ
(reference value)
Weight
0.50 ± 0.10
TTP-16DA
—
—
0.05 g
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Cautions
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copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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