RF Transceiver IC for GSM and PCN Dual band cellular systems
ADE-207-265A (Z)
2nd Edition
May 1999
Description
The HD155121F is a RF transceiver IC for GSM and PCN dual band cellular systems, and integrates most
of the low power silicon functions of a transceiver. The HD155121F incorporates two bias circuits for RF
LNAs, two first mixers, a second mixer, a programmable gain amplifier, and an IQ demodulator for the
receiver, and an IQ modulator and offset PLL for the transmitter. Also, on chip are dividers for the phase
splitter. Moreover the HD155121F includes control circuits to implement power saving modes. These
functions can operate down to 2.7 V and are housed in a 48-pin LQFP SMD package.
Hence the HD155121F can form a small size transceiver handset for dual band by adding a dual PLL
frequency synthesizer IC, power amplifiers and some external components.
The HD155121F is fabricated using a 0.6 µm double-polysilicon Bi-CMOS process.
• High dynamic range Programmable Gain Amplifier (PGA)
2
Page 3
Pin Arrangement
MIX1INB1
1
MIX1IN2
MIX1INB2
POONTX
POONRX2
POONRX1
MIX1OUTB
MIX1OUT
VCCMIX1
GNDMIX1
RFLOIN
VCCDIV
GNDDIV
373839404142434445464748
36
HD155121F
IFLO
MIX1IN1
RFOUT
RFIN1
RFIN2
VCCPLL
GNDPLL
VCOIN2
VCOIN1
VCCCOMP
PLLOUT
ICURAD
2
3
4
5
6
7
8
9
10
11
12
141324232221201918171615
QINB
QIN
IINB
IIN
VCCIQ
MODLB
(Top View)
GNDIQ
QOUTB
QOUT
IOUTB
IOUT
35
34
33
32
31
30
29
28
27
26
25
MIX2OB
BAND
IFVCOO
IFVCOI
VCCIF
GNDIF
IFIN
IFINB
LE
SDATA
CLK
MIX2O
3
Page 4
HD155121F
Pin Description
Pin No.Pin NameDescription
1MIX1INB1Negative input for Mixer1 (GSM)
2MIX1IN1Positive input for Mixer1 (GSM)
3RFOUTBias for the collector of LNA transistor
4RFIN1Bias for the base of LNA transistor (GSM)
5RFIN2Bias for the base of LNA transistor (PCN)
6VCCPLLVCC for OPLL
7GNDPLLGND for OPLL
8VCOIN2TxVCO signal input (PCN)
9VCOIN1TxVCO signal input (GSM)
10VCCCOMPVCC for phase comparator
11PLLOUTCurrent output to control and modulate the TxVCO
12ICURADPhase comparator output current setting
13QINBNegative input of Q signal for modulator
14QINPositive input of Q signal for modulator
15IINBNegative input of I signal for modulator
16IINPositive input of I signal for modulator
17MODLBVCC for modulator load bias
18VCCIQVCC for IQ modulator and demodulator
19GNDIQGND for IQ modulator and demodulator
20QOUTBNegative output of Q signal for modulator
21QOUTPositive output of Q signal for modulator
22IOUTBNegative output of I signal for modulator
23IOUTPositive output of I signal for modulator
24MIX2OBNegative output for Mixer2
25MIX2OPositive output for Mixer2
26CLKClock for serial data
27SDATASerial data for Gain control
28LELoad enable for serial data
29IFINBNegative input for Mixer2
30IFINPositive input for Mixer2
31GNDIFGND for Mixer2 and PGA
32VCCIFVCC for Mixer2 and PGA
33IFVCOIBase of IFVCO transistor
34IFVCOOEmitter of IFVCO transistor
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Page 5
Pin Description (cont)
Pin No.Pin NameDescription
35BANDBand control (Low: GSM, High: PCN)
36IFLOOutput of IFVCO or Input of IF Local
37GNDDIVGND for Divider and IFVCO
38VCCDIVVCC for Divider and IFVCO
39RFLOINInput for RF Local
40GNDMIX1GND for Mixer1
41VCCMIX1VCC for Mixer1
42MIX1OUTPositive output for Mixer1 (GSM/PCN)
43MIX1OUTBNegative output for Mixer1 (GSM/PCN)
44POONRX1Power save control for LNA and Mixer1
45POONRX2Power save control for Mixer2, PGA and demodulator
46POONTXPower save control for modulator and OPLL
47MIX1INB2Negative input for Mixer1 (PCN)
48MIX1IN2Positive input for Mixer1 (PCN)
HD155121F
5
Page 6
HD155121F
Block Diagram
Tune
GNDDIV
VCCDIV
1172MHz
(Rx: 1580MHz, Tx: 1575MHz)
from VCO
GNDMIX1
VCCMIX1
MIX1OUT
MIX1OUTB
POONRX1
POONRX2
RFLOIN
225MHz
(225MHz)
from
System controller
IFLO
BAND
IFVCOO
36
35
540
MHz
Vref
(IFVCO)
Vref
(Div.Rx)
(Div.Tx)
Vref
34
from
(Mix1)
IFVCOI
33
1/2 1/6
Band
SW
VCCIF
GNDIF
32
1/2
(1580/1575MHz) 1172MHz
GSM: 270MHz
225MHz
(225MHz)
IFIN
IFINB
31
30
1/2
(90deg)
(90deg)
45MHz
270MHz
(135MHz)
PCN: 135MHz
from System controller
LE
SDATA
CLK
29
28
27
26
Serial
interface
Vref
(PGA)
(IF)
Vref
(45MHz)
Vref
(Mod)
45MHz
(45MHz)
Vref
MIX2O
25
(Demod)
MIX2OB
23
IOUT
IOUTB
QOUT
QOUTB
GNDIQ
VCCIQ
MODB
IIN
45MHz
to Base bandfrom Base band
driver
ICURAD
IINB
QIN
1314151617181920212224
12
RICURAD
from System controller
POONTX
MIX1INB2
MIX1IN2QINB
(1805MHz)
4746454443424140393837
48
947MHz
1
2
MIX1IN1
MIX1INB1
Vref
(LNA)
LNA
Bias
circuit
3
4
RFIN1
RFOUT
947MHz
from Antenna
1172MHz
(1580/
1575MHz)
Vref
5
RFIN2
VCCPLL
(1805MHz)
(PLL)
6
7
VCOIN2
GNDPLL
(1710MHz)
8
270MHz
(135MHz)
9
VCOIN1
902MHz
Tx.VCO1Tx.VCO2
mode
Current
10
11
PLLOUT
VCCCOMP
6
Page 7
Configuration
HD155121F
B.B.
I
Q
Block
I
Q
LC
45 MHz
Mixer2
225 MHz
Mixer1
RF
SAW
LNA
925 to 960 MHz
filter
IF
I & Q
PGA
SAW
bias
RF
Demo.
filter
Mixer1
circuit
filter
270 MHz
RF
SAW
LNA
1805 to
1880 MHz
45 MHz
interface
Serial data
: 1150 to 1185 MHz
GSM
filter
bias
circuit
RF
filter
÷2
Shift
90 deg
HD155121F
÷2
: Rx. 1580 to 1655 MHz
/Tx. 1575 to 1650 MHz
PCN
RF VCO
PLL1
Dual
synth.
90 deg
÷6
PCN: 270 MHz
IFVCO
GSM: 540 MHz
PLL2
HD155017T
S/W
÷2
Shift
GSM: 270 MHz
PCN: 135 MHz
GSM: 540 MHz
GSM: 270 MHz
PCN: 135 MHz
PCN: 540 MHz
LPF
LPF
Mod
I & Q
Phase
Detector
filter
Loop
880 to 915 MHz
880 to 915 MHz
1710 to 1785 MHz
1710 to 1785 MHz
PA Module
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HD155121F
Functional Operation
The HD155121F has been designed from system stand point and incorporated a large number of the circuit
blocks necessary in the design of a digital cellular handset.
Receiver Operation
The HD155121F incorporates two LNA bias circuits for external RF transistors, whose NF and power gain
can be better selected.
This circuit amplifies the RF signal after selection by the antenna filter before the signal enters the first
mixer section. The RF signal is combined with a local oscillator (LO) signal to generate a wanted first IF
signal in the 130 - 300 MHz range. The first mixer circuit uses a double-balanced Gilbert cell architecture,
which has open collector differential outputs. If, at 225 MHz, a 800 Ω LC load is connected to the mixer’s
outputs then a SSB NF of 9.0 dB (GSM), 9.1 dB (PCN) with a gain of 9.5 dB (GSM), 8.5 dB (PCN) is
realizable. The corresponding input compression point is –10.5 dBm (GSM), –12.5 dBm (PCN), which
allows the device to be used within a GSM and EGSM and PCN system.
A filter is used after the first mixer to provide image rejection and the conditioned signal is then passed
through an intermediate amplifier, before being down converted to a second IF in the range of 26 - 60
MHz.
The second mixer can generate a 45 MHz second IF, if a 270 MHz second local signal is used. The second
mixer also uses the Gilbert cell architecture, but with internal resistive differential outputs of 300 Ω. If
amplifier and second mixer has a SSB NF of 6.0 dB, a power gain of 13 dB and a input compression point
of –22 dBm. In order to improve the blocking characteristics of the device an external LC resonator across
the differential outputs of the second mixer is recommended.
First mixer and second mixer can switch the power gain. Switching gain step of first mixer is 12 dB, and
such step of second mixer is 16 dB.
The signal is then passed to the PGA circuit, which has a dynamic range of more than 80 dB (–42 dB - +56
dB typ.) and is controlled by digital serial data, which is generated by the microprocessor. This gain step is
2 dB.
The signal is then down converted by a demodulator to I and Q. Internal divider circuits convert the IFLO
signal to the same frequency as the second IF before passing this local signal through a phase splitter /
shifter in order to generate the in phase and quadrature phase IQ components. The phase accuracy of the
IQ demodulator is less than +/–1 degree and the amplitude mismatch is less than +/–0.5 dB. In order to
accommodate different baseband interfaces the HD155121F IQ differential outputs have a voltage swing of
1.6 Vpp and DC offset of less than +/–60 mV. Within each output stage a second order Butterworth filter
(fc = 210 kHz) is used to improve the blocking performance of the device.
In order to allow flexibility in circuit implementation the HD155121F can configured to use either a singleended or balanced external circuitry and components.
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HD155121F
Transmitter Operation
The transmitter chain converts differential IQ baseband signals to a suitable format for transmission by a
power amplifier.
The common mode voltage range of the modulator inputs is 0.8 V to 1.2 V and they have 2.0 Vpp
differential swing. The modulator circuit uses double-balanced mixers for the I and Q paths. The Local
signals are generated by dividing the IFLO signals by 2, and then passed to the modulator through a phase
splitter / shifter. The IF signals generated are then summed to produce a single modulated IF signal which
is amplified and fed into the offset PLL block. Carrier suppression due to the mixer circuit is better than 31
dBc. If the common mode DC voltage of the I and Q inputs is adjusted, carrier suppression is better than
40 dBc easily. Side band suppression is better than 35 dBc without adjustment.
Within the offset PLL block there are a down converter, a phase comparator and a VCO driver. The down
converter mixes the first local signal and the TXVCO signal to create a reference local signal for use in the
offset PLL circuit. The phase comparator and the VCO driver generate an error current, which is
proportional to the phase differential between the reference IF and the modulated IF signals. This current is
used in a second order loop filter to generate a voltage, which in turn modulates the TXVCO. In order to
optimize the PLL loop gain, the error current value can be modified by changing the value of an external
resistor - ICURAD. In order to accommodate various control range of TXVCOs, the offset PLL circuit has
been designed to operate with a supply voltage up to 5.25 V.
9
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HD155121F
Operation Modes
The HD155121F has necessary control circuitry to implement the necessary states within the dual band
system. Also provided is a power saving mode which reduces the current consumption of the device by
powering down unnecessary function blocks. Three pins are assigned for power saving mode control,
POONRX1, POONRX2 and POONTX. Also one pin is assigned for switching operational band, BAND.
Table 1 shows the relationship between the pins and the required operating mode. These pins are
controlled by the system controller.
As per GSM requirements the Tx and Rx sections do not operate simultaneously. For the receiver there is a
calibration mode in which the LNA bias circuit and first mixer are switched off. During this period the
gain of the PGA can be adjusted. Also the DC offsets of the IQ demodulator are measured and
subsequently canceled.
In order to change between the Rx and Tx modes a state called “warm-up” is used to ensure that the local
signals are not unduly affected. This method of switching between Tx and Rx ensures that lock is achieved
first time.
Power saving is implemented through use of the idle mode. All function blocks of the HD155121F are
switched off until such time as the system controller commands the device to power up again.
IF local bufferONONONONONONOFF
Total current53 mA52 mA34 mA9.0 mA36 mA37 mA1 µA
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HD155121F
Absolute Maximum Ratings
Any stress in excess of the absolute maximum ratings can cause permanent damage to the HD155121F.
ItemSymbolRatingUnit
Power supply voltage (V
Power supply voltage (V
Pin voltageV
Maximum power dissipationP
Operating temperatureTopr–20 to +75°C
Storage temperatureTstg–55 to +125°C
)VCC–0.3 to +4.0V
CC
)V
CCCOMP
CCCOMP
T
T
–0.3 to +5.5V
–0.3 to VCC+0.3 (4.0 Max)V
400mW
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HD155121F
CCCO
Electrical Characteristics
DC Specifications (VCC = 3 V, Ta = 25°C unless otherwise specified.)
ItemModeMinTypMaxUnitTest ConditionNote
Power supply voltage (VCC)2.73.03.6V
Power supply voltage (V
Power supply current (Rx.)GSM—53.074.0mAVCC = 3.0V, V
Power supply current (Tx.)GSM—36.050.0mAVCC = 3.0V, V
Power supply current (Warm-up)—9.012.5mAVCC = 3.0V, V
Power saving mode supply current—1.010.0µAVCC = 3.0V, V
Power up time (Rx.)—1.55.0µsecfrom PS mode1
Power up time (Tx.)—0.20.5µsecfrom PS mode1
Power on control voltage range
(POONRX1, POONRX2, POONTX)
Power off control voltage range
(Single ended)
I/Q output DC offset voltage–60060mVVIOUTDC – VIOUTBDC,
I/Q common-mode input voltage0.81.01.2V1
I/Q input swing (Single ended)0.81.01.2Vp-pVIIN, VIINB, VQIN, VQINB1
Serial data VH (CLK, SDATA, LE)2.3——V
Serial data VL (CLK, SDATA, LE)——0.8V
Band control VH (BAND)2.3——V
Band control VL (BAND)——0.8V
Input current
(POONRX1, POONRX2, POONTX,
BAND, CLK, SDATA, LE)
Note:1. These values are not tested in mass production.
2. Power supply current does not include the LNA bias current.
)2.73.05.25V
CCCOMP
PCN—52.073.0mAMixer1, 2 = Gain1,
PCN—37.052.0mA
2.3——V
——0.8V
0.81.06—Vp-pVIOUT, VIOUTB,
–10010µA
= 3.0V,2
CCCOMP
PGA = bitNo26
= 3.0V2
CCCOMP
= 3.0V2
CCCOMP
= 3.0V
MP
High level = VCC, Low level = 0V
at mode control pin and serial
data pin (POONRX1, RX2, TX,
BAND, CLK (no clock signal),
SDATA, LE)
VQOUT, VQOUTB
VQOUTDC, VQOUTBDC
2
12
Page 13
HD155121F
AC Specifications (VCC = 3 V, Ta = 25°C unless otherwise specified.)
• LNA Bias circuit specifications
ItemModeMinTypMaxUnitTest ConditionNote
LNA transistor bias currentGSM4.75.6—mA
PCN4.75.6—mA
FrequencyGSM925—960MHz1
PCN18051880MHz
Power gainGSM—19.4—dBRF = 940 MHz1
PCN—13.4—dBRF = 1842 MHz
Noise figureGSM—1.6—dBRF = 940 MHz1
PCN—1.6—dBRF = 1842 MHz
3rd order input intercept pointGSM—–6.0—dBm1
PCN—–2.0—dBm
3rd order output intercept pointGSM—13—dBm1
PCN—11—dBm
1dB input compression pointGSM—–14.5—dBm1
PCN—–9.5—dBm
1dB output compression pointGSM—3.9—dBm1
PCN—2.9—dBm
Output (RF) ZGSM—50—ΩOutput (GSM RF)1
PCN—50—ΩOutput (PCN RF)
Input (RF) ZGSM—50—ΩInput (GSM RF)1
PCN—50—ΩInput (PCN RF)
Note:1. These AC characteristics are shown for reference only and do not form part of the HD155121F
component specification.
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HD155121F
• Mixer1 specifications (Differential output load between pin42 and pin43 = 800 Ω)
ItemModeMinTypMaxUnitTest ConditionNote
Frequency (RF)GSM925—960MHz1
PCN1805—1880MHz
Frequency (LO)GSM1125—1260MHz1
PCN1505—1680MHz
Frequency (IF)—200225300MHz1
RFLO input level—–8.0——dBm
Conversion gain 1GSM6.59.512.5dBRF = 940MHz, LO = 1165MHz, IF = 225MHz2
PCN5.58.511.5dBRF = 1842MHz, LO = 1617MHz, IF = 225MHz
Conversion gain 2GSM–5.5–2.50.5dBRF = 940MHz, LO = 1165MHz, IF = 225MHz2
PCN–6.5–3.5–0.5dBRF = 1842MHz, LO = 1617MHz, IF = 225MHz
Noise figure 1GSM—9.010.5dBRF = 940MHz, LO = 1165MHz, IF = 225MHz1, 2
PCN—9.110.6dBRF = 1842MHz, LO = 1617MHz, IF = 225MHz
Noise figure 2GSM—15.016.5dBRF = 940MHz, LO = 1165MHz, IF = 225MHz1, 2
PCN—16.017.5dBRF = 1842MHz, LO = 1617MHz, IF = 225MHz
3rd order input
intercept point 1
3rd order input
intercept point 2
3rd order output
intercept point 1
3rd order output
intercept point 2
1dB inputGSM–12.5–10.5—dBmRF = 940MHz, LO = 1165MHz, IF = 225MHz2
compression point 1PCN–14.5–12.5—dBmRF = 1842MHz, LO = 1617MHz, IF = 225MHz
1dB inputGSM–8.5–6.5—dBmRF = 940MHz, LO = 1165MHz, IF = 225MHz2
compression point 2PCN–10.5–8.5—dBmRF = 1842MHz, LO = 1617MHz, IF = 225MHz
1dB outputGSM–4.0–2.0—dBmRF = 940MHz, LO = 1165MHz, IF = 225MHz1, 2
compression point 1PCN–7.0–5.0—dBmRF = 1842MHz, LO = 1617MHz, IF = 225MHz
1dB outputGSM–12.0–10.0—dBmRF = 940MHz, LO = 1165MHz, IF = 225MHz1, 2
compression point 2PCN–15.0–13.0—dBmRF = 1842MHz, LO = 1617MHz, IF = 225MHz
Note:1. These values are not tested in mass production.
2. The loss (2.2 dB) of test circuit at Mixer1 output is calculated.
GSM–3.0–1.0—dBmRF1 = 940.8MHz, RF2 = 941.6MHz,
LO = 1165MHz, IF = 225MHz
PCN–6.0–4.0—dBmRF1 = 1842.8MHz, RF2 = 1843.6MHz,
LO = 1617MHz, IF = 225MHz
GSM1.03.0—dBmRF1 = 940.8MHz, RF2 = 941.6MHz,
LO = 1165MHz, IF = 225MHz
PCN–3.0–1.0—dBmRF1 = 1842.8MHz, RF2 = 1843.6MHz,
LO = 1617MHz, IF = 225MHz
GSM6.58.5—dBmRF1 = 940.8MHz, RF2 = 941.6MHz,
LO = 1165MHz, IF = 225MHz
PCN2.54.5—dBmRF1 = 1842.8MHz, RF2 = 1843.6MHz,
LO = 1617MHz, IF = 225MHz
GSM–1.50.5—dBmRF1 = 940.8MHz, RF2 = 941.6MHz,
LO = 1165MHz, IF = 225MHz
PCN–6.5–4.5—dBmRF1 = 1842.8MHz, RF2 = 1843.6MHz,
LO = 1617MHz, IF = 225MHz
1, 2
1, 2
1, 2
1, 2
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HD155121F
• Mixer2 specifications
ItemModeMinTypMaxUnitTest ConditionNote
Frequency (IF1)200225300MHz1
Frequency (LO2)240270360MHzLO2 = IFLO/21
Frequency (IF2)404560MHz1
IFLO input level–10——dBm
Conversion gain 110.513.015.5dBIF1 = 225MHz, IFLO = 540MHz, IF2 = 45MHz2
Conversion gain 2–5.5–3.0–0.5dBIF1 = 225MHz, IFLO = 540MHz, IF2 = 45MHz2
Noise figure 1—6.07.5dBIF1 = 225MHz, IFLO = 540MHz, IF2 = 45MHz1, 2
Noise figure 2—12.013.5dBIF1 = 225MHz, IFLO = 540MHz, IF2 = 45MHz1, 2
3rd order input
intercept point 1
3rd order input
intercept point 2
3rd order output
intercept point 1
3rd order output
intercept point 2
1dB input
compression point 1
1dB input
compression point 2
1dB output
compression point 1
1dB output
compression point 2
Isolation50——dBbetween Mixer1 output and Mixer2 input1, 2
Note:1. These values are not tested in mass production.
2. The loss (3.6 dB) of test circuit at Mixer2 output is calculated.
• IQ Modulator and Offset PLL specifications (IFLO is supplied by signal generator equipment) (cont)
ItemModeMinTypMaxUnitTest ConditionNote
Tx noise
in Rx band
Lock up timeGSM—3580µsec1
Note:1. These values are not tested in mass production.
• IFVCO specifications
ItemModeMinTypMaxUnitTest Condition
Bias current0.92.02.5mA
GSM—–155.1—dBc/Hz925MHz to 935MHz
- 10MHz up from Txband
GSM—–164.1—dBc/Hz935MHz to 960MHz
- 20MHz up from Txband
PCN—–156—dBc/Hz1805MHz - 20MHz up from Txband
PCN—–162—dBc/Hz1850MHz - 65MHz up from Txband
PCN—6580µsec
1
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Page 19
HD155121F
Rx Gain Control Stage
The PGA amplifier of the HD155121F is the main Rx gain control stage. However, Mixer1 and Mixer2
gain level can switched as an optional function in order to optimize system performance.
Mixer1
LNA
LNA
bias
circuit
bias
circuit
Mixer1
Bit allocation
Mixer2
X6 X5 X4 X3 X2 X1 X0
X7
Serial data
X7 : for Mixer1 gain
X6 : for Mixer2 gain
X5 :
X4 :
X3 :
for PGA gain
X2 :
X1 :
X0 :
PGA
Decoder
I&Q
Demo.
Figure 1
Table 2First Mixer Gain Control Table (as optional function)
ItemBandGain (typ)X7
Gain 1 (normal gain)GSM9.5 dB0
PCN8.5 dB0
Gain 2 (low gain)GSM–2.5 dB1
PCN–3.5 dB1
I
Q
CLK (26)
SDATA (27)
LE (28)
Table 3Second Mixer Gain Control Table (as optional function)
ItemGain (Typ)X6
Gain 1 (normal gain)13.0 dB0
Gain 2 (low gain)–3.0 dB1
The HD155121F generates a modulated signal at IF with a quadrature modulator and converts it to a final
frequency with an Offset Phase Locked Loop (OPLL).
The Offset Phase Locked Loop is simply a PLL with a down conversion mixer in the feedback path.
Using a down converter in the feed back path acts as an up converter in the forward path, which allows the
output frequency to be different from the comparison frequency without affecting the normal operation of
the loop. Phase / frequency changes in the reference signal are not scaled, as they would be if a divider
were used in the feed back path, and hence the modulation is faithfully reproduced at the final frequency.
The main advantage of the OPLL in this application is that it forms a tracking band pass filter around the
modulated signal. This is because the loop cannot respond to phase variations at the reference that are
outside its closed loop bandwidth. Thus the broad band phase noise from the quadrature modulator is
shaped by the frequency response of the closed loop allowing the TX noise specifications to be met without
further filtering.
A secondary advantage of the OPLL is that the output signal, coming from a VCO, is truly constant
envelope. This removes the problem of spectral spreading caused by AM to AM and AM to PM
conversion in the power amplifier.
The OPLL is formed from an on-chip Gilbert cell down converter, limitters and phase detector with an offchip passive loop filter and VCO. The phase detector is implemented as a Gilbert cell with a current source
output stage, which allows an integrator to be included in the passive loop filter. This is similar to the
technique commonly used in PLL synthesizers.
As is well known, when out of lock, a mixer type phase detector does not provide any frequency
discrimination. This means that the under normal circumstances, a loop of this type is not guaranteed to
lock. However in the HD155121F, a well defined offset current is added to the phase detector output, so
that when the loop is out of lock, this offset current linearly charges the capacitors in the loop filter. This
has the effect of sweeping the VCO across the band. When the down converted signal from the VCO
approaches the reference frequency, the Gilbert cell begins to operate as a phase detector and the loop
acquires in the normal way. The presence of the offset current in lock is unimportant, as it only results in a
static phase offset between the final signal and the reference signal.
At the end of the transmit burst, when the transmitter is disabled, a switch closes to discharge the loop filter
capacitors. This resets the acquisition process in preparation for the start of the next burst.
The closed loop bandwidth of the OPLL should be designed to be around 1.2 to 1.5 MHz, which should be
large enough to allow rapid locking and accurate tracking of the modulation. If the bandwidth is too large,
the OPLL will not reject the noise from the modulator sufficiently. The ideal bandwidth will be a
compromise dependant on the noise performance of the VCO and amplifier chain.
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HD155121F
Phase detectorVCO
C1
R3
C2
C3
R2
Figure A-1 Loop Filter Circuit of OPLL
The following equations provide a good starting point for the design of the OPLL.
Note that many VCO modules have up to 100 pF capacitance on the control line. This can be very
significant when designing high bandwidth loops.
The phase detector peak output current is centered around 1.2 mA which is set by an 22 kΩ resistor
RICURAD on pin 12.
For example, the f
= 1.2 MHz loop filter using the VCO of kv = 30 MHz / V (GSM) should be designed in
0
the following method.
Let:
09
.
5
6
(/sec)
6
6
5
(/sec)
Ω))
−
3
53
fMHzHz
1212 10
==×
.() .( )
0
ffkHzHz
n
ωπ π
kMHz VHz V
kkrad V
kmA at RICURADk
kmA radA radat RICURADk
26006 10
===×
/()()
0
frad
22610
=⋅=⋅×
nn
3030 10
==×
(/)(/)
v
2230 10
=⋅=××
ππ
vrv
1222
==
.( )(
d
==×=
1717 1022
ππξΩ
./ (/ ) .)/ ( / )()
dr
=≅
Damping Factor
Page 54
HD155121F
Then:
.
.
52
.
−
72 1072
=× =
−
−
9
..
66
=
Ω
23010 1710
×× ××
CkknF
2
=⋅=
vrdrn
RC
222
=⋅⋅ =
()/()
ξω
CCpF
12 157 2 1015480
==× =
/(.)/
RC
3
⋅
33110
≅⋅=
/
ω
n
/()ω
2
26 107 2 10
−
9
n
2610
π
63
2610
××
()
π
209
×
59
×× × ×
π
1
××
6
When the VCO modules have 33 pF capacitance on the control line, C3 is 33 pF.
CpF
333
=
R
3804
=Ω
The result of the calculations for the PLL loop characteristic,based on the following block diagram (figure
A-2), is showed in figure A-3 and figure A-4. The offset PLL will be stable if the component values shown
are used.
VCO module
k
C3
33p
/S
vr
VCO
Unit: R : Ω
C : F
k
+
dr
Phase
detector
Input phaseOutput phase
−
R3
804
C2
7.2n
C1
480p
R2
66
54
= 2π⋅ kv = 2π× 30 × 106 (rad / Vsec)
k
vr
= (1.7 × 10−3) / π (A / rad)
k
dr
Figure A-2 Block Diagram for OPLL Simulation
VCO module example
GSM: MURATA MQE9P7-897
C3 = 33pF
k
= 30MHz/V
PCN: MURATA MQE9P7-1747
v
C3 = 22pF
k
= 47MHz/V
v
Page 55
The open loop transfer function, Hol(S), of OPLL as shown in figure A-2 is given below.
HD155121F
Hol S
()
=
1332
CCR S SS
CC C
=
ω
p
12323
CC C RR
⋅⋅⋅⋅
ω
22
CR
{}
p
ς
=
ω
ωωςς
ωωςς
1
=
z
⋅
CR
22
=−−
pp
pp
()
1
=+−
()
2
kk S
⋅⋅⋅⋅ +⋅+
123
++
(
⋅
CCC CRCC
13 3312
++⋅ +
()
CC C
21 2 3
2
1
2
()
⋅⋅+
vrdrz
22
ω
()
ωω
pp
)()
++
1
Let:
CpF
1 480
=
CnF
272
=
.
CpF VCOinput capcice on the control line
333
=
R
266
=
R
3804
=
(tan)
Ω
Ω
Then:
ωπ
=×=×
35 70 1025 68
..()
p
ς
=
1 036
.
ωπ
=×=×
2 104 102335
.()
z
ωπ
=×=×
27 32 1024 348
p
1
ωπ
=×=×
46 65 1027 425
2
p
krad V
π
=××
23010
vr
kA rad
=×
17 10
(.)/( / )
dr
6
6
..()
6
3
−
6
6
(/ sec)
π
..()
MHz
kHz
MHz
MHz
=
22
CCR S SS
kk S
133
⋅⋅⋅⋅++
()
⋅⋅+
vrdrz
ω
()()
ωω
pp
12
The magnitude, | Hol(jω) |, and the phase, Φ(jω), of Hol(S) are as shown in the following equations. When
the above constants from ωp to kdr are substituted in the equations, then | Hol(jω) | and Φ(jω) in figure A-3
can be obtained.
2
kk
⋅⋅ +
Hol j
()
ω
=
133
CCR
⋅⋅⋅⋅ + ⋅ +
−− −
j
( )tan ( /) tan ( /) tan ( /)(deg)
ωωω ωω ωω
1111
=− − −
vrdrp
22
ωωω ωω
zp p
2
ωω
1
2
pp
1
2
2
2
2
180Φ
55
Page 56
HD155121F
100
| Hol (jω) |
−50
−100
designed for 1.2MHz bandwidth loop filterdesigned for 1.2MHz bandwidth loop filter
50
0
GSM
PCN
−80
−130
−180
GSM, PCN
Φ (jω)
−230
10
4
10
5
10
6
10
7
10
8
Frequency (Hz)
−280
10
4
10
5
10
6
Frequency (Hz)
10
7
10
8
Figure A-3 The Magnitude, | Hol(jω) |, and the Phase, Φ(jω),
of Open Loop Transfer Function Hol(jω)
Moreover, the closed loop transfer function, Hcl(jw) is the following equation, and the magnitude
characteristic, Hcl(jω), of he closed loop is shown is figure A-4.
Hol j
()
Hcl j
()
ω
=
+1
Hol j
ω
()
ω
designed for 1.2MHz bandwidth loop filter
20
GSM
0
−20
PCN
−40
| Hcl (jω) |
−60
−80
−100
10
4
10
5
10
6
10
7
10
8
Frequency (Hz)
Figure A-4 The Magnitude, | Hcl(jω) | of Closed Loop Transfer Function Hcl(jω)
56
Page 57
HD155121F
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
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For further information write to:
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(America) Inc.
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Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
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Electronic components Group
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Germany
Tel: <49> (89) 9 9180-0
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Lower Cookham Road
Maidenhead
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 778322
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7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
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Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Telex: 40815 HITEC HX
57
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