Datasheet HCNW3120-300 Specification

Page 1
HCPL-3120/J312, HCNW3120
Lead (Pb) Free
RoHS 6 fully compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
1
3
SHIELD
2
4
8
6
7
5
N/C
CATHODE
ANODE
N/C
V
CC
V
O
V
O
V
EE
1
3
SHIELD
2
4
8
6
7
5
N/C
CATHODE
ANODE
N/C
V
CC
N/C
V
O
V
EE
HCNW3120
HCPL-3120/J312
2.5 Amp Output Current IGBT Gate Drive Optocoupler
Data Sheet
Description
The HCPL-3120 contains a GaAsP LED while the         HCPL­J312 and the HCNW3120 contain an AlGaAs LED. The LED  is optically coupled to an integrated circuit with a power  output stage. These  optocouplers are  ideally  suited for  driving power IGBTs and MOSFETs used in motor control  inverter applications. The high operating voltage range  of the output stage provides the drive voltages required  by  gate  controlled  devices.  The  voltage  and  current  supplied  by  these  optocouplers  make  them  ideally  suited for directly driving IGBTs with ratings up to 1200  V/100  A. For  IGBTs  with higher  ratings, the  HCPL-3120  series can be used to drive a discrete power stage which  drives the IGBT gate. The HCNW3120 has the highest in­sulation voltage of V
= 1414 Vpeak in the IEC/EN/DIN 
IORM 
EN 60747-5-2. The HCPL-J312 has an insulation  voltage  of  V
IORM 
= 891 V
  and  the  V
peak
IORM 
= 630 V
peak
  is  also 
available with the HCPL-3120 (Option 060).
Functional Diagram
TRUTH TABLE
VCC - VEE
“POSITIVE GOING”
LED
(i.e., TURN-ON)
OFF  0 - 30 V  0 - 30 V  LOW 
ON  0 - 11 V  0 - 9.5 V  LOW 
ON  11 - 13.5 V  9.5 - 12 V  TRANSITION 
ON  13.5 - 30 V  12 - 30 V  HIGH 
VCC - VEE
“NEGATIVE GOING”
(i.e., TURN-OFF) VO
Features
•   2.5 A maximum peak output current
•   2.0 A minimum peak output current
•   25 kV/µs minimum Common Mode Rejection (CMR) at 
VCM = 1500 V
•   0.5  V  maximum  low  level  output  voltage  (VOL)  Eliminates need for negative gate drive
•   ICC = 5 mA maximum supply current
•   Under  Voltage  Lock-Out  protection  (UVLO)  with 
hysteresis
•   Wide operating VCC range: 15 to 30 Volts
•   500 ns maximum switching speeds
•   Industrial temperature range: -40°C to 100°C
•   SafetyApproval:
  UL Recognized
  3750 Vrms for 1 min. for HCPL-3120/J312 
  5000 Vrms for 1 min. for HCNW3120 
  CSA Approval 
  IEC/EN/DIN EN 60747-5-2 Approved
  V
  V
  V
IORM
IORM
IORM
 = 630 V
 = 891 V
 = 1414 V
 for HCPL-3120 (Option 060) 
peak
 for HCPL-J312 
peak
 for HCNW3120
peak
Applications
•  IGBT/MOSFET gate drive
•  AC/Brushless DC motor drives
•  Industrial inverters
•  Switch mode power supplies
A 0.1 µF bypass capacitor must be connected between pins 5 and 8.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
Page 2
Selection Guide
 Part Number HCPL-3120 HCPL-J312 HCNW3120 HCPL-3150*
 Output Peak Current ( I
 IEC/EN/DIN EN    V  60747-5-2 Approval  (Option 060)      (Option 060)
*The HCPL-3150 Data sheet available. Contact Avago sales representative or authorized distributor.
)  2.5 A  2.5 A  2.5 A  0.6 A
O
IORM 
= 630 V
peak
  V
IORM 
= 891 V
peak
  V
IORM 
= 1414 V
peak
  V
IORM 
= 630 V
peak
Ordering Information
HCPL-3120 and HCPL-J312 are UL recognized with 3750 Vrms for 1 minute per UL1577. HCNW3120 is UL Recognized  with 5000 Vrms for 1 minute per UL1577.
Option
Part RoHS Non RoHS Surface Gull Tape IEC/EN/DIN Number Compliant Compliant Package Mount Wing & Reel EN 60747-5-2 Quantity
   -000E  No option            50 per tube 
  -300E  #300     X  X      50 per tube 
HCPL-3120  -500E  #500    X  X  X    1000 per reel
  -060E  #060          X  50 per tube 
  -360E  #360    X  X    X  50 per tube 
  -560E  #560    X  X  X  X  1000 per tube
  -000E  No option          X  50 per tube 
HCPL-J312  -300E  #300     X  X    X  50 per tube 
  -500E  #500    X  X  X  X  1000 per reel
  -000E  No option          X  42 per tube 
HCNW3120  -300E  #300     X  X    X  42 per tube 
  -500E  #500    X  X  X  X  750 per reel
300mil DIP-8
300mil DIP-8
400mil DIP-8
To order, choose a part number from the part number column and combine with the desired option from the option  column to form an order entry. 
Example 1: 
  HCPL-3120-560E to order product of 300 mil DIP Gull Wing Surface Mount package in Tape and Reel packaging with 
IEC/EN/DIN EN 60747-5-2 Safety Approval in RoHS compliant.
Example 2: 
    HCPL-3120 to order product of 300 mil DIP package in tube packaging and non RoHS compliant.
Option datasheets are available. Contact your Avago sales representative or authorized distributor for information.
Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since 15th July 2001 and  RoHS compliant option will use ‘-XXXE’.
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Package Outline Drawings
1.080 ± 0.320
(0.043 ± 0.013)
2.54 ± 0.25
(0.100 ± 0.010)
0.51 (0.020) MIN.
0.65 (0.025) MAX.
4.70 (0.185) MAX.
2.92 (0.115) MIN.
5° TYP.
0.254
+ 0.076
- 0.051
(0.010
+ 0.003)
- 0.002)
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
9.65 ± 0.25
(0.380 ± 0.010)
1.78 (0.070) MAX.
1.19 (0.047) MAX.
A XXXXZ
YYWW
DATE CODE
DIMENSIONS IN MILLIMETERS AND (INCHES).
5678
4321
OPTION CODE*
TYPE NUMBER
* MARKING CODE LETTER FOR OPTION NUMBERS. "V" = OPTION 060 OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
3.56 ± 0.13
(0.140 ± 0.005)
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
9.65 ± 0.25
(0.380 ± 0.010)
0.635 ± 0.130
(0.025 ± 0.005)
7.62 ± 0.25
(0.300 ± 0.010)
5
6
7
8
4
3
2
1
9.65 ± 0.25
(0.380 ± 0.010)
6.350 ± 0.25
(0.250 ± 0.010)
1.016 (0.040)
1.27 (0.050)
10.9 (0.430)
2.0 (0.080)
LAND PATTERN RECOMMENDATION
1.080 ± 0.320
(0.043 ± 0.013)
3.56 ± 0.13
(0.140 ± 0.005)
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
2.54
(0.100)
BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
0.254
+ 0.076
- 0.051
(0.010
+ 0.003)
- 0.002)
HCPL-3120 Outline Drawing (Standard DIP Package)
HCPL-3120 Gull Wing Surface Mount Option 300 Outline Drawing
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Page 4
1.080 ± 0.320
(0.043 ± 0.013)
2.54 ± 0.25
(0.100 ± 0.010)
0.51 (0.020) MIN.
0.65 (0.025) MAX.
4.70 (0.185) MAX.
2.92 (0.115) MIN.
5° TYP.
0.254
+ 0.076
- 0.051
(0.010
+ 0.003)
- 0.002)
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
9.80 ± 0.25
(0.386 ± 0.010)
1.78 (0.070) MAX.
1.19 (0.047) MAX.
A XXXX
YYWW
DATE CODE
DIMENSIONS IN MILLIMETERS AND (INCHES).
5678
4321
TYPE NUMBER
OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
3.56 ± 0.13
(0.140 ± 0.005)
0.635 ± 0.25
(0.025 ± 0.010)
12°NOM.
9.65 ± 0.25
(0.380 ± 0.010)
0.635 ± 0.130
(0.025 ± 0.005)
7.62 ± 0.25
(0.300 ± 0.010)
5
6
7
8
4
3
2
1
9.80 ± 0.25
(0.386 ± 0.010)
6.350 ± 0.25
(0.250 ± 0.010)
1.016 (0.040)
1.27 (0.050)
10.9 (0.430)
2.0 (0.080)
LAND PATTERN RECOMMENDATION
1.080 ± 0.320
(0.043 ± 0.013)
3.56 ± 0.13
(0.140 ± 0.005)
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
2.54
(0.100)
BSC DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.5 mm (20 mils) MAX.
0.254
+ 0.076
- 0.051
(0.010
+ 0.003)
- 0.002)
Package Outline Drawings
HCPL-J312 Outline Drawing (Standard DIP Package)
HCPL-J312 Gull Wing Surface Mount Option 300 Outline Drawing
4
Page 5
HCNW3120 Outline Drawing (8-Pin Wide Body Package)
5
6
7
8
4
3
2
1
11.15 ± 0.15
(0.442 ± 0.006)
1.78 ± 0.15
(0.070 ± 0.006)
5.10
(0.201)
MAX.
1.55
(0.061)
MAX.
2.54 (0.100) TYP.
DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
7° TYP.
0.254
+ 0.076
- 0.0051
(0.010
+ 0.003)
- 0.002)
11.00
(0.433)
9.00 ± 0.15
(0.354 ± 0.006)
MAX.
10.16 (0.400) TYP.
A
HCNWXXXX
YYWW
DATE CODE
TYPE NUMBER
0.51 (0.021) MIN.
0.40 (0.016)
0.56 (0.022)
3.10 (0.122)
3.90 (0.154)
1.00 ± 0.15
(0.039 ± 0.006)
7° NOM.
12.30 ± 0.30
(0.484 ± 0.012)
0.75 ± 0.25
(0.030 ± 0.010)
11.00
(0.433)
5
6
7
8
4
3
2
1
11.15 ± 0.15
(0.442 ± 0.006)
9.00 ± 0.15
(0.354 ± 0.006)
1.3
(0.051)
13.56
(0.534)
2.29
(0.09)
LAND PATTERN RECOMMENDATION
1.78 ± 0.15
(0.070 ± 0.006)
4.00
(0.158)
MAX.
1.55
(0.061)
MAX.
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
0.254
+ 0.076
- 0.0051
(0.010
+ 0.003)
- 0.002)
MAX.
HCNW3120 Gull Wing Surface Mount Option 300 Outline Drawing
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Solder Reow Temperature Prole
0
TIME (SECONDS)
TEMPERATURE (°C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160 °C
140 °C
150 °C
PEAK
TEMP.
245 °C
PEAK TEMP. 240 °C
PEAK
TEMP. 230 °C
SOLDERING
TIME
200 °C
PREHEATING TIME
150 °C, 90 + 30 SEC.
2.5 C ± 0.5 °C/SEC.
3 °C + 1 °C/–0.5 °C
TIGHT TYPICAL LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC. REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
NOTE: NON-HALIDE FLUX SHOULD BE USED.
217 °C
RAMP-DOWN 6 °C/SEC. MAX.
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
* 260 +0/-5 °C
t 25 °C to PEAK
60 to 150 SEC.
15 SEC.
TIME WITHIN 5 °C of ACTUAL PEAK TEMPERATURE
t
p
t
s
PREHEAT
60 to 180 SEC.
t
L
T
L
T
smax
T
smin
25
T
p
TIME
TEMPERATURE
NOTES: THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX. T
smax
= 200 °C, T
smin
= 150 °C
NOTE: NON-HALIDE FLUX SHOULD BE USED.
* RECOMMENDED PEAK TEMPERATURE FOR WIDEBODY 400mils PACKAGE IS 245 °C
Recommended Pb-Free IR Prole
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Regulatory Information
Agency/Standard HCPL-3120 HCPL-J312 HCNW3120
Underwriters Laboratory (UL)  Compliant  Compliant  Compliant  Recognized under UL 1577, Component Recognition Program,  Category, File E55361
Canadian Standards Association (CSA) File CA88324,  Compliant  Compliant  Compliant  per Component Acceptance Notice #5
IEC/EN/DIN EN 60747-5-2  Compliant  Compliant  Compliant    Option 060
Insulation and Safety Related Specications
  Value
HCPL- HCPL- HCNW Parameter Symbol 3120 J312 3120 Units Conditions
 Minimum External  L(101)  7.1  7.4  9.6  mm  Measured from input terminals to output 
 Air Gap (Clearance)            terminals, shortest distance through air.
 Minimum External  L(102)  7.4  8.0  10.0  mm  Measured from input terminals to output    Tracking (Creepage)            terminals, shortest distance path along               body.
 Minimum Internal    0.08  0.5  1.0  mm  Insulation thickness between emitter   Plastic Gap            and detector; also known as distance   (Internal Clearance)            through insulation.
 Tracking Resistance  CTI  >175  >175  >200  Volts  DIN IEC 112/VDE 0303 Part 1   (Comparative   Tracking Index)
 Isolation Group    IIIa  IIIa  IIIa    Material Group (DIN VDE 0110, 1/89,               Table 1)
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All Avago data sheets report the creepage and clearance  inherent  to  the  optocoupler  component  itself.  These  dimensions  are  needed  as  a  starting  point  for  the  equipment designer when determining the circuit insula­tion requirements. However, once mounted on a printed  circuit board, minimum creep-age and clearance require­ments must be met as specied for individual equipment 
the surface of a printed circuit board between the solder  llets of the input and output leads must be considered.  There  are  recommended  techniques  such  as  grooves  and ribs  which  may be  used on  a  printed circuit  board  to  achieve  desired  creepage  and  clearances.  Creepage  and clearance distances will also change depending on  factors such as pollution degree and insulation level.
standards. For creepage, the shortest distance path along 
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics
HCPL-3120 Description Symbol Option 060 HCPL-J312 HCNW3120 Unit
Installation classication per DIN VDE 0110/1.89,  Table 1                  for rated mains voltage ≤150 V rms    I-IV  I-IV  I-IV      for rated mains voltage ≤300 V rms    I-IV  I-IV  I-IV      for rated mains voltage ≤450 V rms    I-III  I-III  I-IV      for rated mains voltage ≤600 V rms      I-III  I-IV      for rated mains voltage ≤1000 V rms        I-III
Climatic Classication    55/100/21  55/100/21  55/100/21
Pollution Degree (DIN VDE 0110/1.89)    2  2  2
Maximum Working Insulation Voltage  V
Input to Output Test Voltage, Method b*  VPR  1181  1670  2652  V   V
 x 1.875 = VPR, 100% Production Test, 
IORM
  tm = 1 sec, Partial Discharge < 5pC           
Input to Output Test Voltage, Method a*  VPR  945  1336  2121  V   V
 x 1.5 = VPR, Type and Sample Test, 
IORM
  tm = 60 sec, Partial Discharge < 5pC
Highest Allowable Overvoltage*  V   (Transient Overvoltage, t
 = 10 sec)           
ini
Safety Limiting Values – maximum values allowed  in the event of a failure, also see Figure 37.                    Case Temperature  TS  175  175  150  °C        Input Current  I       Output Power  P
Insulation Resistance at TS, VIO = 500 V  RS  ≥109  ≥109  ≥109  Ω
  630  891  1414  V
IORM
  6000  6000  8000  V
IOTM
  230  400  400  mA 
S INPUT
  600  600  700  mW
S OUTPUT
peak
peak
peak
peak
*Refer to the IEC/EN/DIN EN 60747-5-2 section (page 1-6/8) of the Isolation Control Component Designer’s Catalog for a detailed description of  Method a/b partial discharge test proles.
Note: These optocouplers are suitable for “safe electrical isolation” only within the safety limit data. Maintenance of the safety data shall be en­sured by means of protective circuits. Surface mount classication is Class A in accordance with CECC 00802.
8
Page 9
Absolute Maximum Ratings
Parameter Symbol Min. Max. Units Note
Storage Temperature    TS  -55  125  °C
Operating Temperature    TA  -40  100  °C
Average Input Current    I
Peak Transient Input Current    I (<1 µs pulse width, 300 pps)
Reverse Input Voltage  HCPL-3120  VR    5  Volts
  HCPL-J312      5    HCNW3120
“High” Peak Output Current    I
“Low” Peak Output Current    I
Supply Voltage    (VCC - VEE)  0  35  Volts
Input Current (Rise/Fall Time)    t
Output Voltage    V
Output Power Dissipation    PO    250  mW  3
Total Power Dissipation    PT    295  mW  4
Lead Solder Temperature  HCPL-3120        260°C for 10 sec., 1.6 mm below seating plane    HCPL-J312
  HCNW3120            260°C for 10 sec., up to seating plane
Solder Reow Temperature Prole                  See Package Outline Drawings section
    25  mA  1
F(AVG)
    1.0  A 
F(TRAN)
    2.5  A  2
OH(PEAK)
    2.5  A  2
OL(PEAK)
r(IN) /tf(IN)   
  0  VCC  Volts
O(PEAK)
500  ns
Recommended Operating Conditions
Parameter Symbol Min. Max. Units
Power Supply Voltage    (VCC - VEE)  15  30  Volts
Input Current (ON)  HCPL-3120    7    HCPL-J312  I
  HCNW3120    10
Input Voltage (OFF)    V
Operating Temperature    TA  -40  100  °C
    16  mA
F(ON)
  -3.6  0.8  V
F(OFF)
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Electrical Specications (DC)
Over  recommended operating  conditions  (TA  =  -40  to  100°C,  for  HCPL-3120, HCPL-J312  I HCNW3120 I
 = 10 to 16mA, V
F(ON)
 = -3.6 to 0.8 V, VCC = 15 to 30 V, VEE = Ground) unless otherwise specied.
F(OFF)
  =  7  to  16mA,  for 
F(ON)
Parameter Symbol Device Min. Typ.* Max. Units Test Conditions Fig. Note
High Level Output  I Current
      2.0      A  VO = (VCC - 15 V) 
Low Level Output  I Current
      2.0      A  VO = (VEE + 15 V) 
OH 
OL 
High Level Output  VOH    (V Voltage                19
Low Level Output  V
OL 
Voltage                20
High Level Supply  I
CCH
Current              IF = 7 to 16 mA
Low Level Supply  I
      2.5  5.0  mA  Output Open, 
CCL
Current              VF = -3.0 to +0.8 V
Threshold Input  I
Current Low to
High
    HCNW3120    2.3  8.0
    HCPL-J312    1.0
Threshold Input  V
  HCPL-3120    2.3  5.0  mA  IO = 0 mA,  9, 15,
FLH
FHL
Voltage High to  Low
Input Forward  VF  HCPL-3120  1.2  1.5  1.8  V  IF = 10 mA  16 Voltage
    HCPL-J312    1.6  1.95 
    HCNW3120
Temperature  ∆VF/∆TA  HCPL-3120    -1.6    mV/°C  IF = 10 mA
Coecient of Forward Voltage
    HCPL-J312    -1.3 
    HCNW3120
Input Reverse  BVR  HCPL-3120  5      V  IR = 10 µA
Breakdown Voltage
    HCPL-J312  3        IR = 100 µA 
    HCNW3120
Input Capacitance  CIN  HCPL-3120    60    pF  f = 1 MHz,
    HCPL-J312    70          HCNW3120
UVLO Threshold  V
UVLO+
              IF = 10 mA  34
  V
UVLO–
UVLO Hysteresis  UVLO
  0.5  1.5    A  VO = (VCC - 4 V)  2, 3,  5
17
  0.5  2.0    A  VO = (VEE + 2.5 V)  5, 6,  5
18
- 4)  (V
CC 
- 3)    V  IO = -100 mA  1, 3,  6, 7 
CC 
    0.1  0.5  V  IO = 100 mA  4, 6, 
      2.5  5.0  mA  Output Open,  7, 8 
      VO > 5 V  21
    0.8      V 
VF = 0 V
    11.0  12.3  13.5  V  VO > 5 V,  22, 
    9.5  10.7  12.0   
      1.6
HYS
  2
  2
*All typical values at TA = 25°C and VCC - VEE = 30 V, unless otherwise noted.
10
Page 11
Switching Specications (AC)
Over  recommended  operating  conditions  (TA  =  -40  to  100°C,  for  HCPL-3120,HCPL-J312  I HCNW3120 I
 = 10 to 16mA, V
F(ON)
 = -3.6 to 0.8 V, VCC = 15 to 30 V,  VEE = Ground) unless otherwise specied.
F(OFF)
  =  7  to  16mA,  for 
F(ON)
Parameter Symbol Min. Typ.* Max. Units Test Conditions Fig. Note
Propagation Delay Time  t to High Output Level            Cg = 10 nF,  12, 13,   
Propagation Delay Time  t to Low Output Level           
Pulse Width Distortion  PWD      0.3  µs      17
Propagation Delay  PDD  -0.35    0.35  µs    35, 36  12  Dierence Between Any  (t Two Parts
Rise Time  tr    0.1    µs    23
Fall Time  tf    0.1    µs
UVLO Turn On Delay  t
UVLO Turn O Delay  t
Output High Level Common  |CMH|  25  35    kV/µs  TA = 25°C,  24  13, 14  Mode Transient Immunity            IF = 10 to 16 mA,              VCM = 1500 V,              VCC = 30 V
Output Low Level Common  |CML|  25  35    kV/µs  TA = 25°C,    13, 15  Mode Transient Immunity            VCM = 1500 V,              VF = 0 V, VCC = 30 V
  0.10  0.30  0.50  µs  Rg = 10 Ω,  10, 11,  16 
PLH
  0.10  0.30  0.50  µs 
PHL
f = 10 kHz,  14, 23 Duty Cycle = 50%
 - t
PHL
UVLO ON
UVLO OFF
) 
PLH
    0.8    µs  VO > 5 V, IF = 10 mA  22
    0.6      VO < 5 V, IF = 10 mA
*All typical values at TA = 25°C and VCC - VEE = 30 V, unless otherwise noted.
11
Page 12
Package Characteristics
Over recommended temperature (TA = -40 to 100°C) unless otherwise specied.
Parameter Symbol Device Min. Typ. Max. Units Test Conditions Fig. Note
Input-Output Momentary  V
Withstand Voltage**
    HCPL-J312  3750       
    HCNW3120  5000       
Resistance  R (Input-Output)    HCPL-J312
    HCNW3120  1012  1013      TA = 25°C
      10
Capacitance  C
(Input-Output)    HCPL-J312    0.8
    HCNW3120    0.5  0.6
LED-to-Case Thermal  qLC      467    °C/W  Thermocouple  28  Resistance              located at center
LED-to-Detector Thermal  qLD      442    °C/W  underside of  Resistance              package
Detector-to-Case  qDC      126    °C/W  Thermal Resistance
  HCPL-3120  3750      V
ISO
  RH < 50%,    8, 11
RMS
t = 1 min.,
TA = 25°C
  HCPL-3120    1012    Ω  V
I-O
11 
      TA = 100°C
  HCPL-3120    0.6    pF  f = 1 MHz
I-O
I-O
    9, 11
    10, 11
 = 500 V
DC   
11 
*All typicals at TA = 25°C. **The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous  voltage rating. For the continuous voltage rating refer to your equipment level safety specication or Avago Application Note 1074 entitled “Op­tocoupler Input-Output Endurance Voltage.”
Notes:
  1. Derate linearly above 70°C free-air temperature at a rate of 0.3 mA/°C.
  2. Maximum pulse width = 10 µs, maximum duty cycle = 0.2%. This value is intended to allow for component tolerances for designs with IO peak  minimum = 2.0 A. See Applications section for additional details on limiting IOH peak.
  3. Derate linearly above 70°C free-air temperature at a rate of 4.8 mW/°C.
  4. Derate linearly above 70°C free-air temperature at a rate of 5.4 mW/°C. The maximum LED junction tem-perature should not exceed 125°C.
  5. Maximum pulse width = 50 µs, maximum duty cycle = 0.5%.
  6. In this test VOH is measured with a dc load current. When driving capacitive loads VOH will approach VCC as IOH approaches zero amps.
  7. Maximum pulse width = 1 ms, maximum duty cycle = 20%.
  8. In accordance with UL1577, each optocoupler is proof tested by applying an insulation test voltage ≥4500 Vrms for 1 second (leakage detec­tion current limit, I
  9. In accordance with UL1577, each optocoupler is proof tested by applying an insulation test voltage ≥4500 Vrms for 1 second (leakage detec­tion current limit, I
10. In accordance with UL1577, each optocoupler is proof tested by applying an insulation test voltage ≥6000 Vrms for 1 second (leakage detec­tion current limit, I
11. Device considered a two-terminal device: pins 1, 2, 3, and 4 shorted together and pins 5, 6, 7, and 8 shorted together.
12. The dierence between t
13. Pins 1 and 4 need to be connected to LED common.
14. Common mode transient immunity in the high state is the maximum tolerable dVCM/dt of the common mode pulse, VCM, to assure that the  output will remain in the high state (i.e., VO > 15.0 V ).
15. Common mode transient immunity in a low state is the maximum tolerable dVCM/dt of the common mode pulse, VCM, to assure that the out­put will remain in a low state (i.e., VO < 1.0 V ).
16. This load condition approximates the gate load of a 1200 V/75A IGBT.
17. Pulse Width Distortion (PWD) is dened as |t
 ≤ 5 µA). 
I-O
 ≤ 5 µA).
I-O
 ≤ 5 µA).
I-O
PHL
 and t
 between any two HCPL-3120 parts under the same test condition.
PLH
| for any given device.
PHL-tPLH
12
Page 13
Figure 1. VOH vs. temperature.
(V
OH
– V
CC
) – HIGH OUTPUT VOLTAGE DROP – V
-40
-4
TA – TEMPERATURE – °C
100
-1
-2
-2000 20 40-360 80
IF = 7 to 16 mA I
OUT
= -100 mA VCC = 15 to 30 V VEE = 0 V
I
OH
– OUTPUT HIGH CURRENT – A
-40
1.0
TA – TEMPERATURE – °C
100
1.8
1.6
-20
2.0
0 20 40
1.2
60 80
IF = 7 to 16 mA V
OUT
= (VCC - 4 V) VCC = 15 to 30 V VEE = 0 V
1.4
(V
OH
– V
CC
) – OUTPUT HIGH VOLTAGE DROP – V
0
-6
IOH – OUTPUT HIGH CURRENT – A
2.5
-2
-3
0.5-11.0 1.5-52.0
IF = 7 to 16 mA VCC = 15 to 30 V VEE = 0 V
-4
100 °C 25 °C
-40 °C
V
OL
– OUTPUT LOW VOLTAGE – V
-40
0
TA – TEMPERATURE – °C
-20
0.25
0 20
0.05
100
0.15
0.20
0.10
40 60 80
VF (OFF) = -3.0 TO 0.8 V I
OUT
= 100 mA VCC = 15 TO 30 V VEE = 0 V
I
OL
– OUTPUT LOW CURRENT – A
-40
0
TA – TEMPERATURE – °C
-2040 20
1
100
2
3
40 60 80
VF (OFF) = -3.0 TO 0.8 V V
OUT
= 2.5 V
VCC = 15 TO 30 V VEE = 0 V
V
OL
– OUTPUT LOW VOLTAGE – V
0
0
IOL – OUTPUT LOW CURRENT – A
2.5
3
0.541.0 1.512.0
V
F(OFF)
= -3.0 to 0.8 V VCC = 15 to 30 V VEE = 0 V
2
100 °C 25 °C
-40 °C
I
CC
– SUPPLY CURRENT – mA
-40
1.5
TA – TEMPERATURE – °C
100
3.0
2.5
-20
3.5
0 20 40
2.0
60 80
VCC = 30 V VEE = 0 V IF = 10 mA for I
CCH
IF = 0 mA for I
CCL
I
CCH
I
CCL
I
CC
– SUPPLY CURRENT – mA
15
1.5
VCC – SUPPLY VOLTAGE – V
30
3.0
2.5
3.5
20
2.0
25
IF = 10 mA for I
CCH
IF = 0 mA for I
CCL
TA = 25 °C VEE = 0 V
I
CCH
I
CCL
Figure 2. IOH vs. temperature.
Figure 3. VOH vs. IOH.
Figure 4. V
Figure 7. ICC vs. temperature. Figure 8. ICC vs. VCC.
13
vs. temperature. Figure 5. IOL vs. temperature. Figure 6. VOL vs. IOL.
OL
Page 14
Figure 9. I
I
FLH
– LOW TO HIGH CURRENT THRESHOLD – mA
-40
0
TA – TEMPERATURE – °C
100
3
2
-2040 20 40160 80
5
VCC = 15 TO 30 V VEE = 0 V OUTPUT = OPEN
HCPL-3120
I
FLH
– LOW TO HIGH CURRENT THRESHOLD – mA
-40
0
TA – TEMPERATURE – °C
-2050 20
1
100
2
3
40 60 80
VCC = 15 TO 30 V VEE = 0 V OUTPUT = OPEN
4
HCPL-J312
I
FLH
– LOW TO HIGH CURRENT THRESHOLD – mA
-40
0
TA – TEMPERATURE – °C
-2050 20
1
100
2
3
40 60 80
VCC = 15 TO 30 V VEE = 0 V OUTPUT = OPEN
4
HCNW3120
T
p
– PROPAGATION DELAY – ns
15
100
VCC – SUPPLY VOLTAGE – V
30
400
300
500
20
200
25
IF = 10 mA TA = 25 °C Rg = 10 Ω Cg = 10 nF DUTY CYCLE = 50% f = 10 kHz
T
PLH
T
PHL
T
p
– PROPAGATION DELAY – ns
6
100
IF – FORWARD LED CURRENT – mA
16
400
300
500
10
200
12
VCC = 30 V, VEE = 0 V Rg = 10 Ω, Cg = 10 nF TA = 25 °C DUTY CYCLE = 50% f = 10 kHz
T
PLH
T
PHL
148
T
p
– PROPAGATION DELAY – ns
-40
100
TA – TEMPERATURE – °C
100
400
300
-20
500
0 20 40
200
60 80
T
PLH
T
PHL
IF = 10 mA VCC = 30 V, VEE = 0 V Rg = 10 Ω, Cg = 10 nF DUTY CYCLE = 50% f = 10 kHz
T
p
– PROPAGATION DELAY – ns
0
100
Rg – SERIES LOAD RESISTANCE – Ω
50
400
300
10
500
30
200
40
T
PLH
T
PHL
VCC = 30 V, VEE = 0 V TA = 25 °C IF = 10 mA Cg = 10 nF DUTY CYCLE = 50% f = 10 kHz
20
T
p
– PROPAGATION DELAY – ns
0
100
Cg – LOAD CAPACITANCE – nF
100
400
300
20
500
40
200
60 80
T
PLH
T
PHL
VCC = 30 V, VEE = 0 V TA = 25 °C IF = 10 mA Rg = 10 Ω DUTY CYCLE = 50% f = 10 kHz
vs. temperature.
FLH
Figure 10. Propagation delay vs. VCC. Figure 11. Propagation delay vs. IF. Figure 12. Propagation delay vs. temperature.
14
Figure 14. Propagation delay vs. Cg.Figure 13. Propagation delay vs. Rg.
Page 15
Figure 15. Transfer characteristics.
V
O
– OUTPUT VOLTAGE – V
0
0
IF – FORWARD LED CURRENT – mA
5
25
15
1
30
253 4
20
10
V
O
– OUTPUT VOLTAGE – V
0
0
IF – FORWARD LED CURRENT – mA
1352
5
5
15
25
3 4
10
20
HCPL-J312
30
I
F
– FORWARD CURRENT – mA
1.10
0.001
VF – FORWARD VOLTAGE – VOLTS
1.60
10
1.0
0.1
1.20
1000
1.30 1.40 1.50
TA = 25°C
I
F
V
F
+
–
0.01
100
HCPL-3120
VF – FORWARD VOLTAGE – VOLTS
1.2 1.3 1.4 1.5
I
F
– FORWARD CURRENT – mA
1.71.6
1.0
I
F
+
TA = 25°C
–
HCPL-J312/HCNW3120
V
F
0.1
0.01
0.001
10
100
1000
0.1 µF
V
CC
= 15
to 30 V
1
3
IF = 7 to
16 mA
+ –
2
4
8
6
7
5
+ –
4 V
I
OH
Figure 16. Input current vs. forward voltage.
Figure 17. IOH test circuit.
15
Page 16
Figure 19. VOH Test circuit.Figure 18. IOL Test circuit.
0.1 µF
V
CC
= 15
to 30 V
1
3
+ –
2
4
8
6
7
5
2.5 V
I
OL
+ –
0.1 µF
V
CC
= 15
to 30 V
1
3
IF = 7 to
16 mA
+ –
2
4
8
6
7
5
100 mA
V
OH
0.1 µF
V
CC
= 15
to 30 V
1
3
+ –
2
4
8
6
7
5
100 mA
V
OL
0.1 µF
V
CC
= 15
to 30 V
1
3
I
F
+ –
2
4
8
6
7
5
VO > 5 V
0.1 µF
V
CC
1
3
IF = 10 mA
+ –
2
4
8
6
7
5
VO > 5 V
Figure 20. VOL Test circuit. Figure 21. I
Figure 22. UVLO test circuit.
16
Test circuit.
FLH
Page 17
Figure 23. t
0.1 µF V
CC
= 15
to 30 V
10 Ω
1
3
IF = 7 to 16 mA
V
O
+ –
+ –
2
4
8
6
7
5
10 KHz
50% DUTY
CYCLE
500 Ω
10 nF
I
F
V
OUT
t
PHL
t
PLH
t
f
t
r
10%
50%
90%
0.1 µF
V
CC
= 30 V
1
3
I
F
V
O
+ –
+ –
2
4
8
6
7
5
A
+
–
B
V
CM
= 1500 V
5 V
V
CM
∆t
0 V
V
O
SWITCH AT B: IF = 0 mA
V
O
SWITCH AT A: IF = 10 mA
V
OL
V
OH
∆t
V
CM
δV
δt
=
, t
, tr, and tf test circuit and waveforms.
PLH
PHL
Figure 24. CMR test circuit and waveforms.
17
Page 18
Applications Information
+ HVDC
3-PHASE
AC
- HVDC
0.1 µF
V
CC
= 18 V
1
3
+ –
2
4
8
6
7
5
270 Ω
HCPL-3120
+5 V
CONTROL
INPUT
Rg
Q1
Q2
74XXX
OPEN
COLLECTOR
Eliminating Negative IGBT Gate Drive (Discussion applies  to HCPL-3120, HCPL-J312, and HCNW3120)
To  keep the  IGBT rmly  o, the  HCPL-3120 has  a very  low maximum VOL specication of 0.5 V. The HCPL-3120  realizes  this  very  low VOL  by  using a  DMOS  transistor  with 1 Ω (typical)  on  resistance in its  pull down circuit.  When the  HCPL-3120 is  in the  low state,  the IGBT  gate  is  shorted  to  the  emitter  by  Rg  +  1 Ω.  Minimizing  Rg  and  the  lead  inductance  from  the  HCPL-3120  to  the  IGBT gate and emitter (possibly by mounting the HCPL-
3120 on  a  small PC  board directly  above the  IGBT)  can  eliminate the need for negative IGBT gate drive in many  applications as shown in Figure 25. Care should be taken  with such  a  PC board  design  to avoid  routing  the IGBT  collector or emitter traces close to the HCPL-3120 input  as  this  can  result  in  unwanted  coupling  of  transient  signals into the HCPL-3120 and degrade performance. (If  the IGBT drain must be routed near the HCPL-3120 input,  then the LED  should  be reverse-biased when  in the o  state, to prevent the transient signals coupled from the  IGBT drain from turning on the HCPL-3120.) 
Figure 25. Recommended LED drive and application circuit.
18
Page 19
Selecting  the  Gate  Resistor  (Rg)  to  Minimize  IGBT 
+ HVDC
3-PHASE
AC
- HVDC
0.1 µF
V
CC
= 15 V
1
3
+ –
2
4
8
6
7
5
HCPL-3120
Rg
Q1
Q2
V
EE
= -5 V
–
+
270 Ω
+5 V
CONTROL
INPUT
74XXX
OPEN
COLLECTOR
Switching  Losses.  (Discussion  applies  to  HCPL-3120,  HCPL-J312 and HCNW3120)
For  the  circuit  in  Figure  26  with  IF  (worst  case)  =  16 mA, Rg  = 8 Ω,  Max  Duty Cycle =  80%, Qg =  500 nC,   f = 20 kHz and TA max = 85 °C:
Step 1: Calculate Rg Minimum from the IOL Peak Specica­tion. The IGBT and Rg in Figure 26 can be analyzed as a  simple RC  circuit with a  voltage  supplied  by the  HCPL-
3120.     (VCC – VEE - VOL) 
Rg  ≥  ———————                 I
  =  ———————                     I
    (15 V + 5 V - 2 V)    =  ———————        
             2.5 A 
  =  7.2 Ω @ 8 Ω
OLPEAK 
(VCC – VEE - 2 V) 
OLPEAK 
The VOL value of 2 V in the previous equation is a con­servative value of VOL at the peak current of 2.5A (see  Figure 6). At lower Rg values the voltage supplied by  the HCPL-3120 is not an ideal voltage step. This results  in lower peak currents (more margin) than predicted by  this analysis. When negative gate drive is not used VEE in  the previous equation is equal to zero volts.
Step 2: Check the HCPL-3120 Power Dissipation and  Increase Rg if Necessary. The HCPL-3120 total power  dissipation (PT) is equal to the sum of the emitter power  (PE) and the output power (PO):
PT = PE + P
O
PE = IF • VF · Duty Cycle
PO = P
O(BIAS)
 + P
O (SWITCHING)
    = ICC • (VCC - VEE)+ ESW(RG, QG) • f
PE = 16 mA • 1.8 V • 0.8 = 23 mW
PO = 4.25 mA • 20 V + 5.2 µ J • 20 kHz
   = 85 mW + 104 mW
   = 189 mW > 178 mW (P
O(MAX)
 @ 85°C
   = 250 mW-15C*4.8 mW/C)
The value of 4.25 mA for ICC in the previous equation was  obtained by derating the ICC max of 5 mA (which occurs  at -40°C) to ICC max at 85C (see Figure 7).
Since PO for this case is greater than P
O(MAX)
, Rg must be 
increased to reduce the HCPL-3120 power dissipation.
P
O(SWITCHING MAX)
  = P
O(MAX)
 - P
O(BIAS)
   = 178 mW - 85 mW
  = 93 mW        P
E
SW(MAX)
             f 
      93 mW      =  ———— = 4.65 µW 
  =  ——————— 
O(SWITCHINGMAX)
20 kHz
For Qg = 500 nC, from Figure 27, a value of ESW = 4.65 µW  gives a   Rg = 10.3 Ω.
Figure 26. HCPL-3120 typical application circuit with negative IGBT gate drive.
19
Page 20
Esw – ENERGY PER SWITCHING CYCLE – µJ
0
0
Rg – GATE RESISTANCE – Ω
50
6
101420430 40
12
Qg = 100 nC
Qg = 500 nC
Qg = 1000 nC
10
8
2
VCC = 19 V VEE = -9 V
Thermal Model (Discussion applies to HCPL-3120, HCPL­J312 and HCNW3120)
The  steady  state  thermal  model  for  the  HCPL-3120  is  shown in Figure 28. The thermal resistance values given  in this model can be used to calculate the temperatures  at each node for a given operating condition. As shown  by the model, all heat generated ows through q
CA 
which  raises  the  case  temperature  TC  accordingly.  The  value  of qCA depends  on the conditions  of the  board design  and is, therefore, determined by the designer. The value  of  qCA = 83°C/W  was  obtained  from  thermal  measure­ments using a 2.5 x 2.5 inch PC board, with small traces  (no ground plane), a single HCPL-3120 soldered into the  center of the board and still air. The absolute maximum  power  dissipation  derating  specications  assume  a 
qCAvalue of 83°C/W.
From the thermal mode in Figure 28 the LED and detector  IC junction temperatures can be expressed as:
TJE = P
          qLC * q + PD•(———————  + qCA) + T
          qLC + qDC + q
          qLC • q TJD = PE (———————  + qCA)            qLC + qDC + q
@ 
(qLC||(qLD + qDC) + qCA)
E 
DC
LD
DC
LD
A
PE Parameter Description
IF  LED Current
VF  LED On Voltage
Duty Cycle  Maximum LED Duty Cycle
PO Parameter Description
ICC  Supply Current
VCC  Positive Supply Voltage
VEE  Negative Supply Voltage
ESW(Rg,Qg)  Energy Dissipated in the HCPL-3120    for each IGBT Switching Cycle       (See Figure 27)
f  Switching Frequency
+ PD • (qDC||(qLD + qLC) + qCA) + T
A
Inserting the values for qLC and  qDC shown in Figure 28  gives:
TJE = PE • (256°C/W + qCA)      + PD • (57°C/W + qCA) + T TJD = PE • (57°C/W + qCA)      + PD • (111°C/W + qCA) + T
A 
Figure 27. Energy dissipated in the HCPL-3120 for each IGBT switching
A
cycle.
For example, given PE = 45 mW, PO = 250 mW, TA = 70°C  and  qCA = 83°C/W:
TJE = P
• 339°C/W + PD • 140°C/W + TA 
E 
    = 45 mW • 339°C/W + 250 mW 
• 140°C/W + 70°C = 120°C
TJD = P
• 140°C/W + PD • 194°C/W + TA 
E 
    = 45 mW • 140°C/W + 250 mW • 194°C/W + 70°C = 125°C
TJE  and  TJD  should  be  limited  to  125°C  based  on  the  board layout and part placement (qCA) specic to the ap­plication.
20
Page 21
  TJE  =  LED junction temperature 
θLD = 442 °C/W
T
JE
T
JD
θLC = 467 °C/W θDC = 126 °C/W
θCA = 83 °C/W*
T
C
T
A
T
JE
= LED JUNCTION TEMPERATURE
T
JD
= DETECTOR IC JUNCTION TEMPERATURE TC = CASE TEMPERATURE MEASURED AT THE CENTER OF THE PACKAGE BOTTOM
θ
LC
= LED-TO-CASE THERMAL RESISTANCE
θ
LD
= LED-TO-DETECTOR THERMAL RESISTANCE
θ
DC
= DETECTOR-TO-CASE THERMAL RESISTANCE
θ
CA
= CASE-TO-AMBIENT THERMAL RESISTANCE
*
θ
CA
WILL DEPEND ON THE BOARD DESIGN AND
THE PLACEMENT OF THE PART.
1
3
2
4
8
6
7
5
C
LEDP
C
LEDN
1
3
2
4
8
6
7
5
C
LEDP
C
LEDN
SHIELD
C
LEDO1
C
LEDO2
  TJD  =  detector IC junction temperature    TC  =  case temperature measured at the center of the package bottom    qLC  =  LED-to-case thermal resistance    qLD  =  LED-to-detector thermal resistance   qDC  =  detector-to-case thermal resistance   qCA  =  case-to-ambient thermal resistance     *qCA will depend on the board design and the placement of the part.
Figure 28. Thermal model.
LED Drive Circuit Considerations for Ultra High CMR Per­formance. (Discussion applies to HCPL-3120, HCPL-J312, and HCNW3120)
Without  a detector  shield,  the  dominant  cause  of  op­tocoupler  CMR  failure  is  capacitive  coupling  from  the  input side of  the optocoupler, through  the package,  to  the detector IC as shown in Figure 29. The     HCPL-3120  improves CMR perform-ance by using a detector IC with  an optically transparent Faraday shield, which diverts the  capacitively coupled current away from the  sensitive  IC  circuitry. However, this shield does not eliminate the ca­pacitive coupling between the LED and optocoupler pins  5-8 as shown in Figure 30. This capacitive coupling causes 
perturbations in the LED current during common mode  transients and becomes the major source of CMR failures  for a shielded optocoupler. The main design objective of  a high CMR LED drive circuit  becomes keeping the LED  in  the  proper  state  (on or  o)  during  common  mode  transients. For  example,  the recommended  application  circuit (Figure 25), can achieve 25 kV/µs CMR while mini­mizing component complexity.
Techniques  to  keep  the  LED  in  the  proper  state  are  discussed in the next two sections.
Figure 29. Optocoupler input to output capacitance model for unshielded optocouplers.
21
Figure 30. Optocoupler input to output capacitance model for shielded optocouplers.
Page 22
CMR with the LED On (CMRH).
Rg
1
3
V
SAT
2
4
8
6
7
5
+
V
CM
I
LEDP
C
LEDP
C
LEDN
SHIELD
* THE ARROWS INDICATE THE DIRECTION OF CURRENT FLOW DURING –dVCM/dt.
+5 V
+ –
V
CC
= 18 V
• • •
• • •
0.1 µF
+
–
–
1
3
2
4
8
6
7
5
C
LEDP
C
LEDN
SHIELD
+5 V
1
3
2
4
8
6
7
5
C
LEDP
C
LEDN
SHIELD
+5 V
Q1
I
LEDN
V
O
– OUTPUT VOLTAGE – V
0
0
(VCC - VEE ) – SUPPLY VOLTAGE – V
10
5
14
10 15
2
20
6
8
4
12
(12.3, 10.8)
(10.7, 9.2)
(10.7, 0.1)
(12.3, 0.1)
A high CMR LED drive circuit must keep the LED on during  common mode transients. This is achieved by overdriv­ing the  LED current beyond the input threshold so that  it is  not pulled  below the  threshold during  a transient.  A  minimum  LED  current  of  10  mA  provides adequate  margin over the maximum I
 of 5 mA to achieve 25 kV/
FLH
µs CMR.
CMR with the LED O (CMRL).
A  high  CMR  LED  drive  circuit  must  keep  the  LED  o  (VF ≤ V example,  during  a  -dVcm/dt  transient  in Figure  31,  the  current  owing  through  C
)  during  common  mode  transients.  For 
F(OFF)
  also  ows  through  the 
LEDP
R
SAT
 and V
 of the logic gate. As long as the low state 
SAT
voltage  developed  across  the  logic  gate  is  less  than  V
, the  LED will  remain  o and no  common mode 
F(OFF)
failure will occur.
The  open  collector  drive  circuit,  shown  in  Figure  32,  cannot  keep  the LED  o during  a +dVcm/dt  transient,  since  all  the  current  owing  through  C
LEDN
  must  be  supplied  by  the  LED,  and  it  is  not  recommended  for  applica-tions  requiring  ultra  high  CMRL  performance.  Figure 33 is an alternative drive circuit which, like the rec­ommended applica-tion circuit (Figure 25), does achieve  ultra high CMR performance by shunting the LED in the  o state.
Figure 31. Equivalent circuit for gure 25 during common mode transient. Figure 32. Not recommended open collector drive circuit.
Figure 33. Recommended LED drive circuit for ultra-high CMR.
22
Figure 34. Under voltage lock out.
Page 23
Under Voltage Lockout Feature. (Discussion applies to
t
PHL MAX
t
PLH MIN
PDD* MAX = (t
PHL- tPLH)MAX
= t
PHL MAX - tPLH MIN
*PDD = PROPAGATION DELAY DIFFERENCE NOTE: FOR PDD CALCULATIONS THE PROPAGATION DELAYS ARE TAKEN AT THE SAME TEMPERATURE AND TEST CONDITIONS.
V
OUT1
I
LED2
V
OUT2
I
LED1
Q1 ON
Q2 OFF
Q1 OFF
Q2 ON
t
PLH
MIN
MAXIMUM DEAD TIME (DUE TO OPTOCOUPLER) = (t
PHL MAX - tPHL MIN
) + (t
PLH MAX - tPLH MIN
)
= (t
PHL MAX - tPLH MIN
) – (t
PHL MIN - tPLH MAX
)
= PDD* MAX – PDD* MIN
*PDD = PROPAGATION DELAY DIFFERENCE NOTE: FOR DEAD TIME AND PDD CALCULATIONS ALL PROPAGATION DELAYS ARE TAKEN AT THE SAME TEMPERATURE AND TEST CONDITIONS.
V
OUT1
I
LED2
V
OUT2
I
LED1
Q1 ON
Q2 OFF
Q1 OFF
Q2 ON
t
PHL MIN
t
PHL MAX
t
PLH MAX
PDD* MAX
(t
PHL-tPLH) MAX
HCPL-3120, HCPL-J312, and HCNW3120)
The HCPL-3120 contains an under voltage lockout (UVLO)  feature that is designed to protect the IGBT under fault  conditions  which  cause the  HCPL-3120  supply voltage  (equivalent  to  the  fully-charged  IGBT  gate  voltage)  to  drop below a level necessary to keep the IGBT in a low re­sistance state. When the HCPL-3120 output is in the high  state and the supply voltage drops below the       HCPL­3120  V coupler output will  go  into the low state  with  a typical  delay, UVLO Turn O Delay, of 0.6 µs.
When  the  HCPL-3120  output  is  in  the  low  state  and  the  supply  voltage  rises  above  the  HCPL-3120  V threshold (11.0 < V will go into the high state (assumes LED is “ON”) with a  typical delay, UVLO Turn On Delay of 0.8 µs.
  threshold  (9.5 < V
UVLO–
UVLO+
<  12.0)  the  opto-
UVLO– 
UVLO+
 < 13.5) the optocoupler output 
IPM Dead Time and Propagation Delay Specications. (Discussion applies to HCPL-3120, HCPL-J312, and HCNW3120)
The HCPL-3120 includes a Propagation Delay Dierence  (PDD) specication intended to help designers minimize  “dead time” in  their power inverter  designs.  Dead time  is the time period during  which both the high and  low  side power transistors (Q1  and  Q2 in  Figure 25)  are o.  Any overlap in Q1 and Q2 conduction will result in large  currents  owing  through  the  power  devices  between  the high and low voltage motor rails.
Figure 36. Waveforms for dead time.
23
Figure 35. Minimum LED skew for zero dead time.
Page 24
OUTPUT POWER – P
S
, INPUT CURRENT – I
S
0
0
TS – CASE TEMPERATURE – °C
175
1000
50
400
12525 75 100 150
600
800
200
100
300
500
700
900
HCNW3120
PS (mW) IS (mA)
OUTPUT POWER – P
S
, INPUT CURRENT – I
S
0
0
TS – CASE TEMPERATURE – °C
200
600
400
25
800
50 75 100
200
150 175
PS (mW)
125
100
300
500
700
IS (mA) FOR HCPL-3120 OPTION 060 IS (mA) FOR HCPL-J312
HCPL-3120 OPTION 060éHCPL-J312
To minimize dead time in a given design, the turn on of  LED2 should be delayed (relative to the turn o of LED1)  so that  under worst-case  con-ditions, transistor  Q1 has  just turned o when transistor Q2 turns on, as shown in  Figure 35. The amount of delay necessary to achieve this  conditions is equal to the maximum value of the propa­gation delay  dierence specication, PDD
, which  is 
MAX
specied  to  be  350 ns  over the  operating temperature  range of -40°C to 100°C.
Delaying the  LED signal by  the maximum propagation  delay dierence ensures that the minimum dead time is  zero, but it does not tell a  designer what the maximum 
dead time will be. The maximum dead time is equivalent  to the dierence between the  maximum and minimum  propagation delay dierence specications as shown in  Figure 36. The maximum dead time for the HCPL-3120 is  700 ns (=  350 ns - (-350 ns)) over  an operating  tempera­ture range of -40°C to 100°C.
Note that the propagation delays used to calculate PDD  and dead time are taken at equal temperatures and test  conditions since  the optocouplers  under consideration  are typically  mounted in  close proximity to  each other  and are switching identical IGBTs.
Figure 37. Thermal derating curve, dependence of safety limiting value with case temperature per IEC/EN/DIN EN 60747-5-2.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes AV01-0622EN AV02-0161EN - July 4, 2008
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