Datasheet HCF4044B, HCF4043B Datasheet (SGS Thomson Microelectronics)

Page 1
QUAD N OR R-S LATC H-4043B QUAD N AND R-S LATC H-4 044B
.QUIESCENT CURRENT SPECIFIED TO 20V
FOR HCC DEVICE
.3-LEVEL OUTPUTS WITHCOMMON OUTPUT
ENABLE
EACHLATCH
.5V, 10V,AND 15V PARAMETRIC RATINGS
.NOR AND NAND CONFIGURATIONS
.INPUT CURRENTOF 100nAAT18V AND 25°C
FOR HCC DEVICE
.100% TESTEDFOR QUIESCENTCURRENT
.MEETSALLREQUIREMENTSOFJEDECTEN-
TATIVESTANDARDN°13A,”STANDARDSPE­CIFICATIONS FOR DESCRIPTION OF ”B” SERIESCMOS DEVICES”
HCC/HCF4043B HCC/HCF4044B
QUAD 3-STATER-S LATCHES
EY
(Plastic Package)
M1
(MicroPackage)
ORDER CODES :
HCC40XXBF HCF40XXBM1 HCF40XXBEY HCF40XXBC1
(CeramicFrit Seal Package)
(Plastic Chip Carrier)
F
C1
DESCRIPTI ON
The HCC4043B, HCC4044B, (extended tempera- ture range) and the HCF4043B, HCF4044B (inter- mediate temperature range) are monolithic integrated circuits, available in 16-lead dual in-line plastic or ceramic package and plastic micropack­age. The HCC/HCF4043B types are quad cross- coupled 3-state COS/MOS NOR latches and the HCC/HCF4044B types are quad cross-coupled 3­state COS/MOS NAND latches. Each latch has a separate Q output and individual SET and RESET inputs. The Q outputs are controlledby a common ENABLE input.A logic”1” or”high” onthe ENABLE input connectsthe latch states to theQ outputs. A logic ”0” or”low” on the ENABLEinput disconnects the latch states from the Q outputs, resulting in an open circuit condition on the Q outputs. The open circuit feature allows common bussing of the out­puts.
PIN C ONN ECT IONS
4043B
4044B
June1989
1/13
Page 2
HCC/HCF4043B/4044B
FUN CTIONAL DIAG R A MS
4043B 4044B
ABSOLUTE MAXIMUM RATIN GS
Symbol Parameter Value Unit
V
* Supply Voltage :HC C Types
DD
HCF Types
V
Input Voltage – 0.5 to VDD+ 0.5 V
i
I
DC Input Current (any one input) ± 10 mA
I
P
Total Power Dissipation (per package)
tot
Dissipation per Output Transistor for Top= Full Package-temperature Range
T
Operating Temperature : HCC Types
op
HCF Types
T
Stresses above those listed under ”Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability. * All voltage values are referred to VSSpin voltage.
Storage Temperature – 65 to + 150 °C
stg
– 0.5 to + 20 – 0.5 to + 18
200 100
– 55 t o + 125
–40to+85
V V
mW mW
°C °C
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Value Unit
V
T
2/13
Supply Voltage :HC C Types
DD
HCF Types
V
Input Voltage 0 to V
I
Operating Temperature : HCC Types
op
HCF Types
3to18 3to15
DD
– 55 t o + 125
–40to+85
V V
V
°C °C
Page 3
LOGI C DI AGRAMS
HCC/HCF4043B/4044B
4044B 4043B
STATIC ELECTRICAL CHARACTERISTICS (over recommended operatingconditions)
Test Conditions Valu e
Symbol Parameter
(V) (V) (µA) (V)
I
L
Quiescent Current
HCC Types
0/ 5 5 1 0.02 1 30 0/10 10 2 0.02 2 60 0/15 15 4 0.02 4 120 0/20 20 20 0.04 20 600
HCF Types
OH
Output High
V
Voltage
0/ 5 5 4 0.02 4 30 0/10 10 8 0.02 8 60 0/15 15 16 0.02 16 120 0/ 5 < 1 5 4.95 4.95 4.95 0/10 < 1 10 9.95 9.95 9.95 0/15 < 1 15 14.95 14.95 14.95
V
OL
Output Low Voltage
5/0 < 1 5 0.05 0.05 0.05 10/0 < 1 10 0.05 0.05 0.05 15/0 < 1 15 0.05 0.05 0.05
IH
Input High
V
Voltage
*T
=–55°CforHCC device : – 40°CforHCF device.
Low
*T
= + 125°CforHCC device : + 85°CforHCF device.
High
The Noise Margin for both ”1” and ”0” level is : 1V min. with VDD= 5V, 2V min. with VDD= 10V, 2.5V min. with VDD= 15V.
V
V
I
O
|IO|V
DD
T
* 25°CT
Low
Min. Max. Min. Typ. M ax. Min. Max.
0.5/4.5 < 1 5 3.5 3.5 3.5 1/9 < 1 10 7 7 7
1.5/13.5 < 1 15 11 11 11
High
*
Unit
µA
V
V
V
3/13
Page 4
HCC/HCF4043B/4044B
STATIC ELECTRICAL CHARACTERISTICS (continued)
Test Conditions Valu e
Symbol Parameter
(V) (V) (µA) (V)
IL
Input Low
V
Voltage
I
OH
Output Drive Current
HCC Types
0/ 5 2.5 5 – 2 – 1.6 – 3.2 – 1.15 0/ 5 4.6 5 – 0.64 – 0.51 – 1 – 0.36 0/10 9.5 10 – 1.6 – 1.3 – 2.6 – 0.9 0/15 13.5 15 – 4.2 – 3.4 – 6.8 – 2.4 0/ 5 2.5 5 – 1.53 – 1.36 – 3.2 – 1.1
HCF Types
0/ 5 4.6 5 – 0.52 – 0.44 – 1 – 0.36 0/10 9.5 10 – 1.3 – 1.1 – 2.6 – 0.9 0/15 13.5 15 – 3.6 – 3.0 – 6.8 – 2.4
OL
Output Sink Current
HCC Types
I
HCF Types
I
IH,IIL
Input leakage Current
HCC Types
HCF Types
I
OH
3-state Output
HCC Types
HCF Types
Input Capacitance Any Input 5 7.5 pF
C
I
*T
=–55°CforHCC device : – 40°CforHCF device.
Low
*T
= + 125°CforHCC device : + 85°CforHCF device.
High
The Noise Margin for both ”1” and ”0” level is : 1V min. with VDD= 5V, 2V min. with VDD= 10V, 2.5V min. with VDD= 15V.
0/ 5 0.4 5 0.64 0.51 1 0.36 0/10 0.5 10 1.6 1.3 2.6 0.9 0/15 1.5 15 4.2 3.4 6.8 2.4 0/ 5 0.4 5 0.52 0.44 1 0.36 0/10 0.5 10 1.3 1.1 2.6 0.9 0/15 1.5 15 3.6 3.0 6.8 2.4
0/18
0/15
0/18 0/18 18 ± 0.4 ±10
0/15 0/15 15 ± 1.0 ±10
V
V
I
O
|IO|V
DD
T
* 25°CT
Low
Min. Max. Min. Typ. M ax. Min. Max.
4.5/0.5 < 1 5 1.5 1.5 1.5 9/1 < 1 10 3 3 3
13.5/1.5 < 1 15 4 4 4
18 ± 0.1 ±10
–5
± 0.1 ± 1
Any Input
15 ± 0.3 ±10
–5
± 0.3 ± 1
–4
± 0.4 ± 12
–4
± 1.0 ± 7.5
High
*
Unit
V
mA
mA
µA
µA
DYNAMIC ELECTRICAL CHARACTERISTICS (T
=25°C, CL= 50pF, RL= 200k,
amb
typical temperature coefficient for all VDDvalues is 0.3%/°C, all input rise and fall times = 20ns)
Symbol Parameter
t
PLH,tPHL
Propagation Delay Time (SET or RESET to Q)
t
PZH,tPHZ
3-state Propagation Delay Time (ENABLE to Q)
4/13
Test Co n di t i ons Value
V
(V) Min. Typ. Max.
DD
5150300 10 70 140 15 50 100
5115230 10 55 110 15 40 80
Unit
ns
ns
Page 5
DYNAMIC ELECTRICAL CHARACTERISTICS (continued)
HCC/HCF4043B/4044B
Symbol Parameter
t
PL Z,tPZL
t
TLH,tTHL
t
W
Propagation Delay Time 5 90 180
Transition Time 5 100 200
Pulse Width (SET or RESET) 5 160 80
Test Co n di t i ons Value
V
(V) Min. Typ. Max.
DD
10 50 100 15 35 70
10 50 100 15 40 80
10 80 40 15 40 20
Typical Output Low (sink)Current. Minimum Output Low (sink) Current Charac-
teristics.
Unit
ns
ns
ns
Typical Output High (source)Current Charac­teristics.
Minimum Output High (source) Current Charac­teristics.
5/13
Page 6
HCC/HCF4043B/4044B
Typical TransitionTime vs. Load Capacitance. TypicalPropagation Delay Timevs. LoadCapacit-
ance (SET, RESETto Q, Q).
TypicalPower Dissipation/device vs. Frequency.
Switch Bounce Eliminator.
4043B
6/13
4044B
Page 7
APPLICATIONS
MULTIPLEBUS STORAGE.
HCC/HCF4043B/4044B
7/13
Page 8
HCC/HCF4043B/4044B
TEST CIRCUITS
QuiescentDevice Current. Input Voltage.
Input Current.
EnablePropagation Delay Time and Waveforms.
Test IN I N A
8/13
t
PHZ
t
PLZ
t
PZH
t
PZL
Z = High impedance.
V
DD
V
SS
V
DD
V
SS
V
SS
V
DD
V
SS
V
DD
V
SS
V
DD
V
SS
V
DD
Page 9
HCC/HCF4043B/4044B
Plastic DIP16 (0.25) MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
a1 0.51 0.020
B 0.77 1.65 0.030 0.065
b 0.5 0.020
b1 0.25 0.010
D 20 0.787 E 8.5 0.335
e 2.54 0.100
e3 17.78 0.700
F 7.1 0.280
I 5.1 0.201
L 3.3 0.130
Z 1.27 0.050
mm inch
P001C
9/13
Page 10
HCC/HCF4043B/4044B
Ceramic DIP16/1 MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 20 0.787 B 7 0.276 D 3.3 0.130 E 0.38 0.015
e3 17.78 0.700
F 2.29 2.79 0.090 0.110 G 0.4 0.55 0.016 0.022 H 1.17 1.52 0.046 0.060
L 0.22 0.31 0.009 0.012 M 0.51 1.27 0.020 0.050 N 10.3 0.406
P 7.8 8.05 0.307 0.317
Q 5.08 0.200
mm inch
10/13
P053D
Page 11
SO16 (Narrow) MECHANICAL DATA
HCC/HCF4043B/4044B
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 1.75 0.068 a1 0.1 0.2 0.004 0.007 a2 1.65 0.064
b 0.35 0.46 0.013 0.018
b1 0.19 0.25 0.007 0.010
C 0.5 0.019
c1 45° (typ.)
D 9.8 10 0.385 0.393
E 5.8 6.2 0.228 0.244
e 1.27 0.050
e3 8.89 0.350
F 3.8 4.0 0.149 0.157
G 4.6 5.3 0.181 0.208
L 0.5 1.27 0.019 0.050
M 0.62 0.024
S8°(max.)
mm inch
P013H
11/13
Page 12
HCC/HCF4043B/4044B
PLCC20 MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 9.78 10.03 0.385 0.395
B 8.89 9.04 0.350 0.356
D 4.2 4.57 0.165 0.180 d1 2.54 0.100 d2 0.56 0.022
E 7.37 8.38 0.290 0.330
e 1.27 0.050
e3 5.08 0.200
F 0.38 0.015 G 0.101 0.004 M 1.27 0.050
M1 1.14 0.045
mm inch
12/13
P027A
Page 13
HCC/HCF4043B/4044B
Information furnished isbelieved tobe accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of suchinformation nor for any infringementof patents orother rights of third parties which mayresults from its use. No license is granted by implication or otherwise underany patent or patent rights of SGS-THOMSON Microelectronics. Specificationsmentioned in this publicationare subject to changewithout notice.This publication supersedesand replaces allinformation previously supplied. SGS-THOMSON Microelectronicsproductsare notauthorized for use ascritical componentsin life supportdevices or systems without express written approval of SGS-THOMSON Microelectonics.
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