Page 1
.STANDARDIZED SYMMETRICAL OUTPUT
CHARACTERISTICS
.QUIESCENT CURRENT SPECIFIED AT 20V
FOR HCC DEVICE
.5V, 10V,AND 15V PARAMETRIC RATINGS
.INPUTCURRENTOF100nA AT18VAND25°C
FOR HCC DEVICE
.100% TESTEDFOR QUIESCENTCURRENT
.MEETSALLREQUIREMENTSOFJEDECTEN-
TATIVE STANDARD No. 13A, ”STANDARD
SPECIFICATIONS FOR DESCRIPTIONOF ”B”
SERIESCMOS DEVICES”
HCC/H CF4 01 74B
HEX ”D” – TYPE FLIP–FLOP
EY
(Plastic Package)
M1
(MicroPackage)
ORDERCODES :
HCC40174BF HCF40174BM1
HCF40174BEY HCF40174BC1
(Ceramic Frit SealPackage)
(Plastic Chip Carrier)
F
C1
DESCRIPTION
The HCC40174B (extended temperature range)
andHCF40174B (intermediate temperature range)
are monolithic integrated circuits available in 16lead dual in-line plastic or ceramic package and
plasticmicropackage.
The HCC/HCF40174B consistsof six identical ’D’ -
typeflip-flopshavingindependent DATAinputs.The
CLOCK and CLEAR inputs are common to all six
units. Data is transferred to the Q outputs on the
positive-going transition of the clock pulse. All six
flip-flopsare simultaneously reset by a low levelon
the CLEAR input.
PIN CONNECTIONS
June 1989
1/12
Page 2
HCC/HCF40174B
FUNCTIONAL DIAGRAM
ABSOLUTE MA XIM UM RATIN GS
Symbol Parameter Value Unit
V
* Supply Voltage : HCC Types
DD
HCF Types
V
Input Voltage – 0.5 to VDD+ 0.5 V
i
I
DC Input Current (any one input) ± 10 mA
I
P
Total Power Dissipation (per package)
tot
– 0.5 to + 20
– 0.5 to + 18
200
V
V
mW
Dissipation per Output Transistor
for Top= Full Package-temperature Range
T
Operating Temperature : HC C Types
op
HCF Types
T
Stresses above those listed under ”Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device
reliability.
Storage Temperature – 65 to + 150 °C
stg
100
–55to+125
–40to+85
mW
°C
°C
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Valu e Unit
V
Supply Voltage : HCC Types
DD
HCF Types
V
Input Voltage 0 to V
I
T
Operating Tem perature : HCC Types
op
HCF Types
3to18
3to15
DD
– 55 to + 125
–40to+85
V
V
V
°C
°C
2/12
Page 3
LOGIC DIAGRAM (1 of 6 Flip-Flops)
HCC/HCF40174B
TRUTH TABLE
Inputs Output
ClockDataClear Q
–
/
–
–
/
–
–
\
–
XX0 0
1 = High Level X = Don’t Care
0 = Low Level NC = No Change
010
111
X1NC
3/12
Page 4
HCC/HCF40174B
STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions)
Test Conditions Valu e
Symbol Parameter
I
Quiescent
L
Current
HCC
Types
HCF
Types
V
OH
Output High
Voltage
V
OL
Output Low
Voltage
V
IH
Input High
Voltage
V
IL
Input Low
Voltage
I
OH
Output
Drive
Current
HCC
Types
HCF
Types
I
OL
Output
Sink
Current
HCC
Types
HCF
Types
I
IH,IIL
Input
Leakage
Current
HCC
Types
HCF
Types
Input Capacitance Any Input 5 7.5 pF
C
I
*T
=–55°CforHCC device : – 40°C for HCF device.
Low
*T
= + 125°C for HCC device : + 85°C for HCF device.
High
TheNoiseMargin for both ”1” and ”0” levelis : 1V min.with VDD=5V, 2V min.withVDD= 10V,2.5 V min.with VDD= 15V.
V
V
O
|IO|V
I
(V) (V) (µA) (V)
T
DD
* 25°CT
Low
Min. Max. Min. Typ. Max. Min. Max.
High
0/ 5 5 1 0.02 1 30
0/10 10 2 0.02 2 60
0/15 15 4 0.02 4 120
0/20 20 20 0.04 20 600
0/ 5 5 4 0.02 4 30
0/10 10 8 0.02 8 60
0/15 15 16 0.02 16 120
0/ 5 < 1 5 4.95 4.95 4.95
0/10 < 1 10 9.95 9.95 9.95
0/15 < 1 15 14.95 14.95 14.95
5/0 < 1 5 0.05 0.05 0.05
10/0 < 1 10 0.05 0.05 0.05
15/0 < 1 15 0.05 0.05 0.05
0.5/4.5 < 1 5 3.5 3.5 3.5
1/9 < 1 10 7 7 7
1.5/13.5 < 1 15 11 11 11
4.5/0.5 < 1 5 1.5 1.5 1.5
9/1 < 1 10 3 3 3
13.5/1.5 < 1 15 4 4 4
0/ 5 2.5 5 – 2 – 1.6 – 3.2 – 1.15
0/ 5 4.6 5 – 0.64 – 0.51 – 1 – 0.36
0/10 9.5 10 – 1.6 – 1.3 – 2.6 – 0.9
0/15 13.5 15 – 4.2 – 3.4 – 6.8 – 2.4
0/ 5 2.5 5 – 1.53 – 1.36 – 3.2 – 1.1
0/ 5 4.6 5 – 0.52 – 0.44 – 1 – 0.36
0/10 9.5 10 – 1.3 – 1.1 – 2.6 – 0.9
0/15 13.5 15 – 3.6 – 3.0 – 6.8 – 2.4
0/ 5 0.4 5 0.64 0.51 1 0.36
0/10 0.5 10 1.6 1.3 2.6 0.9
0/15 1.5 15 4.2 3.4 6.8 2.4
0/ 5 0.4 5 0.52 0.44 1 0.36
0/10 0.5 10 1.3 1.1 2.6 0.9
0/15 1.5 15 3.6 3.0 6.8 2.4
0/18
18 ± 0.1 ±10
–5
± 0.1 ± 1
Any Input
0/15
15 ± 0.3 ±10
–5
± 0.3 ± 1
Unit
*
µA
V
V
V
V
mA
mA
µA
4/12
Page 5
HCC/HCF40174B
DYNAMIC ELECTRICAL CHARACTERISTICS (T
=25°C, CL= 50pF, RL= 200kΩ,
amb
typical temperature coefficient for all VDDvalues is 0.3%/°C, all input rise and fall time = 20ns)
Symbol Parameter
t
,
Propagation Delay Time
Clock to Output
Propagation Delay Time
t
t
PLH
PHL
PHL
Clear to Output
t
,
THL
t
TLH
t
setup
t
hol d
t
Transition Time 5 100 200
Data Setup Time 5 40 20
Data Hold Time 5 80 40
Clock Input Pulse Width
W
Low Level
t
Clock Input Pulse Width
W
High Level
t
Clear Input Pulse Width
W
Low Level
t
r,tf
t
rem
f
CL
Clock Input Rise or Fall Time 5 15
Clear Removal Time 5 0 – 40
Maximum Clock Input Frequency 5 3.5 7
Test Conditions Value
V
(V) Min. Typ. Max.
DD
5 150 300
10 70 140
15 50 100
5 100 200
10 50 100
15 40 80
10 50 100
15 40 80
10 20 10
15 10 0
10 40 20
15 30 15
5 130 65
10 60 30
15 40 20
5 130 65
10 60 30
15 40 20
5 100 50
10 50 25
15 40 20
10 15
15 15
10 0 – 15
15 0 – 10
10 6 12
15 8 16
Unit
ns
ns
ns
ns
ns
ns
ns
ns
µs
ns
MHz
5/12
Page 6
HCC/HCF40174B
WAVEFORMS
OutputLow (sink) Current Characteristics. Output High (source) Current Characteristics.
TypicalPropagationDelayTime(clocktooutput) vs.
Load Capacitance.
6/12
TypicalTransition Time vs. Load Capacitance.
Page 7
TypicalDynamical PowerDissipation vs. ClockFrequency.
TEST CIRCUITS
HCC/HCF40174B
QuiescentDevice Current.
Input Leakage Current.
Input Voltage.
Dynamic Power Dissipation.
7/12
Page 8
HCC/HCF40174B
Plastic DIP16 (0.25) MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
a1 0.51 0.020
B 0.77 1.65 0.030 0.065
b 0.5 0.020
b1 0.25 0.010
D 20 0.787
E 8.5 0.335
e 2.54 0.100
e3 17.78 0.700
F 7.1 0.280
I 5.1 0.201
L 3.3 0.130
Z 1.27 0.050
mm inch
8/12
P001C
Page 9
Ceramic DIP16/1 MECHANICAL DATA
HCC/HCF40174B
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 20 0.787
B 7 0.276
D 3.3 0.130
E 0.38 0.015
e3 17.78 0.700
F 2.29 2.79 0.090 0.110
G 0.4 0.55 0.016 0.022
H 1.17 1.52 0.046 0.060
L 0.22 0.31 0.009 0.012
M 0.51 1.27 0.020 0.050
N 10.3 0.406
P 7.8 8.05 0.307 0.317
Q 5.08 0.200
mm inch
P053D
9/12
Page 10
HCC/HCF40174B
SO16 (Narrow) MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 1.75 0.068
a1 0.1 0.2 0.004 0.007
a2 1.65 0.064
b 0.35 0.46 0.013 0.018
b1 0.19 0.25 0.007 0.010
C 0.5 0.019
c1 45° (typ.)
D 9.8 10 0.385 0.393
E 5.8 6.2 0.228 0.244
e 1.27 0.050
e3 8.89 0.350
F 3.8 4.0 0.149 0.157
G 4.6 5.3 0.181 0.208
L 0.5 1.27 0.019 0.050
M 0.62 0.024
S8°(max.)
mm inch
10/12
P013H
Page 11
PLCC20 MECHANICAL DATA
HCC/HCF40174B
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 9.78 10.03 0.385 0.395
B 8.89 9.04 0.350 0.356
D 4.2 4.57 0.165 0.180
d1 2.54 0.100
d2 0.56 0.022
E 7.37 8.38 0.290 0.330
e 1.27 0.050
e3 5.08 0.200
F 0.38 0.015
G 0.101 0.004
M 1.27 0.050
M1 1.14 0.045
mm inch
P027A
11/12
Page 12
HCC/HCF40174B
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringementofpatents or other rights of third parties which may results from its use. No
license isgranted by implication orotherwiseunder any patentor patent rights ofSGS-THOMSON Microelectronics. Specificationsmentioned
in this publication are subject to changewithout notice. This publication supersedes andreplaces all information previously supplied.
SGS-THOMSON Microelectronicsproductsare notauthorized foruse ascritical componentsin lifesupport devices orsystemswithoutexpress
written approval of SGS-THOMSON Microelectonics.
1994 SGS-THOMSON Microelectronics - All RightsReserved
Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands -
Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - UnitedKingdom - U.S.A
SGS-THOMSON MicroelectronicsGROUP OF COMPANIES
12/12
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