Datasheet HCF40105BE Specification

Page 1
HCF40105B
FIFO REGISTER
■ INDEPENDENT ASYNCHRONOUS INPUTS
AND OUTPUTS
■ 3-STATE OUTPUTS
■ EXPANDABLE IN EITHER DIRECTION
■ STATUS INDICATORS ON INPUT AND
OUTPUT
■ RESET CAPABILITY
CHARACTERISTIC S
■
QUIESCENT CURRENT SPECIF. UP TO 20V
■ 5V , 10V AND 15V PARAMETRIC RATINGS
■ INPUT LEAKAGE CURRENT
I
= 100nA (MAX) AT VDD = 18V TA = 25°C
I
■ 100% TESTED FOR QUIESCENT CURRENT
■ MEETS ALL REQUIREMENTS OF JEDEC
JESD13B " STANDARD SPECIFICATIONS FOR DESCRIPTI ON OF B SERI ES CMOS DEVICES"
DESCRIPTION
HCF40105B is a monolithic integrated circuit fabricated in Metal Oxide Semiconductor technology available in DIP packages. HCF40105B is a low power first-in-first-out (FIFO) "elastic" storage register that can store 164-bit words. It is capable of handling input and output data at different shifting rates. This feature makes it particularly useful as a buffer between asynchronous systems. Each word position in the register is clocked by a control flip-flop, which stores a marker bit. "1" signifies that the position’s data is filled and "0" denotes a vacancy in that
DIP
ORDER CODES
PACKAGE TUBE T & R
DIP HCF40105BEY
position. The control flip-flop dete cts the state of the preceding flip-flop and c ommunicates its ow n status to the succeeding f lip-flop. When a control flip flop is in the "0" state and sees a "1" in the preceding flip-flop, it generates a clock pulse that transfers data from the preceding four data latches into its own four data latches and resets the preceding flip-flop to "0". The first and last control flip-flops have buffered outputs. Since all empty locations "bubble" automatically to the input end, and all valid data ripples through to the output end, the status of the first control flip-flop (DATA-IN READY) indicates if the FIFO is full, and the status of the last flip-flop (DATA-OUT READY) indicates if the FIFO contains data. As the earliest data is removed from the bottom of the data stack (the output and), all data entered later will automatically propagate (ripple) toward the output.
PIN CONNECTION
1/12October 2002
Page 2
HCF40105B
INPUT EQUIVALENT CIRCUIT PIN DESCRIPTION
PIN No SYMBOL NAME AND FUNCTION
1 2 DIR Data-In Ready
3 SI Shift In 15 SO Shift Out 14 DOR Data-Out Ready
4, 5, 6, 7 D0 to D3 Input Buffers
13, 12, 11,
10
9 MR Master Reset
8 VSS Negative Supply Voltage 16 VDD Positive Supply Voltage
FUNCTIONAL DIAGRAM
3-STATE
CONTROL
Q0 to Q3 Output Buffers
3-State Control
TRUTH TABLE
CONTROL INPUTS
CLR
HHHH H H H L Count Down H H L X Preset on Next Positive Clock Transition HLXX
L X X X Clear to Maximum Count
X : Don’t Care Clock connected t o Cl ock input Synchronous Operation : changes occur on negative to positive clock transitions.
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APE SPE CI/CE
PRESET MODE ACTION
Inhibit Counter
Synchronous
Asynchronous
Preset Asynchronously
Page 3
LOGIC DIAGRAM
HCF40105B
TIMING CHART
3/12
Page 4
HCF40105B
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
V
P
T
T
Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is not implied. All voltage values are referred to V
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Value Unit
V
V
T
Supply Voltage
DD
DC Input Voltage -0.5 to VDD + 0.5
I
I
DC Input Current
I
Power Dissipation per Package 200 mW
D
-0.5 to +22 V
10 mA
±
Power Dissipation per Output Transistor 100 mW Operating Temperature
op
Storage Temperature
stg
pin voltage.
SS
Supply Voltage
DD
Input Voltage 0 to V
I
Operating Temperature
op
-55 to +125 °C
-65 to +150 °C
3 to 20 V
DD
-55 to 125 °C
V
V
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Page 5
DC SPECIFICATIONS
Test Condition Value
T
Symbol Parameter
I
Quiescent Current 0/5 5 0.04 5 150 150
L
V
(V)
V
I
(V)
|I
|
O
O
(µA)
V
DD
(V)
= 25°C
A
Min. Typ. Max. Min. Max. Min. Max.
0/10 10 0.04 10 300 300 0/15 15 0.04 20 600 600 0/20 20 0.08 100 3000 3000
V
High Level Output
OH
Voltage
0/5 <1 5 4.95 4.95 4.95
0/15 <1 15 14.95 14.95 14.95
Low Level Output
V
OL
Voltage
5/0 <1 5 0.05 0.05 0.05
15/0 <1 15 0.05 0.05 0.05
High Level Input
V
IH
Voltage
0.5/4.5 <1 5 3.5 3.5 3.5
1.5/13.5 <1 15 11 11 11
V
IL
Low Level Input Voltage
4.5/0.5 <1 5 1.5 1.5 1.5
13.5/1.5 <1 15 4 4 4
I
OH
Output Drive Current
0/5 2.5 <1 5 -1.36 -3.2 -1.1 -1.1
0/5 4.6 <1 5 -0.44 -1 -0.36 -0.36 0/10 9.5 <1 10 -1.1 -2.6 -0.9 -0.9 0/15 13.5 <1 15 -3.0 -6.8 -2.4 -2.4
I
OL
Output Sink Current
0/5 0.4 <1 5 0.44 1 0.36 0.36
0/15 1.5 <1 15 3.0 6.8 2.4 2.4
Input Leakage
I
I
Current
C
Input Capacitance
I
The Noi se Margin fo r both "1" and "0" level is: 1V min. with VDD=5V, 2V min. with VDD=10V, 2.5V min. with VDD=15V
0/18 Any Input 18
Any Input 5 7.5 pF
-5
10
±
-40 to 85°C -55 to 125°C
0.1
±
1
±
HCF40105B
Unit
A
µ
V0/10 <1 10 9.95 9.95 9.95
V10/0 <1 10 0.05 0.05 0.05
V1/9 <1 10 7 7 7
V9/1 <1 10 3 3 3
mA
mA0/10 0.5 <1 10 1.1 2.6 0.9 0.9
1
±
A
µ
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HCF40105B
DYNAMIC ELECTRICAL CHARACTERISTICS (T
Symbol Parameter
t
Propagation Delay Time
PHL
Shift-out or Reset to Data out Ready
t
t
PZH tPLZ
t
PHZ tPLZ
t
t
THL tTLH
t
t
t
setup
t
t
Propagation Delay Time
PHL
Shift-in to Data-in Ready
Propagation Delay Time 3-State Control to Data-out
Propagation Delay Time 3-State Control to data-out
Ripple-trough Delay Input
PLH
to Output
Transition Time 5 100 200
Shift-in or Shift-out Rate 5 1.5 3
f
I
Shift-in Pulse Width 5 200 100
WH
Shift-out Pulse Width 5 360 180
WL
Shift-in or Shift-out Rise
t
r
Time
Shift-in Fall Time 5 15
t
f
Shift-out Fall Time 5 15
t
f
Data Setup Time 5 0
Data Hold Time 5 350 175
hold
Data-in Ready Pulse Width 5 260 520
WL
(V)
V
DD
5 185 370
15 65 130
5 160 320
15 45 90
5 140 280
15 40 80
5 100 200
15 40 80
524
15 0.7 1.4
15 40 80
15 4 8
15 60 30
15 100 50
515
15 15
15 15
15 5
15 0
15 120 60
15 70 140
= 25°C, CL = 50pF, RL = 200KΩ, tr = tf = 20 ns)
amb
Test Condition Value (*) Unit
Min. Typ. Max.
ns10 90 180
ns10 65 130
ns10 60 120
ns10 50 100
µs10 1 2
ns10 50 100
MHz10 3 6
ns10 80 40
ns10 160 80
µs10 15
µs10 15
µs10 5
ns10 0
ns10 150 75
ns10 100 120
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Page 7
HCF40105B
Symbol Parameter
t
Data-out Ready Pulse
WL
Width
(V)
V
DD
5 220 440
15 665 130
Test Condition Value (*) Unit
t
Master Reset Pulse Width 5 200 100
WH
15 60 30
(*) Typical temperature coefficient for all VDD value is 0.3 %/°C.
TYPICAL APPLICATION: EXPANSION, 4 BIT-WIDE-BY-16 N-BITS LONG.
Min. Typ. Max.
ns10 90 180
ns10 90 45
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HCF40105B
TYPICAL APPLICATION: EXPANSION, 8 BITS-WIDE-BY-16 N-BITS LONG.
APPLICATION INFORMATION
LOADING DATA Data can be entered whenever the DATA-IN
READY (DIR) flag is high by a low to high transition on the SHIFT-IN (SI) input. This input must go low mom entarily before the next word is accepted by the FIFO. The DIR flag will go low momentarily until the data has been transferred to the second location. The flag will remain low when all 16-word locations are filled with valid data, and further pulses on the SI in put will be ign ored until DIR goes high.
UNLOADING DATA As soon as the first word has rippled to the output,
DATA-OUT READY (DOR) goes high, and data can be removed by a falling edge on the SO input. This falling edge causes the DOR signal to go low while the word on the output is dum ped and the next word mov es to the output. As long as vali d data is available in the FIFO, the DOR s ignal will go high again signifying that the next word is ready at the output. When t he FIFO is empt y, DOR will remain low, and any further commands will be ignored until a "1" marker ripples down to the last control register, when DOR goe s high. Un loading of data is inhibited while the 3-state control input is high. The 3-state control signal should not be shifted from high to low (data outputs turned on)
while the SHIFT-OUT is at logic "0". This level change causes the first word to be shifted out (unloaded) immediately and the data to be lost.
CASCADING HCF40105B can be cascaded to form longer
registers simply by connect ing the DIR to SO a nd DOR to SI. In the cascaded mode, a MASTER RESET pulse must be applied after the supply voltage is turned on. For w ords wider than 4 -bits, the DIR and the DOR outputs must be gated together with AND gates. T heir outputs drive the SI and SO inputs in p arallel, if ex panding is done in both directions.
3-STATE OUTPUTS In order to f acilitate data busi ng, 3-state outputs
are provided on the data output lines, while the load condition of the regi ster can be detected by the state of the DOR output.
MASTER RESET A high on the MASTER RESET (MR) sets all the
control logic marker bits to "0". DOR goes low and DIR goes high. The cont ents of the data register do not change, only declared invalid, an d will be superseded when the first word is loaded.
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Page 9
TEST CIRCUIT
TEST SWITCH
t
, t
PLH
PHL
, t
t
PZL
PLZ
t
, t
PZH
PHZ
CL = 50pF or equivalent (in cludes jig and probe capac i t ance)
= 200K
R R
Ω
L
= Z
of pulse generator (typically 50Ω)
T
OUT
HCF40105B
Open
V
DD
V
SS
WAVEFORM 1 : PROPAGATION DELAY TIMES (f=1MHz; 50% duty cycle)
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HCF40105B
WAVEFORM 2 : OUTPUT ENABLE AND DISABLE TIME (f=1MHz; 50% duty cycle)
WAVEFORM 3 : MINIMUM SETUP AND HOLD TIME (f=1MHz; 5 0% duty cycl e )
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HCF40105B
Plastic DIP-16 (0.25) MECHANICAL DATA
mm. inch
DIM.
MIN. TYP MAX. MIN. TYP. MAX.
a1 0.51 0.020
B 0.77 1.65 0.030 0.065 b 0.5 0.020
b1 0.25 0.010
D 20 0.787 E 8.5 0.335 e 2.54 0.100
e3 17.78 0.700
F 7.1 0.280
I 5.1 0.201 L 3.3 0.130 Z 1.27 0.050
P001C
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HCF40105B
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibi lity f or the consequences of use of such informatio n nor for any infringement of paten ts or o ther rig hts of t hird part ies which ma y result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previousl y suppl ied. STM icroel ectronics produc ts are not auth orized for use as c ritica l compone nts in l ife s upport dev ices or systems without express written approval of STMicroelectronics.
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