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HI-SINCERITY
MICROELECTRONICS CORP.
HBC558
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HBC558 is designed for switching and AF amplifier amplification
suitable for automatic insertion in thick and thin-film circuits.
Spec. No. : HA200104
Issued Date : 2001.10.01
Revised Date : 2001.10.23
Page No. : 1/3
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature ........................................................................................... -55 ~ +150 °C
Junction Temperature.................................................................................................... +150 °C
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)............................................................................... 500 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage........................................................................................ -30 V
VCEO Collector to Emitter Voltage..................................................................................... -30 V
VEBO Emitter to Base Voltage............................................................................................ -5 V
IC Collector Current....................................................................................................... -100 mA
Characteristics
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -30 - - V IC=-100uA
BVCEO -30 - - V IC=-1mA
BVEBO -5 - - V IE=-10uA
ICBO - - -15 nA VCB=-30V
*VCE(sat)1 - -90 -300 mV IC=-10mA, IB=-0.5mA
*VCE(sat)2 - -250 -650 mV IC=-100mA, IB=-5mA
*VBE(sat)1 - -700 - mV IC=-10mA, IB=-0.5mA
*VBE(sat)2 - -900 - mV IC=-100mA, IB=-5mA
VBE(on)1 -600 - -750 mV VCE=-5V, IB=-2mA
VBE(on)2 - - -800 mV VCE=-5V, IB=-10mA
*hFE 110 - 800 VCE=-5V, IC=-2mA
fT - 150 - MHz VCE=-5V, IC=-10mA
Cob - - 6 pF VCB=-10V, f=1MHz
(Ta=25°C)
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
TO-92
Classification Of hFE
Rank A B C
hFE 110-220 200-450 420-800
HBC558 HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HA200104
Issued Date : 2001.10.01
Revised Date : 2001.10.23
Page No. : 2/3
1000
100
hFE
10
0.1 1 10 100 1000
10000
Curren t Gain & Co llector Cu r rent
VCE=5V
Collector Curr ent (mA)
Saturation Voltage & Collector Current
10000
1000
100
Saturation Voltage (mV)
10
1
0.1 1 10 100 1000
10000
Satu r at ion Voltage & Collector Cur rent
V
@ IC=20I
CE(s at )
Collector Current (mA )
B
On Vol t age & Coll ect or Current
1000
V
@ IC=20I
BE(sat)
Saturation Voltage (mV)
100
0.1 1 10 100 1000
1000
100
Cutoff Frequency (MHz)
Collector Current (mA)
Cutoff Frequency & Collector Current
FT @ VCE=5V
B
1000
V
@ VCE=5V
On Voltage (mV)
100
0.1 1 10 100 1000
Collector Current (mA)
BE (on)
10
1 10 100 1000
Collector Current (mA )
HBC558 HSMC Product Specification
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HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HA200104
Issued Date : 2001.10.01
Revised Date : 2001.10.23
Page No. : 3/3
α2
A
B
31
2
Marking:
Date Code
HC
B
558
Rank
α3
C
D
H
I
α1
G
Style: Pin 1.Collector 2.Base 3.Emitter
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
*: Typical
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
α1
α2
α3
-
-
-
*5°
*2°
*2°
-
-
-
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Fac tory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HBC558 HSMC Product Specification
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