Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6423-B
Issued Date : 1992.11.25
Revised Date : 2000.09.20
Page No. : 1/3
HBC557
PNP EPITAXIAL PLANAR TRANSIST OR
Description
The HBC557 is designed for use in driver stage of audio amplifier
applications.
Features
High Breakdown Voltage: 45V
•
High AC Current Gain: 75-800 at IC=2mA
•
Absolute Maximum Ratings
Maximum Temperatures
•
Storage Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature................................................................................... +150 °C Maximum
Maximum Power Dissipation
•
Total Power Dissipation (Ta=25°C)............................................................................... 500 mW
Maximum Voltages and Currents (Ta=25°C)
•
VCBO Collector to Base Voltag e....................................................................................... -50 V
VCEO Collector to Emitter Voltage .................................................................................... -45 V
VEBO Emitter to Base Voltage ............................................................................................ -5 V
IC Collector Current ..................................................................................................... -100 mA
Characteristics
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -50 - - V IC=-100uA
BVCEO -45 - - V IC=-1mA
BVEBO -5 - - V IE=-10uA
ICBO - - -100 nA VCB=-20V
IEBO - - -1 uA VEB=-5V
VBE(on)1 -600 - -750 mV IC=-2mA, VCE=-5V
VBE(on)2 - - -820 mV IC=-10mA, VCE= -5V
*VCE(sat)1 - - -300 mV IC=-10mA, IB=-1mA
*VCE(sat)2 - - -650 mV IC=-100mA, IB=-10mA
*hFE 75 - 800 VCB=-5V, IC=-2mA
fT - 300 - MHz VCE=-5V, IC=-10mA, f=100MHz
Cob - 4.5 - PF VCB=-10V, IE=0, f=1MHz
(Ta=25°C)
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
Classification of hFE
Rank A B C Normal
Range 125-260 240-500 420-800 75-260
HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6423-B
Issued Date : 1992.11.25
Revised Date : 2000.09.20
Page No. : 2/3
1000
100
hFE
10
1
1 10 100 1000
10
Current Gain & Collector Current
VCE=5V
Collector Current (mA)
On Vol t age & Collector Cur rent
100.000
10.000
1.000
Saturation Voltage (mV)
0.100
0.010
Saturation Volt age & Coll ector Current
CE(sat)
V
1 10 100 1000
Collector Current (mA)
Cut off Fr equency & Collector Cu rrent
1000
100
VCE=5V
@ IC=10I
B
1
BE(on)
V
On Voltage (mV)
0.1
1 10 100 1000
10
Capac itanc e (pF)
Capacitance & Reverse-Biased Volt age
@ VCE=5V
Collector Curren t (m A )
Cob
10
Cutoff Frequency (MHz)
1
1 10 100 1000
Collector Current (mA)
10
1
(mA)
C
0.1
Collector Current-I
Safe Operating Ar ea
PT=1ms
PT=100ms
PT=1s
1
1 10 100
Reverse Biased Volt a ge ( V)
0.01
1 10 100
Forwar d Voltage-VCE (V)
HSMC Product Specification
Page 3
HI-SINCERITY
g
MICROELECTRONICS CORP.
TO-92 Dimension
A
Spec. No. : HE6423-B
Issued Date : 1992.11.25
Revised Date : 2000.09.20
Page No. : 3/3
α
2
Marking :
C
B
31
2
α
3
HSMC Logo
Part Number
Date Code
HSMC Logo
D
Part Number
H
α
I
1
G
Style : Pin 1.Collector 2.Base 3.Emitter
Product Series
Rank
Laser Mark
Product Series
Ink Mark
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code : A
DIM
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes :
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sal es office.
1
α
2
α
3
α
-
-
-
*5
*2
*2
°
°
°
-
-
-
*:Typical
*5
°
*2
°
*2
°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringem ent of pat ents, or applic ati on assistance.
Head Office And Factory :
•
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
•
Factory 2 :
Tel : 886-3-5977061 Fax : 886-3-5979220
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
HSMC Product Specification
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