Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6422
Issued Date : 1992.11.25
Revised Date : 2001.06.15
Page No. : 1/3
HBC556
PNP EPITAXIAL PLANAR TRANSIST OR
Description
The HBC556 is primarily intended for use in driver stage of audio
amplifiers.
Features
High Breakdown Voltage: 65V at IC=1mA
•
High AC Current Gain: 75-500 at IC=2mA,VCE=5V,f=1MHz
•
Absolute Maximum Ratings
Maximum Temperatures
•
Storage Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature................................................................................... +150 °C Maximum
Maximum Power Dissipation
•
Total Power Dissipation (Ta=25°C)............................................................................... 500 mW
Maximum Voltages and Currents (Ta=25°C)
•
VCBO Collector to Base Voltage ....................................................................................... -80 V
VCEO Collector to Emitter Voltage .................................................................................... -65 V
VEBO Emitter to Base Voltage ............................................................................................ -5 V
IC Collector Current ..................................................................................................... -100 mA
Characteristics
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -80 - - V IC=-100uA, IE=0
BVCEO -65 - - V IC=-1mA, IB=0
BVEBO -5 - - V IE=-10uA, IC=0
ICBO - - -15 nA VCB=-30V, IE=0
VBE(on)1 -600 - -750 mV IC=-2mA, VCE=-5V
VBE(on)2 - - -820 mV IC=-10mA, VC E= - 5V
*VCE(sat)1 - - -300 mV IC=-10mA, IB= - 0.5 mA
*VCE(sat)2 - - -650 mV IC=-100mA, IB=-5mA
*hFE 75 - 475 VCE=-5V, IC=-2mA,
fT - 300 - MHZ VCE=-5V, IC=-10mA, f=100MHz
Cob - 4.5 - Pf VCB=-10V, IE=0, f=1MHz
(Ta=25°C)
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
Classification of hFE
Rank A B Normal
Range 125-250 220-475 75-475
HBC556 HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6422
Issued Date : 1992.11.25
Revised Date : 2001.06.15
Page No. : 2/3
1000
100
hFE
10
1
0.1 1 10 100 1000
10000
Current Gain & Collector Current
hFE @ VCE=5V
Collector Current (mA)
On Vol t age & Collector Cur rent
100000
10000
1000
Saturation Voltage (mV)
100
Saturation Volt age & Coll ector Current
BE(sat)
V
10
0.1 1 10 100 1000
B
@ IC=20I
CE(sat)
V
Collector Current (mA)
@ IC=20I
Capacitance & Reverse-Biased Voltage
10
B
1000
On Voltage (mV)
100
0.1 1 10 100 1000
1000
100
Cutoff Frequency (MHz)
Cutoff Frequency & Collector Current
Collector Curren t (m A )
VCE=5V
V
BE(on)
@ VCE=5V
Cob
Capac itanc e (pF)
1
0.1 1 10 100
Reverse-Biased Vol t a ge ( V)
Sa fe Operating Area
10000
PT=1ms
PT=100ms
PT=1s
(mA)
C
Collector Current-I
1000
100
10
10
1 10 100 1000
Collector Curren t (m A )
1
1 10 100
Forwar d Voltage-VCE (V)
HBC556 HSMC Product Specification
Page 3
HI-SINCERITY
g
MICROELECTRONICS CORP.
TO-92 Dimension
A
Spec. No. : HE6422
Issued Date : 1992.11.25
Revised Date : 2001.06.15
Page No. : 3/3
α
2
Marking :
C
B
31
2
α
3
HSMC Logo
Part Number
Date Code
HSMC Logo
D
Part Number
H
α
I
1
G
Style : Pin 1.Collector 2.Base 3.Em itter
Product Series
Rank
Laser Mark
Product Series
Ink Mark
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code : A
DIM
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes :
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your l ocal HSMC sales office.
1
α
2
α
3
α
-
-
-
*5
*2
*2
°
°
°
-
-
-
*:Typical
*5
°
*2
°
*2
°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or appl ication assistance.
Head Office And Factory :
•
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
HBC556 HSMC Product Specification
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
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