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HI-SINCERITY
MICROELECTRONICS CORP.
HBC548
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HBC548 is designed for switching and AF amplifier amplification
suitable for automatic insertion in thick and thin-film circuits.
Spec. No. : HA200103
Issued Date : 2001.10.01
Revised Date : 2001.10.23
Page No. : 1/3
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature .......................................................................................... -55 to +150 °C
Junction Temperature.................................................................................................... +150 °C
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)............................................................................... 625 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage......................................................................................... 30 V
VCEO Collector to Emitter Voltage...................................................................................... 30 V
VEBO Emitter to Base Voltage.............................................................................................. 5 V
IC Collector Current........................................................................................................ 100 mA
Characteristics
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 30 - - V IC=100uA
BVCEO 30 - - V IC=1mA
BVEBO 5 - - V IE=10uA
ICBO - - 15 nA VCB=30V
*VCE(sat)1 - 90 250 mV IC=10mA, IB=0.5mA
*VCE(sat)2 - 200 600 mV IC=100mA, IB=5mA
*VBE(sat)1 - 700 - mV IC=10mA, IB=0.5mA
*VBE(sat)2 - 900 - mV IC=100mA, IB=5mA
VBE(on)1 580 - 700 mV VCE=5V, IC=2mA
VBE(on)2 - - 770 mV VCE=5V, IC=10mA
*hFE 110 - 800 VCE=5V, IC=2mA
fT - 300 - MHz VCE=5V, IC=10mA
Cob - 3.5 6 pF VCB=10V, f=1MHz, IE=0
(Ta=25°C)
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
TO-92
Classification Of hFE
Rank A B C
hFE 110-220 200-450 420-800
HBC548 HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HA200103
Issued Date : 2001.10.01
Revised Date : 2001.10.23
Page No. : 2/3
1000
100
Current Gai n-hFE
10
1
0.1 1 10 100 1000
10000
Curren t Gain & Co llector Cu r rent
hFE @ VCE=5V
Colle ctor Current-IC (mA)
On Voltage & Collect or Current
100000
10000
V
@ IC=20I
1000
Saturation Voltage (mV)
100
10
BE(sat)
V
CE(sat)
0.1 1 10 100 1000
B
@ IC=20I
B
Collector Current-IC (mA)
Capacitance & Rev erse- Biased Voltage
10
Saturation Voltage & Collector Cu r rent
1000
V
@ VCE=5V
On Vol tage (mV)
100
0.1 1 10 100 1000
1000
100
Cutoff Frequence (MHz)
BE(on)
Collector Current-IC (mA)
Cutoff Frequency & Collector Cu rrent
VCE=5V
Cob
1
Capacitance (pF)
0.1
0.1 1 10 100
Reverse-Biased Voltage (V)
PD-Ta
700
600
500
400
300
200
Power Dissipation-PD(mW)
100
10
110100
Collector Current-IC (mA)
0
0 20 40 60 80 100 120 140 160
Ambient Temperature-Ta (oC)
HBC548 HSMC Product Specification
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HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HA200103
Issued Date : 2001.10.01
Revised Date : 2001.10.23
Page No. : 3/3
α2
A
B
31
2
Marking:
Date Code
HC
B
458
Rank
α3
C
D
H
I
α1
G
Style: Pin 1.Collector 2.Base 3.Emitter
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
*: Typical
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
α1
α2
α3
-
-
-
*5°
*2°
*2°
-
-
-
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Fac tory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HBC548 HSMC Product Specification
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