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HI-SINCERITY
MICROELECTRONICS CORP.
HBC546
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HBC546 is primarily intended for use in driver stage of audio
amplifiers.
Spec. No. : HE6417
Issued Date : 1992.11.25
Revised Date : 2002.02.18
Page No. : 1/3
Features
• High Breakdown Voltage: 65V
• High DC Current Gain: 110-800 at IC=2mA VCE=5V
TO-92
Absolute Maximum Ratings
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 625 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage......................................................................................... 80 V
VCEO Collector to Emitter Voltage...................................................................................... 65 V
VEBO Emitter to Base Voltage.............................................................................................. 6 V
IC Collector Current ....................................................................................................... 100 mA
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 80 - - V IC=100uA, IE=0
BVCEO 65 - - V IC=1mA, IB=0
BVEBO 6 - - V IE=10uA, IC=0
ICBO - - 15 nA VCB=30V, IE=0
VBE(on)1 - - 770 mV IC=10mA, VCE=5V
VBE(on)2 580 - 700 mV IC=2mA, VCE=5V
*VCE(sat)1 - - 250 mV IC=10mA, IB=0.5mA
*VCE(sat)2 - - 600 mV IC=100mA, IB=5mA
*VBE(sat)1 - 700 - mV IC=10mA, IB=0.5mA
*VBE(sat)2 - 900 - mV IC=100mA, IB=5mA
*hFE 110 - 800 VCE=5V, IC=2mA
fT - 300 MHz VCE=5V, IC=10mA, f=100MHz
Cob - - 4.5 PF VCB=10V, IE=0, f=1MHz
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
Classification of hFE
Rank A B C
Range 110-220 200-450 420-800
HBC546 HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6417
Issued Date : 1992.11.25
Revised Date : 2002.02.18
Page No. : 2/3
1000
Current Gai n & Collector Cu rrent
75oC
125oC
hFE
25oC
hFE @ VCE=5V
100
0.1 1 10 100
1000
Collector Current- IC (mA)
ON Voltage & Collector Current
25oC
1000
Saturation Voltage & Collector Cu rrent
75oC
100
Satur ation Voltage ( m V)
10
1 10 100
10
125oC
25oC
CE(sat)
V
Collector Current- IC (mA)
Capa citance & Reverse- Biased Volt a ge
@ IC=20I
B
125oC
ON Voltage (mV)
100
1 10 100
Collector Current- IC (mA)
75oC
BE(ON)
V
@ VCE=5V
Safe Operating Area
10000
PT=1ms
1000
(mA)
C
Collector Current-I
100
10
PT=100ms
PT=1s
Cob
Capacitance (pF)
1
0.1 1 10 100
Reverse-Biased Vol tage (V)
PD-Ta
700
600
500
400
300
200
Power Dissipation-PD (mW)
100
1
1 10 100
Forwar d Voltage-VCE (V)
0
0 50 100 150 200
Ambient Temper ature- Ta (oC)
HBC546 HSMC Product Specification
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HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HE6417
Issued Date : 1992.11.25
Revised Date : 2002.02.18
Page No. : 3/3
A
α2
B
31
2
Marking:
HC
B
456
Date Code Control Code
Rank
α3
C
D
H
I
α1
G
Style: Pin 1.Collector 2.Base 3.Emitter
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
*: Typical
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E-*0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
α1
α2
α3
-
-
-
*5°
*2°
*2°
-
-
-
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HBC546 HSMC Product Specification
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