Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
HBC337
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HBC337 is designed for driver and output-stage of audio
amplifiers.
Spec. No. : HE6415
Issued Date : 1992.11.25
Revised Date : 2002.02.05
Page No. : 1/4
Features
• High DC Current Gain: 100-600 at IC=100mA,VCE=1V
• Complementary to HBC327
TO-92
Absolute Maximum Ratings
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 625 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage......................................................................................... 50 V
VCEO Collector to Emitter Voltage...................................................................................... 45 V
VEBO Emitter to Base Voltage.............................................................................................. 5 V
IC Collector Current ....................................................................................................... 800 mA
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 50 - - V IC=100uA, IE=0
BVCEO 45 - - V IC=10mA, IB=0
BVEBO 5 - - V IE=10uA, IC=0
ICBO - - 100 nA VCB=45V, IE=0
*VCE(sat) - - 0.7 V IB=500mA, IB=50mA
VBE(on) - - 1.2 V IC=300mA, VCE=1V
*hFE1 100 - 600 VCE=1V, IC=100mA
*hFE2 40 - - VCE=1V, IC=300mA
fT - 210 - MHZ VCE=5V, IC=10mA, f=100MHZ
Cob - 4 - pF VCB=10V, IE=0, f=1MHZ
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
Classification of hFE1
Rank 16 25 40
Range 100-250 160-400 250-600
HBC337 HSMC Product Specification
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HI-SINCERITY
V
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6415
Issued Date : 1992.11.25
Revised Date : 2002.02.05
Page No. : 2/4
1000
125oC
25oC
100
hFE
10
1 10 100 1000
Collector Current- IC (mA)
75oC
hFE @ VCE=1V
ON Voltage & Collector C urrent
1000
25oC
Current Gai n & Collector Cu rrent
1000
CE(sat)
V
100
Saturat ion Volt age ( m V)
10
0.1 1 10 100 1000
B
@ IC=10I
125oC
Collect o r Current- IC (mA)
75oC
25oC
Capa citance & Reverse- Biased Volt a ge
100
Saturation Voltage & Collector Cu rrent
75oC
125oC
ON Voltage ( m V)
BE(ON)
V
@ VCE=1V
100
0.1 1 10 100 1000
Collector Current- IC (mA)
Cut off Frequ ency & Col l ect or Current
1000
VCE=5
100
Cutoff Frequency (MHz)...
10
Capacitance (pF)
1
0.1 1 10 100
Reverse-Biased Vol t a ge ( V)
Cob
Safe Operating Area
10000
PT=1ms
(mA)
C
Collector Current-I
PT=100ms
1000
PT=1s
100
10
10
1 10 100 1000
Collector Current (mA)
1
1 10 100
Forwar d Voltage-VCE (V)
HBC337 HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6415
Issued Date : 1992.11.25
Revised Date : 2002.02.05
Page No. : 3/4
700
600
500
400
300
200
Power Dissipation-PD (mW)
100
0
0 50 100 150 200
Ambient Temper a t ure-Ta (oC)
PD-Ta
HBC337 HSMC Product Specification
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HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HE6415
Issued Date : 1992.11.25
Revised Date : 2002.02.05
Page No. : 4/4
A
α2
B
31
2
Marking:
HC
B
337
Date Code Control Code
α3
C
D
H
I
α1
G
Style: Pin 1.Collector 2.Base 3.Emitter
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
*: Typical
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0 .56
E-*0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
α1
α2
α3
-
-
-
*5°
*2°
*2°
-
-
-
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HBC337 HSMC Product Specification
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