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HI-SINCERITY
MICROELECTRONICS CORP.
HBC327
PNP EPITAXIAL PLANAR TRANSISTOR
Description
This HBC327 is designed for driver and output-stages of audio
amplifiers.
Spec. No. : HE6413
Issued Date : 1993.01.15
Revised Date : 2002.02.05
Page No. : 1/4
Features
• High DC Current Gain: 100-600 at IC=100mA,VCE=1V
• Complementary to HBC337
TO-92
Absolute Maximum Ratings
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 625 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage........................................................................................ -50 V
VCEO Collector to Emitter Voltage..................................................................................... -45 V
VEBO Emitter to Base Voltage............................................................................................. -5 V
IC Collector Current ...................................................................................................... -500 mA
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -50 - - V IC=-100uA, IE=0
BVCEO -45 - - V IC=-10mA, IB=0
BVEBO -5 - - V IE=-100uA, IC=0
ICBO - - -100 nA VCB=-30V, IE=0
IEBO - - -100 nA VEB=-5V, IC=0
*hFE1 100 - 600 VCE=-1V, IC=-100Ma
*hFE2 40 - - VCE=-1V, IC=-300mA
*VCE(sat)1 - - -0.7 V IC=-500mA, IB=-50mA
VBE(on) - - -1.2 V VCE=-1V, IC=-300mA,
fT - 100 - MHZ VCE=-5V, IC=-10mA, f=100MHZ
Cob - 4 - PF VCB=-10V, f=1MHZ, IC=0
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
Classification of hFE1
Rank 16 25 40
Range 100-250 160-400 250-600
HBC327 HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6413
Issued Date : 1993.01.15
Revised Date : 2002.02.05
Page No. : 2/4
1000
125oC
100
hFE
10
25oC
hFE @ VCE=1V
1 10 100 1000
Collector Current-IC (mA)
75oC
ON Voltage & Collector Cur rent
1000
25oC
Cur ren t Ga in & C ollector Cu rrent
1000
CE(sat)
V
100
Satur ation Voltag e (mV)
10
0.1 1 10 100 1000
B
@ IC=10I
125oC
25oC
Collector Current-IC (mA)
75oC
Cut off Fr equency & Col lector Current
1000
Sat urat ion Vol tage & Collect or Cu rrent
125oC
ON Voltage ( m V)
100
0.1 1 10 100 1000
100
10
Capacitance (pF)
Capacitance & Reverse-Biased Voltage
Collector Current-IC (mA)
Cob
75oC
BE(ON)
V
@ VCE=1V
100
Cutoff Frequency (MHz)...
10
1 10 100 1000
VCE=5V
Collector Curren t ( mA)
Safe Operating Area
10000
PT=1msPT=100ms
1000
(mA)
C
100
Collect or Curre nt-I
10
PT=1s
1
0.1 1 10 100
Reverse Biased Vol t age (V)
1
1 10 100
Forwar d Vol tage-VCE (V)
HBC327 HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6413
Issued Date : 1993.01.15
Revised Date : 2002.02.05
Page No. : 3/4
700
600
500
400
300
200
Power Dissipation-PD (m W)
100
0
0 50 100 150 200
Ambient Temperat ure-Ta (oC)
PD-Ta
HBC327 HSMC Product Specification
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HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HE6413
Issued Date : 1993.01.15
Revised Date : 2002.02.05
Page No. : 4/4
A
α2
B
31
2
Marking:
HC
B
237
Date Code Control Code
α3
C
D
H
I
α1
G
Style: Pin 1.Collector 2.Base 3.Emitter
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
*: Typical
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E-*0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
α1
α2
α3
-
-
-
*5°
*2°
*2°
-
-
-
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HBC327 HSMC Product Specification
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