Datasheet HBAS16 Datasheet (HSMC)

HI-SINCERITY

MICROELECTRONICS CORP.

HBAS16

HIGH-SPEED SWITCHING DIODE

Description

• The HBAS16 is designed for high-speed switching application in
hybrid thick and thin-film circuits.

Spec. No. : HE6833
Issued Date : 1994.05.27
Revised Date : 2002.10.24
Page No. : 1/3

• The devices is manufactured by the silicon epitaxial planar process
and packed in a plastic surface mount package.

SOT-23

Features

• Small SMD Package (SOT-23)

• Low Forward Voltage

• Fast Reverse Recovery Time

• Small Total Capacitance

Absolute Maximum Ratings

• Maximum Temperatures

Stor age Temperature.............................................................................................. -65~+150 °C

Junction Temperature.................................................................................................... +150 °C

• Maximum Power Dissipation

Total Power Dissipation (Ta=25°C)................................................................................ 200 mW

• Maximum Voltages and Currents (Ta=25°C)

Reverse Voltage.................................................................................................................. 75 V

Repetitive Reverse Voltage ................................................................................................. 85 V

Forward Current............................................................................................................. 250 mA

Repetitive Forward Current ........................................................................................... 500 mA

Forward Surge Current (1ms)................................................................................................ 1 A

Characteristics (Ta=25°C)

Characteristic Symbol Condition Min Max. Unit

Reverse Breakdown Voltage V(BR) IR=100uA 75 - V

VF(1) IF=1mA - 715 MV

Forward Voltage

Reverse Current IR VR=75V - 1 uA
Total Capacitance CT VR=0, f=1MHZ - 2 pF

Reverse Recovery Time Trr

HBAS16 HSMC Product Specification

VF(2) IF=10mA - 855 mV
VF(3) IF=50mA - 1000 mV
VF(4) IF=150mA - 1250 mV

IF=IR=10mA, RL=100Ω,
measured at IR=1mA

-6nS

HI-SINCERITY

MICROELECTRONICS CORP.

Characteristics Curve

Spec. No. : HE6833
Issued Date : 1994.05.27
Revised Date : 2002.10.24
Page No. : 2/3

Forw ard Biased Voltage & Forw ar d C ur rent

450

300

(mA)

F

Current-I

150

0

0 500 1000 1500 2000

Forwar d Biased Voltage- VF (mV)

1

Capacit ance & Rever se-Biased Volt age

Capacitanc e- Cd (pF)

0.1

0.1 1 10 100

Reverse Biased Vol tage-VR (V)

HBAS16 HSMC Product Specification

HI-SINCERITY

MICROELECTRONICS CORP.

SOT-23 Dimension

Spec. No. : HE6833
Issued Date : 1994.05.27
Revised Date : 2002.10.24
Page No. : 3/3

Diagram:

Marking:

A

L

3

B

S

21

GV

3-Lead SOT-23 Plastic Surface Mounted Package

HSMC Package Code: N

A 6

Rank Code

Control Code

C

JK

DIM

Style: Pin 1.Anode 2.NC 3.Cathode

*: Typical

Min. Max. Min. Max.

DIM

D

H

Inches Millimeters Inches Millimeters

Min. Max. Min. Max.
A 0.1102 0.1204 2.80 3.04 J 0.0034 0.0070 0.085 0.177
B 0.0472 0.0630 1.20 1.60 K 0.0128 0.0266 0.32 0.67
C 0.0335 0.0512 0.89 1.30 L 0.0335 0.0453 0.85 1.15
D 0.0118 0.0197 0.30 0.50 S 0.0830 0.1083 2.10 2.75
G 0.0669 0.0910 1.70 2.30 V 0.0098 0.0256 0.25 0.65
H 0.0005 0.0040 0.013 0.10

Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.

Material:

• Lead: 42 Alloy; solder plating

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

2.Controlling dimension: millimeters.

3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or appl ication assistance.

Head Office And Factory:

• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: [phone] Fax: [phone]

• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: [phone]~5 Fax: [phone]

HBAS16 HSMC Product Specification