Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6411-B
Issued Date : 199.03.06
Revised Date : 2000.09.01
Page No. : 1/3
HAD826
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HAD826 is designed for general purpose amplifier and high
speed, medium-power switching applications.
Features
Low Collector Saturation Voltage
•
High Speed Switching
•
Absolute Maximum Ratings
Maximum Temperatures
•
Storage Temperature .......................................................................................... -55 ~ +150 °C
Junction Temperature..................................................................................... 150 °C Maximum
Maximum Power Dissipations
•
Total Power Dissipation (Ta=25°C) .............................................................................. 625 mW
Maximum Voltages and Currents (Ta=25°C)
•
VCBO Collector to Base Voltage........................................................................................ 75 V
VCEO Collector to Emitter Voltage..................................................................................... 60 V
VEBO Emitter to Base Voltage............................................................................................. 6 V
IC Collector Current....................................................................................................... 600mA
Characteristics
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 75 - - V IC=10uA, IE=0
BVCEO 60 - - V IC=10mA, IB=0
BVEBO 6 - - V IE=10uA, IC=0
ICBO - - 10 nA VCB=60V, IE=0
ICEX - - 10 nA VCB=60V, VEB(OFF)=3V
IEBO - - 50 nA VEB=3V, IC=0
*VCE(sat)1 - - 300 mV IC=150mA, IB=15mA
*VCE(sat)2 - - 1 V IC=500mA, IB=50mA
*VBE(sat)1 - - 1.2 V IC=150mA, IB=15mA
*VBE(sat)2 - - 2 V IC=500mA, IB=50mA
*hFE1 35 - - VCE=10V, IC=100uA
*hFE2 50 - - VCE=10V, IC=1mA
*hFE3 75 - - VCE=10V, IC=10mA
*hFE4 100 - 300 VCE=10V, IC=150mA
*hFE5 40 - - VCE=10V, IC=500mA
*hFE6 50 - - VCE=1V, IC=150mA
fT 300 - - MHz IC=20mA, VCE=20V, f=100MHz
Cob - - 8 pF VCB=10V, F=1MHz
(Ta=25°C)
HSMC Product Specific at i on
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6411-B
Issued Date : 199.03.06
Revised Date : 2000.09.01
Page No. : 2/3
1000
VCE=10V
100
VCE=1V
Current Gain-hFE
10
1
1 10 100 1000
Collec tor Cur rent-IC (mA)
Cut o ff Fr equenc y & Collector Current
1000
Curr ent Ga in & Collet or Current
100
VCE=20V
10000
1000
BE(sat)@IC
V
100
CE(sat)@IC
Saturation Voltage (mV)
10
1
0.1 1 10 100 1000
V
Collec tor Curre nt -IC ( mA)
=10I
=10I
B
B
Capacit ance & Rever se-Biased Volt age
10
Saturation Voltage & Collector Current
10
Cutoff Frequency (MHz)
1
1 10 100
Collec tor Cur rent-IC (mA)
Safe Operat ing Area
10000
PT=100ms
PT=1ms
PT=1s
1
1 10 100
Forwar d Vol tage-VCE (V)
Collec tor Cur rent-IC (mA)
1000
100
10
Capacitance-(Pf)
1
0.1 1 10 100
Reverse Biased Voltage (V)
Cob
PD-Ta
700
600
500
400
300
200
Power Dissipation-PD(mW)
100
0
0 20 40 60 80 100 120 140 160
Ambient Tempe r at ure- Ta(oC)
HSMC Product Specific at i on
Page 3
HI-SINCERITY
g
MICROELECTRONICS CORP.
TO-92 Dimension
A
Spec. No. : HE6411-B
Issued Date : 199.03.06
Revised Date : 2000.09.01
Page No. : 3/3
α
2
Marking :
C
HSMC Logo
B
31
2
α
3
Part Number
Date Code
HSMC Logo
D
Part Number
H
α
I
1
G
Style : Pin 1.Base 2.Collector 3.Emitter
Product Series
Rank
Laser Mark
Product Series
Ink Mark
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code : A
DIM
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes :
Material :
• Lead : 42 Alloy ; solder plati ng
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thicknes s includes lead finish thickness, and minimum lead thickness is the minimum thick ness of base material.
4.If there is any question with packing specification or packing method, please contac t your local HSMC sales office.
1
α
2
α
3
α
-
-
-
*5
*2
*2
°
°
°
-
-
-
*:Typical
*5
°
*2
°
*2
°
Important Notice:
• All rights are reserved. Reproduc tion in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to m ake changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application as sistance.
Head Office And Factory :
•
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
•
Factory 2 :
Tel : 886-3-5977061 Fax : 886-3-5979220
(Hi-Sincerity Microelect ronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hs i n-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Indus trial Park Hsin-Chu Taiwan. R.O.C
HSMC Product Specific at i on
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