Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6116
Issued Date : 1997.09.08
Revised Date : 2002.04.17
Page No. : 1/4
HA8050S
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HA8550S is designed for gen er al purp ose amplifier applicatio ns.
Features
• High DC Current Gain (hFE=100~500 at IC=150mA)
• Complementary to HA8550S
Absolute Maximum Ratings
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
TO-92
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 625 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage......................................................................................... 25 V
VCEO Collector to Emitter Voltage...................................................................................... 20 V
VEBO Emitter to Base Voltage.............................................................................................. 5 V
IC Collector Current........................................................................................................ 700 mA
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 25 - - V IC=10uA
BVCEO 20 - - V IC=1mA
BVEBO 5 - - V IE=10uA
ICBO - - 1 uA VCB=20V
IEBO - - 100 nA VEB=6V
*VCE(sat) - - 0.5 V IC=0.5A, IB=50mA
VBE(on) - - 1 V VCE=1V, IC=150mA
*hFE1 100 - 500 VCE=1V, IC=150mA
*hFE2 - 170 - VCE=1V, IC=500mA
fT 150 - - MHz VCE=10V, IC=20mA, f=100MHz
Cob - - 10 pF VCB=10V, f=1MHz
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
Classification on hFE
Rank C D E
hFE1 100~200 150~300 250-500
HA8050S HSMC Product Specification
Page 2
HI-SINCERITY
)
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6116
Issued Date : 1997.09.08
Revised Date : 2002.04.17
Page No. : 2/4
1000
Current Gain & Collector Current
125oC
25oC
100
hFE
hFE @ VCE=1V
10
1 10 100 1000
1000
ON Voltage & Collector Current
75oC
Collector Current-IC (mA)
25oC
75oC
1000
Sat urati on Voltage & Col lector Cur rent
CE(sat)
V
100
Satur ation Voltag e ( mV)
10
0.1 1 10 100 1000
10000
1000
Cut off Frequen cy & Coll ector Current
B
@ IC=10I
75oC
125oC
Collector Curren t- IC (mA)
25oC
125oC
ON Voltage (mV)
100
0.1 1 10 100 1000
Collector Current-IC (mA)
BE(ON)
V
@ VCE=1V
Capacitance & Reverse- Biased Volta ge
100
10
Capacitance (pF)
1
0.1 1 10 100
Reverse Biased Vol t ag e ( V)
100
Cutoff Fr equen cy ( M Hz)...
VCE=2V
10
1 10 100 1000
Collector Current (mA)
Safe Operating Area
10000
1000
100
Collector Cu r rent (m A
@PT=1ms @PT=100ms @PT=1s
10
1 10 100
Forwar d Vol tage (V)
HA8050S HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6116
Issued Date : 1997.09.08
Revised Date : 2002.04.17
Page No. : 3/4
700
600
500
400
300
200
Power Dissipation-PD (mW)
100
0
0 50 100 150 200
Ambient Temper atur e-Ta (oC)
PD-Ta
HA8050S HSMC Product Specification
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HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HE6116
Issued Date : 1997.09.08
Revised Date : 2002.04.17
Page No. : 4/4
A
α2
B
31
2
Marking:
HA
085
0S
Date Code Control Code
Rank
α3
C
D
H
I
α1
G
Style: Pin 1.Emitter 2.Base 3.Collector
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
*: Typical
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class : UL94V-0
α1
α2
α3
-
-
-
*5°
*2°
*2°
-
-
-
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HA8050S HSMC Product Specification
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