Datasheet HA17324A Datasheet (HIT)

HA17324/A Series

Quad Operational Amplifier

ADE-204-031 (Z)

1st Edition

Apr. 2000

Description

HA17324 series and HA17324A series are quad operational amplifier that provide high gain and internal
phase compensation, with single power supply. They can be widely used to control equipments.

Features

• Wide range of supply voltage, and single power supply used

• Internal phase compensation

• Wide range of common mode voltage, and possible to operate with an input about 0V

Features only for “A” series

• Low electro-magnetic interference level

5.0

4.0

3.0

(arb. unit)

2.0

1.0

Output offset voltage

−1.0
100E+3 1E+6 10E+6 100E+6 1E+9 10E+9

Vcc = +7.5 V
Vee = −7.5 V

RF signal source
(for quasi-RF noise)

Rs
Rs

Rf

0.01 µ
Vin

−10 dBm

Rf

−

+

Vout

V

_

(= 100∗Vio)

Notice: The example of an applied circuit or combination with other equipment shown herein indicates

characteristics and performance of semiconductor -applied products.
The company shall assume no responsibility for any problem involving a patent caused when
applying the descriptions in the example.

Output Offset Voltage vs. Input InterferenceMeasurement Condition

HA17324 series

0

HA17324A series

Input RF frequency (Hz)

HA17324/A Series

Ordering Information

HA17324 Series

Type No. Application Package

HA17324P Industrial use DP-14
HA17324FP FP-14DA
HA17324 Commercial use DP-14
HA17324F FP-14DA

HA17324A Series

Type No. Application Package

HA17324AP Industrial use DP-14
HA17324ARP FP-14DN
HA17324AFP FP-14DA

2

Pin Arrangement

HA17324/A Series

Circuit Schematic (1/4)

Vin(−)

Vin(+)

Q1 Q4

Vout1
Vin(−)1
Vin(+)1

V

CC

Vin(+)2
Vin(−)2

Vout2

Q2 Q3

Q8 Q9

1
2
3
4
5
6
7

1

+

−

+

−

2

(Top view)

C

+

+

Q10

14

Vout4

13

Q11

12
11
10

9
8

Q12

Vin(−)4
Vin(+)4
V

EE

Vin(+)3
Vin(−)3
Vout3

Q7

Q5

Q6

Q13

R

1

Vout

4

−

−

3

3

HA17324/A Series

Absolute Maximum Ratings (Ta = 25°C)

Ratings

Item Symbol HA17324/P/AP HA17324F/FP/ARP/AFP Unit

Supply voltage V

CC

Sink current Isink 50 50 mA
Power dissipation P
Common mode input voltage V

T

CM

Differential input voltage Vin (diff) ±V
Operating temperature Topr –20 to +75 –20 to +75 °C
Storage temperature Tstg –55 to +125 –55 to +125 °C

Notes: 1. This is the allowable values up to Ta = 50°C. Derate by 8.3 mW/°C.

2. Tjmax = θj-a · P

max + Ta (θj-a; Thermal resistor between junction and ambient at set board

C

use).
The wiring density and the material of the set board must be chosen for thermal conductance of

efficacy board.

And P

max cannot be over the value of PT.

C

32 32 V

1

625 *
–0.3 to V

CC

CC

2

625 *
–0.3 to V
±V

CC

CC

mW
V
V

(°C)

Thermal resistor θj-a

240
220
200
180
160
140
120
100

80

ab

SOP14 − with compound

SOP14

−

no compound

0.5 1 2 5 10 20

Thermal conductance of efficacy board (W/m °C)

40 mm

1.5 t epoxy

a. Class epoxy board of 10% wiring density
b. Class epoxy board of 30% wiring density

4

HA17324/A Series

Electrical Characteristics (VCC = +15 V, Ta = 25°C)

Item Symbol Min Typ Max Unit Test Conditions

Input offset voltage V
Input offset current I
Input bias current I
Power source rejection

IO

IO

IB

PSRR — 93 — dB f = 100 Hz, RS = 1 kΩ, Rj = 100 kΩ

—27mVV
— 5 50 nA VCM = 7.5 V, IIO = | I
— 30 500 nA VCM = 7.5 V

ratio
Voltage gain A
Common mode rejection

VD

CMR — 80 — dB RS = 50 Ω, Rf = 5 kΩ

75 90 — dB RS = 1 kΩ, Rf = 100 kΩ, RL = ∞

ratio
Common mode input

V

CM

–0.3 — 13.5 V RS = 1 kΩ, Rf = 100 kΩ, f = 100 Hz

voltage range
Maximum output voltage Vop-p — 13.6 — V f = 100 Hz, RS = 1 kΩ, Rf = 100 kΩ,

Output source current Iosource 20 40 — mA V
Output sink current Iosink 10 20 — mA VIN = 0 V, VIN = 1 V, VOL = 2.5 V
Supply current I

CC

— 0.8 2 mA VIN = GND, RL = ∞
Slew rate SR — 0.19 — V/µs f = 1.5 kHz, VCM = 7.5 V, RL = ∞
Channel separation CS — 120 — dB f = 1 kHz
Output sink current Iosink 15 50 — µAV

Iosink 3 9 — mA V

Output voltage V

Output voltage V

OH

V

OH

OL

V

OL

13.2 13.6 — V IOH = –1 mA

12.0 13.3 — V IOH = –10 mA

— 0.8 1.0 V IOL = 1 mA

— 1.1 1.8 V IOL = 10 mA

= 7.5 V, RS = 50 Ω, Rf = 50 kΩ

CM

– I

I (–)

I (+)

R

= 20 kΩ

L

+

= 1 V, V

IN

+

= 0 V, V

IN

+

= 0 V, V

IN

–

= 0 V, VOH = 10 V

IN

–

= 1 V, VOL = 200 mV

IN

–

= 1 V, VOL = 1 V

IN

|

5

HA17324/A Series

Characteristic Curves

Output Source Current vs. Ambient Temperature

80
70
60

VCC = 15 V

= 10 V

V

OH

50
40
30
20
10

0

Output source current Iosource (mA)

−200 20406080
Ambeint temperature Ta (°C)

Supply Current vs. Supply Voltage

4

3

(mA)

CC

Ta = 25°C

2

1

Supply current I

Input Bias Current vs. Ambient Temperature

80
70

(nA)

60

IB

VCC = 15 V
VCM = 7.5 V

50
40
30
20
10

Input bias current I

0

−200 20406080
Ambeint temperature Ta (°C)

Input Bias Current vs. Supply Voltage

80

(nA)

60

IB

Ta = 25°C

40

20

Input bias current I

6

0

Voltage Gain vs. Supply Voltage

160

120

(dB)

VD

80

40

Voltage gain A

0

8 16243240

Supply voltage VCC (V)

Ta = 25°C
RL = ∞

8 16243240

Supply voltage VCC (V)

0

8 16243240

Supply voltage VCC (V)

Maxlmum Output Voltage vs. Frequency

20

(V)

16

OP-P

12

8

4

0

Maximum output voltage V

1 k 3 k 10 k 30 k 100 k 300 k

Frequency f (Hz)

VCC = 15 V
Ta = 25°C
RL = 20 kΩ

1 M

HA17324/A Series

Voltage Gain vs. Frequency

120

100

(dB)

80

VD

60

40

Voltage gain A

20

0

1 3 10 30 100 300 1 k 3 k 10 k 30 k 100 k 300 k 1 M

Frequency f (Hz)

Common Mode Rejection Ratio vs. Frequency

120

100

= 15V

V

CC

Ta = 25°C
RS = 50 Ω

= 15V

V

CC

Ta = 25°C
RL = ∞

80

60

40

20

Common mode rejection ratio CMR (dB)

0
100 300 1 k 3 k 10 k 30 k 100 k 300 k 1M

Frequency f (Hz)

7

HA17324/A Series

Solder Mounting Method

1. Small and light surface-mount packages require spicial attentions on solder mounting.
On solder mounting, pre-heating before soldering is needed.
The following figure show an example of infrared rays refow.

2. The difference of thermal expansion coefficeient between mounted substrates and IC leads may cause a
failure like solder peeling or soler wet, and electrical characteristics may change by thermal stress.
Therefore, mounting should be done after sufficient confirmation for especially in case of ceramic
substrates.

235°C Max

140 to 160°C

≅ 60 s

Temperature

1 to 5°C/s

10 s Max

1 to 4°C/s

Time (s)

Figure 1 An Example of Infrared Rays Reflow Conditions

8

Package Dimensions

1

19.20

20.32 Max

1.30

HA17324/A Series

Unit: mm

814

6.30

7.40 Max

7

2.54 ± 0.25

10.5 Max

14

1

1.27

2.39 Max

10.06

1.42 Max

0.48 ± 0.10

8

5.5

7

2.20 Max

2.54 Min 5.06 Max

0.51 Min

Hitachi Code
JEDEC
EIAJ
Mass

7.80

0.20 ± 0.04

*0.22 ± 0.05

0.70 ± 0.20

7.62

+ 0.10

0.25

– 0.05

0° – 15°

(reference value)

+ 0.20
– 0.30

1.15

0° – 8°

DP-14
Conforms
Conforms

0.97 g

Unit: mm

*0.42 ± 0.08

0.40 ± 0.06

*Dimension including the plating thickness

Base material dimension

0.12

0.10 ± 0.10

0.15

M

Hitachi Code
JEDEC
EIAJ
Mass

(reference value)

FP-14DA
—
Conforms

0.23 g

9

HA17324/A Series

14

Unit: mm

8.65

9.05 Max
8

*Pd plating

1

0.635 Max

1.27

*0.40 ± 0.06

7

+ 0.11

0.14

0.25

3.95

– 0.04

0.15

1.75 Max

M

6.10

1.08

*0.20 ± 0.05

+ 0.67

0.60

– 0.20

Hitachi Code
JEDEC
EIAJ
Weight

+ 0.10
– 0.30

0° – 8°

(reference value)

FP-14DN
Conforms
Conforms

0.13 g

10

HA17324/A Series

Cautions

1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.

2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.

3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.

4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.

5. This product is not designed to be radiation resistant.

6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.

7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.

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Copyright ' Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.

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11