Spec. No. : Preliminary Data
Issued Date : 1998.07.01
Revised Date : 1999.08.01
Page No. : 1/5
H603AL
N-Channel Logic Level Enhancement Mode Field Effect Transistor
Description
This very high density process has been especially tailored to minimize onstate resistance and provide superior switching performance. These
devices are particularly suited for low voltage applications such as DC/DC
converters and other battery powered circuits where fast switching, low inline power loss, and resistance to transients are needed.
(Ta=25°C)
Absolute Maximum Ratings
Maximum Temperatures
•
Operating and Storage Temperature................................................................................ -65 ~ +175 °C
Maximum Power Dissipation
•
Total Power Dissipation at Tc=25°C ............................................................................................... 60 W
Derate Above 25°C................................................................................................................ 0.4 W / °C
Maximum Voltages and Currents
•
Drain-Source Voltage...................................................................................................................... 30 V
Gate-Source Voltage -Continuous................................................................................................ ± 20 V
Drain Current -Continuous.............................................................................................................. 30 A
Drain Current -Pulsed................................................................................................................... 100 A
Thermal Resistance, Junction-to-Case .................................................................................. 2.5 °C / W
Thermal Resistance, Junction-to-Ambient............................................................................ 62.5 °C / W
Electrical Characteristics
Off Characteristics
•
SymbolParameterConditionMinTypMaxUnit
BV
DSS
I
DSS
+I
GSS
-I
GSS
On Characteristics
•
V
GS(TH)
RDS(on)Static Drain-Source On-Resistance
IDS(on)On-State Drain Current
g
FS
Dynamic Characteristic
•
C
iss
C
oss
C
rss
Drain-Source Breakdown VoltageVGS=0V, ID=250uA30--V
Zero Gate Voltage Drain CurrentVDS=30V, VGS=0V--10uA
Gate-Body Leakage, ForwardVGS=20V, VDS=0V--100nA
Gate-Body Leakage, ReverseVGS=-20V, VDS=0V---100nA
Gate Threshol d Vo ltage
V
DS=VGS
V
DS=VGS
, ID=250uA1.1-3
, ID=10mA1.4-3
VGS=10V, ID=25A-0.018 0.022
V
=4.5V, ID=10A-0.029 0.040
GS
VGS=10V, VDS=10V60--
=4.5V, VDS=10V15--
V
GS
Forward TransconductanceVDS=10V, ID=25A-26-S
Input Capacitance-1100-pF
Output Capacitance-600-pF
Reverse Transfer Capacitance
V
=15V, VGS=0V
DS
f=1.0Mhz
-180-pF
V
Ω
A
HSMC Product Specification
Page 2
HI-SINCERITY
V
MICROELECTRONICS CORP.
Switching Characteristics
•
Spec. No. : Preliminary Data
Issued Date : 1998.07.01
Revised Date : 1999.08.01
Page No. : 2/5
SymbolParameterConditionMinTypMaxUnit
T(on)
T(off)
Q
g
Q
gs
Q
gd
Drain-Source Diode Characteristics And Maximum Ratings
•
V
SD
Turn-On Delay Time--30ns
V
Turn -On Rise Time--110ns
Turn-Off Delay Time--150ns
Turn -Off Fa ll Time
Total Gate Charge--45nC
Gate-Source Charge--10nC
Gate-Drain Charge
Maximum Continuous Drain-Source Diode Forward Current
Drain-Source Diode Forward VoltageVGS=0V, IS=25A
=15V, ID=25A
DS
=10V, R
V
GS
=10V, ID=25A,
V
DS
=10V
V
GS
GEN
=24
Ω
--130ns
--10nC
--25A
--1.3V
Characteristics Curve
100
VGS=10V
80
60
40
Drain-Source Current (A)
20
0
012345
8V
6V7V
Drain-Source Voltage (V)
5V
4.5V
4V
3V
On Resistance Variation & Temperature
1.6
1.5
On-Region C ha racteristic
1.4
1.3
1.2
1.1
1.0
0.9
Norm alize d Drain-Source O n-R esistan ce
ID=25A
VGS=10V
On-Resistance Variation With Gate Voltage &
3.0
2.5
2.0
Resistance
1.5
Norma liz e d Drain-So urce On-
1.0
0.5
0 20406080
Drai n Cur rent
VGS= 4V
4.5V
5 V
6V
7V
8V
10
Drain Curre nt (A)
On-Resistance Variation & Drain Current &
2.5
VGS=10V
2
1.5
Resistance
1
Norma liz e d Drain-So urce On-
Temperature
TJ=125°C
TJ=25°C
0.8
255075100125150
Junction Temperature (°C)
0.5
020406080
Drain Curre nt (A)
HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data
Issued Date : 1998.07.01
Revised Date : 1999.08.01
Page No. : 3/5
Drain Current Variation & G ate Voltage &
Temperature
50
TJ= 25°C
40
TJ=125°C
30
20
Drain Curre nt (A)
10
0
0123456
Gate -Source Voltage (V)
Gate Threshold Variation & Temperature
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1
Gate -Source Thr es hold Voltage ( V)
0.9
0.8
255075100125150
Junction Temperature (°C)
ID= 250uA
ID=10mA
ID=1mA
Sub- Threshold Dr ain Current Va riati on & Gate
Volta g e & Te m p era tu re
0.06
0.05
0.04
0.03
0.02
Drain Curre nt (A)
0.01
0
0.51.01.52.02.5
TJ=125°C
Gate -Source Voltage (V)
TJ=25°C
Capacitance Characteristics
2000
1500
Ciss
1000
Capac itance (pF)
500
0
051015202530
Drain-Source Voltage (V)
Coss
Crss
Brea kdow n Voltage Vari ation & Temperature
1.1
1.08
1.06
1.04
Voltage
1.02
1
Norm alize d Drain-Source Brea kdown
0.98
255075100125150
Junction Temperature (°C)
Body Di ode Forward Voltage Variati on &
Curren t & Temperature
100
TJ=125°C
10
1
Reverse Drain Curren t (A)
0.1
0.20.40.60.811.2
Body Diode Forward Vol t a ge ( V)
TJ= 25°C
HSMC Product Specification
Page 4
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data
Issued Date : 1998.07.01
Revised Date : 1999.08.01
Page No. : 4/5
Transductance Variation & Drain Current &
Temperature
30
TJ=25°C
25
20
15
10
Transconductance (S)
5
0
01020304050
Drain Curre nt (A)
1
0.5
0.2
TJ=125°C
Tra nci ent Therm al Response Curve
100
Max i mum Sa fe Operati ng Ar ea
Rds(on) Line
10
Drain-Source Current (A)
VGS=20V
Single Pulse
TC=25°C
1
0.1110100
Drain-Source Voltage (V)
1ms
10ms
100ms
1us
Dc
0.1
0.1
0.05
Resistance
0.02
0.01
Norm alize d Ef f ec t ive Trans ient T hermal
0.01
0.11101001000
Time (ms)
RθJC(t) = r(t) * RθJC(t)
RθJC =2.5 °C / W
P(pk)
t1
t2
TJ-TC=P* RθJC(t)
Duty Cycle,D=t1/t2
HSMC Product Specification
Page 5
HI-SINCERITY
MICROELECTRONICS CORP.
TO-220AB Dimension
AB
D
H
I
G
Spec. No. : Preliminary Data
Issued Date : 1998.07.01
Revised Date : 1999.08.01
Page No. : 5/5