Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6616-B
Issued Date : 1993.09.24
Revised Date : 2000.12.01
Page No. : 1/4
H2N6718V
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The H2N6718V is designed for general purpose medium power
amplifier and switching .
Absolute Maximum Ratings
Maximum Temperatures
•
Storage Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature................................................................................... +150 °C Maximum
Maximum Power Dissipation
•
Total Power Dissipation (Ta=25°C)................................................................................... 1.6 W
Maximum Voltages and Currents
•
BVCBO Collector to Base Voltage.................................................................................... 100 V
BVCEO Collector to Emitter Voltage................................................................................. 100 V
BVEBO Emitter to Base Voltage........................................................................................... 5 V
IC Collector Current.............................................................................................................. 1 A
Electrical Characteristics
Symbol Min. Typ. Max. Unit Test Co nditions
BVCBO 100 - - V IC=100uA, IE=0
BVCEO 100 - - V IC=1mA, IB=0
BVEBO 5 - - V IE=10uA, IC=0
ICBO - - 100 nA VCB=80V, IE=0
*VCE(sat) - - 350 mV IC=350mA, IB=35mA
*hFE1 80 - - IC=50mA, VCE=1V
*hFE2 50 - 250 IC=250mA, VCE=1V
*hFE3 20 - - IC=500mA, VCE=1V
fT 50 - - MHz VCE=10V, IC=50mA, f=100MHz
Cob - - 20 pF VCB=10V, f=1MHz, IE=0
(Ta=25°C)
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6616-B
Issued Date : 1993.09.24
Revised Date : 2000.12.01
Page No. : 2/4
1000
100
hFE
10
0.1 1 10 100 1000
100
Current Gain & Col lector Current
VCE=1V
Collector Curren t ( mA)
Capacit ance & Reverse- Bia sed Voltage
1000
100
Satu r ation Vol tage (m V)
CE(sat)
V
10
0.1 1 10 100 1000
Collector Curren t ( mA)
@ IC=10I
B
Cut o ff Fr equency & Col lector Current
1000
VCE=10V
Saturation Voltage & Collector Curr ent
10
Capac itance (pF)
1
0.1 1 10 100 1000
Reverse Biased Vol tage (V)
Cob
Safe Operating Area
10000
1000
(mA)
C
100
PT=1 ms
Collector Curren t- I
10
PT=100 ms
PT=1 s
100
Cutoff Frequency (MHz)
10
1 10 100 1000
Collector Curren t ( mA)
Power Derating
1800
1600
1400
1200
1000
800
600
Power Dissipation-PD(mW)
400
200
1
1 10 100 1000
Forwar d Vol tage-VCE (V)
0
0 20 40 60 80 100 120 140 160
Ambient Temperature-Ta(oC)
HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6616-B
Issued Date : 1993.09.24
Revised Date : 2000.12.01
Page No. : 3/4
260
240
220
200
180
C)
o
160
140
120
100
Temperature(
80
60
40
20
0
0 50 100 150 200 250 300
10+/-2 sec
40+/-20 sec
150+/-30
Time(sec)
IR Reflow Profile
300
Tempera ture Profile for Dip Solder in g
250
200
C)
o
150
Temperature(
100
120+/-20 sec
50
0
0 50 100 150 200 250 300 350
Time(sec)
10+/-2 sec
HSMC Product Specification
Page 4
HI-SINCERITY
g
MICROELECTRONICS CORP.
TO-126ML Dimension
Spec. No. : HE6616-B
Issued Date : 1993.09.24
Revised Date : 2000.12.01
Page No. : 4/4
Marking :
A
D
C
N
M L K
E
F
3
2
1
O
H
G
J
B
I
HSMC Logo
Part Number
Date Code
Ink Marking
Style : Pin 1.Emitter 2.Collector 3.Base
Product Series
Rank
3-Lead TO-126ML Plastic Package
DIM
HSMC Packa
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
e Code : D
DIM
Min. Max. Min. Max.
A 0.1356 0.1457 3.44 3.70 I - *0.1795 - *4.56
B 0.0170 0.0272 0.43 0.69 J 0.0268 0.0331 0.68 0.84
C 0.0344 0.0444 0.87 1.12 K 0.5512 0.5906 14.00 15.00
D 0.0501 0.0601 1.27 1.52 L 0.2903 0.3003 7.37 7.62
E 0.1131 0.1231 2.87 3.12 M 0.1378 0.1478 3.50 3.75
F 0.0737 0.0837 1.87 2.12 N 0.1525 0.1625 3.87 4.12
G 0.0294 0.0494 0.74 1.25 O 0.0740 0.0842 1.88 2.14
H 0.0462 0.0562 1.17 1.42
Notes :
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sal es office.
*:Typical
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringem ent of pat ents, or applic ati on assistance.
Head Office And Factory :
•
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
•
Factory 2 :
Tel : 886-3-5977061 Fax : 886-3-5979220
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
HSMC Product Specification
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