Datasheet H2N6718V Datasheet (HSMC)

Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6616-B Issued Date : 1993.09.24 Revised Date : 2000.12.01 Page No. : 1/4
H2N6718V
Description
The H2N6718V is designed for general purpose medium power amplifier and switching .
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature................................................................................... +150 °C Maximum
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................... 1.6 W
Maximum Voltages and Currents
BVCBO Collector to Base Voltage.................................................................................... 100 V
BVCEO Collector to Emitter Voltage................................................................................. 100 V
BVEBO Emitter to Base Voltage........................................................................................... 5 V
IC Collector Current.............................................................................................................. 1 A
Electrical Characteristics
Symbol Min. Typ. Max. Unit Test Co nditions
BVCBO 100 - - V IC=100uA, IE=0 BVCEO 100 - - V IC=1mA, IB=0 BVEBO 5 - - V IE=10uA, IC=0
ICBO - - 100 nA VCB=80V, IE=0
*VCE(sat) - - 350 mV IC=350mA, IB=35mA
*hFE1 80 - - IC=50mA, VCE=1V *hFE2 50 - 250 IC=250mA, VCE=1V *hFE3 20 - - IC=500mA, VCE=1V
fT 50 - - MHz VCE=10V, IC=50mA, f=100MHz
Cob - - 20 pF VCB=10V, f=1MHz, IE=0
(Ta=25°C)
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6616-B Issued Date : 1993.09.24 Revised Date : 2000.12.01 Page No. : 2/4
1000
100
hFE
10
0.1 1 10 100 1000
100
Current Gain & Col lector Current
VCE=1V
Collector Curren t ( mA)
Capacit ance & Reverse- Bia sed Voltage
1000
100
Satu r ation Vol tage (m V)
CE(sat)
V
10
0.1 1 10 100 1000
Collector Curren t ( mA)
@ IC=10I
B
Cut o ff Fr equency & Col lector Current
1000
VCE=10V
Saturation Voltage & Collector Curr ent
10
Capac itance (pF)
1
0.1 1 10 100 1000
Reverse Biased Vol tage (V)
Cob
Safe Operating Area
10000
1000
(mA)
C
100
PT=1 ms
Collector Curren t- I
10
PT=100 ms PT=1 s
100
Cutoff Frequency (MHz)
10
1 10 100 1000
Collector Curren t ( mA)
Power Derating
1800
1600
1400
1200
1000
800
600
Power Dissipation-PD(mW)
400
200
1
1 10 100 1000
Forwar d Vol tage-VCE (V)
0
0 20 40 60 80 100 120 140 160
Ambient Temperature-Ta(oC)
HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6616-B Issued Date : 1993.09.24 Revised Date : 2000.12.01 Page No. : 3/4
260 240 220 200 180
C)
o
160 140 120 100
Temperature(
80 60 40 20
0
0 50 100 150 200 250 300
10+/-2 sec
40+/-20 sec
150+/-30
Time(sec)
IR Reflow Profile
300
Tempera ture Profile for Dip Solder in g
250
200
C)
o
150
Temperature(
100
120+/-20 sec
50
0
0 50 100 150 200 250 300 350
Time(sec)
10+/-2 sec
HSMC Product Specification
Page 4
HI-SINCERITY
g
MICROELECTRONICS CORP.
TO-126ML Dimension
Spec. No. : HE6616-B Issued Date : 1993.09.24 Revised Date : 2000.12.01 Page No. : 4/4
Marking :
A
D
C
N
M L K
E
F
3 2
1
O
H
G
J
B
I
HSMC Logo
Part Number
Date Code
Ink Marking
Style : Pin 1.Emitter 2.Collector 3.Base
Product Series
Rank
3-Lead TO-126ML Plastic Package
DIM
HSMC Packa
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
e Code : D
DIM
Min. Max. Min. Max. A 0.1356 0.1457 3.44 3.70 I - *0.1795 - *4.56 B 0.0170 0.0272 0.43 0.69 J 0.0268 0.0331 0.68 0.84 C 0.0344 0.0444 0.87 1.12 K 0.5512 0.5906 14.00 15.00 D 0.0501 0.0601 1.27 1.52 L 0.2903 0.3003 7.37 7.62 E 0.1131 0.1231 2.87 3.12 M 0.1378 0.1478 3.50 3.75
F 0.0737 0.0837 1.87 2.12 N 0.1525 0.1625 3.87 4.12 G 0.0294 0.0494 0.74 1.25 O 0.0740 0.0842 1.88 2.14 H 0.0462 0.0562 1.17 1.42
Notes :
Material :
Lead : 42 Alloy ; solder plating
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sal es office.
*:Typical
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringem ent of pat ents, or applic ati on assistance.
Head Office And Factory :
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
Factory 2 :
Tel : 886-3-5977061 Fax : 886-3-5979220
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
HSMC Product Specification
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