Datasheet H2N6668 Datasheet (HSMC)

HI-SINCERITY
MICROELECTRONICS CORP.
H2N6668
Description
The H2N6668 is designed for general-purpose amplifier and switching applications.
Spec. No. : HE6754-A Issued Date : 1998.07.01 Revised Date : 1999.08.01 Page No. : 1/3
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature............................................................................................... -55~+150°C
Junction Temperature.....................................................................................+150°C Maximum
Maximum Power Dissipation
Total Power Dissipation (Tc=25°C) ..................................................................................... 65 W
Maximum Voltages and Currents
BVCBO Collector to Base Voltage..................................................................................... -80 V
BVCEO Collector to Emitter Voltage.................................................................................. -80 V
BVEBO Emitter to Base Voltage.......................................................................................... -5 V
IC Collector Current........................................................................................................... -10 A
Characteristics
Symbol Min. Typ. Max. Unit Test Co nditions
BVCBO -80 - - V IC=-10mA
*BVCEO -80 - - V IC=-200mA
IEBO - - -100 mA VEB=-5V ICEO - - -1 mA VCE=-80V
ICEV - - -300 uA VCE=-80V, VBE(off)=-1.5V *VCE(sat)1 - - -2 V IC=-5A, IB=-10mA *VCE(sat)2 - - -3 V IC=-10A, IB=-100mA
VBE(on)1 - - -2.8 V IC=-5A, VCE=-3V VBE(on)2 - - -4.5 V IC=-10A, VCE=-3V
*hFE1 1 - 20 K IC=-5A, VCE=-3V *hFE2 100 - - IC=-10A, VCE=-3V
(Ta=25°C)
(Ta=25°C)
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6754-A Issued Date : 1998.07.01 Revised Date : 1999.08.01 Page No. : 2/3
10000
Current Gai n & Collector Current
1000
100
hFE
10
1
1 10 100 1000 10000
10000
Collector Curren t (m A )
On Vol t age & Collector Cur rent
hFE @ VCE=3V
10000
BE (sat)
V
CE (sat)
V
@ IC=100I
@ IC=100I
1000
Saturation voltage (mV)
100
10 100 1000 10000
Collector Current (mA)
B
B
Switching Time & Collector Current
Saturation Volt age & Coll ector Cu rrent
10
VCC=30V, IC=250IB1=-250I
B2
1000
On Voltage (mV)
100
10 100 1000 10000
1000
100
Capac itanc e (pF)
Capacitance & Reverse-Biased Voltage
BE (on)
V
@ VCE=3V
Collector Curren t (m A )
Cob
Tstg
1
Tf
Switchin g T imes ( us)
0.1 110
Ton
Collector Current (A)
Safe Operating Ar ea
100000
10000
1000
Collector Current-Ic (mA)
100
PT=1ms
PT=100ms PT=1s
10
0.1 1 10 100
Reverse-Biased Vol t ag e ( V)
10
1 10 100 1000
Forwar d Voltage-VCE (V)
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-220AB Dimension
A B
D
H
I
G
Spec. No. : HE6754-A Issued Date : 1998.07.01 Revised Date : 1999.08.01 Page No. : 3/3
Marking :
E
M
C
K
HSMC Logo
Part Number
Date Code
Style : Pin 1.Base 2.Collector 3.Emitter
Product Series
Rank
3 2
N
4
1
P
3-Lead TO-220AB Plastic Package
HSMC Package Code : E
DIM
Inches Millimeters Inches M illimeters
Min. Max. Min. Max.
A 0.2197 0.2949 5.58 7.49 I -
O
DIM
Min. Max. Min. Max.
*
0.1508 ­B 0.3299 0.3504 8.38 8.90 K 0.0295 0.0374 0.75 0.95 C 0.1732 0.185 4.40 4.70 M 0.0449 0.0551 1.14 1.40 D 0.0453 0.0547 1.15 1.39 N -
*
0.1000 ­E 0.0138 0.0236 0.35 0.60 O 0.5000 0.5618 12.70 14.27
G 0.3803 0.4047 9.66 10.28 P 0.5701 0.6248 14.48 15.87
H-*0.6398 -
Notes :
Material :
Lead : 42 Alloy ; solder plating
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sal es office.
*
16.25
*:Typical
*
3.83
*
2.54
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringem ent of pat ents, or applic ati on assistance.
Head Office And Factory :
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
Factory 2 :
Tel : 886-3-5977061 Fax : 886-3-5979220
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
HSMC Product Specification
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