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HI-SINCERITY
MICROELECTRONICS CORP.
H2N3906
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The H2N3906 is designed for general purpose switchi ng and amplifier
applications.
Spec. No. : HE6240
Issued Date : 1992.11.25
Revised Date : 2002.04.03
Page No. : 1/4
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperatur e........................................................................................... -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)............................................................................... 625 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage........................................................................................ -40 V
VCEO Collector to Emitter Voltage..................................................................................... -40 V
VEBO Emitter to Base Voltage............................................................................................. -5 V
IC Collector Current ...................................................................................................... -200 mA
TO-92
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -40 - - V IC=-100uA, IE=0
BVCEO -40 - - V IC=-1mA, IB=0
BVEBO -5 - - V IE=-10uA, IC=0
ICEX - - -50 nA VCE=-30V, VBE=-3V
*VCE(sat)1 - - -250 mV IB=-1mA, IC=-10mA
*VCE(sat)2 - - -400 mV IB=-5mA, IC=-50mA
*VBE(sat)1 -650 - -850 mV IB=-1mA, IC=-10mA
*VBE(sat)2 - - -950 mV IB=-5mA, IC=-50mA
*hFE1 60 - - VCE=-1V, IC=-100uA
*hFE2 80 - - VCE=-1V, IC=-1mA
*hFE3 100 - 300 VCE=-1V, IC=-10mA
*hFE4 60 - - VCE=-1V, IC=-50mA
*hFE5 30 - - VCE=-1V, IC=-100mA
fT 250 - - MHz VCE=-20V, IC=-10mA,, f=100MHz
Cob - - 4 pF VCB=-5V, IE=0, f=1MHz
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
H2N3906 HSMC Product Specification
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HI-SINCERITY
)
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6240
Issued Date : 1992.11.25
Revised Date : 2002.04.03
Page No. : 2/4
1000
Cur ren t Gain & Collector Current
125oC
25oC
100
hFE
hFE @ VCE=1V
10
1 10 100 1000
10000
1000
Sat urati on Vol ta ge & C ol lector Cu rrent
75oC
Collector Current-IC (mA)
75oC
25oC
1000
Sat ur ation Voltage & Collector Cur rent
125oC
75oC
100
Satur ation Volta g e ( m V)
10
1 10 100 1000
1000
100
Collector Current-IC (mA)
Cutoff Frequency & Collector Current
fT @ VCE=20V
25oC
CE(sat)
V
@ IC=10I
B
Saturat ion Volta ge ( m V)
100
1 10 100 1000
100
10
Capacitance (Pf )
1
0.1 1 10 100
125oC
Collector Current -IC (mA)
BE(sat)
V
@ IC=10I
Capacit ance & Reverse-Biased Voltage
Cob
Rev e r se Biased Vol tage (V)
B
Cutoff Fr equen cy ( M Hz)...
10
1 10 100 1000
Collector Current (mA)
Safe Operat ion Area
10
1
PT=1ms
PT=100ms
0.1
Collect o r Cur rent (mA
0.01
1 10 100
Forwar d Biased Vol tage (V)
PT=1s
H2N3906 HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6240
Issued Date : 1992.11.25
Revised Date : 2002.04.03
Page No. : 3/4
700
PD-Ta
600
500
400
300
200
Power Dis s ipat io n-PD ( mW)
100
0
0 50 100 150 200
Ambient Temperat ure-Ta (oC)
H2N3906 HSMC Product Specification
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HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HE6240
Issued Date : 1992.11.25
Revised Date : 2002.04.03
Page No. : 4/4
A
α2
B
31
2
Marking:
HN
2
930
6
Date Code Control Code
α3
C
D
H
I
α1
G
Style: Pin 1.Emitter 2.Base 3.Collector
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
*: Typical
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E-*0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
α1
α2
α3
-
-
-
*5°
*2°
*2°
-
-
-
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
H2N3906 HSMC Product Specification
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