Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
H2N3904
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The H2N3904 is designed for general purpose switchi ng and amplifier
applications.
Spec. No. : HE6218
Issued Date : 1992.11.25
Revised Date : 2002.04.03
Page No. : 1/4
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperatur e........................................................................................... -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)............................................................................... 625 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage......................................................................................... 60 V
VCEO Collector to Emitter Voltage...................................................................................... 40 V
VEBO Emitter to Base Voltage.............................................................................................. 6 V
IC Collector Current........................................................................................................ 200 mA
TO-92
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 60 - - V IC=10uA, IE=0
BVCEO 40 - - V IC=1mA, IB=0
BVEBO 6 - - V IE=10uA, IC=0
ICEX - - 50 nA VCE=30V, VBE=3V
*VCE(sat)1 - - 200 mV IB=1mA, IC=10mA
*VCE(sat)2 - - 300 mV IB=5mA, IC=50mA
*VBE(sat)1 650 - 850 mV IB=1mA, IC=10mA
*VBE(sat)2 - - 950 mV IB=5mA, IC=50mA
*hFE1 40 - - VCE=1V, IC=100uA
*hFE2 70 - - VCE=1V, IC=1mA
*hFE3 100 - 300 VCE=1V, IC=10mA
*hFE4 60 - - VCE=1V, IC=50mA
*hFE5 30 - - VCE=1V, IC=100mA
fT 300 - - MHz IC=10mA, VCE=20V, f=100MHz
Cob - - 4 pF VCB=5V, f=1MHz, IE=0
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
H2N3904 HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6218
Issued Date : 1992.11.25
Revised Date : 2002.04.03
Page No. : 2/4
1000
Cur rent Ga in & C ollector Cu rrent
125oC
25oC
100
hFE
hFE @ VCE=1V
10
1 10 100 1000
10000
Sat urati on Voltage & Col lector Current
75oC
Collector Current-IC (mA)
1000
125oC
75oC
100
Satur ation Voltag e ( mV)
10
1 10 100 1000
Collector Current-IC (mA)
25oC
CE(sat)
V
@ IC=10I
Capacitan ce & Reverse- B iased Vol tage
10
Sat uration Volta ge & C o llector Current
B
75oC
1000
Saturat ion Volta ge ( m V)
100
1 10 100 1000
25oC
125oC
Collector Current -IC (mA)
BE(sat)
V
Cutoff Frequency & Colllector Current
1000
VCE=20V
100
Cutoff Fr equenc y (MHz)...
@ IC=10I
Cob
1
Capacitance (pF)
B
0.1
0.1 1 10 100
10000
1000
(mA)
C
100
Collector Cu rre nt- I
10
Reverse Biased Vol t age ( V)
Safe Operating Area
PT=1ms
PT=1s
PT=100ms
10
0.1 1 10 100
Collector Curren t (mA)
1
1 10 100
Forwar d Biased Vol tage-VCE (V)
H2N3904 HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6218
Issued Date : 1992.11.25
Revised Date : 2002.04.03
Page No. : 3/4
700
PD-Ta
600
500
400
300
200
Power Dis s ipatio n -PD (mW)
100
0
0 50 100 150 200
Ambient Tem per a t ure-Ta (oC)
H2N3904 HSMC Product Specification
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HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HE6218
Issued Date : 1992.11.25
Revised Date : 2002.04.03
Page No. : 4/4
A
α2
B
31
2
Marking:
HN
2
930
4
Date Code Control Code
α3
C
D
H
I
α1
G
Style: Pin 1.Emitter 2.Base 3.Collector
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
*: Typical
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E-*0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
α1
α2
α3
-
-
-
*5°
*2°
*2°
-
-
-
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
H2N3904 HSMC Product Specification
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