Datasheet H1563S, H1563P Datasheet (HSMC)

HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : HP200201
Issued Date : 2000.10.01

Revised Date : 2002.07.12
Page No. : 1/8

HS200207

H1563P / H1563S

HIGH-EFFICIENCY DC/DC CONVERTER

Description

The H1563 is a monolithic control circuit containing the primary functions required for DC to DC converters
and highside-sensed constant current source. The device consists of an internal temperature compensa­ted reference, comparator, controlled duty cycle oscillator with an active current sense circuit, bootstrap­ped driver, and high current output switch. This device is specifically designed to construct a constant
current source for battery chargers with a minimum number of external components. Bootstrapped driver
can drive the NPN output switch to saturation for higher eff-iciency and less heat dissipation. The H1563
can deliver 1.5A continuous current without requiring a heat sink.

Features

• 3V to 40V Input Voltage Operation

• Internal 2A Peak Current Switch

• 1.5A Continuous Output Current

• Bootstrapped Driver

• High Side Current Sense Capability

• High Efficiency (up to 90%)

• Internal ±2% Reference

• Low Quiescent Current at 1.6mA

• Frequency Operation from 100Hz to 100KHz

Applications

• Constant Current Source for Battery Chargers

• Saver for Cellular Phone

• Step-Down DC-DC Converter Module

T y pical Application Circuit

Saver Circuit for Cellular Phone

R1

1K

Vin

+

D2

H1N4148

C1
220uF

CT

470pF

R2

120

C3
1uF

SC BST
SE IS
TC VCC

GND FB

H1563

L

220uH

D1

H1N5821

RA

5.6K

D3

H1N5819

+ +

Co

220uF

*RS

C5

10uF

RB

33K

Io

*Io=300mV/RS

H1563P / H1563S HSMC Product Specification

Pin Connections

HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : HP200201

HS200207
Issued Date : 2000.10.01
Revised Date : 2002.07.12
Page No. : 2/8

Order No. Pin1: SC-2A Switch Collector

H1563P

Top View

Pin2: SE-Darlington Switch Emitter Pin6: VCC-Power Supply Input

5678

(Plastic DIP)

Pin3: TC-Oscillator Timing Capacitor

H1563S

(Plastic SO)

4321

Pin4: GND-Power Ground

Block Diagram

1

SC

Q2

CT Is

Oscillator

1.25V

Reference

Voltage

SE

TC

Q1

2

3

4

80

Pin5: FB-Feedback Comparator
Inverting Input

Pin7: IS-Highside Current Sense
Input

Pin8: BST-Bootstrapped Driver
Collector

8

BST

­S

Q

R

+

­Comparator

7

IS

6

VCC

5

FBGND

Absolute Maxium Rating

Rating Symbol Value Unit

Power Supply Voltage Vcc 40 Vdc
Comparator Input Voltage Range Vir 0.3 ~ +40 Vdc
Switch Collector Voltage Vc(switch) 40 Vdc
Switch Emitter Voltage (Vpin1=40V) Ve(switch) 40 Vdc
Switch Collector to Emitter Voltage Vce(switch) 40 Vdc
Driver Collector Voltage Vc(driver) 40 Vdc
Switch Current Isw 2 A
Operating Junction Temperature Tj 150
Operating Ambient Temperature Range Ta 0 to +70
Storage Temperature Range Tstg -65 to +150
DIP Package Power Dissipation and Thermal Characteristics:
Ta=25°C
Thermal Resistance 85
SO Package Power Dissipation and Thermal Characteristics:
Ta=25°C
Thermal Resistance 105

1.5 W
°C/W

1.2 W

°C/W

°C
°C
°C

H1563P / H1563S HSMC Product Specification

Test Circuit

HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : HP200201

HS200207
Issued Date : 2000.10.01
Revised Date : 2002.07.12
Page No. : 3/8

Current Source

I

1A

2V/0V

DISCHG/ICHG

CT

1nF

Characteristics Curve

Standby Supply Current vs Supply Voltage

2

1.6

1.2

1

SC BST

2

SE IS

3

TC VCC

4

GND FB

H1563

R1

1K

8
7
6
5

VCC
20mA

Current Source

4.55V
@VCC=5V

4.75V

VCC

1.275V

1.225V

Vfb Theshol d Vol t age vs Temper ature

1.3

1.28

1.26

0.8

Icc Supply Cur rent (m A)

0.4

0

0 5 10 15 20 25 30 35 40

Vcc Suppl y Voltage (V)

Common Emitter Configuration Output Switch

Saturation Voltage vs Collector Current

1

0.8

0.6

0.4

Vce(sat) Saturation Voltage (V)

0.2

VCC=5V
PIN7=VCC
PIN 2,3,5=GND

Forced Beta=20

0

00.511.52

Ic Coll e c tor Current ( A )

1.24

Vfb Thresh ol d Voltage (V)

1.22

1.2
0 1020304050607080

Temperatu re (J)

VCC=5V

Ct=1nF

PIN2=GND

Emmiter Follower Configuration Output Switch

Saturtion Voltage vs Emmiter Current

1.8

1.7

1.6

1.5

1.4

Vce(sat) Sar urtion Vol tage ( V)

1.3

1.2

00.511.52

Ie Emitter (A)

VCC=5V
PIN1,7 ,8=VCC
PIN3,5=GND

H1563P / H1563S HSMC Product Specification

HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : HP200201
Issued Date : 2000.10.01

Revised Date : 2002.07.12
Page No. : 4/8

HS200207

Electrical Characteristics (Vcc=5V, Ta=25°C, unless otherwise specified)

Parameter Test Condition Symbol Min. Typ. Max. Unit

Oscillator

Charging Current
Discharge Current

5V≤V
5V≤V

CC≤40V
CC≤40V

Voltage Swing Pin3 VOSC -0.6- V
Discharge to Charge Current Ratio VIS =VCC IDischg/Ichg -6-
Current Limit Sense Voltage IChg=Idischg VCC-VIS 250 300 350 mV

Output Switch

Saturation Voltage, Emitter
Follower Connection

Saturation Voltage

SE=1A, VBST=VSC=VCC VCE(Sat) -11.3V

I
I

SC=1A, IBST=50mA

(Forced β ≈ 20)
DC Current Gain ISC=1A, VCE=5V hFE 35 120 -
Collector Off-State Current VCE=30V ICC(Off) -10-nA

Comparator

Threshold Voltage
Threshold Voltage Line Regulation

Ta=25°C

0°C≤Ta≤70°C

CC≤40V

3V≤V
Input Bias Current VIN=0V IIB - 20 400 nA

V

IS=VCC, VPin5>VFB

Supply Current

5V≤VCC≤40V, CT=1nF

Pin2=Gnd

Remaining pins open

I

chg 24 35 42 uA

I

dischg 140 220 260 uA

CE(Sat) -0.40.7V

V

VFB

REG

Line -36mV

1.227 1.25 1.273 V

1.21 - 1.29 V

ICC -1.63mA

Application Information

Design Formula Table

Calculation Step-Down Step-Up

ton / toff Vout+VF / (Vin(min) -Vsat-Vout) Vout+VF-Vin(min) / (Vin(min)-Vsat)

(ton+toff) max 1 / Fmin 1 / Fmin

CT 4*10-5ton 4*10-5ton

IC(switch) 2*Iout(max) 2*Iout(max)*(ton+toff / toff)

RS 0.3 / IC(switch) 0.3 / IC(switch)

L(min)

CO IC(switch)*(ton+toff) / 8VRipple(P-P)

Vsat: Saturation voltage of the output switch.
V

F: Forward voltage of the ringback rectifier.

The following power supply characteristics must be chosen:
V

in: Nominal input voltage.

V

out: Desired output voltage. |Vout|=1.25*(1+RB/RA)

I

out: Desired output current

Fmin: Minimum desired switching frequency at selected values for V
V

Ripple(P-P): Desired peak to peak output ripple voltage in practice, the calculated value will need to be increased due

to the capacitor equivalent series resistance and board layout. The ripple voltage should be kept to a low
value since it will directly effect the line and load regulation.

((Vin(min)-Vsat-Vout) / IC(switch))*ton(max) ((Vin(min)-Vsat) / IC(switch))*ton(max)

Iout*ton / VRipple(P-P)

in and Iout.

H1563P / H1563S HSMC Product Specification

HI-SINCERITY

D1

MICROELECTRONICS CORP.

Application Information (Continuos)

Spec. No. : HP200201

HS200207
Issued Date : 2000.10.01
Revised Date : 2002.07.12
Page No. : 5/8

Fig.1 Step-Down Converter

RS

0.22

C1
100uF

D2

H1N4148

D2

H1N4148

R1

470

RS

0.22

Vin

8V~25V

+

C1
100uF

Fig.2 Step-Down Converter With External 5V Bootstrap

5V

Vin

16V~25V

+

C3

+

1uF

8
7
6

C3

+

1uF

8
7
6

H1563

H1563

R3

2.2M

GNDFB

D3

SCBST

SEIS
TCVCC

GNDFB

1

SCBST

2

SEIS

3

TCVCC

45

1
2
3
45

1N1418

R2
390K

C2
1000pF

L1

300uH

D1
H1N5819

RA
1K

5V/1A

+

C4
470uF

RB

3K

Line Regulation: 40mV (Vin=10V~20V, @Io=1A)
Load Regulation: 20mV (Vin=15V, @Io=100mA~1A)
Short Circuit Current: 1.3A (Vin=15V, @RL=0.1Ω)

C2
470pF

L1

300uH

D1
H1N5819

+

RA

1.5K

C4
470uF

RB

13K

12V/1A

Fig.3 Step-Up Converter

L

Vin

200uH

R1

150

8

RS

0.22

+

C1
100uF

RA

2.2K

7
6

H1563

1

SCBST

2

SEIS

3

TCVCC

45

GNDFB

H1N5819

CT
680pF

RB

47K

+

Co
220uF

Line Regulation: 100mV (Vin=8V~16V, @Io=200mA)

=

H1563P / H1563S HSMC Product Specification

Vout

28V/200mA

=

~

HI-SINCERITY

MICROELECTRONICS CORP.

Fig.4 Step-Up Converter With External NPN Switch

L

R1

1

SCBST

2

SEIS

3

TCVCC

45

GNDFB

Vin

8

RA

7
6

H1563

RS

+

C1

CT

D1

R2

Q1

RB

Spec. No. : HP200201

HS200207
Issued Date : 2000.10.01
Revised Date : 2002.07.12
Page No. : 6/8

Vout

+

Co

Fig.5 Inverting Converter

Vin

4.5V~6V

8

RS

0.25

+

C1
100uF

RB

8.2K

7
6

H1563

RA

953

1

SCBST

2

SEIS

3

TCVCC

45

GNDFB

CT
600pF

Co
470uF

L
100uH

D1
H1N5819

Vout

-12V/100mA

Line Regulation: 20mV (Vin=4.5V~6V, @Io=100mA)
Load Regulation: 100mV (Vin=5V, @Io=10mA~100mA)

H1563P / H1563S HSMC Product Specification

HI-SINCERITY

g

MICROELECTRONICS CORP.

H1563P Dimension (DIP-8P)

5

87

6

Spec. No. : HP200201

HS200207
Issued Date : 2000.10.01
Revised Date : 2002.07.12
Page No. : 7/8

Marking:

A

1

432

HP
15 63

Date Code

B

J

DIP-8P Plastic Package

DIM

F

α1

C

E

G

H

D

I

M

Inches Millimeters Inches Millimeters

Min. Max. Min. Max.

K

L

DIM

Min. Max. Min. Max.

HSMC Packa

e Code: P

A 0.2480 0.2520 6.29 6.40 H 0.0150 0.0210 0.38 0.53
B 0.3630 0.3670 9.22 9.32 I 0.0898 0.1098 2.28 2.79
C - *0.0600 - *1.52 J 0.2950 0.3050 7.49 7.74
D - *0.0500 - *1.27 K - *0.1181 - *3.00
E - *0.0390 - *0.99 L 0.3370 0.7470 8.56 8.81

F 0.1280 0.1320 3.25 3.35 M 0.0090 0.0150 0.229 0.381

G 0.1250 0.1400 3.17 3.55

Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.

2.Controlling dimension: millimeters.

3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.

Material:

• Lead: 42 Alloy; solder plating

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

α194° 97° 94° 97°

*: Typical

H1563P / H1563S HSMC Product Specification

HI-SINCERITY

g

MICROELECTRONICS CORP.

H1563S Dimension (SOP-8P)

Spec. No. : HP200201

HS200207
Issued Date : 2000.10.01
Revised Date : 2002.07.12
Page No. : 8/8

Top View

B

A

C

Right side View

G

I

H

Marking:

HS
15 63

Date Code

SOP-8P Plastic Package

D

Front View

Part A

J

E

Part A

M

K

L

N

HSMC Packa

e Code: S

O

F

DIM

Inches Millimeters Inches Millimeters

Min. Max. Min. Max.

DIM

Min. Max. Min. Max.
A 0.1909 0.2007 4.85 5.10 I 0.0019 0.0078 0.05 0.20
B 0.1515 0.1555 3.85 3.95 J 0.0118 0.0275 0.30 0.70
C 0.2283 0.2441 5.80 6.20 K 0.0074 0.0098 0.19 0.25
D 0.0480 0.0519 1.22 1.32 L 0.0145 0.0204 0.37 0.52
E 0.0145 0.0185 0.37 0.47 M 0.0090 0.0110 0.23 0.28

F 0.1472 0.1527 3.74 3.88 N 0.0031 0.0051 0.08 0.13
G 0.0570 0.0649 1.45 1.65 O 0.0000 0.0059 0.00 0.15
H 0.1889 0.2007 4.80 5.10

Notes: 1.Dimension and tolerance based on our Spec. dated Mar. 01, 2001.

Material:

• Lead: 42 Alloy; solder plating

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

2.Controlling dimension: millimeters.

3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.

*: Typical

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or appl ication assistance.

Head Office And Factory:

• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: [phone] Fax: [phone]

• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: [phone]~5 Fax: [phone]

H1563P / H1563S HSMC Product Specification