Datasheet H11N3-M, H11N2-M, H11N1-M Datasheet (Fairchild Semiconductor)

6-PIN DIP

HIGH SPEED LOGIC OPTOCOUPLERS

H11N1-M H11N2-M H11N3-M

PACKAGE

6

1

6

1

DESCRIPTION

The H11NX-M series has a high speed integrated circuit detector optically coupled to an AlGaAs infrared emitting diode. The output incorporates a Schmitt trigger, which provides hysteresis for noise immunity and pulse s haping. The detector circuit is optimized for simplicity of operation and utilizes an open collector output for maximum application ﬂexibility.

SCHEMATIC

1

ANODE

CATHODE

2

3

Truth Table

Input Output

HL

LH

V

6

CC

5GND

V

4

O

FEATURES

• High data rate, 5 MHz typical (NRZ)

•Free from latch up and oscilliation throughout voltage and temperature ranges.

• Microprocessor compatible drive

• Logic compatible output sinks 16 mA at 0.5 V maximum

• Guaranteed on/off threshold hysteresis

• Wide supply voltage capability, compatible with all popular logic systems

• High common mode transient immunity, 2000 V/µs minimum

•Fast switching t

• Underwriter Laboratory (UL) recognized—ﬁle #E90700

• VDE recognized – File#102497 – Add option V (e.g., H11N1VM)

= 7.5ns typical, t

r

= 12ns typical

f

APPLICATIONS

• Logic to logic isolator

• Programmable current level sensor

• Line receiver—eliminate noise and transient problems

• A.C. to TTL conversion—square wave shaping

• Interfaces computers with peripherals

• Isolated power MOS driver for power supplies

Page 1 of 9

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HIGH SPEED LOGIC OPTOCOUPLERS

H11N1-M H11N2-M H11N3-M

ABSOLUTE MAXIMUM RATINGS

Parameters Symbol Device Value Units

TOTAL DEVICE

Storage Temperature

Operating Temperature

Lead Solder Temperature

Total Device Power Dissipation @ 25°C

Derate Above 25°C 2.94 mW/°C

EMITTER

Continuous Forward Current

Reverse Voltage

Forward Current - Peak (1 µs pulse, 300 pps)

LED Power Dissipation 25°C Ambient

Derate Linearly From 25°C 1.41 mW/°C

DETECTOR

Detector Power Dissipation @ 25°C

Derate Linearly from 25°C 1.76 mW/°C

Allowed Range V

V

45

V

Allowed Range V

65

I

Output Current I

4

T

I

P

V

F

P

STG

OPR

SOL

D

I

F

R

(pk)

D

O

CC

O

All -55 to +150 °C

All -40 to +85 °C

All 260 for 10 sec °C

All

250 mW

All 30 mA

All 6 V

All 1.0 A

All

120 mW

150 mW

All 0 to 16 V

All 50 mA

ELECTRICAL CHARACTERISTICS

(T

= 0-70°C Unless otherwise speciﬁed.)

A

INDIVIDUAL COMPONENT CHARACTERISTICS

Parameters Test Conditions Symbol Device Min Typ* Max Units

EMITTER

= 10 mA

I

Input Forward Voltage

Reverse Current

F

I

= 0.3 mA

F

V

= 5 V I

R

Capacitance V = 0, f = 1.0 MHz

DETECTOR

Operating Voltage Range

I

Supply Current

Output Current, High

*Typical values at T

= 25°C

A

= 0, V

F

I

= 0.3mA, V

F

= 5V I

CC

= V

O

= 15V I

Page 2 of 9

V

F

R

C

J

V

CC

CC(off)

OH

All

0.75 1.25

All 10 µA

All 100 pF

All 4 15 V

All 6 10 mA

All 100 µA

1.4 2

4/14/03

V

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HIGH SPEED LOGIC OPTOCOUPLERS

H11N1-M H11N2-M H11N3-M

TRANSFER CHARACTERISTICS

DC Characteristics Test Conditions Symbol Device Min Typ* Max Units

I

Supply Current

Output Voltage, low

Tu r n-On Threshold Current

Tu r n-Off Threshold Current

Hysteresis Ratio

= 10mA, V

F

R

=270 Ω ,V

L

R

=270 Ω , V

L

note 1

R

=270 Ω , V

L

R

=270 Ω , V

L

AC Characteristics Test Conditions Symbol Device Min Typ Max Units

= 5V I

CC

=5V, I

=I

CC

F

= 5V

= 5V I

max. V

F(on)

CC(on)

I

F(off)

OL

F(on)

F(off)

/I

All 6.5 10 mA

All 0.5 V

H11N1-M 0.8 3.2

H11N3-M 4.1 10

All 0.3 mA

F(on)

All 0.65 0.95

mAH11N2-M 2.3 5

SWITCHING SPEED

Propagation delay time High to Low

Rise Time

Propagation delay time Low to High

Fall time

C=120pF, t Fig. 1

=1µs, R

P

=1µs, R

P

=1µs, R

P

=1µs, R

P

: Note 2

E

: Note 2

E

: Note 2

E

: Note 2

E

t

PHL

t

PLH

All 100 330 ns

t

r

All 7.5 ns

All 150 330 ns

t

f

All 12 ns

Data Rate All 5 MHz

ISOLATION CHARACTERISTICS

Parameters Test Conditions Symbol Min Typ* Max Units

Input-Output Isolation Voltage f = 60 Hz, t =1 sec.

V

Isolation Capacitance

Isolation Resistance

*Typical values at T

= 25°C

A

= 0V, f = 1 MHz C

I-O

V

= ±500 VDC R

I-O

V

ISO

7500

11

10

0.4 0.6 pF

NOTES:

1. Maximum I

is the maximum current required to trigger the output. For example, a 3.2mA maximum trigger current would

F(ON)

require the LED to be driven at a current greater than 3.2mA to guarantee the device will turn on. A 10% guard band is recommended to account for degradation of the LED over its lifetime. The maximum allowable LED drive current is 30mA.

2. H11N1: R H11N2: R H11N3: R

= 910 Ω

E

= 560 Ω

E

= 240 Ω

E

V

PEAK

Ω

Page 3 of 9

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HIGH SPEED LOGIC OPTOCOUPLERS

H11N1-M H11N2-M H11N3-M

tr = tf ≤ 0.01µS Z = 50Ω

C

I

F

H11N1-M

R

E

V

IN

1

2

I

6

5

Figure 1. Switching Test Circuit and Waveforms

Figure 2. Transfer Characteristics

6

V

5

4

3

2

- OUTPUT VOLTAGE (V)

Hysteresis area

O

V

shaded for illustration

1

0

01234

OH

I

F(OFF)

IF - INPUT CURRENT (mA)

I

F(ON)

VCC = 5V

= 270

R

L

= 25°C

T

A

V

OL

Ω

5V

VIN 5V

50%

0

R

270Ω

L

4

0.1µF

V

O

t

on

V

O

t

off

10%

90%

t

f

t

r

Figure 3. Threshold Current vs. Supply Voltage

1.4

1.2

1.0

0.8

0.6

0.4

0.2

- NORMALIZED THRESHOLD CURRENT

F

I

0.0 0246810121416

VCC - SUPPLY VOLTAGE (V)

TURN ON THRESHOLD

TURN OFF THRESHOLD

NORMALIZED TO: TURN ON THRESHOLD AT

= 5V, TA = 25°C

V

CC

D

:

AT

Figure 4. Threshold Current vs. Temperature

1.2

1.0

I

0.8

F(Off)

, I

F(On)

0.6

0.4

CURRENT I

NORMALIZED THRESHOLD

0.2

0.0 010203040506070

F(On)

NORMALIZED TO : V

CC

= 25°C

T

A

TA - TEMPERATURE (°C)

= 5V

I

F(Off)

Page 4 of 9

Figure 5. Load Current vs. Output Voltage

100

IF = I

F(ON)

V

= 5V

10

- LOAD CURRENT (mA)

O

I

1

0.0 0.2 0.4 0.6 0.8 1.0

VO - OUTPUT VOLTAGE, LOW (V)

CC

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HIGH SPEED LOGIC OPTOCOUPLERS

H11N1-M H11N2-M H11N3-M

Figure 6. Supply Current vs. Supply Voltage Figure 7. LED Forward Voltage vs. Forward Current

12

100

10

8

6

4

- SUPPLY CURRENT (mA)

C

I

2

0

24681012 14 16

TA = -25°C

TA = 25°C

TA = 85°C

ON STATE IF = 10mA

OFF STATE IF = 0

VCC - SUPPLY VOLTAGE (V)

TA = 85°C

10

- FORWARD CURRENT (mA)

F

I

1

1.0 1.2 1.4 1.6 1.8 2.0

VF - FORWARD VOLTAGE (V)

TA = -25°C

TA = 25°C

Page 5 of 9

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HIGH SPEED LOGIC OPTOCOUPLERS

H11N1-M H11N2-M H11N3-M

Package Dimensions (Through Hole) Package Dimensions (Surface Mount)

0.350 (8.89)

0.320 (8.13)

0.014 (0.36)

0.010 (0.25)

0.260 (6.60)

0.240 (6.10)

0.100 [2.54]

0.390 (9.90)

0.332 (8.43)

0.012 (0.30)

0.008 (0.20)

0.320 (8.13)

0.035 (0.88)

0.006 (0.16)

0.070 (1.77)

0.040 (1.02)

0.200 (5.08)

0.115 (2.93)

0.100 (2.54)

0.015 (0.38)

0.020 (0.50)

0.016 (0.41)

0.350 (8.89)

0.320 (8.13)

0.014 (0.36)

0.010 (0.25)

0.100 (2.54)

0.260 (6.60)

0.240 (6.10)

0.320 (8.13)

15°

0.012 (0.30)

0.070 (1.77)

0.040 (1.02)

0.200 (5.08)

0.115 (2.93)

0.025 (0.63)

0.020 (0.51)

0.020 (0.50)

0.016 (0.41)

Package Dimensions (0.4” Lead Spacing) Recommended Pad Layout for

0.350 (8.89)

0.320 (8.13)

Surface Mount Leadform

0.260 (6.60)

0.240 (6.10)

0.070 (1.77)

0.040 (1.02)

0.200 (5.08)

0.115 (2.93)

0.100 (2.54)

0.015 (0.38)

0.020 (0.50)

0.016 (0.41)

0.014 (0.36)

0.010 (0.25)

0.100 [2.54]

0.012 (0.30)

0.008 (0.21)

0.425 (10.80)

0.400 (10.16)

Page 6 of 9

0.425 (10.79

0.100 (2.54

0.305 (7.75

0.070 (1.78

0.060 (1.52

0.030 (0.76

4/14/03

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HIGH SPEED LOGIC OPTOCOUPLERS

H11N1-M H11N2-M H11N3-M

ORDERING INFORMATION

Option/Order Entry Identiﬁer Description

S Surface Mount Lead Bend

SR2 Surface Mount; Tape and reel

T 0.4" Lead Spacing

V VDE 0884

TV VDE 0884, 0.4" Lead Spacing

SV VDE 0884, Surface Mount

SR2V VDE 0884, Surface Mount, Tape & Reel

MARKING INFORMATION

1

H11N1

V X YY Q

43

Deﬁnitions

1Fairchild logo

2Device number

VDE mark (Note: Only appears on parts ordered with VDE

3

option – See order entry table)

4 One digit year code, e.g., ‘3’

5Two digit work week ranging from ‘01’ to ‘53’

6 Assembly package code

*Note – Parts that do not have the ‘V’ option (see deﬁnition 3 above) that are marked with date code ‘325’ or earlier are marked in portrait format.

5

2

6

Page 7 of 9

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Carrier Tape Specifications

12.0 ± 0.1

4.5 ± 0.20

0.30 ± 0.05

21.0 ± 0.1

0.1 MAX

User Direction of Feed

4.0 ± 0.1

10.1 ± 0.20

2.0 ± 0.05

1.5 MIN

Ø

9.1 ± 0.20

Ø

1.5 ± 0.1/-0

1.75 ± 0.10

11.5 ± 1.0

24.0 ± 0.3

NOTE

All dimensions are in inches (millimeters)

Reﬂow Proﬁle (White Package, -M Sufﬁx)

300

250

200

150

100

Temperature (°C)

50

0

0.5 1 1.5 2 2.5 3 3.5 4 4.5

0

245°C peak

Time above 183°C, 120–180 sec

Ramp up = 2–10°C/sec

Time (Minute)

230°C, 10–30 s

• Peak reflow temperature: 245°C (package surface temperature)

• Time of temperature higher than 183°C for 120–180 seconds

• One time soldering reflow is recommended

Page 8 of 9

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DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:

1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user.

2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.

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