Datasheet H11N1M Datasheet (Fairchild)

H11N1M, H11N2M, H11N3M — 6-Pin DIP High Speed Logic Optocouplers

September 2009

H11N1M, H11N2M, H11N3M 6-Pin DIP High Speed Logic Optocouplers

Features

■

High data rate, 5MHz typical (NRZ) Free from latch up and oscilliation throughout voltage

■

and temperature ranges.

■

Microprocessor compatible drive Logic compatible output sinks 16mA at 0.5V

■

maximum Guaranteed on/off threshold hysteresis

■

Wide supply voltage capability, compatible with all popular logic systems

High common mode transient immunity, 2000V/µs

■

minimum

■

Fast switching t Underwriter Laboratory (UL) recognized—

■

= 7.5ns typical, t

r

= 12ns typical

f

file #E90700

■

VDE recognized—File#102497 – Add option V (e.g., H11N1VM)

Applications

Logic to logic isolator

■

Programmable current level sensor Line receiver—eliminate noise and transient problems

■

A.C. to TTL conversion—square wave shaping Interfaces computers with peripherals

■

Isolated power MOS driver for power supplies

Description

The H11NXM series has a high speed integrated circuit detector optically coupled to an AlGaAs infrared emitting diode. The output incorporates a Schmitt trigger, which provides hysteresis for noise immunity and pulse shaping. The detector circuit is optimized for simplicity of operation and utilizes an open collector output for maximum application flexibility.

Schematic Package Outlines

ANODE

CATHODE

1

2

3

V

6

CC

5 GND

V

4

O

Truth Table

Input Output

HL

LH

H11N1M, H11N2M, H11N3M — 6-Pin DIP High Speed Logic Optocouplers

Absolute Maximum Ratings

(T

= 25°C unless otherwise specified.)

A

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.

Symbol Parameters Value Units

TOTAL DEVICE

T

STG

T

OPR

T

SOL

P

D

EMITTER

I

F

V

R

I

(pk) Forward Current – Peak (1µs pulse, 300 pps) 1.0 A

F

P

D

DETECTOR

P

D

V

O

V

CC

I

O

Storage Temperature -40 to +150 °C Operating Temperature -40 to +85 °C Lead Solder Temperature 260 for 10 sec °C Total Device Power Dissipation @ 25°C 250 mW Derate Above 25°C 2.94 mW/°C

Continuous Forward Current 30 mA Reverse Voltage 6 V

LED Power Dissipation 25°C Ambient 120 mW Derate Linearly From 25°C 1.41 mW/°C

Detector Power Dissipation @ 25°C 150 mW Derate Linearly from 25°C 1.76 mW/°C V

Allowed Range 0 to 16 V

45

V

Allowed Range 0 to 16 V

65

I

Output Current 50 mA

4

H11N1M, H11N2M, H11N3M — 6-Pin DIP High Speed Logic Optocouplers

Electrical Characteristics

(T

= 25°C unless otherwise speciﬁed.)

A

Individual Component Characteristics

Symbol Parameters Test Conditions Device Min. Typ.* Max. Units

EMITTER

V

C

Input Forward Voltage I

F

I

Reverse Current V

R

Capacitance V = 0, f = 1.0MHz All 100 pF

J

= 10mA All 1.4 2 V

F

I

= 0.3mA 0.75 1.25

F

= 5V All 10 µA

R

DETECTOR

V

I

CC(off)

I

OH

Operating Voltage Range All 4 15 V

CC

Supply Current I Output Current, High I

= 0, V

F

CC

= 0.3mA, V

= 5V All 6 10 mA

= V

CC

= 15V All 100 µA

O

Transfer Characteristics

Symbol DC Characteristics Test Conditions Device Min. Typ.* Max. Units

I

F(off)

I

CC(on)

V

OL

I

F(on)

I

F(off)

/ I

Supply Current I Output Voltage, Low R

Tu r n-On Threshold Current R

Tu r n-Off Threshold Current R Hysteresis Ratio R

F(on)

= 10mA, V

F

=270 Ω ,V

L

I

= I

F

F(on)

=270 Ω , V

L

= 270 Ω , V

L

= 270 Ω , V

L

= 5V All 6.5 10 mA

CC

=5V,

All 0.5 V

max.

CC

= 5V

H11N1M 0.8 3.2 mA

(1)

H11N2M 2.3 5 H11N3M 4.1 10

= 5V All 0.3 mA

CC

= 5V All 0.65 0.95

CC

Switching Speed

Symbol AC Characteristics Test Conditions Device Min. Typ.* Max. Units

t

PHL

t

PLH

t

Propagation Delay Time HIGH-to-LOW

Rise Time C = 120pF, t

r

Propagation Delay Time LOW-to-HIGH

Fall Time C = 120pF, t

f

C = 120pF, t

(2)

R

=

, Figure 1

E

(2)

R

=

, Figure 1

E

C = 120pF, t

(2)

R

=

, Figure 1

E

(2)

R

=

, Figure 1

E

= 1µs,

P

= 1µs,

P

= 1µs,

P

= 1µs,

P

All 100 330 ns

All 7.5 ns

All 150 330 ns

All 12 ns

Data Rate All 5 MHz

Isolation Characteristics

Symbol Parameters Test Conditions Min. Typ.* Max. Units

V

ISO

C

ISO

R

ISO

*Typical values at T

Notes:

1. Maximum I would require the LED to be driven at a current greater than 3.2mA to guarantee the device will turn on. A 10% guard band is recommended to account for degradation of the LED over its lifetime. The maximum allowable LED drive current is 30mA.

2. H11N1: R

Input-Output Isolation Voltage f = 60 Hz, t =1 sec. 7500 V Isolation Capacitance V Isolation Resistance V

= 25°C

A

is the maximum current required to trigger the output. For example, a 3.2mA maximum trigger current

F(ON)

= 910 Ω , H11N2: R

E

= 560 Ω , H11N3: R

E

= 0V, f = 1 MHz 0.4 0.6 pF

I-O

= ±500 VDC 10

I-O

= 240 Ω

E

11

PEAK

Ω

Safety and Insulation Ratings

As per IEC 60747-5-2, this optocoupler is suitable for “safe electrical insulation” only within the safety limit data. Compliance with the safety ratings shall be ensured by means of protective circuits.

Symbol Parameter Min. Typ. Max. Unit

H11N1M, H11N2M, H11N3M — 6-Pin DIP High Speed Logic Optocouplers

Installation Classiﬁcations per DIN VDE 0110/1.89

Ta ble 1 For Rated Main Voltage < 150Vrms I-IV For Rated Main voltage < 300Vrms I-IV Climatic Classiﬁcation 55/100/21 Pollution Degree (DIN VDE 0110/1.89) 2

CTI Comparative Tracking Index 175

V

PR

Input to Output Test Voltage, Method b,

V

x 1.875 = V

IORM

, 100% Production Test

PR

1594 V

peak

with tm = 1 sec, Partial Discharge < 5pC

Input to Output Test Voltage, Method a,

V

x 1.5 = VPR, Type and Sample Test

IORM

1275 V

peak

with tm = 60 sec, Partial Discharge < 5pC

V

IORM

IOTM

Max. Working Insulation Voltage 850 V

Highest Allowable Over Voltage 6000 V

peak

External Creepage 7 mm External Clearance 7 mm

Insulation Thickness 0.5 mm

RIO Insulation Resistance at Ts, V

= 500V 10

IO

9

Ω

Typical Performance Curves

H11N1M, H11N2M, H11N3M — 6-Pin DIP High Speed Logic Optocouplers

tr = tf ≤ 0.01µS

C

I

F

H11N1-M

R

E

V

IN

1

2

I

6

4

5

Z = 50Ω

Figure 1. Switching Test Circuit and Waveforms

Figure 2. Transfer Characteristics

6

V

5

4

3

2

- OUTPUT VOLTAGE (V)

Hysteresis area

O

V

shaded for illustration

1

0

01234

OH

I

F(OFF)

I

F(ON)

IF – INPUT CURRENT (mA)

VCC = 5V R

= 270

L

T

= 25°C

A

V

OL

Ω

R

L

0.1µF

5V

VIN 5V

270Ω

V

O

0

V

O

Figure 3. Threshold Current vs. Supply Voltage

1.4

1.2

1.0

0.8

0.6

0.4

0.2

- NORMALIZED THRESHOLD CURRENT

F

I

0.0 0246810121416

VCC – SUPPLY VOLTAGE (V)

50%

t

on

TURN ON THRESHOLD

TURN OFF THRESHOLD

NORMALIZED TO: TURN ON THRESHOLD AT V

CC

t

off

t

f

= 5V, TA = 25°C

10%

90%

t

r

:

Figure 4. Threshold Current vs. Temperature

Figure 5. Load Current vs. Output Voltage

1.2

I

F(On)

1.0

I

0.8

F(Off)

, I

F(On)

0.6

0.4

CURRENT I

NORMALIZED THRESHOLD

0.2

0.0 010203040506070

– TEMPERATURE (°C)

T

A

F(Off)

NORMALIZED TO :

= 5V

V

CC

T

= 25°C

A

100

IF = I

F(ON)

= 5V

V

10

- LOAD CURRENT (mA)

O

I

1

0.0 0.2 0.4 0.6 0.8 1.0

CC

VO – OUTPUT VOLTAGE, LOW (V)

Typical Performance Curves (Continued)

Figure 6. Supply Current vs. Supply Voltage Figure 7. LED Forward Voltage vs. Forward Current

12

H11N1M, H11N2M, H11N3M — 6-Pin DIP High Speed Logic Optocouplers

100

10

8

6

4

– SUPPLY CURRENT (mA)

C

I

2

0

24681012 14 16

TA = -25°C

TA = 25°C

TA = 85°C

ON STATE IF = 10mA OFF STATE IF = 0

VCC – SUPPLY VOLTAGE (V)

TA = 85°C

10

– FORWARD CURRENT (mA)

F

I

1

1.0 1.2 1.4 1.6 1.8 2.0

VF – FORWARD VOLTAGE (V)

TA = -25°C

TA = 25°C

Package Dimensions

Through Hole 0.4" Lead Spacing

8.13–8.89

64

8.13–8.89

64

H11N1M, H11N2M, H11N3M — 6-Pin DIP High Speed Logic Optocouplers

6.10–6.60

5.08 (Max.)

3.28–3.53

0.38 (Min.)

(0.86)

1.02–1.78

Pin 1

13

0.41–0.51

0.25–0.36

0.76–1.14

2.54–3.81

2.54 (Bsc)

Surface Mount

7.62 (Typ.)

15° (Typ.)

8.13–8.89

64

0.20–0.30

6.10–6.60

5.08 (Max.)

3.28–3.53

0.38 (Min.)

(0.86)

1.02–1.78

Pin 1

13

0.41–0.51

(1.78)

0.25–0.36

0.76–1.14

2.54–3.81

2.54 (Bsc)

(1.52)

0.20–0.30

10.16–10.80

(2.54)

(0.76)

8.43–9.90

6.10–6.60

Pin 1

(7.49)

(10.54)

13

Rcommended Pad Layout

0.25–0.36

3.28–3.53

5.08

(Max.)

0.38 (Min.)

(0.86)

1.02–1.78

0.41–0.51

0.76–1.14

2.54 (Bsc)

0.16–0.88

(8.13)

0.20–0.30

Note:

All dimensions in mm.

Ordering Information

Option

No option H11N1M Standard Through Hole Device

S H11N1SM Surface Mount Lead Bend

SR2 H11N1SR2M Surface Mount; Tape and Reel

T H11N1TM 0.4" Lead Spacing

V H11N1VM VDE 0884

TV H11N1TVM VDE 0884, 0.4" Lead Spacing

SV H11N1SVM VDE 0884, Surface Mount

SR2V H11N1SR2VM VDE 0884, Surface Mount, Tape and Reel

Marking Information

H11N1M, H11N2M, H11N3M — 6-Pin DIP High Speed Logic Optocouplers

Order Entry Identiﬁer

(Example) Description

1

H11N1

V X YY

43

Q

5

2

6

Deﬁnitions

1Fairchild logo

2Device number

VDE mark (Note: Only appears on parts ordered with VDE

3

option – See order entry table)

4 One digit year code, e.g., ‘3’

5Two digit work week ranging from ‘01’ to ‘53’

6 Assembly package code

*Note – Parts that do not have the ‘V’ option (see definition 3 above) that are marked with date code ‘325’ or earlier are marked in portrait format.

Tape Dimensions

4.5 ± 0.20

21.0 ± 0.1

0.30 ± 0.05

4.0 ± 0.1

12.0 ± 0.1

2.0 ± 0.05

H11N1M, H11N2M, H11N3M — 6-Pin DIP High Speed Logic Optocouplers

Ø1.5 MIN

1.75 ± 0.10

11.5 ± 1.0

24.0 ± 0.3

9.1 ± 0.20

0.1 MAX

User Direction of Feed

Note:

All dimensions are in millimeters.

Reflow Soldering Profile

300

280

260

240

220

200

180

160

°C

140

120

100

80

60

40

20

0

0 60 180120 270

10.1 ± 0.20

1.822°C/Sec Ramp up rate

33 Sec

Time (s)

Ø1.5 ± 0.1/-0

260°C

>245°C = 42 Sec

Time above

183°C = 90 Sec

360

TRADEMARKS

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries,andis not intended to be an exhaustive list of all such trademarks.

Auto-SPM™ Build it Now™ CorePLUS™ CorePOWER™

CROSSVOLT™

CTL™ Current Transfer Logic™ EcoSPARK EfficentMax™ EZSWITCH™*

®

™*

®

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®

FACT

®

FAST

®

F-PFS™

®

FRFET Global Power Resource Green FPS™ Green FPS™ e-Series™ Gmax™ GTO™ IntelliMAX™ ISOPLANAR™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MillerDrive™ MotionMax™ Motion-SPM™ OPTOLOGIC OPTOPLANAR

®

FastvCore™ FETBench™ FlashWriter FPS™

®

*

PDP SPM™ Power-SPM™

PowerTrench

SM

PowerXS™ Programmable Active Droop™ QFET QS™ Quiet Series™ RapidConfigure™

Saving our world, 1mW/W/kW at a time™ SmartMax™ SMART START™ SPM STEALTH™ SuperFET™ SuperSOT™-3

®

SuperSOT™-6 SuperSOT™-8 SupreMOS™ SyncFET™ Sync-Lock™

®

ThePower Franchise

TinyBoost™ TinyBuck™

®

TinyLogic

®

TINYOPTO™

™

TinyPower™ TinyPWM™ TinyWire™ TriFault Detect™

®

TRUECURRENT™* µSerDes™

®

UHC Ultra FRFET™ UniFET™ VCX™ VisualMax™

®

*

XS™

*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.

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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERSTHESE PRODUCTS.

H11N1M, H11N2M, H11N3M — 6-Pin DIP High Speed Logic Optocouplers

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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.

As used herein:

1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user.

2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.

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Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failedapplications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technicalandproduct information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.

PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet Identification Pr oduct Status Definition

Advance Information Formative / In Design

Preliminary

First Production

No Identification Needed Full Production

Obsolete Not In Production

Datasheet contains the design specifications for product development. Specifications may change in any manner without notice.

Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.

Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design.

Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only.

Rev. I40