Datasheet H11F3, H11F2, H11F1 Datasheet (Fairchild Semiconductor)

Page 1
• ≥
PHOTO FET OPTOCOUPLERS
H11F1 H11F2 H11F3
PACKAGE
ANODE
6
1
6
CATHODE
SCHEMATIC
1
2
OUTPUT
6
TERM.
5
1
OUTPUT
3
4
TERM.
6
1
DESCRIPTION
The H11F series consists of a Gallium-Aluminum-Arsenide IRED emitting diode coupled to a symmetrical bilateral silicon photo­detector. The detector is electrically isolated from the input and performs like an ideal isolated FET designed for distortion-free control of low level AC and DC analog signals. The H11F series devices are mounted in dual in-line packages.
FEATURES
As a remote variable resistor
• ≤ 100 Ω to ≥ 300 M Ω
99.9% linearity
• ≤ 15 pF shunt capacitance
• ≥ 100 G Ω I/O isolation resistance
As an analog switch
• Extremely low offset voltage
• 60 V
• No charge injection or latch-up
•t
on
• UL recognized (File #E90700)
• VDE recognized (File #E94766) – Ordering option ‘300’ (e.g. H11F1.300)
signal capability
pk-pk
, t
15 µS
off
APPLICATIONS
As a variable resistor –
• Isolated variable attenuator
• Automatic gain control
• Active filter fine tuning/band switching
As an analog switch –
• Isolated sample and hold circuit
• Multiplexed, optically isolated A/D conversion
© 2002 Fairchild Semiconductor Corporation
6/24/02
Page 2
PHOTO FET OPTOCOUPLERS
H11F1 H11F2 H11F3
Absolute Maximum Ratings
Parameter Symbol Device Value Units
TOTAL DEVICE
Storage Temperature T
Operating Temperature T
Lead Solder Temperature T
EMITTER
Continuous Forward Current I
Reverse Voltage V
Forward Current - Peak (10 µs pulse, 1% duty cycle) I
LED Power Dissipation 25°C Ambient
Derate Linearly From 25°C 1.33 mW/°C
DETECTOR
Detector Power Dissipation @ 25°C
Derate linearly from 25°C 4.0 mW/°C
Breakdown Voltage (either polarity) BV
Continuous Detector Current (either polarity) I
ELECTRICAL CHARACTERISTICS
(T
= 25°C unless otherwise specied)
A
STG
OPR
SOL
F
R
F(pk)
P
D
P
D
4-6
4-6
(T
= 25°C Unless otherwise specied.)
A
All -55 to +150 °C
All -55 to +100 °C
All 260 for 10 sec °C
All 60 mA
All 5 V
All 1 A
All
All
100 mW
300 mW
H11F1, H11F2 ±30 V
H11F3 ±15 V
All ±100 mA
INDIVIDUAL COMPONENT CHARACTERISTICS
Parameter Test Conditions Symbol Device Min Typ* Max Unit
EMITTER
Input Forward Voltage I
Reverse Leakage Current V
Capacitance V = 0 V, f = 1.0 MHz C
OUTPUT DETECTOR
Breakdown Voltage Either Polarity
Off-State Dark Current
V
4-6
Off-State Resistance V
Capacitance V
© 2002 Fairchild Semiconductor Corporation
4-6
= 16 mA V
F
= 5 V I
R
I
= 10µA, I
4-6
V
= 15 V, I
4-6
= 15 V, I
= 15 V, I
4-6
= 15 V, I
= 0 BV
F
= 0
F
= 0, T
F
= 100°C All 50 µA
A
= 0 R
F
= 0, f = 1MHz C
F
F
R
J
All 1.3 1.75 V
All 10 µA
All 50 pF
H11F1, H11F2 30
4-6
I
4-6
4-6
4-6
H11F3 15
All 50 nA
All 300 M Ω
All 15 pF
6/24/02
V
Page 3
PHOTO FET OPTOCOUPLERS
H11F1 H11F2 H11F3
ISOLATION CHARACTERISTICS
Parameter Test Conditions Symbol Min Typ* Max Units
Input-Output Isolation Voltage f = 60Hz, t = 1 min. V
Isolation Resistance V
Isolation Capacitance V
TRANSFER CHARACTERISTICS
= 500 VDC R
I-O
= 0, f = 1.0 MHz C
I-O
(T
= 25°C Unless otherwise specied.)
A
ISO
ISO
ISO
5300 Vac (rms)
11
10
2pF
DC Characteristics Test Conditions Symbol Device Min Typ* Max Units
H11F1 200
On-State Resistance I
= 16 mA, I
F
= 100 µA R
4-6
4-6
H11F2 330
H11F3 470
H11F1 200
On-State Resistance I
= 16 mA, I
F
= 100 µA R
6-4
6-4
H11F2 330
H11F3 470
Resistance, non-linearity and assymetry
= 16mA, I
I
F
= 25 µA RMS,
4-6
f = 1kHz
All 0.1 %
AC Characteristics Test Conditions Symbol Device Min Typ* Max Units
Turn-On Time R
Turn-Off Time R
= 50 Ω , I
L
= 50 Ω , I
L
= 16mA, V
F
= 16mA, V
F
= 5V t
4-6
= 5V t
4-6
on
off
All 25 µS
All 25 µS
© 2002 Fairchild Semiconductor Corporation
6/24/02
Page 4
PHOTO FET OPTOCOUPLERS
H11F1 H11F2 H11F3
Figure 1. Resistance vs. Input Current
10
1
r(on) - Normalized Resistance
Normalized to: I
= 16 mA
F
= 5 µA RMS
I
46
0.1 1 10 100
- INPUT CURRENT - mA
I
F
Figure 3. LED Forward Voltage vs. Forward Current
2.0
1.8
1.6
1.4
TA = -55°C
Figure 2. Output Characteristics
800
600
400
200
= 2mA
I
F
0
= 6mA
I
-200
- OUTPUT CURRENT (µA)
-400
46
I
-600
-800
F
= 10mA
I
F
= 14mA
I
F
= 18mA
I
F
-0.2 -0.1 0.0
- OUTPUT VOLTAGE (V)
V
46
I
= 18mA
F
I
= 14mA
F
I
= 10mA
F
= 6mA
I
F
I
= 2mA
F
0.1 0.2
Figure 4. Off-state Current vs. Ambient Temperature
10000
NORMALIZED TO:
= 15V
V
46
= 0mA
I
F
= 25°C
T
A
1000
100
1.2
- FORWARD VOLTAGE (V)
F
V
1.0
0.8
0.1 101 100
TA = 25°C
TA = 100°C
- LED FORWARD CURRENT - mA
I
F
Figure 5. Resistance vs. Temperature
0.8
0.6
r(on) - NORMALIZED RESISTANCE
0.4
3
2
Observed Range
1
NORMALIZED TO
= 16mA
I
F
= 25µA RMS
I
4-6
= 25˚C
T
A
1K
-25-50 0 25 50 75 100
- AMBIENT TEMPERATURE - °C
T
A
Median
Device
10
- NORMALIZED DARK CURRENT
46
I
1
0 204060
- AMBIENT TEMPERATURE (°C)
T
A
Figure 6. Region of Linear Resistance
100
80
60
40
20
10
8
6
4
MAXIMUM RMS SIGNAL VOLTAGE - mV
­2
4-6
V
1
100 1000 10K 100K
MAXIMUM RMS VOLTAGE
MAXIMUM RMS CURRENT
r(on) RESISTANCE -
80 100
100 80
60
40
20
10 8
6
4
2
MAXIMUM RMS SIGNAL CURRENT - µA
-
4-6
I
© 2002 Fairchild Semiconductor Corporation
6/24/02
Page 5
PHOTO FET OPTOCOUPLERS
Figure 7. Resistive non-linearity vs. D.C. Bias
5
4
3
2
1
r(on) - CHANGE IN RESISTANCE – %
I
= 10 µA RMS
4-6
r(on) = 200
H11F1 H11F2 H11F3
0
1 50 100 150 200 250 300 350
- D.C. BIAS VOLTAGE - mA
V
4-6
© 2002 Fairchild Semiconductor Corporation
6/24/02
Page 6
TYPICAL APPLICATIONS
AS A VARIABLE RESISTOR AS AN ANALOG SIGNAL SWITCH
ISOLATED VARIABLE ATTENUATORS
500K
500K
H11F1
30mA
F
V
OUT
V
IN
I
F
LOW FREQUENCY HIGH FREQUENCY
DYNAMIC RANGE 70db
@10KHz
FOR 0 I
V
IN
H11F1
I
F
DYNAMIC RANGE 50db
@1MHz
FOR 0 ≤ IF 30mA
Distortion free attenuation of low level A.C. signals is accom­plished by varying the IRED current, I range and absence of coupling capacitors; D.C. level shifting or
Note the wide dynamic
F
parasitic feedback to the controlling function.
AUTOMATIC GAIN CONTROL
V
IN
H11F1
I
F
AGC
SIGNAL
+
-
500K
V
50
OUT
V
OUT
PHOTO FET OPTOCOUPLERS
H11F1 H11F2 H11F3
ISOLATED SAMPLE AND HOLD CIRCUIT
+
-
V
IN
H11F1
I
F
C
Accuracy and range are improved over conventional FET switches because the H11F has no charge injection from the control signal. The H11F also provides switching of either polarity input signal up to 30V magnitude.
MULTIPLEXED, OPTICALLY-ISOLATED A/D CONVERSION
H11F1
V
1
V
2
V
n
CONVERTER
H11F1
MSB
A/D
H74A1
LSB
V
H74A1
OUT
V
V
OUT
CALL V1
MSB
DATA
LSB
IN
I
F
INPUT
t
DATA
ACQUISITION
PROCESS CONTROL
LOGIC
SYSTEM
CALL
V
n
This simple circuit provides over 70db of stable gain control for an AGC signal range of from 0 to 30mA. This basic circuit can be used to provide programmable fade and attack for electronic music.
ACTIVE FILTER FINE TUNING/BAND SWITCHING
I
F1
A1
I
ADJUSTS f1, IF2 ADJUSTS f
F1
H11F1
2
I
F2
A2
H11F1
A3
The linearity of resistance and the low offset voltage of the H11F allows the remote tuning or band-switching of active lters without switching glitches or distortion. This schematic illustrates the concept, with current to the H11F1 IREDs controlling the lters transfer characteristic.
© 2002 Fairchild Semiconductor Corporation
The optical isolation, linearity and low offset voltage of the H11F allows the remote multiplexing of low level analog signals from such transducers as thermocouplers, Hall effect devices, strain gauges, etc. to a single A/D converter.
TEST EQUIPMENT - KELVIN CONTACT POLARITY
I
TEST
DEVICE
UNDER
TEST
H11F1
I
F
I
F
H11F1
H11F1
I
F
AC
PARAMETER
SENSING
BOARD
B
D
I
F
H11F1
A & B FOR
POLARITY 1
C & D FOR
POLARITY 2
In many test equipment designs the auto polarity function uses reed relay contacts to switch the Kelvin Contact polarity. These reeds are normally one of the highest maintenance cost items due to sticking contacts and mechanical problems. The totally solid-State H11F eliminates these troubles while providing faster switching.
I
TO
F
6/24/02
Page 7
PHOTO FET OPTOCOUPLERS
)
)
)
)
)
)
H11F1 H11F2 H11F3
Package Dimensions (Through Hole) Package Dimensions (Surface Mount)
0.350 (8.89)
0.330 (8.38)
3
2
5
4
0.070 (1.78)
0.045 (1.14)
Lead Coplanarity : 0.004 (0.10) MAX
1
6
PIN 1 ID.
0.020 (0.51) MIN
0.100 (2.54)
TYP
0.270 (6.86)
0.240 (6.10)
0.300 (7.62) TYP
0.016 (0.40) MIN
0.315 (8.00) MIN
0.405 (10.30) MAX
0.070 (1.78)
0.045 (1.14)
SEATING PLANE
0.200 (5.08)
0.135 (3.43)
0.154 (3.90)
0.100 (2.54)
0.022 (0.56)
0.016 (0.41)
0.100 (2.54) TYP
0.350 (8.89)
0.330 (8.38)
PIN 1 ID.
0.270 (6.86)
0.240 (6.10)
0.020 (0.51) MIN
0.016 (0.40)
0.008 (0.20)
0° to 15°
0.300 (7.62) TYP
0.200 (5.08)
0.165 (4.18)
0.022 (0.56)
0.016 (0.41)
Package Dimensions (0.4” Lead Spacing) Recommended Pad Layout for
Surface Mount Leadform
0.016 (0.41)
0.008 (0.20)
0.270 (6.86)
0.240 (6.10)
0.350 (8.89)
0.330 (8.38)
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.135 (3.43)
SEATING PLANE
0.154 (3.90)
0.100 (2.54)
0.022 (0.56)
0.016 (0.41)
0.004 (0.10) MIN
0.100 (2.54) TYP
NOTE
All dimensions are in inches (millimeters)
© 2002 Fairchild Semiconductor Corporation
0.016 (0.40)
0.008 (0.20)
0.400 (10.16) TYP
0° to 15°
0.415 (10.54
0.100 (2.54
0.295 (7.49
0.070 (1.78
0.060 (1.52
0.030 (0.76
6/24/02
Page 8
PHOTO FET OPTOCOUPLERS
H11F1 H11F2 H11F3
ORDERING INFORMATION
Option Order Entry Identifier Description
S .S Surface Mount Lead Bend
SD .SD Surface Mount; Tape and Reel
W .W 0.4" Lead Spacing
300 .300 VDE 0884
300W .300W VDE 0884, 0.4" Lead Spacing
3S .3S VDE 0884, Surface Mount
3SD .3SD VDE 0884, Surface Mount, Tape and Reel
Carrier Tape Specifications
4.85 ± 0.20
0.30 ± 0.05
13.2 ± 0.2
0.1 MAX
User Direction of Feed
NOTE
All dimensions are in inches (millimeters)
Tape and reel quantity is 1,000 units per reel
4.0 ± 0.1
10.30 ± 0.20
12.0 ± 0.1
4.0 ± 0.1
1.55 ± 0.05
Ø
1.75 ± 0.10
7.5 ± 0.1
9.55 ± 0.20
Ø
1.6 ± 0.1
16.0 ± 0.3
© 2002 Fairchild Semiconductor Corporation
6/24/02
Page 9
PHOTO FET OPTOCOUPLERS
H11F1 H11F2 H11F3
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user.
2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
© 2002 Fairchild Semiconductor Corporation
6/24/02
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