Datasheet H11D1SM Specification

Page 1
Parameter Symbol Value Units
TOTAL DEVICE
T
STG
-55 to +150 °C
Storage Temperature Operating Temperature T
OPR
-55 to +100 °C
SOL
260 for 10 sec °C
Total Device Power Dissipation @ TA= 25°C
P
D
260 mW
Derate above 25°C 3.5 mW/°C
EMITTER
I
F
80 mA
*Forward DC Current *Reverse Input Voltage V
R
6.0 V *Forward Current - Peak (1µs pulse, 300pps) IF(pk) 3.0 A *LED Power Dissipation @ TA= 25°C
P
D
150 mW
Derate above 25°C 1.41 mW/°C
FEATURES
• High Voltage
- H11D1, H11D2, BV
CER
= 300 V
- H11D3, H11D4, BV
CER
= 200 V
• High isolation voltage
- 5300 VAC RMS - 1 minute
- 7500 VAC PEAK - 1 minute
• Underwriters Laboratory (UL) recognized File# E90700
DESCRIPTION
The H11DX and 4N38 are phototransistor-type optically coupled optoisolators. An infrared emitting diode manufactured from specially grown gallium arsenide is selectively coupled with a high voltage NPN silicon phototransistor. The device is supplied in a standard plastic six-pin dual-in-line package.
8/9/00 200046A
HIGH VOLTAGE
PHOTOTRANSISTOR OPTOCOUPLERS
H11D1 H11D2 H11D3 H11D4
4N38
APPLICATIONS
Power supply regulators
Digital logic inputs
Microprocessor inputs
Appliance sensor systems
Industrial controls
ABSOLUTE MAXIMUM RATINGS
ANODE
1
BASE
6
CATHODE
2
COLLECTOR
5
N/C
3
4
EMITTER
Page 2
8/9/00 200046A
H11D1, H11D2, H11D3, H11D4, 4N38
HIGH VOLTAGE
PHOTOTRANSISTOR OPTOCOUPLERS
Notes
* Parameters meet or exceed JEDEC registered data (for 4N38 only) ** All typical values at T
A
= 25°C
ELECTRICAL CHARACTERISTICS
(TA= 25°CUnless otherwise specified.)
Characteristic Test Conditions Symbol Device Min Typ** Max Unit
EMITTER
(I
F
= 10 mA) V
F
ALL 1.15 1.5 V
*Forward Voltage
Forward Voltage Temp. !V
F
ALL -1.8 mV/°C
Coefficient !T
A
Reverse Breakdown Voltage (IR= 10 µA) BV
R
ALL 6 25 V
Junction Capacitance
(V
F
= 0 V, f = 1 MHz)
C
J
ALL 50 pF
(VF= 1 V, f = 1 MHz) ALL 65 pF
*Reverse Leakage Current (VR= 6 V) I
R
ALL 0.05 10 µA
DETECTOR (RBE= 1 M")
BV
CER
H11D1/2 300
*Breakdown Voltage (IC= 1.0 mA, IF= 0) H11D3/4 200
Collector to Emitter (No RBE) (IC= 1.0 mA) BV
CEO
4N38 80
H11D1/2 300
V
*Collector to Base (IC= 100 µA, IF= 0) BV
CBO
H11D3/4 200
4N38 80
Emitter to Base
(I
E
= 100 µA , IF= 0)
BV
EBO
4N38 7
Emitter to Collector BV
ECO
ALL 7 10
(VCE= 200 V, IF= 0, TA= 25°C)
H11D1/2
100 nA
*Leakage Current (VCE= 200 V, IF= 0, TA= 100°C)
I
CER
250 µA
Collector to Emitter (VCE= 100 V, IF= 0, TA= 25°C)
H11D3/4
100 nA
(RBE= 1 M")(V
CE
= 100 V, IF= 0, TA= 100°C) 250 µA
(No RBE) (VCE= 60 V, IF= 0, TA= 25°C) I
CEO
4N38 50 nA
INDIVIDUAL COMPONENT CHARACTERISTICS
Parameter Symbol Value Units
DETECTOR
300 mW
*Power Dissipation @ T
A
= 25°CP
D
Derate linearly above 25°C 4.0 mW/°C
H11D1 - H11D2 300
*Collector to Emitter Voltage H11D3 - H11D4 V
CER
200
4N38 80
H11D1 - H11D2 300
V
*Collector Base Voltage H11D3 - H11D4 V
CBO
200
4N38 80
*Emitter to Collector Voltage
H11D1 - H11D2
V
ECO
7
H11D3 - H11D4
Collector Current (Continuous) 100 mA
ABSOLUTE MAXIMUM RATINGS (Cont.)
Page 3
8/9/00 200046A
H11D1, H11D2, H11D3, H11D4, 4N38
HIGH VOLTAGE
PHOTOTRANSISTOR OPTOCOUPLERS
DC Characteristic Test Conditions Symbol Device Min Typ** Max Unit
EMITTER H11D1
Current Transfer Ratio
(I
F
= 10 mA, VCE= 10 V) H11D2 2 (20)
Collector to Emitter
(R
BE
= 1 M") CTR H11D3 mA (%)
H11D4 1 (10)
(I
F
= 10 mA, VCE= 10 V) 4N38 2 (20)
(IF= 10 mA, IC= 0.5 mA)
H11D1/2/3/4 0.1 0.40
*Saturation Voltage (R
BE
= 1 M")V
CE (SAT)
V
(IF= 20 mA, IC= 4 mA) 4N38 1.0
TRANSFER CHARACTERISTICS
Characteristic Test Conditions Symbol Device Min Typ** Max Unit
SWITCHING TIMES
(V
CE
=10 V, ICE= 2 mA) t
on
ALL 5
Non-Saturated Turn-on Time µs Turn-off Time (RL= 100 ") t
off
ALL 5
TRANSFER CHARACTERISTICS
Characteristic Test Conditions Symbol Device Min Typ** Max Unit
Isolation Voltage (I
I-O
#$1 µA, 1 min.) V
ISO
ALL
5300 (V
AC
RMS)
7500 (V
AC
PEAK)
Isolation Resistance (V
I-O
= 500 VDC) R
ISO
ALL 10
11
"
Isolation Capacitance (f = 1 MHz) C
ISO
ALL 0.5 pF
ISOLATION CHARACTERISTICS
Notes
* Parameters meet or exceed JEDEC registered data (for 4N38 only) ** All typical values at TA= 25°C
Fig.1 LED Forward Voltage vs. Forward Current
1.8
1.7
1.6
1.5
1.4
1.3
- FORWARD VOLTAGE (V)
F
1.2
V
1.1
1.0 1 10 100
IF - LED FORWARDCURRENT (mA)
TA = 55˚C
TA = 25˚C
TA = 100˚C
Fig.2 Normalized Output Characteristics
10
1
- OUTPUT CURRENT
CER
0.1
0.01
NORMALIZED I
0.1 1 10 100
Normalized to: V
= 10 V
CE
= 10 mA
I
F
= 106 Ω
R
BE
= 25˚C
T
IF = 50 mA
IF = 10 mA
IF = 5 mA
VCE - COLLECTOR VOLTAGE (V)
A
Page 4
8/9/00 200046A
H11D1, H11D2, H11D3, H11D4, 4N38
HIGH VOLTAGE
PHOTOTRANSISTOR OPTOCOUPLERS
Fig.3 Normalized Output Current vs. LED Input Current
10
Normalized to:
= 10 V
V
CE
I
= 10 mA
F
= 106 Ω
R
BE
= 25˚C
T
A
1
- OUTPUT CURRENT
CER
0.1
NORMALIZED I
0.01
110
IF - LED INPUT CURRENT (mA)
Fig.5 Normalized Dark Current vs. Ambient Temperature
Normalized to:
= 100 V
10000
1000
- DARK CURRENT
CER
NORMALIZED I
V
CE
= 106 Ω
R
BE
= 25˚C
T
A
VCE = 300 V
100
10
1
0.1
VCE = 100 V
VCE = 50 V
10 20 30 40 50 60 70 80 90 100 110
TA - AMBIENT TEMPERATURE (˚C)
Fig.4 Normalized Output Current vs. Temperature
Normalized to:
= 10 V
V
CE
= 10 mA
I
F
= 106 Ω
R
BE
T
A
= 25˚C
1
- OUTPUT CURRENT
CER
IF = 20 mA
IF = 10 mA
IF = 5 mA
NORMALIZED I
0.1
-60 -40 -20 0 20 40 60 80 100
TA - AMBIENT TEMPERATURE (˚C)
Normalized Collector-Base Current vs. Temperature
10
9
8
IF = 50 mA
7
6
5
4
- COLLECTOR-BASE CURRENT
3
CBO
IF = 10 mA
2
1
IF = 5 mA
0
-60 -40 -20 0 20 40 60 80 100
NORMALIZED I
TA - AMBIENT TEMPERATURE (˚C)
Normalized to:
= 10 V
V
CE
= 10 mA
I
F
= 106 Ω
R
BE
= 25˚C
T
A
Page 5
Lead Coplanarity : 0.004 (0.10) MAX
0.270 (6.86)
0.240 (6.10)
0.350 (8.89)
0.330 (8.38)
0.300 (7.62) TYP
0.405 (10.30) MAX
0.315 (8.00) MIN
0.016 (0.40) MIN
2
5
PIN 1 ID.
0.016 (0.41)
0.008 (0.20)
0.100 (2.54) TYP
0.022 (0.56)
0.016 (0.41)
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.165 (4.18)
4
3
0.020 (0.51)
MIN
1
6
0.100 (2.54) TYP
0.020 (0.51) MIN
0.350 (8.89)
0.330 (8.38)
0.270 (6.86)
0.240 (6.10)
PIN 1
ID.
0.022 (0.56)
0.016 (0.41)
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.135 (3.43)
0.300 (7.62) TYP
0° to 15°
0.154 (3.90)
0.100 (2.54)
SEATING PLANE
0.016 (0.40)
0.008 (0.20)
321
456
SEATING PLANE
0.016 (0.40)
0.008 (0.20)
0.070 (1.78)
0.045 (1.14)
0.350 (8.89)
0.330 (8.38)
0.154 (3.90)
0.100 (2.54)
0.200 (5.08)
0.135 (3.43)
0.004 (0.10) MIN
0.270 (6.86)
0.240 (6.10)
0.400 (10.16) TYP
0° to 15°
0.022 (0.56)
0.016 (0.41)
0.100 (2.54) TYP
3
PIN 1 ID.
21
456
NOTE
All dimensions are in inches (millimeters)
0.070 (1.78)
0.060 (1.52)
0.030 (0.76)
0.100 (2.54)
0.295 (7.49)
0.415 (10.54)
Package Dimensions (Surface Mount)Package Dimensions (Through Hole)
Package Dimensions (0.4”Lead Spacing) Recommended Pad Layout for
Surface Mount Leadform
8/9/00 200046A
H11D1, H11D2, H11D3, H11D4, 4N38
HIGH VOLTAGE
PHOTOTRANSISTOR OPTOCOUPLERS
Page 6
S .S Surface Mount Lead Bend SD .SD Surface Mount; Tape and reel W .W 0.4 Lead Spacing 300 .300 VDE 0884 300W .300W VDE 0884, 0.4 Lead Spacing 3S .3S VDE 0884, Surface Mount 3SD .3SD VDE 0884, Surface Mount, Tape & Reel
Option
Order Entry Identifier
Description
4.0 ± 0.1
Ø1.55 ± 0.05
User Direction of Feed
4.0 ± 0.1
1.75 ± 0.10
7.5 ± 0.1
16.0 ± 0.3
12.0 ± 0.1
0.30 ± 0.05
13.2 ± 0.2
4.85 ± 0.20
0.1 MAX
10.30 ± 0.20
9.55 ± 0.20
Ø1.6 ± 0.1
QT Carrier Tape Specifications (“D” Taping Orientation)
ORDERING INFORMATION
NOTE
All dimensions are in millimeters
8/9/00 200046A
H11D1, H11D2, H11D3, H11D4, 4N38
HIGH VOLTAGE
PHOTOTRANSISTOR OPTOCOUPLERS
Page 7
MARKING INFORMATION
1
Definitions
1 Fairchild logo
2 Device number
VDE mark (Note: Only appears on parts ordered with VDE
3
option – See order entry table)
4 Two digit year code, e.g., ‘03’
5 Two digit work week ranging from ‘01’ to ‘53’
6 Assembly package code
Reflow Profile (Black Package, No Suffix)
H11D1
V XX YY K
43
5
2
6
300
250
200
150
100
Temperature (°C)
50
0
0.5 1 1.5 2 2.5 3 3.5 4 4.5
0
225 C peak
Ramp up = 3
Time (Minute)
Time above 183° C, 60–150 sec
C/sec
215°C, 10–30 s
Peak reflow temperature: 225° C (package surface temperature)
• Time of temperature higher than 183° C for 60–150 seconds
One time soldering reflow is recommended
Page 8
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1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Formative or In Design
First Production
Full Production
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or
effectiveness.
This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I13
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