Datasheet H1117J, H1117-3.3J Datasheet (HSMC)

HI-SINCERITY

MICROELECTRONICS CORP.

H1117J Series

1A LOW DROPOUT POSITIVE VOLTAGE REGULATOR

Features

•

Low Dropout Voltage 1.2V at 1A

•

Adjustable or Fixed Voltage

•

Maximum Line Regulation 0.45%

•

Maximum Load Regulation 0.4%

•

Adjust Pin Current Less Than 90 uA

•

Over Current Protection

•

Thermal Protection

Applications

•

High Efficiency Linear Regulators

•

5V to 3.3V Voltage Converter

•

Battery Charger

Spec. No. : Preliminary Data
Issued Date : 1998.06.01
Revised Date : 2000.10.01
Page No. : 1/6

General Description

The H1117J is a 1A low-dropout positive voltage regulator. It is available in fixed and adjustable output voltage
versions. Over curre nt and thermal protection are integr ated onto the chip. Output current will decr ease while it
reaches the pre-set current or tem perature limit. The dropout voltage is specified at 1.2V Maximum at full rated
output current. H1117J Series provides excellent regulation over variations due to changes in line, load and
temperature. H1117J is three terminal regulator and available in popular packages.

Device Selection Guide

Device Output Voltage Package

H1117J(Adj) 1.3V to 4V

H1117-3.3J 3.3

D-PAK

TO-252

Absolute Maximum Ratings

Parameter Symbol Maximum Units
Input Voltage V
Power Dissipation P
Thermal Resistance Junction To Case TO-252
Thermal Resistance Junction To Ambient TO-252
Operating Junction Temperature Range T
Storage Temperature Range T
Lead Temperature (Soldering) 10 Sec T

θ
θ

IN

D
JC
JA

j

STG

LEAD

Internally Limited W

20 V

15

156

0 To 125

-65 To 150
260

°

C/W

°

C/W

°
°
°

C
C
C

Typical Application

H1117J

+

4.75V
to 20V

DC

Input Range Depends On V
Please Refer To Electrical Characteristics.

10uF
TAN

GND

O

10uF
TAN

Load

HSMC Product Specification

Block Diagram

HI-SINCERITY

MICROELECTRONICS CORP.

Current
Limiting

Amplifier

Spec. No. : Preliminary Data
Issued Date : 1998.06.01
Revised Date : 2000.10.01
Page No. : 2/6

Input

Electrical Characteristics

H1117J (adj version)

Parameter Symbol Test Conditions Min Typ Max Units

Reference Voltage V

Line Regulation Reg

Load Regulation Reg
Dropout Voltage V

Current Limit I
Temperature Coeff. T

Adjust Pin Current I
Adjust Pin Current Change

Temperature Stability T
Minimum Load Current I
RMS Output Noise V
Ripple Rejection Ratio R

∆

REF

LINE

LOAD

D

S

C

adj

I

adj

S

O

N
A

Thermal

Protection

Error
AMP

VIN=5V, IO=10mA, Tj=25°C

Bandcap

Reference

Output

ADJ/COM

1.238 1.25 1.262
VIN=5V, IO=10mA, Over Temp. 1.225 1.25 1.275
VIN=4.75~20V, IO=10mA, Tj=25°C

--0.3
VIN=4.75~20V, IO=10mA, Over Temp. - - 0.45
VIN=5V, IO=10mA~1A,Tj=25°C

- 0.05 0.3
VIN=5V, IO=10mA~1A, Over Temp. - 0.2 0.4
IO=10mA~1A, Over Temp., ∆VO=±1%

-11.2V
VIN=2.75~7V, Over Temp. 1 - - A
VIN=2.75~7V, IO=10mA~1A - 0.005 ­VIN=2.75~7V, IO=10mA~1A,Tj=25°C

-55­VIN=2.75~7V, IO=10mA~1A, Over Temp. - - 90
VIN=2.75~7V, IO=10mA~1A, Over Temp. - 0.2 5
VIN=5V, IO=100mA, Over Temp. - 0.5 - %
VIN=5V - 5 10 mA
Tj=25°C

-0.003- %
VIN=5V, IO=1A, Over Temp. 60 72 - dB

V

%

%

%/°C

uA

H1117-3.3J

Parameter Symbol Test Conditions Min Typ Max Units

Output Voltage V

Line Regulation Reg

Load Regulation Reg
Dropout Voltage V

Current Limit I
Quiescent Current I
Temperature Coeff. T
Temperature Stability T
RMS Output Noise V
Ripple Rejection Ratio R

VIN=5V, IO=0A,Tj=25°C

O

VIN=5V, IO=0A, Over Temp. 3.234 3.3 3.366
VIN=4.75~20V, IO=0A, Tj=25°C

LINE

VIN=4.75~20V, IO=0A, Over Temp. - - 0.45
VIN=5V, IO=0A~1A,Tj=25°C

LOAD

VIN=5V, IO=0A~1A, Over Temp. - 0.2 0.4
IO=0A~1A, Over Temp., ∆VO=±1%

D

VIN=4.75~7V, Over Temp. 1 - - A

S

VIN=5V, IO=0A~1A,Over Temp. - 12 13 mA

Q

VIN=4.75~7V, IO=0A~1A - 0.005 -

C

VIN=5V, IO=100mA, Over Temp. - 0.5 - %

S

Tj=25°C

N

VIN=5V, IO=1A, Over Temp. 60 72 - dB

A

3.270 3.3 3.333

--0.3

- 0.05 0.3

-11.2V

-0.003- %

HSMC Product Specification

V

%

%

%/°C

HI-SINCERITY

MICROELECTRONICS CORP.

Characteristics Curve

Spec. No. : Preliminary Data
Issued Date : 1998.06.01
Revised Date : 2000.10.01
Page No. : 3/6

Load Regu la tion

0

-0.05

-0.1

-0.15

Output Voltage deviation (%)

-0.2

-0.25

-50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100

Tem per atur e ( ºC)

Minimum O perating Cu rrent

3.5

3

2.5

2

1.5

1

0.5

Minimum Operating Current (mA)

0

-0.5
0 0.1 1 1.1 1.2 2 3 5 10 15 20 25 30 35

In put /Outpu t Differential (V)

1.252

1.25

1.248

1.246

1.244

Referen ce Voltage ( V)

1.242

1.24

1.238

-50 -25 0 25 50 75 100 125

Tem per atur e (º C)

Ajust Pin Current

45

40

35

30

25

20

15

Adjust Pin Current ( uA)

10

5

0

Temperature Stability

-50 -25 0 25 50 75 100 125

Temperatu re (ºC)

1.6

Short Circuit Current

1.4

1.2

1

0.8

0.6

Short Circuit Current (A)

0.4

0.2

0

1.2 1.3 1.5 1.7 2 5 10 15

In put/Outpu t Differential (V)

1.4

1.2

1

0.8

0.6

0.4

Minmum Input/Ou tput Differential (V)

0.2

0

0.1 0.3 0.5 0.7 0.9 1
Output Current (A)

HSMC Product Specification

Dropout Voltage

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MICROELECTRONICS CORP.

Spec. No. : Preliminary Data
Issued Date : 1998.06.01
Revised Date : 2000.10.01
Page No. : 4/6

Applications Description

Output Voltage Adjustment

•

Like most regulators, the H1117J regulates the output by
comparing the output voltage to an internally generated
reference voltage. On the adjustable version, the V
available externally as 1.25V between V
voltage ratio formed by R

and R2 should be set to conduct

1

and ADJ. The

OUT

REF

is

V

IN

10mA (minimum output load). The output voltage is given

=V

by the following equation : V

OUT

(1+R2/R1) + I

REF

ADJ R2

On fixed versions of H1117J, the voltage divider is
provided internally.

Thermal Protection

•

H1117J has thermal protection which limits junction
temperature to 150°C. However, device functionality is
only guaranteed to a maximum junction temperature of
+125°C.
The power dissipation and junction temperature for H1117J in TO-252 package given by

=(V

- V

) I

P

D

IN

OUT

Current Limit Protection

•

, T

OUT

JUNCTION=TAMBIENT

+(PDx

θ

), Note : T

JA

JUNCTION

must not exceed 125°C

H1117J is protected against overload conditions. Current protection is triggered at typically 1.5A.

In

I

ADJ

10uA

V

=V

OUT

REF

Out

ADJ

(1+R2/R1) + I

V

REF

ADJ R2

R1

R2

V

OUT

Stability And Load Regu lation

•

H1117J requires a capacitor from V
compensation feedback to the internal gain stage. This is
to ensure stability at the output terminal. Typically, a 10uF
tantalum or 50uF aluminum electrolytic is sufficient.
Note : It is important that the ESR for this capacitor does
not exceed 0.5Ω.

The output capacitor does not have a theoretical upper
limit and increasing its va lue wi ll inc reas e st abi l it y. C

to GND to provide

OUT

OUT

=

R

P

Parasitic

Line Resistance

OutIn

V

IN

Adj

R1

R2

Connect

R1 to Case

RL

100 uF or more is typical for high current regulator design.
H1117J load regulation is limited by the resistance of the

wire connecting it to the load(R
version, the best load regulation is accomplished when the
top of the resistor divider(R
output pin of the H1117J. When so connected, R

). For the adjustable

P

) is connected directly to the

1

is not

P

Connect

R2 to Load

multiplied by the divider ratio. For fixed output versions,
the top of R

is internally connected to the output and ground pin can be connected to low side of the load as a

1

negative side sense if, so desired.

Thermal Consideration

•

The H1117J series contain thermal limiting circuitry designed to protect itself for over-temperature conditions.
Even for normal load conditions, maximum junction temperature ratings must not be exceeded. As mention in
thermal protection section, we need to consider all sources of thermal resistance between junction and ambient.
It contains junction-to-case, case-to-heat-sink interface and heat sink resistance itself. An additional heat sink is
applied externally sometimes. It can increase the maximum power dissipation. For example, the equivalent
junction temperature of 300mA output current is 115°C without external heat sink. Under the same junction
temperature IC can operates 500mA with an adequate heat sink. Therefore, to attach an extra heat sink is
recommended.

Junction-to-case thermal resistance is specified from the IC junction to the bottom of the case directly below the
die. The bonding wires are appending paths. The former is the lowest resistance path. Proper mounting is
required to ensure the best possible thermal flow this area of the package to the heat sink. Thermal compound at
the case-to-heat-sink interface is strongly recommended. The case of all devices in this series is electrically
connected to the output. Therefore, if the case of the device must be electrically isolated, a thermally conductive
spacer can be used, as long its thermal resistance is considered.

HSMC Product Specification

HI-SINCERITY

MICROELECTRONICS CORP.

Protection Diode

•

(The figure is shown as Regulator with Reverse Diode Protection in advanced applications)
In general operation, H1117J does not need any protection diodes. From the cross-section structure of H1117J,
the output pin is connected to P+ substrate, and the input pin is connected to N- well. There is a parasitic reverse
diode between them. It can handle microsecond surge currents of 5A to 10A. Even with large output capacitance,
it is very difficult to get those values of surge currents in normal operation. Only with high value output capacitors,
such as 1000uF. And with the input pin instantaneously shorted to ground. can damage occur. A crowbar circuit
at the input of the H1117J can generate those kinds of currents, and a diode from output to input is
recommended. Normal power supply cycling or even plugging and unplugging in the system will not generate
currents large enough to do any damage.

Spec. No. : Preliminary Data
Issued Date : 1998.06.01
Revised Date : 2000.10.01
Page No. : 5/6

HSMC Product Specification

HI-SINCERITY

MICROELECTRONICS CORP.

TO-252 Dimension

Spec. No. : Preliminary Data
Issued Date : 1998.06.01
Revised Date : 2000.10.01
Page No. : 6/6

A

B

L

F

G

C

D

Marking :

HSMC Logo

Part Number

Date Code

Product Series

Rank

Ink Mark

Style : Pin 1.COM/ADJ 2.Vout 3.Vin

3

H

E

K

2

I

1

J

3-Lead TO-252 Plastic Surface Mount Package

HSMC Package Code : J

DIM

Inches Millimeters Inches Millimeters

Min. Max. Min. Max.

DIM

Min. Max. Min. Max.
A 0.0177 0.0217 0.45 0.55 G 0.0866 0.1102 2.20 2.80
B 0.0650 0.0768 1.65 1.95 H - *0.0906 - *2.30
C 0.0354 0.0591 0.90 1.50 I - 0 .0354 - 0.90
D 0.0177 0.0236 0.45 0.60 J - 0 .0315 - 0.80
E 0.2520 0.2677 6.40 6.80 K 0.2047 0.2165 5.20 5.50
F 0.2125 0.2283 5.40 5.80 L 0.0551 0.0630 1.40 1.60

Notes :

Material :

• Lead : 42 Alloy ; solder plating

• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0

1.Dimension and tolerance based on our Spec. dated May. 05,1996.

2.Controlling dimension : millimeters.

3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sal es office.

*:Typical

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

•

HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringem ent of pat ents, or applic ati on assistance.

Head Office And Factory :

•

Head Office

Tel : [phone] Fax : [phone]

•

Factory 1 :

Tel : [phone]~5 Fax : [phone]

•

Factory 2 :

Tel : [phone] Fax : [phone]

(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.

No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C

No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C

HSMC Product Specification