Page 1
GS71116TP/J/U
SOJ, TSOP, FP-BGA
64K x 16
Commercial Temp
Industrial Temp
1Mb Asynchronous SRAM
Features
• Fast access time: 10, 12, 15ns
• CMOS low power operation: 100/85/70 mA at min. cycle time.
• Single 3.3V ± 0.3V power supply
• All inputs and outputs are TTL compatible
• Byte control
• Fully static operation
• Industrial Temperature Option: -40° to 85°C
• Package line up
J: 400mil, 44 pin SOJ package
TP: 400mil, 44 pin TSOP Type II package
U: 6 mm x 8 mm Fine Pitch Ball Grid Array package
Description
The GS71116 is a high speed CMOS static RAM organized as
65,536-words by 16-bits. Static design eliminates the need for external clocks or timing strobes. Operating on a single 3.3V power supply
and all inputs and outputs are TTL compatible. The GS71116 is available in a 6x8 mm Fine Pitch BGA package as well as in 400 mil SOJ
and 400 mil TSOP Type-II packages.
SOJ 64K x 16 Pin Configuration
A4
A3
A2
A1
A0
CE
DQ1
DQ2
DQ3
DQ4
VDD
VSS
DQ5
DQ6
DQ7
DQ8
WE
A15
A14
A13
A12
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
Top view
44 pin
SOJ
10, 12, 15ns
3.3V VDD
Center VDD & VSS
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A5
A6
A7
OE
UB
LB
DQ16
DQ15
DQ14
DQ13
VSS
VDD
DQ12
DQ11
DQ10
DQ9
NC
A8
A9
A10
A11
NC NC
Pin Descriptions
Symbol Description
A0 to A15
DQ1 to DQ16 Data input/output
CE Chip enable input
LB
UB
WE Write enable input
OE Output enable input
VDD +3.3V power supply
VSS Ground
NC No connect
Address input
Lower byte enable input
(DQ1 to DQ8)
Upper byte enable input
(DQ9 to DQ16)
Fine Pitch BGA 64K x 16 Bump Configuration
1 2 3 4 5 6
A LB OE A0 A1 A2 NC
B DQ16 UB A3 A4 CE DQ1
C DQ14 DQ15 A5 A6 DQ2 DQ3
D VSS DQ13 NC A7 DQ4 VDD
E VDD DQ12 NC NC DQ5 VSS
F DQ11 DQ10 A8 A9 DQ7 DQ6
G DQ9 NC A10 A11 WE DQ8
H NC A12 A13 A14 A15 NC
6mm x 8mm, 0.75mm Bump Pitch
Top View
Rev: 1.06 6/2000 1/15 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. M
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TSOP-II 64K x 16 Pin Configuration
GS71116TP/J/U
CE
DQ1
DQ2
DQ3
DQ4
VDD
VSS
DQ5
DQ6
DQ7
DQ8
WE
A15
A14
A13
A12
A4
A3
A2
A1
A0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
Top view
44 pin
TSOP II
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
A5
A6
A7
OE
UB
LB
DQ16
DQ15
DQ14
DQ13
VSS
VDD
DQ12
DQ11
DQ10
DQ9
NC
27
A8
26
A9
25
A10
24
A11
23
NC NC
Block Diagram
A0
A15
CE
WE
OE
UB
LB
_____
_____
Address
Input
Buffer
Control
Row
Decoder
Memory Array
Column
Decoder
I/O Buffer
DQ1
DQ16
Rev: 1.06 6/2000 2/15 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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GS71116TP/J/U
Truth Table
CE OE WE LB UB DQ1 to DQ8 DQ9 to DQ16 VDD Current
H X X X X Not Selected Not Selected ISB1 , ISB2
L L Read Read
L L H
L X L
L H H X X High Z High Z
L X X H H High Z High Z
Note: X: “H” or “L”
L H Read High Z
H L High Z Read
L L Write Write
L H Write Not Write, High Z
H L Not Write, High Z Write
Absolute Maximum Ratings
Parameter Symbol Rating Unit
Supply Voltage VDD -0.5 to +4.6 V
Input Voltage VIN
Output Voltage VOUT
-0.5 to VDD+0.5
(≤ 4.6V max.)
-0.5 to VDD+0.5
(≤ 4.6V max.)
IDD
V
V
Allowable power dissipation PD 0.7 W
Storage temperature TSTG -55 to 150
Note:
Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation shall be restricted to Recommended
Operating Conditions. Exposure to higher than recommended voltages for extended periods of time could affect device reliability.
Rev: 1.06 6/2000 3/15 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
o
C
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Recommended Operating Conditions
Parameter Symbol Min Typ Max Unit
Supply Voltage for -12/15 VDD 3.0 3.3 3.6 V
Supply Voltage for -10 VDD 3.135 3.3 3.6 V
Input High Voltage VIH 2.0 - VDD +0.3 V
Input Low Voltage VIL -0.3 - 0.8 V
GS71116TP/J/U
Ambient Temperature,
Commercial Range
Ambient Temperature,
Industrial Range
Note:
1. Input overshoot voltage should be less than VDD +2V and not exceed 20ns.
2. Input undershoot voltage should be greater than -2V and not exceed 20ns.
TAc 0 - 70
TAI -40 - 85
Capacitance
Parameter Symbol Test Condition Max Unit
Input Capacitance CIN VIN =0V 5 pF
Output Capacitance COUT VOUT =0V 7 pF
Notes:
1. Tested at TA =25°C, f=1MHz
2. These parameters are sampled and are not 100% tested
DC I/O Pin Characteristics
Parameter Symbol Test Conditions Min Max
o
C
o
C
Input Leakage
Current
Output Leakage
Current
Output High Voltage VOH IOH = - 4mA 2.4
Output Low Voltage VOL ILO = + 4mA 0.4V
Rev: 1.06 6/2000 4/15 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
IIL VIN = 0 to VDD -1uA 1uA
ILO
Output High Z
VOUT = 0 to VDD
-1uA 1uA
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Power Supply Currents
Parameter Symbol Test Conditions
CE ≤ VIL
Operating
Supply
Current
Standby
Current
IDD (max)
ISB1 (max)
All other inputs
≥ VIH or ≤ VIL
Min. cycle time
IOUT = 0 mA
CE ≥ VIH
All other inputs
≥ VIH or ≤VIL
Min. cycle time
GS71116TP/J/U
0 to 70°C -40 to 85°C
10ns 12ns 15ns 10ns 12ns 15ns
100mA 85mA 70mA 115mA 100mA 85mA
45mA 40mA 35mA 50mA 45mA 40mA
Standby
Current
ISB2 (max)
CE ≥ VDD - 0.2V
All other inputs
≥ VDD - 0.2V or ≤ 0.2V
10mA 15mA
Rev: 1.06 6/2000 5/15 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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AC Test Conditions
Parameter Conditions
Input high level VIH =2.4V
Input low level VIL =0.4V
DQ
GS71116TP/J/U
Output Load 1
50Ω
30pF
1
Input rise time tr=1V/ns
Input fall time tf=1V/ns
Input reference level 1.4V
Output reference level 1.4V
Output load Fig. 1& 2
Note:
1. Include scope and jig capacitance.
2. Test conditions as specified with output loading as shown in Fig. 1
unless otherwise noted
3. Output load 2 for tLZ , tHZ , tOLZ and tOHZ .
VT=1.4V
Output Load 2
DQ
5pF
1
3.3V
589Ω
434Ω
Rev: 1.06 6/2000 6/15 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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AC Characteristics
Read Cycle
Parameter Symbol
Read cycle time tRC 10 --- 12 --- 15 --- ns
Address access time tAA --- 10 --- 12 --- 15 ns
Chip enable access time (CE) tAC --- 10 --- 12 --- 15 ns
Byte enable access time (UB, LB) tAB --- 4 --- 5 --- 6 ns
Output enable to output valid (OE) tOE --- 4 --- 5 --- 6 ns
Output hold from address change tOH 3 --- 3 --- 3 --- ns
GS71116TP/J/U
-10 -12 -15
Unit
Min Max Min Max Min Max
Chip enable to output in low Z (CE)
Output enable to output in low Z (OE)
Byte enable to output in low Z (UB, LB)
Chip disable to output in High Z (CE)
Output disable to output in High Z (OE)
Byte disable to output in High Z (UB, LB)
* These parameters are sampled and are not 100% tested
tLZ
tOLZ
tBLZ
tHZ
tOHZ
tBHZ
*
*
*
*
*
*
Read Cycle 1: CE = OE = VIL, WE = VIH, UB and, or LB = V
Address
tOH
3 --- 3 --- 3 --- ns
0 --- 0 --- 0 --- ns
0 --- 0 --- 0 --- ns
--- 5 --- 6 --- 7 ns
--- 4 --- 5 --- 6 ns
--- 3.5 --- 3.5 --- 4 ---
IL
tRC
tAA
Data Out Previous Data Data valid
Rev: 1.06 6/2000 7/15 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Page 8
GS71116TP/J/U
Read Cycle 2: WE = V
Write Cycle
IH
Address
CE
UB, LB
OE
Data Out
High impedance
tLZ
tBLZ
tOLZ
tAA
tAC
tRC
tAB
tOE
tHZ
tBHZ
tOHZ
Data valid
-10 -12 -15
Parameter Symbol
Min Max Min Max Min Max
Write cycle time tWC 10 --- 12 --- 15 --- ns
Address valid to end of write tAW 7 --- 8 --- 10 --- ns
Chip enable to end of write tCW 7 --- 8 --- 10 --- ns
Byte enable to end of write tBW 7 --- 8 --- 10 --- ns
Data set up time tDW 5 --- 6 --- 7 --- ns
Data hold time tDH 0 --- 0 --- 0 --- ns
Write pulse width tWP 7 --- 8 --- 10 --- ns
Address set up time tAS 0 --- 0 --- 0 --- ns
Write recovery time (WE) tWR 0 --- 0 --- 0 --- ns
Write recovery time (CE) tWR1 0 --- 0 --- 0 --- ns
Output Low Z from end of write
Write to output in High Z
tWLZ
tWHZ
*
*
3 --- 3 --- 3 --- ns
--- 4 --- 5 --- 6 ns
Unit
* These parameters are sampled and are not 100% tested
Rev: 1.06 6/2000 8/15 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Page 9
Write Cycle 1: WE control
GS71116TP/J/U
tWC
Address
Write Cycle 2: CE control
Address
OE
CE
UB, LB
WE
Data In
Data Out
tAW
tCW
tBW
tAS tWP
tWC
tWR
tDW tDH
Data valid
tWLZ tWHZ
High impedance
tAW
OE
tAS tCW
CE
tBW
UB, LB
tWP
WE
tDW tDH
Data In
Data Out
Rev: 1.06 6/2000 9/15 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Data valid
High impedance
tWR1
Page 10
Write Cycle 3: UB, LB control
Address
GS71116TP/J/U
tWC
OE
CE
UB, LB
WE
Data In
Data Out
tAW
tAS tCW
tBW
tWP
tWR1
tDW tDH
Data valid
High impedance
Rev: 1.06 6/2000 10/15 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Page 11
44 Pin, 400 mil SOJ
GS71116TP/J/U
D
1 22
e
A2
A
A1
y
B
B1
L
23 44
E
c
HE
A
Detail A
Symbol
min nom max min nom max
A - - 0.148 - - 3.759
A1 0.025 - - 0.635 - A2 0.105 0.110 0.115 2.667 2.794 2.921
GE
Q
B - 0.018 - - 0.457 B1 0.026 0.028 0.032 0.660 0.711 0.813
c - 0.008 - - 0.203 D 1.120 1.125 1.130 28.44 28.58 28.70
E 0.395 0.400 0.405 10.033 10.160 10.287
e - 0.05 - - 1.27 -
HE 0.435 0.440 0.445 11.049 11.176 11.303
GE 0.360 0.370 0.380 9.144 9.398 9.652
L 0.082 0.087 0.106 2.083 2.210 2.70
y - - 0.004 - - 0.102
Q
Note:
1. Dimension D& E do not include interlead flash
2. Dimension B1 does not include dambar protrusion / intrusion
o
0
-
o
7
o
0
-
o
7
Dimension in inch Dimension in mm
Rev: 1.06 6/2000 11/15 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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44 Pin, 400 mil TSOP-II
Controlling dimension: mm
1 22
A
A1 A2
e
y
GS71116TP/J/U
Dimension in inch Dimension in mm
D
23 44
E
HE
B
L1
c
Q
Detail A
Symbol
A1 0.002 - - 0.05 - -
A
L
A2 0.037 0.039 0.041 0.95 1.00 1.05
HE 0.455 0.463 0.471 11.56 11.76 11.96
L1 - 0.031 - - 0.80 -
Note:
1. Dimension D& E do not include interlead flash
2. Dimension B does not include dambar protrusion / intrusion
min nom max min nom max
A - - 0.047 - - 1.20
B 0.01 0.014 0.018 0.25 0.35 0.45
c - 0.006 - - 0.15 D 0.721 0.725 0.729 18.31 18.41 18.51
E 0.396 0.400 0.404 10.06 10.16 10.26
e - 0.031 - - 0.80 -
L 0.016 0.020 0.024 0.40 0.50 0.60
y - - 0.004 - - 0.10
Q
o
0
-
o
o
5
0
-
o
5
Rev: 1.06 6/2000 12/15 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Page 13
6mm x 8mm Fine Pitch BGA
pin A1 index
GS71116TP/J/U
8.00 ± 0.10
6.00 ± 0.10
units: mm
1.20(max)
D
0.10
A
B
C
D
0.22 ± 0.05
F
E
H
G
0.36(typ)
pin A1 index
3.75
Bottom View Top View
0.75(typ).
6 5 4 3 2 1
5.25
Ball Dia. 0.35
Pitch 0.75
Rev: 1.06 6/2000 13/15 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Page 14
Ordering Information
GS71116TP/J/U
Part Number
GS71116TP-10 400 mil TSOP-II 10 ns Commercial
GS71116TP-12 400 mil TSOP-II 12 ns Commercial
GS71116TP-15 400 mil TSOP-II 15 ns Commercial
GS71116TP-10I 400 mil TSOP-II 10 ns Industrial
GS71116TP-12I 400 mil TSOP-II 12 ns Industrial
GS71116TP-15I 400 mil TSOP-II 15 ns Industrial
GS71116J-10 400 mil SOJ 10 ns Commercial
GS71116J-12 400 mil SOJ 12 ns Commercial
GS71116J-15 400 mil SOJ 15 ns Commercial
GS71116J-10I 400 mil SOJ 10 ns Industrial
GS71116J-12I 400 mil SOJ 12 ns Industrial
GS71116J-15I 400 mil SOJ 15 ns Industrial
GS71116U-10 Fine Pitch BGA 10 ns Commercial
GS71116U-12 Fine Pitch BGA 12 ns Commercial
*
Package Access Time Temp. Range Status
GS71116U-15 Fine Pitch BGA 15 ns Commercial
GS71116U-10I Fine Pitch BGA 10 ns Industrial
GS71116U-12I Fine Pitch BGA 12 ns Industrial
GS71116U-15I Fine Pitch BGA 15 ns Industrial
*
Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. For example: GS71116TP-10T
Rev: 1.06 6/2000 14/15 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Page 15
Revision History
GS71116TP/J/U
Rev. Code: Old;
New
GS711Rev1.05 10/19991/
2000K;Rev 5 2/2000L
GS71116 Rev 1.05 2/2000;Rev1.06
2/2000M (not posted)
GS71116 Rev1.05 2/2000; Rev1.06
6/2000 (previous rev not posted)
Types of Changes
Format or Content
Format/Content
Content
Content
Page #/Revisions/Reason
1. GSI Logo
2.
1. Took all referenced to 8ns and 9ns speed bins out.
2. Heading, Power Supply Currents, Read and Writ eCycle table, Ordering
information.
1. Added Standby Current numbers back into Power Supply Currents table
2. Noted that numbers were max.
Rev: 1.06 6/2000 15/15 © 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.