Datasheet GS71116AU-8I, GS71116AU-8, GS71116ATP-12I, GS71116ATP-12, GS71116ATP-10I Datasheet (GSI)

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Page 1
GS71116ATP/J/U
SOJ, TSOP, FP-BGA
64K x 16
Commercial Temp Industrial Temp
1Mb Asynchronous SRAM

Features

• Fast access time: 7, 8, 10, 12 ns
• CMOS low power operation: 145/125/100/85 mA at minimum cycle time
• Single 3.3 V power supply
• All inputs and outputs are TTL-compatible
• Byte control
• Fully static operation
• Industrial Temperature Option: –40° to 85°C
• Package line up
J: 400 mil, 44-pin SOJ package TP: 400 mil, 44-pin TSOP Type II package U: 6 mm x 8 mm Fine Pitch Ball Grid Array package

Description

The GS71116A is a high speed CMOS static RAM organized as 65,536-words by 16-bits. Static design eliminates the need for external clocks or timing strobes. Operating on a single
3.3 V power supply and all inputs and outputs are TTL-
compatible. The GS71116A is available in a 6 mm x 8 mm Fine Pitch BGA package, as well as in 400 mil SOJ and 400 mil TSOP Type-II packages.

Pin Descriptions

Symbol Description
0–A15
A
DQ
1–DQ16 Data input/output
CE
LB
UB
WE
OE
V
DD
V
SS
NC No connect
Address input
Chip enable input
Lower byte enable input
(DQ1 to DQ8)
Upper byte enable input
(DQ9 to DQ16)
Write enable input
Output enable input
+3.3 V power supply
Ground
7, 8, 10, 12 ns
3.3 V V
Center VDD and V

SOJ 64K x 16-Pin Configuration

A A A A A
CE DQ DQ DQ DQ
V
DD
V
SS
DQ DQ6 DQ7 DQ
WE A A A
A
12
4
3
2
1
0
1
2
3
4
5
8
15
14
13
1 2 3 4 5 6 7 8 9 10 11 12
13 14 15
16 17 18
19 20 21 22
Top view
44-pin
SOJ
44 43 42 41 40 39 38 37 36 35 34 33 32 31
30
29 28
27
26 25
24 23
Package J

Fine Pitch BGA 64K x 16-Bump Configuration

123456
0
ALB
OE A
BDQ16UB A
CDQ14DQ15A
V
D
E
DQ13NC A7DQ
SS
V
DQ12NC NC DQ
DD
FDQ11DQ10A
GDQ9NC A
HNCA12A
1
A
3
A4CE DQ
5
A6DQ2DQ
8
A9DQ7DQ
10A11
13A14A15
WE DQ
A2NC
V
4
V
5
NC
A A A OE UB LB DQ DQ DQ
DQ V V DQ DQ DQ DQ NC A A A A NCNC
DD
SS
DD
SS
5
6
7
16
15
14
13
SS
DD
12
11
10
9
8
9
10
11
1
3
6
8
6 mm x 8 mm, 0.75 mm Bump Pitch (Package U)
Rev: 1.04a 10/2002 1/15 © 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Page 2

TSOP-II 64K x 16-Pin Configuration

GS71116ATP/J/U
Top View
DQ DQ DQ DQ
V
V
DQ DQ DQ DQ
WE A
A14
A
A
CE
A
4
A
3
A
2
A
1
A
0
1
2
3
4
DD
SS
5
6
7
8
15
13
12
1 2 3 4 5 6 7 8 9 10 11 12
13 14 15
16 17 18
19 20 21 22
Top view
44-pin
TSOP II
44 43 42 41 40 39 38 37 36 35 34 33 32 31
30
29 28
27
26
25
24
23
A A A OE UB LB DQ DQ DQ
DQ V V DQ DQ DQ DQ NC A A A A NCNC
5
6
7
16
15
14
13
SS
DD
12
11
10
9
8
9
10
11
Package TP
Block Diagram
A
A
CE
WE
OE
UB LB
0
15
_____
_____
Address
Input
Buffer
Control
Row
Decoder
Memory Array
Column Decoder
I/O Buffer
DQ
1
DQ
16
Rev: 1.04a 10/2002 2/15 © 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Page 3

Truth Table

GS71116ATP/J/U
CE OE WE LB UB DQ1 to DQ
8
DQ9 to DQ
16
H X X X X Not Selected Not Selected ISB1, ISB
L L Read Read
LLH
L H Read High Z
H L High Z Read
LL Write Write
LXL
L H Write Not Write, High Z
H L Not Write, High Z Write
L H H X X High Z High Z
L X X H H High Z High Z
Note: X: “H” or “L”

Absolute Maximum Ratings

Parameter Symbol Rating Unit
Supply Voltage V
DD
–0.5 to +4.6 V
VDD Current
2
I
DD
Input Voltage V
Output Voltage V
IN
OUT
–0.5 to V
(4.6 V max.)
–0.5 to V
(4.6 V max.)
DD
DD
+0.5
+0.5
V
V
Allowable power dissipation PD 0.7 W
Storage temperature T
STG –55 to 150
o
C
Note: Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation shall be restricted to Rec­ommended Operating Conditions. Exposure to higher than recommended voltages for extended periods of time could affect device reliability.
Rev: 1.04a 10/2002 3/15 © 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Page 4

Recommended Operating Conditions

Parameter Symbol Min Typ Max Unit
GS71116ATP/J/U
Supply Voltage for -7/-8/-10/-12
Input High Voltage V
Input Low Voltage V
Ambient Temperature,
Commercial Range
Ambient Temperature,
Industrial Range
V
DD
IH
IL
T
Ac
I
T
A
3.0 3.3 3.6 V
2.0
–0.3 0.8 V
0 70
–40 85
Notes:
1. Input overshoot voltage should be less than V
+2 V and not exceed 20 ns.
DD

2. Input undershoot voltage should be greater than –2 V and not exceed 20 ns.

Capacitance

Parameter Symbol Test Condition Max Unit
Input Capacitance C
Output Capacitance C
IN
OUT
Notes:
1. Tested at T
A
= 25°C, f = 1 MHz

2. These parameters are sampled and are not 100% tested.

IN
V
= 0 V 5 pF
OUT
V
= 0 V 7 pF
V
DD
+0.3
V
o
C
o
C

DC I/O Pin Characteristics

Parameter Symbol Test Conditions Min Max
Input Leakage Current I
Output Leakage
Current
Output High Voltage V
Output Low Voltage V
IL
LO
I
OH
OL ILO = +4 mA 0.4V
Rev: 1.04a 10/2002 4/15 © 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
VIN = 0 to V
DD
Output High Z
V
OUT = 0 to V
OH
I
DD
= –4 mA 2.4
–1 uA 1uA
–1 uA 1uA
Page 5

Power Supply Currents

Parameter Symbol Test Conditions
CE V
Operating
Supply
Current
Standby
Current
IDD
I
SB1
All other inputs
VIH
or ≤ V
Min. cycle time
IOUT
= 0 mA
CE V
All other inputs
V
IH
or ≤V
Min. cycle time
GS71116ATP/J/U
0 to 70°C –40 to 85°C
7 ns 8 ns 10 ns 12 ns 7 ns 8 ns 10 ns 12 ns
IL
IL
IH
IL
145 mA 125 mA 100 mA 85 mA 150 mA 130 mA 105 mA 90 mA
25 mA 20 mA 20 mA 15 mA 30 mA 25 mA 25 mA 20 mA
Standby
Current
I
SB2
CE VDD – 0.2 V
All other inputs
V
DD – 0.2 V or 0.2 V
2 mA 5 mA
Rev: 1.04a 10/2002 5/15 © 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Page 6

AC Test Conditions

Parameter Conditions
Input high level VIH = 2.4 V
Input low level V
I L
= 0.4 V
DQ
GS71116ATP/J/U
Output Load 1
50
30pF
1
Input rise time tr = 1V/ns
Input fall time tf = 1 V/ns
Input reference level 1.4 V
Output reference level 1.4 V
Output load Fig. 1& 2
Notes:

1. Include scope and jig capacitance.

2. Test conditions as specified with output loading as shown in Fig. 1 unless otherwise noted.

3. Output load 2 for t
LZ, tHZ, tOLZ and tOHZ
VT = 1.4 V
Output Load 2
DQ
5pF
1
3.3 V
589
434
Rev: 1.04a 10/2002 6/15 © 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Page 7

AC Characteristics

Read Cycle

GS71116ATP/J/U
Parameter Symbol
Read cycle time t
Address access time t
Chip enable access time (CE
Byte enable access time (UB
Output enable to output valid (OE
)tAC—7—8—10—12ns
, LB)tAB—3—3.5— 4 — 5 ns
)tOE —3—3.5— 4 — 5 ns
Output hold from address change t
Chip enable to output in low Z (CE
Output enable to output in low Z (OE
Byte enable to output in low Z (UB
Chip disable to output in High Z (CE
Output disable to output in High Z (OE
Byte disable to output in High Z (UB
)
)
, LB)
)
)
, LB)
-7 -8 -10 -12 Unit
Min Max Min Max Min Max Min Max
RC
AA —7—8—10—12ns
OH
*
t
LZ
*
OLZ
t
*
t
BLZ
*
t
HZ
*
t
OHZ
*
t
BHZ
7—8—10 12 ns
3—3—3 — 3 —ns
3—3—3 — 3 —ns
0—0—0 — 0 —ns
0—0—0 — 0 —ns
—3.5— 4 — 5 — 6 ns
—3—3.5— 4 — 5 ns
—3—3.5— 4 — 5 —
* These parameters are sampled and are not 100% tested.
Read Cycle 1: CE = OE = VIL, WE = VIH, UB and, or LB = V
IL
RC
t
Address
tAA
OH
t
Data Out Previous Data Data valid
Rev: 1.04a 10/2002 7/15 © 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Page 8
GS71116ATP/J/U
Read Cycle 2: WE = V

Write Cycle

IH
Address
CE
UB, LB
OE
Data Out
High impedance
tLZ
tBLZ
tOLZ
tAA
tAC
tRC
tAB
tOE
tHZ
tBHZ
tOHZ
Data valid
-7 -8 -10 -12
Parameter Symbol
MinMaxMinMaxMinMaxMinMax
Write cycle time tWC 7 8 10 12 ns
Address valid to end of write tAW 5 5.5 7 8 ns
Chip enable to end of write tCW 5 5.5 7 8 ns
Byte enable to end of write tBW 5 5.5 7 8 ns
Data set up time tDW 3.5 4 5 6 ns
Data hold time tDH 0 0 0 0 ns
Write pulse width tWP 5 5.5 7 8 ns
Address set up time tAS 0 0 0 0 ns
Write recovery time (WE
Write recovery time (CE
Output Low Z from end of write
Write to output in High Z
* These parameters are sampled and are not 100% tested.
) tWR 0—0—0—0—ns
) tWR10—0—0—0—ns
tWLZ
tWHZ
*
*
3—3—3—3—ns
—3—3.5—4—5ns
Unit
Rev: 1.04a 10/2002 8/15 © 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Page 9

Write Cycle 1: WE control

GS71116ATP/J/U
tWC
Address

Write Cycle 2: CE control

Address
OE
CE
UB, LB
WE
Data In
Data Out
tAW
tCW
tBW
tAS tWP
tWC
tWR
tDW tDH
Data valid
tWLZtWHZ
High impedance
tAW
OE
tAS tCW
CE
tBW
UB, LB
tWP
WE
tDW tDH
Data In
Data Out
Rev: 1.04a 10/2002 9/15 © 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Data valid
High impedance
tWR1
Page 10

Write Cycle 3: UB, LB control

Address
GS71116ATP/J/U
tWC
OE
CE
UB, LB
WE
Data In
Data Out
tAW
tAS tCW
tBW
tWP
tWR1
tDW tDH
Data valid
High impedance
Rev: 1.04a 10/2002 10/15 © 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Page 11

44-Pin, 400 mil SOJ

GS71116ATP/J/U
D
2344
E
122
e
c
E
H
A
A2
A
A1
y
B
B1
Detail A
L
Symbol
Dimension in inch Dimension in mm
min nom max min nom max
A 0.148 3.759
A1 0.025 0.635
A2 0.105 0.110 0.115 2.667 2.794 2.921
E
G
B 0.018 0.457
B1 0.026 0.028 0.032 0.660 0.711 0.813
c 0.008 0.203
D 1.120 1.125 1.130 28.44 28.58 28.70
E 0.395 0.400 0.405 10.033 10.160 10.287
e 0.05 1.27
H
E
0.435 0.440 0.445 11.049 11.176 11.303
G
E 0.360 0.370 0.380 9.144 9.398 9.652
Q
L 0.082 0.087 0.106 2.083 2.210 2.70
y 0.004 0.102
Q
o
0
o
7
o
0
o
7
Notes:
1. Dimension D& E do not include interlead flash.
2. Dimension B1 does not include dambar protrusion/intrusion.
3. Controlling dimension: inches
Rev: 1.04a 10/2002 11/15 © 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Page 12

44 Pin, 400 mil TSOP-II

GS71116ATP/J/U
D
2344
E
E
H
122
e
B
A2
A
A1
y
L1
Detail A
Symbol
c
Dimension in inch Dimension in mm
min nom max min nom max
A 0.047 1.20
A1 0.002 0.05
A2 0.037 0.039 0.041 0.95 1.00 1.05
A
B 0.01 0.014 0.018 0.25 0.35 0.45
c 0.006 0.15
D 0.721 0.725 0.729 18.31 18.41 18.51
E 0.396 0.400 0.404 10.06 10.16 10.26
e 0.031 0.80
H
E
0.455 0.463 0.471 11.56 11.76 11.96
L 0.016 0.020 0.024 0.40 0.50 0.60
L1 0.031 0.80
L
Q
y 0.004 0.10
Q
o
0
o
5
o
0
5
o
Notes:
1. Dimension D& E do not include interlead flash.
2. Dimension B does not include dambar protrusion/intrusion.
3. Controlling dimension: mm
Rev: 1.04a 10/2002 12/15 © 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Page 13

6 mm x 8 mm Fine Pitch BGA

pin A1 index
GS71116ATP/J/U
8.00 ± 0.10
6.00 ± 0.10
units: mm
1.20(max)
A
B
0.22 ± 0.05
pin A1 index
Bottom View Top View
654321
D
0.10
F
C
E
D
H
G
0.36(typ)
3.75
0.75(typ).
5.25
Ball Dia. 0.35
Pitch 0.75
Rev: 1.04a 10/2002 13/15 © 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Page 14

Ordering Information

GS71116ATP/J/U
Part Number
GS71116ATP-7 400 mil TSOP-II 7 ns Commercial
GS71116ATP-8 400 mil TSOP-II 8 ns Commercial
GS71116ATP-10 400 mil TSOP-II 10 ns Commercial
GS71116ATP-12 400 mil TSOP-II 12 ns Commercial
GS71116ATP-7I 400 mil TSOP-II 7 ns Industrial
GS71116ATP-8I 400 mil TSOP-II 8 ns Industrial
GS71116ATP-10I 400 mil TSOP-II 10 ns Industrial
GS71116ATP-12I 400 mil TSOP-II 12 ns Industrial
GS71116AJ-7 400 mil SOJ 7 ns Commercial
GS71116AJ-8 400 mil SOJ 8 ns Commercial
GS71116AJ-10 400 mil SOJ 10 ns Commercial
GS71116AJ-12 400 mil SOJ 12 ns Commercial
GS71116AJ-7I 400 mil SOJ 7 ns Industrial
GS71116AJ-8I 400 mil SOJ 8 ns Industrial
*
Package Access Time Temp. Range Status
GS71116AJ-10I 400 mil SOJ 10 ns Industrial
GS71116AJ-12I 400 mil SOJ 12 ns Industrial
GS71116AU-7 6 mm x 8 mm Fine Pitch BGA 7 ns Commercial
GS71116AU-8 6 mm x 8 mm Fine Pitch BGA 8 ns Commercial
GS71116AU-10 6 mm x 8 mm Fine Pitch BGA 10 ns Commercial
GS71116AU-12 6 mm x 8 mm Fine Pitch BGA 12 ns Commercial
GS71116AU-7I 6 mm x 8 mm Fine Pitch BGA 7 ns Industrial
GS71116AU-8I 6 mm x 8 mm Fine Pitch BGA 8 ns Industrial
GS71116AU-10I 6 mm x 8 mm Fine Pitch BGA 10 ns Industrial
GS71116AU-12I 6 mm x 8 mm Fine Pitch BGA 12 ns Industrial
*
Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. For example:
GS71116ATP-10T
Rev: 1.04a 10/2002 14/15 © 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Page 15

1Mb Asynchronous Datasheet Revision History

GS71116ATP/J/U
Rev. Code: Old;
New
71116A_r1
71116A_r1; 71116_r1_01 Content
71116A_r1_01; 71116A _r1_02
71116A_r1_02; 71116A _r1_03
71116A_r1_03; 71116A _r1_04
Types of Changes Format or Content
Content
Content
Content
Page #/Revisions/Reason
• Creation of new datasheet
• Added 6 ns speed bin to entire document
• Updated all power numbers
• Changed 6 mm x 10 mm FPBGA package designator from U to X
• Updated Recommended Operating Conditions table on page 4
• Changed FPBGA package from 6 x 10 to 6 x 8 (package U)
• Updated Read Cycle AC Characteristics table
• Removed 6 ns speed bin from entire document
• Added 7 ns speed bin to entire document
Rev: 1.04a 10/2002 15/15 © 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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