Datasheet GLT4160L04SE-70TC, GLT4160L04SE-70J3, GLT4160L04SE-60TC, GLT4160L04SE-60J3, GLT4160L04SE-50TC Datasheet (G-LINK)

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Page 1
G-LINK
RAS
CAS
RAS
RAS
CAS
4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
Features : Description :
GLT4160L04
May 2001 (Rev.3.1)
4,194,304 words by 4 bits organization.Fast access time and cycle timeLow power dissipation.
Read-Modify-Write,
-Before-
Refresh, Hidden Refresh.
-Only Refresh,
2,048 refresh cycles per 32ms.Available in 300 mil 26(24) SOJ and TSOPII. ∗ 3.3V±0.3V Vcc Power Supply voltage.All inputs and Outputs are LVTTL compatible.Extended Data-Out (EDO) Page access
cycle.
Self-refresh Capability. (S-Version).
The GLT4160L04 is a high-performance CMOS dynamic random access memory containing 16,777,216 bits organized in a x4 configuration. The GLT4160L04 offers page cycle access with Extended Data Output. The GLT4160L04 has 11 row- and 11 column-addresses, and accepts 2048-cycle refresh in 32 ms.
The GLT4160L04 provides EDO PAGE MODE operation which allows for fast data access within a row-address defined boundary, up to 2048 x 4 bits with cycle times as short as 18ns.
HIGH PERFORMANCE 40 50 60 70
Max.
Access Time, (t
RAC
)
40 ns 50 ns 60 ns 70 ns
Max. Column Address Access Time, (tAA) 20 ns 25 ns 30 ns 35 ns Min. Extended Data Out Page Mode Cycle Time, (tPC) 18 ns 20 ns 25 ns 30 ns Min. Read/Write Cycle Time, (tRC) 70 ns 84 ns 104 ns 124 ns
Max.
G-Link Technology
2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A.
Access Time (t
CAC
)
G-Link Technology Corporation,Taiwan
12 ns 13 ns 15 ns 20 ns
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G-LINK
RAS
CAS
WE
OE
Pin Configuration :
GLT4160L04
4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
May 2001 (Rev.3.1)
Vcc DQ0 DQ1
WE
RAS
NC
10
A
0
A A1 A2
3
A
VCC
Pin Descriptions:
A0 - A
10
GLT4160L04
300mil 26(24) SOJ
1
2 3 4 5 6
8
9 10 11 12 13
26 25 24 23 22 21
19 18 17 16 15 14
VSS DQ3 DQ2 CAS
OE
A9
8
A A7
A6 A5
4
A
VSS
Vcc DQ0 DQ1
WE
RAS
NC
A10
A0 A1 A2 A3
VCC
GLT4160L04
300mil 26(24) TSOPII
1
2 3 4 5 6
8
9 10 11 12 13
Name Function
Address Inputs Row Address Strobe
26 25 24 23 22 21
19 18 17 16 15 14
VSS DQ3 DQ2 CAS
OE
A9
A8 A7
A6 A5 A4
VSS
DQ0 - DQ V
CC
V
SS
NC No Connection
G-Link Technology
2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A.
Column Address Strobe Write Enable Output Enable
3
Data Inputs / Outputs +3.3V Power Supply Ground
G-Link Technology Corporation,Taiwan
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G-LINK
CAS
RAS
RAS
4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
Absolute Maximum Ratings* Capacitance*
TA=25°C, VCC=3.3V±0.3V, VSS=0V
Operating Temperature, TA (ambient)
.............................................….0°C to
+70°C For Extended Temperature……………..-20°C to 85°C
Storage Temperature(plastic)............-55°C to +150°C
Voltage Relative to VSS........................-0.5V to + 4.6V
Short Circuit Output Current...............................20mA
Power Dissipation...............................................1.0W
*Note: Operation above Absolute Maximum Ratings can
aversely affect device reliability.
Electrical Specifications
l All voltages are referenced to GND. l After power up, wait more than 200µs and then, execute eight
refresh cycles as dummy cycles to initialize internal circuit.
Symbol
C C
C
*Note: Capacitance is sampled and not 100% tested
Address Input
IN1
RAS, CAS, WE, OE
IN2
Data Input/Output
OUT
Parameter
-before-
GLT4160L04
May 2001 (Rev.3.1)
Max.
or
Unit
5 7 7
pF pF pF
-only
Block Diagram :
WE
CAS
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9
A10
RAS
11
11
NO.2 CLOCK
GENERATOR
COLUMN-
ADDRESS
BUFFER(11)
REFRESH
CONTROLLER
REFRESH COUNTER
ROW
ADDRESS
BUFFERS(11)
NO.1 CLOCK
GENERATOR
11
11
ROW DECODER
2048
DATA-IN BUFFER
DATA-OUT
BUFFER
COLUMN
DECODER
2048
SENSE AMPLIFIERS
I/O GATING
2048
2048 x 1024 x 4
MEMORY
ARRAY
4
4
4
4
DQ0 DQ1 DQ2 DQ3
OE
VDD VSS
G-Link Technology
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G-Link Technology Corporation,Taiwan
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G-LINK
RAS
CAS
WE
OE
RAS
Truth Table:
GLT4160L04
4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
May 2001 (Rev.3.1)
Function
Standby H
HX
X X X X High-Z
ADDRESS DATA-IN/OUT
t
R
t
C
DQ1-DQ4
READ L L H L ROW COL Data-Out EARLY WRITE L L L X ROW COL Data-In READ WRITE L L EDO-PAGE-MODE 1st Cycle L READ 2nd cycle L EDO-PAGE-MODE 1st Cycle L EARLY-WRITE 2nd cycle L EDO-PAGE-MODE 1st Cycle L READ-WRITE 2nd cycle L
-ONLY REFRESH
HIDDEN REFRESH READ
WRITE CBR REFRESH SELF REFRESH
LHL LHL
HL HL
L H X X ROW n/a High-Z
HL HL HL HL HL HL LH HL HL LH
HL LH
H L ROW COL Data-Out H L n/a COL Data-Out
L X ROW COL Data-In L X n/a COL Data-In
L H L ROW COL Data-Out L L X ROW COL Data-In L H X X X High-Z L H X X X High-Z
ROW COL Data-Out,Data-In
ROW COL Data-Out,Data-In
n/a COL Data-Out,Data-In
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G-Link Technology Corporation,Taiwan
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G-LINK
Time
RAS, CAS
RAS
RAS
CAS
RAS
CAS
CAS
RAS
RAS, CAS
RAS
CAS
RAS=CAS
WE = OE = A~A=V
-0.2V or
4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
DC and Operating Characteristics (1-2)
TA = 0°C to 70°C, -20°C to 85°C VCC=3.3V±0.3V, VSS=0V, unless otherwise specified.
GLT4160L04
May 2001 (Rev.3.1)
Sym. Parameter Test Conditions Access
I
Input Leakage Current
LI
(any input pin)
0V V
VCC+0.3V
IN
(All other pins not under
Min. Typ Max. Unit Notes
-5 +5 µA
test=0V)
I
I
I
I
I
I
I
I
Output Leakage Current
LO
(for High-Z State) Operating Current,
CC1
Random READ/WRITE
Standby Current (TTL)
CC2
Refresh Current,
CC3
-Only
Operating Current,
CC4
EDO Page Mode
Refresh Current,
CC5
Before
Standby Current, (CMOS)
CC6
Self refresh Current
CC7
0V ≤ V
out
V
CC
Output is disabled (Hiz) tRC = tRC (min.) t
at V
other inputs ≥V
cycling,
IH
SS
at V
IH
tRC = tRC (min.)
at VIL,
address
cycling:tPC=tPC(min.)
address cycling:
tRC=tRC (min.)
VCC-0.2V, ≥VCC-0.2V,
All other inputs V
SS
=0.2V,
0.2V
t t t
t t t t t t t t t t t t
RAC RAC RAC RAC
RAC RAC RAC RAC RAC RAC RAC RAC RAC RAC RAC RAC
= 40ns = 50ns = 60ns = 70ns
= 40ns = 50ns = 60ns = 70ns = 40ns = 50ns = 60ns = 70ns = 40ns = 50ns = 60ns = 70ns
-5 +5
130 120
80 70
130 120
80
70 130 120
80
70 130 120
80
70
300
300
µA
mA
1 mA
mA
mA
mA 1
µA
µA
1,2
2
1,2
1,5
DQ0~DQ3=VCC-0.2V,0.2V or
Open V V V V
Input Low Voltage -0.3 +0.8 V 3
IL
Input High Voltage 2.0 VCC+0.3 V 4
IH
Output Low Voltage IOL = 2mA 0.4 V
OL
Output High Voltage IOH = -2mA 2.4 V
OH
Notes:
1. ICC is dependent on output loading when the device output is selected. Specified ICC(max.) is measured with the output open.
2. ICC is dependent upon the number of address transitions specified ICC(max.) is measured with a maximum of one transition per address cycle in random Read/Write and EDO Fast Page Mode.
3. Specified VIL(min.) is steady state operation. During transitions VIL(min.) may undershoot to –1V for a period not to exceed 15ns. All AC parameters are measured with VIL(min.)VSS and VIH(max.)VCC.
4. Specified VIH(max.) is steady state operation . During transitions VIH(max.) may overshoot to VCC+1V for a period not to exceed 15ns. All AC parameters are measured with VIL(min.) VSS and VIH(max.) VCC .
5. S-Version.
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G-Link Technology Corporation,Taiwan
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G-LINK
CAS
RAS
RAS
RAS
RAS
RAS
CAS
CAS
CAS
RAS
CAS
CAS
RAS
CAS
RAS
CAS
RAS
RAS
RAS
CAS
RAS
RAS
CAS
4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
AC Characteristics
TA =0°C to 70°C , -20°C to 85°C VCC = 3.3 V ± 0.3V, VIH/VIL = 3/0 V, VOH/VOL = 2/0.8V An initial pause of 200 µs and 8
Parameter
Read or Write Cycle Time Read Modify Write Cycle Time
Precharge Time
Pulse Width Access Time from Access Time from
Access Time from Column Address
to Output Low-Z to Output High-Z
Hold Time
Hold Time
Pulse Width to to Column Address Delay Time
to
Row Address Set-Up Time Row Address Hold Time Column Address Set-Up Time Column Address Hold Time
Column Address to Column Address Hold Time Referenced to
Read Command Set-Up Time Read Command Hold Time Referenced to
Read Command Hold Time Referenced to Write Command Set-Up Time
Write Command Hold Time Write Command Pulse Width
Write Command to Write Command to
Delay Time
Precharge Time
Lead Time
Lead Time
Lead Time
-before-
or
-only refresh cycles are required after power-up.
40 50 60 70
Symbol Min. Max. Min. Max. Min. Max. Min. Max. Unit Notes
t
t
RWC
t
t
RAS
t
RAC
t
CAC
t
t t
CEZ
t
RSH
t
CSH
t
CAS
t
RCD
t
RAD
t
CRP
t
ASR
t
RAH
t
ASC
t
CAH
t
RAL
t
t
RCS
t
RCH
t
RRH
t
WCS
t
WCH
t
t
RWL
t
CWL
RC
RP
AA
CLZ
AR
WP
70 84 104 124 ns 91 116 140 170 ns 25 30 40 50 ns
40 10K 50 10k 60 10k 70 10k ns
40 50 60 70 ns 1,2,3 12 13 15 20 ns 1,5,10 20 25 30 35 ns 1,5,6
0 3 3 3 ns
3 8 3 13 3 15 3 20 ns 12 13 15 20 ns 34 38 45 50 ns
7 10k 8 10k 10 10k 15 10k ns 18 28 20 37 20 45 20 50 ns 13 20 15 25 15 30 15 35 ns 7
5 5 5 5 ns
0 0 0 0 ns
8 10 10 10 ns
0 0 0 0 ns
6 8 10 15 ns 20 25 30 35 ns
34 40 45 50 ns
0 0 0 0 ns
0 0 0 0 ns 4
0 0 0 0 ns 4
0 0 0 0 ns 8,9
6 10 10 15 ns
6 10 10 15 ns 12 13 15 30 ns
8 8 10 15 ns
GLT4160L04
May 2001 (Rev.3.1)
G-Link Technology
2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A.
G-Link Technology Corporation,Taiwan
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G-LINK
RAS
RAS
CAS
CAS
WE
RAS
CAS
CAS
CAS
RAS
CAS
CAS
RAS
RAS
CAS
OE
OE
OE
OE
WE
OE
CAS
RAS
WE
OE
CAS
CAS
OE
OE
WE
CAS
CAS
RAS
4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
AC Characteristics
Parameter
Data Set-Up Time Data Hold Time
Data Hold Time Referenced to
to WE Delay Time
to WE Delay Time
Column Address to WE Delay Time
Precharge to
to
Precharge Time
precharge time
test cycle) Access Time from
EDO Page Mode Cycle Time EDO Page Mode Read-Modify-Write Cycle Time
Precharge Time (EDO Page Mode)
Pulse Width (EDO Page Mode Only)
Hold Time from
Access Time from
to Data Delay Time to Output Low-Z to Output High-Z
to Data Delay
Command Hold Time
Data Output Hold after
to Output High-Z
to Output High-Z
to
Hold Time
Hold Time to
Precharge Time
Puts width (EDO mixed read write cycle) Set-Up Time for
(
Delay
Before
Precharge
precharge
low
-before-
counter
Cycle
GLT4160L04
May 2001 (Rev.3.1)
40 50 60 70
Symbol Min. Max. Min. Max. Min. Max. Min. Max. Unit Notes
t
DS
t
DH
t
DHR
t
RWD
t
CWD
t
AWD
t
CPWD
t
RPC
t
CPT
t
CPA
t
PC
t
PRWC
t
CP
t
RASP
t
RHCP
t
OEA
t
OED
t
OLZ
t
OEZ
t
WED
t
OEH
t
DOH
t
REZ
t
WEZ
t
OCH
t
CHO
t
OEP
t
WPE
t
CSR
0 0 0 0 ns 7 8 10 15 ns
36 40 45 50 ns 54 67 79 94 ns 24 30 34 44 ns 32 42 49 59 ns 47 47 54 64 ns
0 5 5 5 ns
20 20 20 25 ns
22 28 35 40 ns
18 20 25 30 ns 50 47 56 71 ns
6 8 10 10 ns 40 100k 50 100k 60 100k 70 100k ns 30 30 35 40 ns
12 13 15 0 20 ns 8 8 13 15 20 ns 3 3 0 0 ns 3 8 3 13 3 15 3 20 ns
15 15 15 20 ns
7 13 15 20 ns 3 5 5 5 ns 3 8 3 13 3 15 3 20 ns 3 10 3 13 3 15 3 20 ns 5 5 5 5 ns 5 5 5 5 ns 5 5 5 5 ns 5 5 5 5 ns 5 5 5 5 ns
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G-Link Technology Corporation,Taiwan
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G-LINK
CAS
CAS
RAS
WE
RAS
CAS
RAS
WE
RAS
CAS
RAS
RAS
CAS
RAS
RAS
CAS
RAS
CAS
CAS
RAS
4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
Parameter Symbol
t
Hold Time for
to
precharge time (
-before-
refresh )
refresh
to
hold time (
)
Transition Time Refresh Period (2,048 cycles) Refresh Period (S-Version)
Pulse Width (
Before
)
precharge Time (
refresh
)
Hold Time (
Before
Before
Before
Cycle
Before
Self
Self
refresh
Self
refresh
CHR
t
WRP
t
WRH
t
T
t
REF
t
REF
t
RASS
t
RPS
t
CHS
)
GLT4160L04
May 2001 (Rev.3.1)
40 50 60 70
Min. Max. Min. Max. Min. Max. Min. Max. Unit Notes
8 10 10 15 ns
10 10 10 10 ns
10 10 10 10 ns
2 50 2 50 2 50 2 50 ns
32 32 32 32 ms
128 128 128 128 ms
100 100 100 100
70 90 110 130 ns
-50 -50 -50 -50 ns
µs
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G-LINK
RAS
CAS
RAS
CAS
RAS
CAS
RAS
CAS
RAS
CAS
RAS
CAS
OE
OE
OE
4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
TEST MODE CYCLE
Parameter
Random read or write cycle time Read-modify-write cycle time
Access time from Access time from
Access time from column address
pulse width
pulse width
hold time
hold time
Column address to
to WE delay time
to WE delay time
Column address to WE delay time t
Precharge to WE delay time
EDO Page Mode cycle time EDO page mode read-modify-write cycle time
Pulse width (EDO page cycle)
Access time form
access time to data delay command hold time
Write command set-up time (Test mode in) Write command hold time (Test mode in)
lead time
precharge
Symbol Min. Max. Min. Max. Min. Max. Min. Max. Unit Notes
t
RC
t
RWC
t
RAC
t
CAC
t
t
RAS
t
CAS
t
RSH
t
CSH
t
RAL
t
CWD
t
RWD
AWD
t
CPWD
t
t
PRWC
t
RASP
t
CPA
t
OEA
t
OED
t
OEH
t
WTS
t
WTH
GLT4160L04
40 50 60 70
89 89 109 129 ns
121 121 145 175 ns
55 55 65 75 ns 1,2,3,7 18 18 20 25 ns 1,3,7
AA
PC
30 30 35 40 ns 1,2,7
55 10k 55 10k 65 10k 75 10k ns 13 10k 13 10k 15 10k 20 10k ns 18 18 20 25 ns 43 43 50 55 ns 30 30 35 40 ns 35 35 39 49 ns 8 72 72 84 99 ns 8 47 47 54 64 ns 8
52 52 59 69 ns 8 25 25 30 35 ns
53 53 61 76 ns 55 100k 55 100k 65 100k 75 100k ns
33 33 40 45 ns 1
18 18 20 25 ns 18 18 20 25 ns 18 18 20 25 ns 10 10 10 10 ns
10 10 10 10 ns
May 2001 (Rev.3.1)
G-Link Technology
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G-Link Technology Corporation,Taiwan
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G-LINK
CAS
WE
GLT4160L04
4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
May 2001 (Rev.3.1)
Notes:
1. Measure with a load equivalent to one TTL input and 100 pF.
2. Assumes that t dominant.
3. Assumes that t
controlled by t
4. Either t
RRH
or t
5. Access time is determined by the longest of tAA, t
6. Assumes that t
7. Operation within the t
is specified as a reference point only. If t limit, the access time is controlled by t
8. t
9. t
, t
WCS WCS
, t
RWD
AWD
(min.) must be satisfied in an Early Write Cycle.
10. tDS and tDH are referenced to the latter occurrence of
11. tT is measured between VIH (min.) and VIL (max.). AC-measurements assume tT = 2 ns.
≤ t
RCD
≤ t
RAD
.
CAC
must be satisfied for a Read Cycle.
RCH
≥ t
RAD
and t
(max.). If t
RCD
(max.). If t
RAD
(max.).
RAD
(max.) limit ensures that t
RAD
are not restrictive operating parameters.
CWD
is greater than t
RCD
is greater than t
RAD
is greater than the specified t
RAD
and t
CAA
CAC
(max.), access time will be t
RCD
(max.), access time will be
RCD
and t
CAC
(max.) can be met. t
RAC
CPA
.
.
or
(max.)
RAD
(max.)
RAD
.
AA
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G-LINK
Read CYCLE
RAS
CAS
Address
WE
OE
DQ
GLT4160L04
4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
t
RC
t
RAS
V
IH-
V
IL-
t
CRP
V
IH-
V
IL-
t
V
IH-
V
IL-
V
IH-
V
IL-
V
IH-
V
IL-
V
OH-
V
OL-
ASR
ROW
ADDRESS
t
RAH
t
RAD
t
RCS
t
RCD
t
t
ASC
t
RAC
AR
t
CSH
COLUMN
ADDRESS
t
t
t
CAH
AA
CLZ
t
CAC
t
t
t
RAL
OEA
t
CAS
RSH
DATA-OUT
t
OEZ
t
RP
t
t
RRH
CRP
t
RCH
t
CEZ
May 2001 (Rev.3.1)
Early Write Cycle NOTE : D
VIH-
RAS
VIL-
VIH-
CAS
VIL-
DQ
WE
OE
VIH- VIL-
VIH- VIL-
VIH- VIL-
V V
IH-
IL-
Address
= OPEN
OUT
tCRP
tASR
tRAH
ROW
ADDRESS
tRCD
tRAD
tASC
tWCS
tDHR
tDS tDH
tCSH
COLUMN
ADDRESS
tAR
DATA - IN
tRAS
tCAH
tCWL
tRWL
tWCR
tWCH tWP
tRC
tCAS
tRAL
t
RSH
Don't Care
tRP
tCRP
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Don't Care
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G-LINK
GLT4160L04
4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
May 2001 (Rev.3.1)
OE Controlled Write Cycle NOTE : D
V
IH-
RAS
V
IL-
V
IH-
CAS
V
IL-
t
t
ADDRESS
Address
WE
DQ
OE
V
IH-
V
IL-
V
IH-
V
IL-
V
IH-
V
IL-
V
IH-
V
IL-
t
CRP
ASR RAH
OUT
ROW
= OPEN
t
RAD
t
t
ASC
RCS
t
RCD
t
OED
t
COLUMN
ADDRESS
t
DS
DATA - IN
CSH
t
RAS
t
CAH
t
t
DH
t
WP
OEH
t
t
t
RC
CAS
RAL
t
CWL
t
t
RSH
RWL
t
RP
t
CRP
Don't Care
Read - Modify - Write Cycle
V
IH-
RAS
V
IL-
V
IH-
CAS
V
IL-
V
DQ
WE
OE
IH-
V
IL-
IH-
V V
IL-
V
IH-
V
IL-
V
I/OH-
V
I/OL-
Address
G-Link Technology
2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A.
t
CRPtRCD
t
RAD
t
ASR
t
ASC
t
RAH
ROW
ADDR.
COLUMN
ADDRESS
t
AA
t
RAC
RC
t
t
RAS
t
RSH
t
CAS
t
CSH
t
CAH
t
AWD
t
CWD
t
OEA
CLZ
t
CAC
t
VALID
DATA-OUT
t
OEZ
t
OED
DS
t
t
t
DH
VALID
DATA-IN
t
WP
t
RWL
CWL
t
RP
CRP
t
Don't Care
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GLT4160L04
4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
May 2001 (Rev.3.1)
EDO Page Mode Read Cycle NOTE : D
VIH-
RAS
VIL-
= OPEN
OUT
tCSH
CAS
Address
tCRP
VIH-
VIL-
tCSR
VIH- VIL-
ROW
ADDR.
tRCD tCAS
tRAD
tRAH
tASC
COLUMN
ADDRESS
tRCS
VIH-
WE
VIL-
VIH-
OE
VIL-
VOH-
DQ
VOL-
EDO Page Mode Early Write Cycle NOTE : D
VIH-
RAS
VIL-
CAS
Address
WE
tCRP
VIH- VIL-
tASR
VIH- VIL-
VIH- VIL-
ROW
ADDR.
tRCD tCAS
tRAD
tRAH
tASC
COLUMN
ADDRESS
tWCS
tCAH
tWCH tWCS tWCStWCH
tCAH
tCAC
tCLZ
tCSH
tWP
tOEA
tRAC tOLZ
OUT
tPC tPC tPC
tCP
tCAS
tASC
tCAH
COLUMN
ADDRESS
tAA tCPA tCAC
tDOH
VALID
DATA-OUT
= OPEN
tPC tPC
tCP tCP
tASC tASC
COLUMN
ADDRESS
tWP tWP
tRASP tRP
tRHCP
tCP tCP
tCAS tCAS
tASC
tOEZ
VALID
DATA-OUT
tOCH tOEA
tOEP
COL.
ADDR.
tCAH
tASC
tCAC
tAA
tCPA
VALID
DATA-OUT
tCAH
COL.
ADDR.
tRRH
tRCH
tCPA
tCAC
tAA
tCHO tOEP
tOEZ tOEZ
VALID
DATA-OUT
Don't Care
tRASP tRP
tRHCP
tCAS
tRSH
tCAS
tCAH tCAH
COLUMN
ADDRESS
tWCH
VALID
DATA-OUT
VIH-
OE
VIL-
VIH-
DQ
VIL-
G-Link Technology
2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A.
tDS tDS tDStDH
VALID
DATA-IN
VALID
DATA-IN
- 13 -
VALID
DATA-IN
tDS
Don't Care
tDS
G-Link Technology Corporation,Taiwan
Page 14
G-LINK
GLT4160L04
4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
May 2001 (Rev.3.1)
EDO Page Mode Read - Modify - Write Cycle NOTE : D
V
RAS
CAS
Address
WE
OE
DQ
IH-
V
IL-
t
ASR
ROW
ADDR.
RCD
t
RAD
t
RAH
t
ASC
t
RCS
t
V
IH-
V
IL-
t
V
IH-
V
IL-
V
IH-
V
IL-
V
IH-
IL-
V
V
I/OH-
V
I/OL-
COL.
ADDR.
CLZ
t
CAH
t
RAC
t
t
CAC
t
AA
t
OEA
t
t
RWD
CSH
t
CWD
AWD
t
CAS
t
OED
t
OEZ
VALID
DATA-OUT
t
CWL
t
WP
t
DH
t
DS
VALID
DATA-IN
EDO PAGE READ AND WRITE MIXED CYCLE
V
IH-
RAS
V
CAS
ADDRESS
WE
OE
DQ
0
~DQ
IL-
t
RAH
t
ROW
COL.
ADDR
t
AA
t
RAC
ASC
t
CAH
t
CAS
t
RCH
t
OEA
t
CAC
DATA-OUT
V
IH-
V
IL-
t
ASR
V
IH-
ADDR
V
IL-
t
RCS
V
IH-
V
IL-
V
IH-
V
IL-
V
I/OH-
3
V
I/OL-
t
CP
t
ASC
COLUMN
ADDRESS
t
t
t
VALID
RCS
WPE
t
CPA
WEZ
t
HPC
t
CAH
OUT
t
RCH
t
t
CLZ
t
WEZ
VALID
DATA-OUT
= OPEN
t
RASP
t
CP
ASC
COL.
ADDR.
t
CLZ
t
RASP
t
CP
t
t
WCStWCH
t
WED
t
ASC
COLUMN
ADDRESS
t
CAH
t
CPWD
t
OEA
t
CAC
t
AA
HPC
t
CAS
t
CAH
t
DH
t
DS
VALID
DATA-IN
t
CAS
t
PRWC
t
RAL
t
CWD
t
AWD
VALID
DATA-OUT
t
RSH
t
OEZ
t
OED
t
CP
t
ASC
COLUMN
ADDRESS
VALID
DATA-IN
t
HPC
t
CAH
t
AA
t
t
t
t
CAS
WP
OEH
DH
t
t
DS
t
CWL
RCH
t
RP
t
CRP
t
RWL
Don't Care
t
VALID
DATA-OUT
t
RP
REZ
G-Link Technology
2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A.
Don't Care
G-Link Technology Corporation,Taiwan
- 14 -
Page 15
G-LINK
CAS
RAS
RAS
t
t
GLT4160L04
4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
May 2001 (Rev.3.1)
- Before -
RAS
CAS
WE
Refresh Cycle
V
IH-
V
IL-
V
IH-
V
IL-
V
IH-
V
IL-
Remark Address, OE : Don’t care DQ : Hi - Z
-Only Refresh Cycle
V
IH-
RAS
V
IL-
V
IH-
CAS
V
IL-
V
Address
IH-
V
IL-
Remark WE, OE : Don’t care DQ : Hi - Z
t
t
CSR
WRP
t
t
CRP
ASR
t
CHR
t
WRH
ROW
ADDRESS
t
RAS
t
RAH
t
RAS
t
t
RAS
RC
RC
t
t
RP
t
RPCtCRP
t
RP
RPC
t
t
CRP
t
RC
t
RP
t
t
RPC
RC
t
CSR
t
WRPtWRH
t
RP
t
ASR
t
CHR
t
RAH
ROW
ADDRESS
t
RAS
Hidden Refresh Cycle ( Read )
VIH-
RAS
VIL-
Address
WE
OE
DQ
VIH- VIL-
VIH- VIL-
VIH- VIL-
VIH- VIL-
V VIL-
IH-
UCAS,LCAS
t
CRP
ROW
ADDRESS
RC
tRAS tRAS
tRCD
tRAD tRAL
tASC tCAHtASR tCAH
COLUMN
ADDRESS
tRCS
tAA
tRAC
tCLZ
OPEN
tRSH
tCAC
tOEA
tRP
RC
tRP
tCHR
tWRH
tWRPtRRH
tWEZ
tOEZ
DATA-OUT
tCEZ
tREZ
Don't Care
G-Link Technology
2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A.
G-Link Technology Corporation,Taiwan
- 15 -
Page 16
G-LINK
GLT4160L04
4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
May 2001 (Rev.3.1)
Hidden Refresh Cycle ( Write ) NOTE : D
V
IH-
RAS
V
IL-
tCRP
V
IH-
CAS
V
IL-
tCAH
V
Address
WE
OE
DQ
IH-
V
IL-
V
IH-
V
IL-
V
IH-
V
IL-
V
IH-
IL-
V
ROW
ADDRESS
= OPEN
OUT
tRAS tRAS
tRCD
tRSH
tRAD tRSH
COLUMN
ADDRESS
tCAHtASC
tWCH
tASC
tWCS
tWP
tDS
tDH
DATA-IN
t
RC
tRP
tWRP tWRH
tRP
tCHR
Don't Care
G-Link Technology
2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A.
G-Link Technology Corporation,Taiwan
- 16 -
Page 17
G-LINK
t
4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
CAS-Before RAS Refresh Counter Test Cycle
VIH-
RAS
VIL-
VIH-
CAS
VIL-
VIH-
Address
VIL-
Read Cycle
VIH-
WE
VIL-
VIH-
OE
VIL-
VOH-
DQ
VOL-
Write Cycle
VIH-
WE
VIL-
VIH-
OE
VIL-
VIH-
DQ
VIL-
Read-Modify-Write
VIH-
WE
VIL-
VIH-
OE
VIL-
VI/OH-
DQ
VI/OL-
tCSR
tWRP tWRH
tWRP tWRH
tCHR
tWRHtWRP
OPEN
tRCS
tWCS
tRAS
tCPT
tASC
ADDRESS
tRCS
COLUMN
tCLZ
tDS
VALID DATA-IN
tRSH
tCAS
tRAL
tCAH
tAA
tCAC
tOEA
tRWL
tCWL
tWCH
tWP
tDH
tAWD
tCWD tRWL
tCAC
tAA
tOEA
tOED
tCLZ
tOEZ
VALID
DATA-OUT
tOEZ
VALID DATA-OUT
tCWL
tWP
tDH
tDS
VALID
DATA-IN
GLT4160L04
May 2001 (Rev.3.1)
RP
tRRH
tRCH
tCEZ
Don't Care
G-Link Technology
2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A.
G-Link Technology Corporation,Taiwan
- 17 -
Page 18
G-LINK
t
GLT4160L04
4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
May 2001 (Rev.3.1)
TEST MODE IN CYCLE
RC
tRP
tRAS
tRPC
OPEN
Don't Care
RAS
CAS
WE
DQ
VIH- VIL-
VIH- VIL-
VIH- VIL-
VI/OH-
VI/OL-
tRP
t
RPC
tCP tCSR
tWTS
tCEZ
tCHR
tWTH
Test Mode
By using the test mode, the test time can be reduced. The reason for this is that, the memory emulates the x 16-bit organization during test mode. Don’t care about the input levels of the CAS input A0, A1 .
(1) Setting the mode
Executing the test mode cycle (WE , CAS before RAS refresh cycle ) sets the test mode.
(2) Write / read operation
When either a “0” or a “1” is written to the input pin in test mode, this data is written to 16 bits of memory cell.
Next, when the data is read from the output pin at the same address, the cell be checked.
Output = “1” Normal write (all memory cells) Output = “0” Abnormal write
(3) Refresh
Refresh in the test mode must be performed with the RAS / CAS cycle or with the WE, CAS before RAS refresh cycle. The WE, CAS before RAS refresh cycle use the same counter as the CAS before RAS refresh’s internal counter.
(4) Mode Cancellation
The test mode is cancelled by executing one cycle of RAS only refresh cycle or CAS before RAS refresh cycle.
G-Link Technology
2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A.
G-Link Technology Corporation,Taiwan
- 18 -
Page 19
G-LINK
t
t
t
4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
CAS-BEFORE-RAS SELF REFRESH CYCLE
VIH-
RAS
VIL-
V
CAS
DQ
WE
IH-
VIL-
V
I/OH-
VI/OL-
V VIL-
IH-
NOTE : OE , Address = Don’t Care
RP
tRPC
tCP
tCEZ
tWRP tWRH
tCSR
RASS
GLT4160L04
May 2001 (Rev.3.1)
RPS
tRPC
tCHS
OPEN
Don't Care
G-Link Technology
2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A.
G-Link Technology Corporation,Taiwan
- 19 -
Page 20
G-LINK
Part Number
SPEED
POWER
FEATURE
TEMPERATURE
PACKAGE
GLT4160L04
4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
May 2001 (Rev.3.1)
Ordering Information
GLT4160L04-40J3 40ns Normal EDO Commercial SOJ 300mil 26(24)L GLT4160L04-50J3 50ns Normal EDO Commercial SOJ 300mil 26(24)L GLT4160L04-60J3 60ns Normal EDO Commercial SOJ 300mil 26(24)L
GLT4160L04-70J3 70ns Normal EDO Commercial SOJ 300mil 26(24)L GLT4160L04E-40J3 40ns Normal EDO Extended SOJ 300mil 26(24)L GLT4160L04E-50J3 50ns Normal EDO Extended SOJ 300mil 26(24)L GLT4160L04E-60J3 60ns Normal EDO Extended SOJ 300mil 26(24)L GLT4160L04E-70J3 70ns Normal EDO Extended SOJ 300mil 26(24)L GLT4160L04S-40J3 40ns Self Refresh EDO Commercial SOJ 300mil 26(24)L GLT4160L04S-50J3 50ns Self Refresh EDO Commercial SOJ 300mil 26(24)L GLT4160L04S-60J3 60ns Self Refresh EDO Commercial SOJ 300mil 26(24)L GLT4160L04S-70J3 70ns Self Refresh EDO Commercial SOJ 300mil 26(24)L
GLT4160L04SE-40J3 40ns Self Refresh EDO Extended SOJ 300mil 26(24)L GLT4160L04SE-50J3 50ns Self Refresh EDO Extended SOJ 300mil 26(24)L GLT4160L04SE-60J3 60ns Self Refresh EDO Extended SOJ 300mil 26(24)L GLT4160L04SE-70J3 70ns Self Refresh EDO Extended SOJ 300mil 26(24)L
GLT4160L04-40TC 40ns Normal EDO Commercial TSOPII 300mil 26(24)L GLT4160L04-50TC 50ns Normal EDO Commercial TSOPII 300mil 26(24)L GLT4160L04-60TC 60ns Normal EDO Commercial TSOPII 300mil 26(24)L
GLT4160L04-70TC 70ns Normal EDO Commercial TSOPII 300mil 26(24)L GLT4160L04E-40TC 40ns Normal EDO Extended TSOPII 300mil 26(24)L GLT4160L04E-50TC 50ns Normal EDO Extended TSOPII 300mil 26(24)L GLT4160L04E-60TC 60ns Normal EDO Extended TSOPII 300mil 26(24)L GLT4160L04E-70TC 70ns Normal EDO Extended TSOPII 300mil 26(24)L GLT4160L04S-40TC 40ns Self Refresh EDO Commercial TSOPII 300mil 26(24)L GLT4160L04S-50TC 50ns Self Refresh EDO Commercial TSOPII 300mil 26(24)L GLT4160L04S-60TC 60ns Self Refresh EDO Commercial TSOPII 300mil 26(24)L GLT4160L04S-70TC 70ns Self Refresh EDO Commercial TSOPII 300mil 26(24)L
GLT4160L04SE-40TC 40ns Self Refresh EDO Extended TSOPII 300mil 26(24)L GLT4160L04SE-50TC 50ns Self Refresh EDO Extended TSOPII 300mil 26(24)L GLT4160L04SE-60TC 60ns Self Refresh EDO Extended TSOPII 300mil 26(24)L GLT4160L04SE-70TC 70ns Self Refresh EDO Extended TSOPII 300mil 26(24)L
G-Link Technology
2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A.
G-Link Technology Corporation,Taiwan
- 20 -
Page 21
G-LINK
4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
Parts Numbers (Top Mark) Definition :
GLT4160L04
May 2001 (Rev.3.1)
4 : DRAM 5 : Synchronous DRAM 6 : Standard SRAM 7 : Cache SRAM 8 : Synchronous Burst SRAM 9 : SGRAM
GLT 4 160 L 04 S E - 40 J3
-SRAM
064 : 8K 256 : 256K 512 : 512K 100 : 1M
-DRAM
10 : 1M(C/EDO) 11 : 1M(C/FPM) 12 : 1M(H/EDO) 13 : 1M(H/FPM) 20 : 2M(EDO) 21 : 2M(FPM) 40 : 4M(EDO) 41 : 4M(FPM) 80 : 8M(EDO) 81 : 8M(FPM) 160 : 16M(EDO) 161 : 16M(FPM) 640 : 64M(EDO) 641 : 64M(FPM)
-SDRAM
40 : 4M 160 : 16M 320 : 32M,4Bank 321 : 32M,2Bank 640 : 64M
CONFIG.
04 : x04 08 : x08 16 : x16 32 : x32
VOLTAGE
Blank : 5V L : 3.3V M : 2.5V N : 2.1V
POWER
Blank : Standard S : Self Refresh Low Power L : Low Power LL : Low Low Power SL : Super Low Power
SPEED
-SRAM
12 : 12ns 15 : 15ns 20 : 20ns 70 : 70ns
-DRAM
25 : 25ns 28 : 28ns 30 : 30ns 35 : 35ns 40 : 40ns 45 : 45ns 50 : 50ns 60 : 60ns 70 : 70ns 80 : 80ns 100 : 100ns
SDRAM :
5 : 5ns/200 MHZ
5.5 : 5.5ns/182 MHZ 6 : 7ns/166 MHZ 7 : 8ns/125 MHZ 10 : 10ns/100 MHZ
PACKAGE
T : PDIP(300mil) TS : TSOP(Type I) ST : sTSOP(Type I) TC : TSOPll (40/44) TD : TSOPII (44/50) PL : PLCC FA : 300mil SOP FB : 330mil SOP FC : 445mil SOP J3 : 300mil SOJ J4 : 400mil SOJ P : PDIP(600mil) Q : PQFP TQ : TQFP FG : 48Pin BGA 9x12 FH : 48Pin BGA 8x10 FI : 48Pin BGA 6x8
Temperature Range
E : Extended Temperature I : Industrial Temperature Blank : Commercial Temperature
G-Link Technology
2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A.
G-Link Technology Corporation,Taiwan
- 21 -
Page 22
G-LINK
4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT
Package Information
300mil 24/26 Lead Thin Small Outline Package SOJ
GLT4160L04
May 2001 (Rev.3.1)
300mil 24/26 Lead Thin Small Outline Package (TSOP) TYPE II
G-Link Technology
2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A.
G-Link Technology Corporation,Taiwan
- 22 -
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