Datasheet GBPC3508, GBPC3510, GBPC3506, GBPC3504, GBPC2510 Datasheet (Fairchild Semiconductor)

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Page 1

GBPC 12, 15, 25, 35 SERIES

Features

•Integrally molded heatsink

provided very low thermal resistance for maximum heat dissipation.

•Surge overload rartings

from 300 amperes to 400 amperes.

•Isolated voltage from case

to lead over 2500 volts.

Suffix "W"

Wire Lead Structure

Suffix "M"

Terminal Location Face to Face

0.442(11.23)

0.432(10.97)

0.442(11.23)

0.432(10.97)

GBPC

GBPC-W

0.042(1.07)

0.038(0.97)

0.25(6.35)

Discrete POWER & Signal

HOLE FOR #10 SCREW

0.22(5.59)

DI A

0.20(5.08)

1.14(29.0)

1.12(28.5)

0.96(24.5)

0.85(21.5)

H OLE FO R #10 SCREW

0.22(5.59)

0.20(5.08)

1.2(30.5)

MI N

0.692(17.6)

0.612(15.5)

DI A

1.14(29.0)

1.12(28.5)

Dimensions are in:

inches (mm)

Technologies

1.14(29.0)

1.12(28.5)

0.692(17.6)

0.612(15.5)

~–

0.752(19.1)

0.672(17.1)

1.14(29.0)

1.12(28.5)

0.752(19.1)

0.672(17.1)

–

0.490(12.4)

0.410(10.4)

0.602(15.3)

0.522(13.3)

0.752(19.1)

0.672(17.1)

GBPC 12, 15, 25, 35 SERIES

12, 15, 25, 35 Ampere Glass Passivated Bridge Rectifiers

Absolute Maximum Ratings* T

Symbol Parameter Value Units

f(surge)

stg

*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.

1999 Fairchild Semiconductor Corporation

Averag e Rectified Curr en t

@ T

= 55°C

Peak F orward Surge C urrent

8.3 ms single half- sine- wave Superimposed on rate d load (JEDEC method )

Total D evice Dissipati on

Derate above 25°C

Ther mal Resistance, J unc tion to Lead 1.5 Storag e Temperature Range -55 to +150 Operati ng Junction Temperature -55 to +150

= 25°C unless otherwise noted

GBPC12 GBPC15 GBPC25 GBPC35

GBPC12, 15, 25

GBPC35

12 15 25 35

300 400

83.3 666

A A A A

A A

m W/°C

C/W

GBPC 12, 15, 25, 35 SERIES , Rev . A

Page 2

Glass Passivated Bridge Rectifiers

(continued)

GBPC 12, 15, 25, 35 SERIES

Electrical Characteristics T

= 25°C unless otherwise noted

Parameter Device Units

005 01 02 04 06 08 10

Peak Repetitive Reverse Voltage 50 100 200 400 600 800 1000 V Maximum RMS Bridge Input Voltage 35 70 140 280 420 560 700 V DC Reverse Voltage (Rated VR)

50 100 200 400 600 800 1000 V

Maximum Reverse Leakage, total bridge @ rated VRTA = 25°C

= 125°C

5.0

500

Maximum Forward Voltage Drop, per bridge @ 6.0 A

@ 7.5 A @ 12.5 A

@ 17.5 A I2t rating for fusing t < 8.3 ms

GBPC12 GBPC15 GBPC25 GBPC35

GBPC12,15,25

GBPC35

1.1 V

375 660

A A

2 2

Typical Junction Capac itance, per leg VR = 4.0V, f = 1.0 MHz

GBPC12,15,25

GBPC35

180 200

T ypical Characteristics

Forward Current De ratin g Curve

GBPC35

GBPC25

GBPC12-GBPC15

SINGLE PHASE HALF WAV E 60HZ RESISTIVE OR INDUCTIVE LOAD .375" (9.0mm ) LEAD LENGTH S

Non-Repetitive Surge Current

400

200

100

GBPC12-GBPC25

GBPC35

µA µA

Sec Sec

pF pF

FORWARD CU RRENT (A)

0 25 50 75 100 125 150 175

AMBIENT TEM PERATURE ( C)

Forward Charact eristics

200 100

GBPC25

FORWARD CU RR E NT ( A)

0.1

0.6 0.8 1 1.2 1.4 1.6 1.8 2

GBPC35

GBPC12-GBPC15

T = 25 C

Pulse Width = 300µs 2% Duty Cycle

FORWARD VOLTAGE (V)

PEAK FORWARD SURGE CURRENT (A)

12 51020 50100

NUMBER OF CYCLES AT 60Hz

Reverse Characteris tics

100

T = 125 C

REVERSE CURRENT ( A)

0.1 0 20406080100120140

PERCENT OF RA TED PEAK REVERSE VO L TAGE (%)

T = 25 C

GBPC 12, 15, 25, 35 SERIES , Rev. A

Page 3

TRADEMARKS

The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.

ACEx™ CoolFET™ CROSSVOLT™ E2CMOS

FACT™ FACT Quiet Series™

FAST FASTr™ GTO™ HiSeC™

ISOPLANAR™ MICROWIRE™ POP™ PowerTrench™ QS™ Quiet Series™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 TinyLogic™

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:

1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.

2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or

effectiveness.

PRODUCT STATUS DEFINITIONS Definition of Terms

Datasheet Identification Product Status Definition

Advance Information

Preliminary

No Identification Needed

Obsolete

Formative or In Design

First Production

Full Production

Not In Production

This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.

This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.

This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.

This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.