Datasheet GAL20XV10B-20LP, GAL20XV10B-20LJ, GAL20XV10B-15LP, GAL20XV10B-15LJ, GAL20XV10B-10LP Datasheet (Lattice Semiconductor Corporation)

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Page 1
GAL20XV10
High-Speed E2CMOS PLD
Generic Array Logic™
Features
HIGH PERFORMANCE E2CMOS ® TECHNOLOGY — 10 ns Maximum Propagation DelayFmax = 100 MHz7 ns Maximum from Clock Input to Data OutputTTL Compatible 16 mA OutputsUltraMOS® Advanced CMOS Technology
50% to 75% REDUCTION IN POWER FROM BIPOLAR90mA Maximum Icc75mA Typical Icc
ACTIVE PULL-UPS ON ALL PINS
E2 CELL TECHNOLOGY — Reconfigurable LogicReprogrammable Cells100% Tested/100% YieldsHigh Speed Electrical Erasure (<100 ms)20 Year Data Retention
TEN OUTPUT LOGIC MACROCELLS XOR Gate Capability on all OutputsFull Function and Parametric Compatibility with
PAL12L10, 20L10, 20X10, 20X8, 20X4
Registered or Combinatorial with Polarity
PRELOAD AND POWER-ON RESET OF ALL REGISTERS
APPLICATIONS INCLUDE:High Speed CountersGraphics Processing Comparators
ELECTRONIC SIGNA TURE FOR IDENTIFICATION
Functional Block Diagram
I/CLK
I
I
I
I
I
I
(40 X 40)
I
AND-ARRAY
PROGRAMMABLE
I
I
I
4
OLMC
4
OLMC
4
OLMC
4
OLMC
4
OLMC
4
OLMC
4
OLMC
4
OLMC
4
OLMC
4
OLMC
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
Description
The GAL20XV10 combines a high performance CMOS process with electrically erasable (E2) floating gate technology to provide

Pin Configuration

I/OE
the highest speed Exclusive-OR PLD available in the market. At
I I I I I
I I
I I I
DIP
1
GAL
20XV10
6
12
Vcc
24
I/O/Q I/O/Q I/O/Q I/O/Q I/O/Q
18
I/O/Q I/O/Q I/O/Q I/O/Q I/O/Q
13
I/OE
90mA maximum Icc (75mA typical Icc), the GAL20XV10 provides a substantial savings in power when compared to bipolar counter­parts. E2CMOS technology offers high speed (<100ms) erase
PLCC
I/CLK
times providing the ability to reprogram, reconfigure or test the de­vices quickly and efficiently .
The generic architecture provides maximum design flexibility by allowing the Output Logic Macrocell (OLMC) to be configured by the user. An important subset of the many architecture configu­rations possible with the GAL20XV10 are the PAL® architectures listed in the macrocell description section of this document. The GAL20XV10 is capable of emulating these PAL architectures with full function and parametric compatibility.
Unique test circuitry and reprogrammable cells allow complete AC, DC, and functional testing during manufacturing. As a result, Lattice
I
4
5
I I I
7
GAL20XV10
NC
I
9 I I
11
12
I
I
2
T op View
14 16 18
I
I/CLK
GND
I/O/Q
I/O/Q
Vcc
26
28
25
I/O/Q I/O/Q
23
I/O/Q NC I/O/Q
21
I/O/Q
19
I/O/Q
I/OE
I/O/Q
I/O/Q
Semiconductor delivers 100% field programmability and function­ality of all GAL products. In addition, 100 erase/write cycles and data retention in excess of 20 years are specified.
Copyright © 1997 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A. July 1997 Tel. (503) 681-0118; 1-888-ISP-PLDS; FAX (503) 681-3037; http://www.latticesemi.com
20xv10_02
1
GND
Page 2
GAL20XV10 Ordering Information
Commercial Grade Specifications
)sn(dpT)sn(usT)sn(ocT)Am(ccI#gniredrOegakcaP
016709PL01-B01VX02LAGPIDcitsalPniP-42
JL01-B01VX02LAGCCLPdaeL-82
518809PL51-B01VX02LAGPIDcitsalPniP-42
JL51-B01VX02LAGCCLPdaeL-82
02010109PL02-B01VX02LAGPIDcitsalPniP-42
JL02-B01VX02LAGCCLPdaeL-82
Part Number Description
Specifications GAL20XV10
GAL20XV10B
Device Name
Speed (ns)
PowerL = Low Power
XXXXXXXX XX X X X
_
Grade
Package
Blank = Commercial
P = Plastic DIP J = PLCC
2
Page 3
Output Logic Macrocell (OLMC)
Specifications GAL20XV10
The following discussion pertains to configuring the Output Logic Macrocell. It should be noted that actual implementation is accomplished by development software/hardware and is com­pletely transparent to the user.
The GAL20XV10 has two global architecture configurations that allow it to emulate P AL architectures. The Input mode emulates combinatorial PAL devices, with the I/CLK and I/OE pins used as inputs. The Feedback mode emulates registered P AL devices with the I/CLK pin used as the register clock and the I/OE pin as an output enable for all registers. The following is a list of P AL archi­tectures that the GAL20XV10 can emulate. It also shows the global architecture mode used to emulate the P AL architecture.
P AL Architectures Emulated by
GAL20XV10
PAL12L10 PAL20L10 PAL20X10 PAL20X8 PAL20X4
INPUT MODE
The Input mode architecture is defined when the global architecture bit SYN = 1. In this mode, the I/CLK pin becomes an input to the AND array and also provides the clock source for all registers. The I/OE pin becomes an input into the AND array and provides the output enable control for any macrocell config­ured as an Exclusive-OR function. Feedback into the AND array is provided from macrocells 2 through 9 only. In this mode, macrocells 1 and 10 have no feedback into the AND array.
FEEDBACK MODE
The Feedback mode architecture is defined when the global architecture bit SYN = 0. In this mode the I/CLK pin becomes a dedicated clock source for all registers. The I/OE pin is a dedi­cated output enable control for any macrocell configured as an Exclusive-OR function. The I/CLK and I/OE pins are not avail­able to the AND array in this mode. Feedback into the AND array is provided on all macrocells 1 through 10.
FEATURES
Each Output Logic Macrocell has four possible logic function configurations controlled by architecture control bits AC0 and AC1. Four product terms are fed into each macrocell.
GAL20XV10 Global
OLMC Mode
Input Mode
Input Mode Feedback Mode Feedback Mode Feedback Mode
Exclusive-OR macrocells. In Feedback mode, the state of the register is available to the AND array via an internal feedback path on all macrocells. In Input mode, the state of the register is available to the AND array via an internal feedback path on macrocells 2 through 9 only , macrocells 1 and 10 have no feedback into the AND array.
REGISTERED CONFIGURATION
The Macrocell is set to Registered configuration when AC0 = 1 and AC1 = 0. Three of the four product terms are used as sum-of­product terms for the D input of the register. The inverting output buffer is enabled by the fourth product term. The output is en­abled while this product term is true. The XOR bit controls the po­larity of the output. The register is clocked by the low-to-high tran­sition of the I/CLK. In Feedback mode, the state of the register is available to the AND array via an internal feedback path on all macrocells. In Input mode, the state of the register is available to the AND array via an internal feedback path on macrocells 2 through 9 only, macrocells 1 and 10 have no feedback into the AND array .
XOR COMBINA TORIAL CONFIGURATION
The Macrocell is set to the Exclusive-OR Combinatorial configu­ration when AC0 = 0 and AC1 = 1. The four product terms are seg­mented into two OR-sums of two product terms each, which are then combined by an Exclusive-OR gate and fed to an output buffer. The inverting output buffer is enabled by the I/OE pin, which is an active low output enable that is common to all XOR macrocells. In Feedback mode, the state of the I/O pin is avail­able to the AND array via an internal feedback path on all macrocells. In Input mode, the state of the I/O pin is available to the AND array via an input buf fer path on macrocells 2 through 9 only , macrocells 1 and 10 have no input into the AND array.
COMBINAT ORIAL CONFIGURATION
The Macrocell is set to Combinatorial mode when AC0 = 1 and AC1 = 1. Three of the four product terms are used as sum-of­product terms for the combinatorial output. The XOR bit controls the polarity of the output. The inverting output buffer is enabled by the fourth product term. The output is enabled while this product term is true. In Feedback mode, the state of the I/O pin is avail­able to the AND array via an internal feedback path on all macrocells. In Input mode, the state of the I/O pin is available to the AND array via an input buffer path on macrocells 2 through 9 only , macrocells 1 and 10 have no input into the AND array.
XOR REGISTERED CONFIGURA TION
The Macrocell is set to the Exclusive-OR Registered configuration when AC0 = 0 and AC1 = 0. The four product terms are seg­mented into two OR-sums of two product terms each, which are then combined by an Exclusive-OR gate and fed into a D-type register. The register is clocked by the low-to-high transition of the I/CLK pin. The inverting output buffer is enabled by the I/OE pin, which is an active low output enable common to all
3
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Input Mode
OE
CLK
CLK
XOR
Specifications GAL20XV10
XOR Registered Configuration
- SYN = 1.
- AC0 = 0.
D
Q
Q
Registered Configuration
D
Q
Q
- AC1 = 0.
- OLMC 1 and OLMC10 do not have the feedback path.
- Pin 1(2) can be CLK and/or Input.
- Pin 13(16) can be OE and/or Input.
- SYN = 1.
- AC0 = 1.
- AC1 = 0.
- XOR = 1 defines Active Low Output.
- XOR = 0 defines Active High Output.
- OLMC 1 and OLMC10 do not have the feedback path.
- Pin 1(2) can be CLK and/or Input.
- OE controlled by product term.
OE
XOR
XOR Combinatorial Configuration
- SYN = 1.
- AC0 = 0.
- AC1 = 1.
- OLMC 1 and OLMC10 do not have the feedback path.
- Pin 13(16) can be OE and/or Input.
Combinatorial Configuration
- SYN = 1.
- AC0 = 1.
- AC1 = 1.
- XOR = 1 defines Active Low Output.
- XOR = 0 defines Active High Output.
- OLMC 1 and OLMC10 do not have the feedback path.
- OE controlled by product term.
4
Page 5
Input Mode Logic Diagram
1(2)
0
120
2(3)
160 280
3(4)
Specifications GAL20XV10
DIP (PLCC) Package Pinouts
2812 16 20 24 32 36048
OLMC
XOR - 1600 AC0 - 1610 AC1 - 1620
OLMC
XOR - 1601 AC0 - 1611 AC1 - 1621
23(27)
22(26)
4(5)
5(6)
6(7)
7(9)
8(10)
9(11)
320 440
480 600
640 760
800 920
960
1080
1120 1240
OLMC
XOR - 1602 AC0 - 1612 AC1 - 1622
OLMC
XOR - 1603 AC0 - 1613 AC1 - 1623
OLMC
XOR - 1604 AC0 - 1614 AC1 - 1624
OLMC
XOR - 1605 AC0 - 1615 AC1 - 1625
OLMC
XOR - 1606 AC0 - 1616 AC1 - 1626
OLMC
XOR - 1607 AC0 - 1617 AC1 - 1627
21(25)
20(24)
19(23)
18(21)
17(20)
16(19)
10(12)
11(13)
1280 1400
1440 1560
40-USER ELECTRONIC SIGNA TURE FUSES
1631, 1632, .... .... 1669, 1670
Byte4 Byte3 .... .... Byte1 Byte0
5
OLMC
XOR - 1608 AC0 - 1618 AC1 - 1628
OLMC
XOR - 1609 AC0 - 1619 AC1 - 1629
15(18)
14(17)
13(16)
SYN - 1630
Page 6
Feedback Mode
OE
CLK
CLK
XOR
Specifications GAL20XV10
XOR Registered Configuration
- SYN = 0.
D
Q
Q
Registered Configuration
D
Q
Q
- AC0 = 0.
- AC1 = 0.
- Dedicated CLK input on Pin 1(2).
- Dedicated OE input on Pin 13(16).
- SYN = 0.
- AC0 = 1.
- AC1 = 0.
- XOR = 1 defines Active Low Output.
- XOR = 0 defines Active High Output.
- Dedicated CLK input on Pin 1(2).
- OE controlled by product term.
- Pin 13(16) is not connected to this configura­ tion.
OE
XOR
XOR Combinatorial Configuration
- SYN = 0.
- AC0 = 0.
- AC1 = 1.
- Dedicated OE input on Pin 13(16).
- Pin 1(2) is not connected to this configura­ tion.
Combinatorial Configuration
- SYN = 0.
- AC0 = 1.
- AC1 = 1.
- XOR = 1 defines Active Low Output.
- XOR = 0 defines Active High Output.
- OE controlled by product term.
- Both pin1(2) and pin 13(16) are not con­ nected to this configuration.
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Feedback Mode Logic Diagram
1(2)
0
120
2(3)
Specifications GAL20XV10
DIP (PLCC) Package Pinouts
2812 16 20 24 32 36048
OLMC
XOR - 1600 AC0 - 1610 AC1 - 1620
23(27)
3(4)
4(5)
5(6)
6(7)
7(9)
8(10)
160 280
320 440
480 600
640 760
800 920
960
1080
OLMC
XOR - 1601 AC0 - 1611 AC1 - 1621
OLMC
XOR - 1602 AC0 - 1612 AC1 - 1622
OLMC
XOR - 1603 AC0 - 1613 AC1 - 1623
OLMC
XOR - 1604 AC0 - 1614 AC1 - 1624
OLMC
XOR - 1605 AC0 - 1615 AC1 - 1625
OLMC
XOR - 1606 AC0 - 1616 AC1 - 1626
22(26)
21(25)
20(24)
19(23)
18(21)
17(20)
9(11)
10(12)
11(13)
1120 1240
1280 1400
1440 1560
40-USER ELECTRONIC SIGNA TURE FUSES
1631, 1632, .... .... 1669, 1670
Byte4 Byte3 .... .... Byte1 Byte0
7
OLMC
XOR - 1607 AC0 - 1617 AC1 - 1627
OLMC
XOR - 1608 AC0 - 1618 AC1 - 1628
OLMC
XOR - 1609 AC0 - 1619 AC1 - 1629
16(19)
15(18)
14(17)
13(16)
SYN - 1630
Page 8
Specifications GAL20XV10
Absolute Maximum Ratings
Supply voltage Vcc.......................................–0.5 to+7V
Input voltage applied ..........................–2.5 to
Off-state output voltage applied .........–2.5 to
Storage T emperature ............................... –65 to 150°C
Ambient Temperature with
Power Applied .......................................... –55 to 125°C
1.Stresses above those listed under the Absolute Maximum Ratings may cause permanent damage to the device. These are stress only ratings and functional operation of the device at these or at any other conditions above those indicated in the operational sections of this specification is not implied (while pro­gramming, follow the programming specifications).
(1)
VCC +1.0V VCC +1.0V
Recommended Operating Conditions
Commercial Devices:
Ambient T emperature ( Supply voltage (
with Respect to Ground ..................... +4.75 to +5.25V
TA) .............................0 to +75°C
VCC)

DC Electrical Characteristics

Over Recommended Operating Conditions (Unless Otherwise Specified)
SYMBOL PARAMETER CONDITION MIN. TYP.3MAX. UNITS
VIL Input Low Voltage VSS – 0.5 0.8 V
VIH Input High Voltage 2.0 VCC+1 V
1
IIL
Input or I/O Low Leakage Current 0V VIN VIL (MAX.) ——–100 µA
IIH Input or I/O High Leakage Current 3.5V VIN VCC ——10 µA
VOL Output Low Voltage IOL = MAX. Vin = VIL or VIH ——0.5 V
VOH Output High Voltage IOH = MAX. Vin = VIL or VIH 2.4 ——V
IOL Low Level Output Current ——16 mA
IOH High Level Output Current ——–3.2 mA
2
IOS
Output Short Circuit Current VCC = 5V VOUT = 0.5V TA= 25°C 50 —–150 mA
COMMERCIAL
ICC Operating Power VIL = 0.5V VIH = 3.0V L -10/-15/-20 75 90 mA
Supply Current f
1) The leakage current is due to the internal pull-up on all input and I/O pins. See Input Buffer section for more information.
2) One output at a time for a maximum duration of one second. Vout = 0.5V was selected to avoid test problems by tester
ground degradation. Characterized but not 100% tested.
3) Typical values are at V CC = 5V and TA = 25 °C
toggle = 15MHz Outputs Open
8
Page 9
AC Switching Characteristics
Specifications GAL20XV10
Over Recommended Operating Conditions
COM
PARAMETER UNITS
TEST
COND.
DESCRIPTION
1
-10
MIN. MAX.
COM
-15
MIN. MAX.
COM
-20
MIN. MAX.
tpd A Input or I/O to Combinatorial Output 3 10 3 15 3 20 ns tco A Clock to Output Delay 2 7 2 8 2 10 ns
tcf
2
Clock to Feedback Delay 4 4 4ns
tsu Setup Time, Input or Feedback before Clock 6 8 10 ns
th Hold Time, Input or Feedback after Clock 0 0 0 ns
fmax
A Maximum Clock Frequency with 76.9 62.5 50 MHz
3
A Maximum Clock Frequency with 100 83.3 71.4 MHz
A Maximum Clock Frequency with 100 83.3 71.4 MHz
External Feedback, 1/(tsu + tco)
Internal Feedback, 1/(tsu + tcf)
No Feedback
twh Clock Pulse Duration, High 4 6 7 ns
twl Clock Pulse Duration, Low 4 6 7 ns
ten
tdis
B Input or I/O to Output Enabled 3 10 3 15 3 20 ns B OE to Output Enabled 2 9 2 10 2 15 ns C Input or I/O to Output Disabled 3 9 3 15 3 20 ns C OE to Output Disabled 2 9 2 10 2 15 ns
1) Refer to Switching Test Conditions section.
2) Calculated from fmax with internal feedback. Refer to fmax Description section.
3) Refer to fmax Description section.
Capacitance (TA = 25°C, f = 1.0 MHz)
SYMBOL PARAMETER MAXIMUM* UNITS TEST CONDITIONS
I Input Capacitance 8 pF VCC = 5.0V, VI = 2.0V
C
CI/O I/O Capacitance 8 pF VCC = 5.0V, VI/O = 2.0V
*Characterized but not 100% tested
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Page 10
Switching Waveforms
Specifications GAL20XV10
INPUT or I/O FEEDBACK
COMBINATORIAL OUTPUT
VALID INPUT
t
pd
Combinatorial Output
INPUT or I/O FEEDBACK
t
dis
OUTPUT
Input or I/O Feedback to Enable/Disable
t
wl
CLK
t
wh
1/ fmax
(w/o fdbk)
Clock Width
INPUT or I/O FEEDBACK
CLK
REGISTERED OUTPUT
VALID INPUT
t
su
t
t
1/ fmax
(external fdbk)
h
co
Registered Output
OE
dis
t
en
OUTPUT
OEOE
OE to Output Enable/Disable
OEOE
CLK
REGISTERED FEEDBACK
t
1/fmax (internal fdbk)
cf
t
en
t
su
t
fmax with Feedback
Input/Output Equivalent Schematics
PIN
(Vref Typical = 3.2V)
ESD Protection Circuit
PIN
Active Pull-up Circuit
Vcc
Vref
ESD Protection Circuit
Typical Input T ypical Output
Vcc
Vcc
10
Data Output
Feedback
Tri-State Control
Active Pull-up Circuit
Vcc
Feedback (To Input Buffer)
Vref
PIN
(Vref Typical = 3.2V)
PIN
Page 11
fmax Descriptions
Specifications GAL20XV10
CLK
LOGIC ARRAY
t
su
REGISTER
t
co
fmax with External Feedback 1/(tsu+tco)
Note: fmax with external feedback is calculated from measured tsu and tco.
CLK
LOGIC ARRAY
t
su + th
REGISTER
fmax with No Feedback
Note: fmax with no feedback may be less than 1/(twh + twl). This
is to allow for a clock duty cycle of other than 50%.
CLK
LOGIC ARRAY
REGISTER
t
cf
t
pd
fmax with Internal Feedback 1/(tsu+tcf)
Note: tcf is a calculated value, derived by subtracting tsu from
the period of fmax w/internal feedback (tcf = 1/fmax - tsu). The value of tcf is used primarily when calculating the delay from clocking a register to a combinatorial output (through registered feedback), as shown above. For example, the timing from clock to a combinatorial output is equal to tcf + tpd.
Switching Test Conditions
Input Pulse Levels GND to 3.0V Input Rise and Fall Times 3ns 10% – 90% Input Timing Reference Levels 1.5V Output Timing Reference Levels 1.5V
Output Load See Figure
3-state levels are measured 0.5V from steady-state active level.
Output Load Conditions (see figure)
T est Condition R
A
Active High 390Ω 50pF
B
Active Low 300 390Ω 50pF Active High 390Ω 5pF
C
Active Low 300 390Ω 5pF
1 R2 CL
300 390 50pF
11
+5V
R
1
FROM OUTPUT (O/Q) UNDER TEST
R
2
INCLUDES TEST FIXTURE AND PROBE CAPACITANCE
*C
L
C *
L
TEST POINT
Page 12
Specifications GAL20XV10
Electronic Signature
An electronic signature word is provided in every GAL20XV10 device. It contains 40 bits of reprogrammable memory that con­tains user defined data. Some uses include user ID codes, revi­sion numbers, pattern identification or inventory control codes. The signature data is always available to the user independent of the state of the security cell.
NOTE: The electronic signature bits, if programmed to any value other then zero(0) will alter the checksum of the device.
Security Cell
A security cell is provided in every GAL20XV10 device as a deter­rent to unauthorized copying of the device pattern. Once pro­grammed, this cell prevents further read access of the device pattern information. This cell can be only be reset by reprogram­ming the device. The original pattern can never be examined once this cell is programmed. The Electronic Signature is always avail­able regardless of the security cell state.
Device Programming
GAL devices are programmed using a Lattice Semiconductor­approved Logic Programmer, available from a number of manu­facturers. Complete programming of the device takes less than a second. Erasing of the device is transparent to the user, and is done automatically as part of the programming cycle.
Latch-Up Protection
GAL20XV10 devices are designed with an on-board charge pump to negatively bias the substrate. The negative bias is of sufficient magnitude to prevent input undershoots from causing the circuitry to latch. Additionally , outputs are designed with n-channel pullups instead of the traditional p-channel pullups to eliminate any pos­sibility of SCR induced latching.
Input Buffers
GAL20XV10 devices are designed with TTL level compatible in­put buffers. These buffers have a characteristically high imped­ance, and present a much lighter load to the driving logic than bi­polar TTL devices.
GAL20XV10 input buffers have active pull-ups within their input structure. This pull-up will cause any un-terminated input or I/O to float to a TTL high (logical 1). Lattice Semiconductor recommends that all unused inputs and tri-stated I/O pins be connected to another active input, Vcc, or GND. Doing this will tend to improve noise immunity and reduce Icc for the device.
T ypical Input Pull-up Characteristic
0
-20
-40
Input Current (µA)
-60
1.0 2.0 3.0 4.0 5.0
0
Input Voltage (Volts)
Power-Up Reset
Circuitry within the GAL20XV10 provides a reset signal to all reg­isters during power-up. All internal registers will have their Q outputs set low after a specified time (
on the registered output pins (if they are enabled) will always be high on power-up, regardless of the programmed polarity of the output pins. This feature can greatly simplify state machine design by providing a known state on power-up. The timing diagram for power-up is shown below. Because of the asynchronous nature
tpr, 1µs MAX). As a result, the state
Vcc (min.)
Vcc
CLK
INTERNAL REGISTER
Q - OUTPUT
FEEDBACK/EXTERNAL
OUTPUT REGISTER
of system power-up, some conditions must be met to provide a valid power-up reset of the GAL20XV10. First, the V
CC rise must be
monotonic. Second, the clock input must be at static TTL level as shown in the diagram during power up. The registers will reset within a maximum of
tpr time. As in normal system operation, avoid
clocking the device until all input and feedback path setup times have been met. The clock must also meet the minimum pulse width requirements.
t
su
t
wl
t
pr
Internal Register Reset to Logic "0"
Device Pin Reset to Logic "1"
12
Page 13
Typical AC and DC Characteristic Diagrams
Specifications GAL20XV10
Normalized Tpd vs Vcc
1.2
1.1
1
0.9
Normalized Tpd
0.8
4.50 4.75 5.00 5.25 5.50
Supply Voltage (V)
Normalized Tpd vs Temp
1.3
1.2
1.1
1
0.9
Normalized Tpd
0.8
0.7
-55 -25 0 25 50 7 5 100 125
PT H->L PT L->H
Temperature (deg. C)
PT H->L PT L->H
Normalized Tco vs Vcc
1.2
1.1
1
0.9
Normalized Tco
0.8
4.50 4.75 5.00 5.25 5.50
Supply Voltage (V)
Normalized Tco vs Temp
1.3
1.2
1.1
1
0.9
Normalized Tco
0.8
0.7
-55 -25 0 25 50 75 100 125
RISE FALL
Temperature (deg. C)
RISE
FALL
Normalized Tsu vs Vcc
1.2
1.1
1
0.9
Normalized Tsu
0.8
4.50 4.75 5.00 5.25 5.50
PT H->L PT L->H
Supply Voltage (V)
Normalized Tsu vs Temp
1.4
1.3
1.2
1.1 1
0.9
Normalized Tsu
0.8
0.7
-55 -25 0 25 50 75 100 125
PT H->L PT L->H
Temperature (deg. C)
Delta Tpd vs # of Outputs
Switching
0
-0.5
-1
-1.5
Delta Tpd (ns)
-2 12345678910
Number of Outputs Switching
Delta Tpd vs Output Loading
12 10
8 6 4 2
Delta Tpd (ns)
0
-2 0 50 100 150 200 250 300
RISE FALL
Output Loading (pF)
RISE FALL
Delta Tco vs # of Outputs
Switching
0
-0.5
-1
-1.5
Delta Tco (ns)
-2 12345678910
Number of Outputs Switching
Delta Tco vs Output Loading
12 10
8 6 4 2
Delta Tco (ns)
0
-2 0 50 100 150 200 250 300
RISE FALL
Output Loading (pF)
RISE FALL
13
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Typical AC and DC Characteristic Diagrams
Specifications GAL20XV10
Vol vs Iol
3
2.5
2
1.5
Vol (V)
1
0.5
0
0.00 20.00 40.00 60.00 80.00 100.00
Iol (mA)
Normalized Icc vs Vcc
1.20
1.10
1.00
0.90
Normalized Icc
0.80
4.50 4.75 5.00 5.25 5.50
Supply Voltage (V)
Voh vs Ioh
5
4
3
2
Voh (V)
1
0
0.00 10.00 20.00 30.00 40.00 50.00 60.00
Ioh(mA)
Normalized Icc vs Temp
1.2
1.1
1
0.9
Normalized Icc
0.8
-55 -25 0 25 50 75 100 125
Temperature (deg. C)
Voh vs Ioh
4.5
4.25
4
Voh (V)
3.75
3.5
0.00 1.00 2.00 3.00 4.00
Ioh(mA)
Normalized Icc vs Freq.
1.70
1.60
1.50
1.40
1.30
1.20
1.10
1.00
0.90
Normalized Icc
0.80
0.70 0 255075100
Frequency (MHz)
Delta Icc vs Vin (1 input)
10
8
6
4
Delta Icc (mA)
2
0
0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00
Vin (V)
Input Clamp (Vik)
0
20
40
60
Iik (mA)
80
100
120
-2.00 -1.50 -1.00 -0.50 0.00
Vik (V)
14
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