Datasheet GAL18V10B-7LJ, GAL18V10B-20LP, GAL18V10B-20LJ, GAL18V10B-15LP, GAL18V10B-15LJ Datasheet (Lattice Semiconductor Corporation)

...
Page 1
GAL18V10
High Performance E2CMOS PLD
Generic Array Logic™
Features
HIGH PERFORMANCE E2CMOS® TECHNOLOGY — 7.5 ns Maximum Propagation DelayFmax = 11 1 MHz5.5 ns Maximum from Clock Input to Data OutputTTL Compatible 16 mA OutputsUltraMOS
®
Advanced CMOS Technology
LOW POWER CMOS75 mA T ypical Icc
ACTIVE PULL-UPS ON ALL PINS
2
CELL TECHNOLOGY
EReconfigurable LogicReprogrammable Cells100% Tested/100% YieldsHigh Speed Electrical Erasure (<100ms)20 Year Data Retention
TEN OUTPUT LOGIC MACROCELLSUses Standard 22V10 Macrocell ArchitectureMaximum Flexibility for Complex Logic Designs
PRELOAD AND POWER-ON RESET OF REGISTERS100% Functional Testability
APPLICATIONS INCLUDE:DMA ControlState Machine ControlHigh Speed Graphics ProcessingStandard Logic Speed Upgrade
ELECTRONIC SIGNA TURE FOR IDENTIFICATION
Description
The GAL18V10, at 7.5 ns maximum propagation delay time, com­bines a high performance CMOS process with Electrically Eras­able (E2) floating gate technology to provide a very flexible 20-pin PLD. CMOS circuitry allows the GAL18V10 to consume much less power when compared to its bipolar counterparts. The E2 technol­ogy offers high speed (<100ms) erase times, providing the ability to reprogram or reconfigure the device quickly and efficiently .
By building on the popular 22V10 architecture, the GAL18V10 eliminates the learning curve usually associated with using a new device architecture. The generic architecture provides maximum design flexibility by allowing the Output Logic Macrocell (OLMC) to be configured by the user. The GAL18V10 OLMC is fully com­patible with the OLMC in standard bipolar and CMOS 22V10 de­vices.
Unique test circuitry and reprogrammable cells allow complete AC, DC, and functional testing during manufacture. As a result, Lattice Semiconductor delivers 100% field programmability and function­ality of all GAL products. In addition, 100 erase/write cycles and data retention in excess of 20 years are specified.
Functional Block Diagram
I/CLK
I
I
I
I
AND-ARRAY
RESET
8
8
8
10
10
(96X36)
8
PROGRAMMABLE
I
I
I
8
8
PRESET

Pin Configuration

PLCC
2
T op View
11
Vcc
I/O/Q
20
18
I/O/Q
I/O/Q
I/O/Q
16
I/O/Q
I/O/Q
14
13
I
4
I
I
I
I
I
GAL18V10
6
8
9
GND I/O/Q I/O/QI/O/Q I/O/Q
8
8
I/CLK
I/O/Q
GND
OLMC
OLMC
OLMC
OLMC
OLMC
OLMC
OLMC
OLMC
OLMC
OLMC
I
I
I
I
I
I
I
DIP
1
GAL
18V10
5
10
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
20
15
11
Vcc
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
Copyright © 1997 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A. July 1997 Tel. (503) 681-0118; 1-888-ISP-PLDS; FAX (503) 681-3037; http://www.latticesemi.com
18v10_03
1
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GAL18V10 Ordering Information
Commercial Grade Specifications
)sn(dpT)sn(usT)sn(ocT)Am(ccI#gniredrOegakcaP
5.765.5511 511
0177 511
511
51801511
511 511PL51-01V81LAGPIDcitsalPniP-02 511JL51-01V81LAGCCLPdaeL-02
022121511
511 511PL02-01V81LAGPIDcitsalPniP-02 511JL02-01V81LAGCCLPdaeL-02
01V81LAG B-7 PL 01V81LAG B-7 JL 01V81LAGB1-0PL 01V81LAGB1-0JL 01V81LAGBPL51­01V81LAGBJL51-
01V81LAGBPL02­01V81LAGBJL02-
Specifications GAL18V10
PIDcitsalPniP-02
CCLPdaeL-02
PIDcitsalPniP-02
CCLPdaeL-02
PIDcitsalPniP-02
CCLPdaeL-02
PIDcitsalPniP-02
CCLPdaeL-02
Part Number Description
GAL18V10B
GAL18V10
Device Name
Speed (ns)
PowerL = Low Power
XXXXXXXX XX X X X
_
Grade
Package
Blank = Commercial
P = Plastic DIP J = PLCC
2
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Output Logic Macrocell (OLMC)
Specifications GAL18V10
The GAL18V10 has a variable number of product terms per OLMC. Of the ten available OLMCs, two OLMCs have access to ten prod­uct terms (pins 14 and 15), and the other eight OLMCs have eight product terms each. In addition to the product terms available for logic, each OLMC has an additional product-term dedicated to out­put enable control.
The output polarity of each OLMC can be individually programmed to be true or inverting, in either combinatorial or registered mode. This allows each output to be individually configured as either active high or active low.
AR
D
The GAL18V10 has a product term for Asynchronous Reset (AR) and a product term for Synchronous Preset (SP). These two prod­uct terms are common to all registered OLMCs. The Asynchronous Reset sets all registered outputs to zero any time this dedicated product term is asserted. The Synchronous Preset sets all registers to a logic one on the rising edge of the next clock pulse after this product term is asserted.
NOTE: The AR and SP product terms will force the Q output of the flip-flop into the same state regardless of the polarity of the output. Therefore, a reset operation, which sets the register output to a zero, may result in either a high or low at the output pin, depending on the pin polarity chosen.
Q QCLK
4 TO 1
MUX
SP
2 TO 1
MUX
GAL18V10 OUTPUT LOGIC MACROCELL (OLMC)
Output Logic Macrocell Configurations
Each of the Macrocells of the GAL18V10 has two primary functional modes: registered, and combinatorial I/O. The modes and the output polarity are set by two bits (SO and S1), which are normally controlled by the logic compiler. Each of these two primary modes, and the bit settings required to enable them, are described below and on the the following page.
REGISTERED
In registered mode the output pin associated with an individual OLMC is driven by the Q output of that OLMC’s D-type flip-flop. Logic polarity of the output signal at the pin may be selected by specifying that the output buffer drive either true (active high) or inverted (active low). Output tri-state control is available as an in­dividual product term for each OLMC, and can therefore be defined by a logic equation. The D flip-flop’s /Q output is fed back into the AND array, with both the true and complement of the feedback available as inputs to the AND array.
NOTE: In registered mode, the feedback is from the /Q output of the register, and not from the pin; therefore, a pin defined as reg­istered is an output only , and cannot be used for dynamic I/O, as can the combinatorial pins.
COMBINAT ORIAL I/O
In combinatorial mode the pin associated with an individual OLMC is driven by the output of the sum term gate. Logic polarity of the output signal at the pin may be selected by specifying that the output buffer drive either true (active high) or inverted (active low). Out­put tri-state control is available as an individual product-term for each output, and may be individually set by the compiler as either “on” (dedicated output), “off” (dedicated input), or “product-term driven” (dynamic I/O). Feedback into the AND array is from the pin side of the output enable buffer . Both polarities (true and inverted) of the pin are fed back into the AND array.
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Registered Mode
Specifications GAL18V10
CLK
S0 = 0 S1 = 0
Combinatorial Mode
AR
D
SP
Q
Q
S0 = 1 S1 = 0
CLK
AR
D
ACTIVE HIGHACTIVE LOW
Q
Q
SP
S0 = 0 S1 = 1
ACTIVE HIGHACTIVE LOW
S0 = 1 S1 = 1
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GAL18V10 Logic Diagram/JEDEC Fuse Map
DIP and PLCC Package Pinouts
1
0000
0036
0324
0360
0648
2
0684
0972
3
1008
1296
4
1332
1692
5
1728
2088
6
2124
2412
7
2448
2736
8
2772
3060
3096
3384
3420
0 4 8 12 16 20 24 28 32
. . .
. . .
. . .
. . .
. . . .
. . . .
. . .
. . .
. . .
. . .
L S B
Electronic Signature
3476, 3477 ...
Byte 7 Byte 6 Byte 5 Byte 4 Byte 3 Byte 2 Byte 1 Byte 0
M S B
... 3538, 3539
Specifications GAL18V10
ASYNCHRONOUS RESET (TO ALL REGISTERS)
8
8
8
8
10
10
8
8
8
8
OLMC
S0
3456
S1
3457
OLMC
S0
3458
S1
3459
OLMC
SO
3460
S1
3461
OLMC
S0
3462
S1
3463
OLMC
S0
3464
S1
3465
OLMC
S0
3466
S1
3467
OLMC
S0
3468
S1
3469
OLMC
S0
3470
S1
3471
OLMC
S0
3472
S1
3473
OLMC
S0
3474
S1
3475
SYNCHRONOUS PRESET (TO ALL REGISTERS)
19
18
17
16
15
14
13
12
11
9
5
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Specifications GAL18V10B
Absolute Maximum Ratings
Supply voltage VCC....................................... -0.5 to +7V
Input voltage applied ...........................-2.5 to VCC +1.0V
Off-state output voltage applied ..........-2.5 to VCC +1.0V
Storage Temperature .................................-65 to 150°C
(1)
Recommended Operating Conditions
Commercial Devices:
Ambient T emperature (TA) .............................0 to +75°C
Supply voltage (VCC)
with Respect to Ground ..................... +4.75 to +5.25V
Ambient T emperature with
Power Applied.........................................-55 to 125°C
1.Stresses above those listed under the Absolute Maximum Ratings may cause permanent damage to the device. These are stress only ratings and functional operation of the device at these or at any other conditions above those indicated in the operational sections of this specification is not implied (while programming, follow the programming specifications).

DC Electrical Characteristics

Over Recommended Operating Conditions (Unless Otherwise Specified)
SYMBOL PARAMETER CONDITION MIN. TYP.
3
MAX. UNITS
VIL Input Low Voltage Vss – 0.5 0.8 V
VIH Input High Voltage 2.0 Vcc+1 V
1
IIL
Input or I/O Low Leakage Current 0V VIN VIL (MAX.) ——–100 µA
IIH Input or I/O High Leakage Current 3.5V VIN VCC ——10 µA
VOL Output Low Voltage IOL = MAX. Vin = VIL or VIH ——0.5 V
VOH Output High Voltage IOH = MAX. Vin = VIL or VIH 2.4 —— V
IOL Low Level Output Current ——16 mA IOH High Level Output Current ——–3.2 mA
2
IOS
Output Short Circuit Current VCC = 5V VOUT = 0.5V TA = 25°C 30 —–130 mA
COMMERCIAL
ICC Operating Power VIL = 0.5V VIH = 3.0V L -7/-10/-15/-20 75 1 15 mA
Supply Current f
1) The leakage current is due to the internal pull-up on all pins. See Input Buffer section for more information.
2) One output at a time for a maximum duration of one second. Vout = 0.5V was selected to avoid test problems caused by tester
ground degradation. Characterized but not 100% tested.
3) Typical values are at Vcc = 5V and TA = 25 °C
toggle = 15MHz Outputs Open
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AC Switching Characteristics
Specifications GAL18V10B
Over Recommended Operating Conditions
COM COM COM
-10
MIN. MAX.
-15
MIN. MAX.
-20
MIN. MAX.
PARAM.
TEST
COND.
DESCRIPTION
1
COM
-7
MIN. MAX.
tpd A Input or I/O to Comb. Output 7.5 10 15 20 ns tco A Clock to Output Delay 5.5 7 10 12 ns
2
tcf
Clock to Feedback Delay 3.5 3.5 7 10 ns
tsu Setup Time, Input or Fdbk before Clk 5.5 6 8 12 ns
th Hold Time, Input or Fdbk after Clk 0 0 0 0 ns
A Maximum Clock Frequency with 90.9 76.9 55.5 41.6 MHz
External Feedback, 1/(tsu + tco)
3
fmax
A Maximum Clock Frequency with 1 11 105 66.7 45.4 MHz
Internal Feedback, 1/(tsu + tcf)
A Maximum Clock Frequency with 1 11 105 66.7 62.5 MHz
No Feedback
twh Clock Pulse Duration, High 4 4 6 8 ns
twl Clock Pulse Duration, Low 4 4 6 8 ns
ten B Input or I/O to Output Enabled 8 10 15 20 ns
tdis C Input or I/O to Output Disabled 8 9 15 20 ns
UNITS
tar A Input or I/O to Asynch. Reset of Reg. 13 13 20 20 ns
tarw Asynch. Reset Pulse Duration 8 8 10 15 ns
tarr Asynch. Reset to Clk Recovery Time 8 8 10 15 ns tspr Synch. Preset to Clk Recovery T ime 10 10 10 12 ns
1) Refer to Switching T est Conditions section.
2) Calculated from fmax with internal feedback. Refer to fmax Description section.
3) Refer to fmax Description section.
Capacitance (TA = 25°C, f = 1.0 MHz)
SYMBOL PARAMETER MAXIMUM* UNITS TEST CONDITIONS
C
I
C
I/O
*Characterized but not 100% tested.
Input Capacitance 8 pF VCC = 5.0V , VI = 2.0V
I/O Capacitance 8 pF VCC = 5.0V , V
= 2.0V
I/O
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Page 8
Specifications GAL18V10
Absolute Maximum Ratings
(1)
Supply voltage VCC....................................... -0.5 to +7V
Input voltage applied ...........................-2.5 to VCC +1.0V
Off-state output voltage applied ..........-2.5 to VCC +1.0V
Storage Temperature .................................-65 to 150°C
Recommended Operating Conditions
Commercial Devices:
Ambient T emperature (TA) .............................0 to +75°C
Supply voltage (VCC)
with Respect to Ground ..................... +4.75 to +5.25V
Ambient T emperature with
Power Applied.........................................-55 to 125°C
1.Stresses above those listed under the Absolute Maximum Ratings may cause permanent damage to the device. These are stress only ratings and functional operation of the device at these or at any other conditions above those indicated in the operational sections of this specification is not implied (while programming, follow the programming specifications).

DC Electrical Characteristics

Over Recommended Operating Conditions (Unless Otherwise Specified)
3
SYMBOL PARAMETER CONDITION MIN. TYP.
MAX. UNITS
VIL Input Low Voltage Vss – 0.5 0.8 V VIH Input High Voltage 2.0 Vcc+1 V
1
IIL
Input or I/O Low Leakage Current 0V VIN VIL (MAX.) ——–100 µA
IIH Input or I/O High Leakage Current 3.5V VIN VCC ——10 µA
VOL Output Low Voltage IOL = MAX. Vin = VIL or VIH ——0.5 V
VOH Output High Voltage IOH = MAX. Vin = VIL or VIH 2.4 ——V
IOL Low Level Output Current ——16 mA IOH High Level Output Current ——–3.2 mA
2
IOS
Output Short Circuit Current VCC = 5V VOUT = 0.5V TA = 25°C 50 —–135 mA
COMMERCIAL
ICC Operating Power VIL = 0.5V VIH = 3.0V L -15/-20 75 115 mA
Supply Current f
1) The leakage current is due to the internal pull-up on all pins. See Input Buffer section for more information.
2) One output at a time for a maximum duration of one second. Vout = 0.5V was selected to avoid test problems caused by tester
ground degradation. Characterized but not 100% tested.
3) T ypical values are at Vcc = 5V and TA = 25 °C
toggle = 15MHz Outputs Open
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AC Switching Characteristics
Specifications GAL18V10
Over Recommended Operating Conditions
COM
PARAMETER UNITS
TEST
COND.
DESCRIPTION
1
-15
MIN. MAX.
COM
-20
MIN. MAX.
tpd A Input or I/O to Combinatorial Output 15 20 ns tco A Clock to Output Delay 10 12 ns
2
tcf
Clock to Feedback Delay 7 10 ns
tsu Setup T ime, Input or Feedback before Clock 10 12 ns
th Hold Time, Input or Feedback after Clock 0 0 ns
A Maximum Clock Frequency with 50 41.6 MHz
External Feedback, 1/(tsu +tco)
3
fmax
A Maximum Clock Frequency with 58.8 45.4 MHz
Internal Feedback, 1/(tsu + tcf)
A Maximum Clock Frequency with 62.5 62.5 MHz
No Feedback
twh Clock Pulse Duration, High 8 8 ns
twl Clock Pulse Duration, Low 8 8 ns ten B Input or I/O to Output Enabled 15 20 ns
tdis C Input or I/O to Output Disabled 15 20 ns
tar A Input or I/O to Asynchronous Reset of Register 20 20 ns
tarw Asynchronous Reset Pulse Duration 10 15 ns
tarr Asynchronous Reset to Clock Recovery T ime 15 15 ns tspr Synchronous Preset to Clock Recovery Time 10 12 ns
1) Refer to Switching Test Conditions section.
2) Calculated from fmax with internal feedback. Refer to fmax Description section.
3) Refer to fmax Description section.
Capacitance (TA = 25°C, f = 1.0 MHz)
SYMBOL PARAMETER MAXIMUM* UNITS TEST CONDITIONS
C
I
C
I/O
*Characterized but not 100% tested.
Input Capacitance 8 pF VCC = 5.0V , VI = 2.0V
I/O Capacitance 10 pF VCC = 5.0V , V
I/O
= 2.0V
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(
)
Switching Waveforms
Specifications GAL18V10
INPUT or I/O FEEDBACK
COMBINA TORIAL OUTPUT
INPUT or I/O FEEDBACK
OUTPUT
Input or I/O to Output Enable/Disable
VALID INPUT
Combinatorial Output
dis
t
t
pd
INPUT or I/O FEEDBACK
CLK
REGISTERED OUTPUT
VALID INPUT
t
su
(exter nal fdbk)
1/ fmax
t
t
co
h
Registered Output
en
t
CLK
1/ fmax (internal fdbk)
cf
t
REGISTERED FEEDBACK
t
su
CLK
INPUT or I/O FEEDBACK DRIVING SP
CLK
REGISTERED OUTPUT
fmax with Feedback
t
wh
Clock Width
t
su
Synchronous Preset Asynchronous Reset
f
max
1/
w/o fdbk
t
wl
INPUT or I/O FEEDBACK DRIVING AR
t
h
t
spr
CLK
t
co
REGISTERED OUTPUT
t
arw
t
ar
t
arr
10
Page 11
TEST POINT
C *
L
FROM OUTPUT (O/Q) UNDER TEST
+5V
*C
L
INCLUDES TEST FIXTURE AND PROBE CAPACITANCE
R
2
R
1
fmax Descriptions
Specifications GAL18V10
CLK
CLK
LOGIC ARRAY
t
su
REGISTER
t
co
fmax with External Feedback 1/(tsu+tco)
Note: fmax with external feedback is cal-
culated from measured tsu and tco.
CLK
LOGIC ARRAY
t
su + th
REGISTER
fmax with No Feedback
Note: fmax with no feedback may be less
than 1/(twh + twl). This is to allow for a clock duty cycle of other than 50%.
LOGIC ARRAY
REGISTER
t
cf
t
pd
fmax with Internal Feedback 1/(tsu+tcf)
Note: tcf is a calculated value, derived by sub-
tracting tsu from the period of fmax w/internal feedback (tcf = 1/fmax - tsu). The value of tcf is used primarily when calculating the delay from clocking a register to a combinatorial output (through registered feedback), as shown above. For example, the timing from clock to a combi­natorial output is equal to tcf + tpd.
Switching Test Conditions
Input Pulse Levels GND to 3.0V Input Rise and -7/-10 2ns 10% – 90% Fall Times -15/-20 3ns 10% – 90% Input Timing Reference Levels 1.5V Output Timing Reference Levels 1.5V Output Load See Figure
3-state levels are measured 0.5V from steady-state active level.
Output Load Conditions (see figure)
Test Condition R
A 300 390 50pF B Active High 390Ω 50pF
C Active High 390Ω 5pF
1 R2 CL
Active Low 300 390Ω 50pF
Active Low 300 390Ω 5pF
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Specifications GAL18V10
Electronic Signature
An electronic signature is provided in every GAL18V10 device. It contains 64 bits of reprogrammable memory that can contain user­defined data. Some uses include user ID codes, revision numbers, or inventory control. The signature data is always available to the user independent of the state of the security cell.
Security Cell
A security cell is provided in every GAL18V10 device to prevent unauthorized copying of the array patterns. Once programmed, this cell prevents further read access to the functional bits in the device. This cell can only be erased by re-programming the de­vice, so the original configuration can never be examined once this cell is programmed. The Electronic Signature is always available to the user, regardless of the state of this control cell.
Latch-Up Protection
GAL18V10 devices are designed with an on-board charge pump to negatively bias the substrate. The negative bias is of sufficient magnitude to prevent input undershoots from causing the circuitry to latch. Additionally , outputs are designed with n-channel pullups instead of the traditional p-channel pullups to eliminate any pos­sibility of SCR induced latching.
Device Programming
GAL devices are programmed using a Lattice Semiconductor­approved Logic Programmer, available from a number of manu­facturers (see the the GAL Development Tools section). Complete programming of the device takes only a few seconds. Erasing of the device is transparent to the user, and is done automatically as part of the programming cycle.
Output Register Preload
When testing state machine designs, all possible states and state transitions must be verified in the design, not just those required in the normal machine operations. This is because certain events may occur during system operation that throw the logic into an illegal state (power-up, line voltage glitches, brown-outs, etc.). To test a design for proper treatment of these conditions, a way must be provided to break the feedback paths, and force any desired (i.e., illegal) state into the registers. Then the machine can be sequenced and the outputs tested for correct next state conditions.
The GAL18V10 device includes circuitry that allows each registered output to be synchronously set either high or low. Thus, any present state condition can be forced for test sequencing. If necessary, approved GAL programmers capable of executing test vectors perform output register preload automatically.
Input Buffers
GAL18V10 devices are designed with TTL level compatible input buffers. These buffers have a characteristically high impedance, and present a much lighter load to the driving logic than bipolar TTL devices.
The input and I/O pins also have built-in active pull-ups. As a result, floating inputs will float to a TTL high (logic 1). However, Lattice Semiconductor recommends that all unused inputs and tri-stated I/O pins be connected to an adjacent active input, Vcc, or ground. Doing so will tend to improve noise immunity and reduce Icc for the device.
T ypical Input Current
0
12
-20
-40
Input Current (uA)
-60 0
1.0 2.0 3.0 4.0 5.0
Input Voltage (Volts)
Page 13
Power-Up Reset
Specifications GAL18V10
Vcc
CLK
INTERNAL REGISTER
Q - OUTPUT
ACTIVE LOW
OUTPUT REGISTER
ACTIVE HIGH
OUTPUT REGISTER
Vcc (min.)
Circuitry within the GAL18V10 provides a reset signal to all reg­isters during power-up. All internal registers will have their Q outputs set low after a specified time (tpr, 1µs MAX). As a result, the state on the registered output pins (if they are enabled) will be either high or low on power-up, depending on the programmed polarity of the output pins. This feature can greatly simplify state machine design by providing a known state on power-up. Be­cause of the asynchronous nature of system power-up, some
t
su
t
wl
pr
t
Internal Register Reset to Logic "0"
Device Pin Reset to Logic "1"
Device Pin Reset to Logic "0"
conditions must be met to provide a valid power-up reset of the device. First, the V
CC rise must be monotonic. Second, the clock
input must be at static TTL level as shown in the diagram during power up. The registers will reset within a maximum of tpr time. As in normal system operation, avoid clocking the device until all input and feedback path setup times have been met. The clock must also meet the minimum pulse width requirements.
Input/Output Equivalent Schematics
PIN
(Vref Typical = 3.2V)
ESD Protection Circuit
PIN
ESD Protection Circuit
Active Pull-up Circuit
Vcc
Vref
T ypical Input T ypical Output
Vcc
Vcc
Data Output
Feedback
Tri-State Control
Active Pull-up Circuit
Vcc
Feedback (To Input Buffer)
PIN
(Vref Typical = 3.2V)
Vref
PIN
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Specifications GAL18V10
GAL18V10B: Typical AC and DC Characteristic Diagrams
Normalized Tpd vs Vcc
1.2
1.1
1
0.9
Normalized Tpd
0.8
4.50 4.75 5.00 5.25 5.50
PT H->L PT L->H
Supply Voltage (V)
Normalized Tpd vs Temp
1.3
1.2
1.1
1
0.9
Normalized Tpd
0.8
0.7
PT H->L PT L->H
-55 -25 0 25 5 0 7 5 100 125
Temperature (deg. C)
Normalized Tco vs Vcc
1.2
1.1
1
0.9
Normalized Tco
0.8
4.50 4.75 5.00 5.25 5.50
RISE FALL
Supply Voltage (V)
Normalized Tco vs Temp
1.3
1.2
1.1
1
0.9
Normalized Tco
0.8
0.7
-55 -25 0 25 50 75 100 125
RISE FALL
Temperature (deg. C)
Normalized Tsu vs Vcc
1.2
1.1
1
0.9
Normalized Tsu
0.8
4.50 4.75 5.00 5.25 5.50
PT H->L PT L->H
Supply Voltage (V)
Normalized Tsu vs Temp
1.4
1.3
1.2
1.1
1
0.9
Normalized Tsu
0.8
0.7
-55 -25 0 25 50 75 100 125
PT H->L PT L->H
Temperature (deg. C)
Delta Tpd vs # of Outputs
Switching
0
-0.5
-1
-1.5
Delta Tpd (ns)
-2 12345678910
Number of Outputs Switching
Delta Tpd vs Output Loading
10
8
6
4
2
0
Delta Tpd (ns)
-2
-4 0 50 100 150 200 250 300
RISE FALL
Output Loading (pF)
RISE FALL
Delta Tco vs # of Outputs
Switching
0
-0.5
-1
-1.5
Delta Tco (ns)
-2 12345678910
Number of Outputs Switching
Delta Tco vs Output Loading
10
8
6
4
2
0
Delta Tco (ns)
-2
-4 0 50 100 150 200 250 300
RISE FALL
Output Loading (pF)
RISE FALL
14
Page 15
Specifications GAL18V10
GAL18V10B: Typical AC and DC Characteristic Diagrams
Vol vs Iol
1
0.75
0.5
Vol (V)
0.25
0
0 10203040
Iol (mA)
Normalized Icc vs Vcc
1.2
1.1
1
0.9
Normalized Icc
0.8
4.50 4.75 5.00 5.25 5.50
Supply Voltage (V)
Voh vs Ioh
5
4
3
2
Voh (V)
1
0
0 102030405060
Ioh(mA)
Normalized Icc vs Temp
1.2
1.1
1
0.9
Normalized Icc
0.8
-55 -25 0 25 50 75 100 125
Temperature (deg. C)
Voh vs Ioh
5.25 5
4.75
4.5
4.25 4
Voh (V)
3.75
3.5
3.25 3
01234
Ioh(mA)
Normalized Icc vs Freq.
1.4
1.3
1.2
1.1
1
Normalized Icc
0.9
0.8 0 25 50 75 100
Frequency (MHz)
Delta Icc vs Vin (1 input)
8 7 6 5 4 3
Delta Icc (mA)
2 1 0
0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00
Vin (V)
Input Clamp (Vik)
0
-20
-40
-60
Iik (mA)
-80
-100
-120
-2.00 -1.50 -1.00 -0.50 0.00
Vik (V)
15
Page 16
Specifications GAL18V10
GAL18V10B: Typical AC and DC Characteristic Diagrams
1.3
1.2
1.1
1
0.9
Normalized Tpd
0.8
0.7
Normalized Tpd vs. Vcc
PT H -> L PT L -> H
4.5 4.75 5 5.25 5.5
Supply Voltage (V)
1.3
1.2
1.1
0.9
Normalized Tpd
0.8
0.7
0
Normalized Tpd vs. Temperature
1
-50
0 25 50 75 100 125
-25
Ambient Temperature (°C)
Delta Tpd vs. # of Outputs Switching
1.3
Normalized Tsu vs. Vcc
1.2
1.1
1
0.9
Normalized Tsu
0.8
PT L -> H
PT H -> L
0.7
4.5 4.75 5 5.25 5.5
Supply Voltage (V)
1.3
1.2
1.1
1
0.9
Normalized Tsu
0.8
0.7
10
Normalized Tsu vs. Temperature
-55 -25 0 25 50 75 100 125
Ambient Temperature (°C)
Delta Tpd vs. Output Loading
1.3
1.2
1.1
1
0.9
Normalized Tco
0.8
0.7
4.5 4.75 5 5.25 5.5
1.3
1.2
1.1
1
0.9
Normalized Tco
0.8
0.7
-55 -25 0 25 50 75 100 125
Normalized Tco vs. Vcc
Supply Voltage (V)
Normalized Tco vs. Temperature
Ambient Temperature (°C)
1.3
Normalized Icc vs. Vcc
-1
-2
Delta Tpd (ns)
-3 0
Max. - 8
# of Outputs
250
200
150
IOL vs. V
(mA)
OL
100
I
50
0
012
VOL (V)
Max. - 4
OL
8
6
4
2
Delta Tpd (ns)
0
-2
Max.
0 100 200 300 400
Output Loading Capacitance (pf)
IOH vs. V
-150
-100
OH
(mA)
OH
I
-50
3
0
4
0123
4
VOH (V)
1.2
1.1
1
0.9
Normalized Icc
0.8
0.7
4.5 4.75 5 5.25 5.5
1.3
1.2
1.1
1
0.9
Normalized Icc
0.8
0.7
-55 -25 0 25 50 75 100 125
Supply Voltage (V)
Normalized Icc vs. Temperature
Icc vs. Temperature Isb vs. Temperature
Ambient Temperature (°C)
16
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