• HIGH PERFORMANCE E2CMOS® TECHNOLOGY
— 7.5 ns Maximum Propagation Delay
— Fmax = 11 1 MHz
— 5.5 ns Maximum from Clock Input to Data Output
— TTL Compatible 16 mA Outputs
— UltraMOS
®
Advanced CMOS Technology
• LOW POWER CMOS
— 75 mA T ypical Icc
• ACTIVE PULL-UPS ON ALL PINS
2
CELL TECHNOLOGY
• E
— Reconfigurable Logic
— Reprogrammable Cells
— 100% Tested/100% Yields
— High Speed Electrical Erasure (<100ms)
— 20 Year Data Retention
• TEN OUTPUT LOGIC MACROCELLS
— Uses Standard 22V10 Macrocell Architecture
— Maximum Flexibility for Complex Logic Designs
• PRELOAD AND POWER-ON RESET OF REGISTERS
— 100% Functional Testability
• APPLICATIONS INCLUDE:
— DMA Control
— State Machine Control
— High Speed Graphics Processing
— Standard Logic Speed Upgrade
• ELECTRONIC SIGNA TURE FOR IDENTIFICATION
Description
The GAL18V10, at 7.5 ns maximum propagation delay time, combines a high performance CMOS process with Electrically Erasable (E2) floating gate technology to provide a very flexible 20-pin
PLD. CMOS circuitry allows the GAL18V10 to consume much less
power when compared to its bipolar counterparts. The E2 technology offers high speed (<100ms) erase times, providing the ability
to reprogram or reconfigure the device quickly and efficiently .
By building on the popular 22V10 architecture, the GAL18V10
eliminates the learning curve usually associated with using a new
device architecture. The generic architecture provides maximum
design flexibility by allowing the Output Logic Macrocell (OLMC)
to be configured by the user. The GAL18V10 OLMC is fully compatible with the OLMC in standard bipolar and CMOS 22V10 devices.
Unique test circuitry and reprogrammable cells allow complete AC,
DC, and functional testing during manufacture. As a result, Lattice
Semiconductor delivers 100% field programmability and functionality of all GAL products. In addition, 100 erase/write cycles and
data retention in excess of 20 years are specified.
The GAL18V10 has a variable number of product terms per OLMC.
Of the ten available OLMCs, two OLMCs have access to ten product terms (pins 14 and 15), and the other eight OLMCs have eight
product terms each. In addition to the product terms available for
logic, each OLMC has an additional product-term dedicated to output enable control.
The output polarity of each OLMC can be individually programmed
to be true or inverting, in either combinatorial or registered mode.
This allows each output to be individually configured as either active
high or active low.
AR
D
The GAL18V10 has a product term for Asynchronous Reset (AR)
and a product term for Synchronous Preset (SP). These two product terms are common to all registered OLMCs. The Asynchronous
Reset sets all registered outputs to zero any time this dedicated
product term is asserted. The Synchronous Preset sets all registers
to a logic one on the rising edge of the next clock pulse after this
product term is asserted.
NOTE: The AR and SP product terms will force the Q output of the
flip-flop into the same state regardless of the polarity of the output.
Therefore, a reset operation, which sets the register output to a zero,
may result in either a high or low at the output pin, depending on
the pin polarity chosen.
Q
QCLK
4 TO 1
MUX
SP
2 TO 1
MUX
GAL18V10 OUTPUT LOGIC MACROCELL (OLMC)
Output Logic Macrocell Configurations
Each of the Macrocells of the GAL18V10 has two primary functional
modes: registered, and combinatorial I/O. The modes and the
output polarity are set by two bits (SO and S1), which are normally
controlled by the logic compiler. Each of these two primary modes,
and the bit settings required to enable them, are described below
and on the the following page.
REGISTERED
In registered mode the output pin associated with an individual
OLMC is driven by the Q output of that OLMC’s D-type flip-flop.
Logic polarity of the output signal at the pin may be selected by
specifying that the output buffer drive either true (active high) or
inverted (active low). Output tri-state control is available as an individual product term for each OLMC, and can therefore be defined
by a logic equation. The D flip-flop’s /Q output is fed back into the
AND array, with both the true and complement of the feedback
available as inputs to the AND array.
NOTE: In registered mode, the feedback is from the /Q output of
the register, and not from the pin; therefore, a pin defined as registered is an output only , and cannot be used for dynamic
I/O, as can the combinatorial pins.
COMBINAT ORIAL I/O
In combinatorial mode the pin associated with an individual OLMC
is driven by the output of the sum term gate. Logic polarity of the
output signal at the pin may be selected by specifying that the output
buffer drive either true (active high) or inverted (active low). Output tri-state control is available as an individual product-term for
each output, and may be individually set by the compiler as either
“on” (dedicated output), “off” (dedicated input), or “product-term
driven” (dynamic I/O). Feedback into the AND array is from the pin
side of the output enable buffer . Both polarities (true and inverted)
of the pin are fed back into the AND array.
Supply voltage VCC....................................... -0.5 to +7V
Input voltage applied ...........................-2.5 to VCC +1.0V
Off-state output voltage applied ..........-2.5 to VCC +1.0V
Storage Temperature .................................-65 to 150°C
(1)
Recommended Operating Conditions
Commercial Devices:
Ambient T emperature (TA) .............................0 to +75°C
Supply voltage (VCC)
with Respect to Ground ..................... +4.75 to +5.25V
Ambient T emperature with
Power Applied.........................................-55 to 125°C
1.Stresses above those listed under the “Absolute Maximum
Ratings” may cause permanent damage to the device. These
are stress only ratings and functional operation of the device
at these or at any other conditions above those indicated in
the operational sections of this specification is not implied
(while programming, follow the programming specifications).
DC Electrical Characteristics
Over Recommended Operating Conditions (Unless Otherwise Specified)
SYMBOLPARAMETERCONDITIONMIN.TYP.
3
MAX.UNITS
VILInput Low Voltage Vss – 0.5—0.8V
VIHInput High Voltage2.0—Vcc+1V
1
IIL
Input or I/O Low Leakage Current0V ≤ VIN≤ VIL (MAX.)——–100µA
IIHInput or I/O High Leakage Current3.5V ≤ VIN≤ VCC——10µA
VOLOutput Low VoltageIOL = MAX. Vin = VIL or VIH——0.5V
VOHOutput High VoltageIOH = MAX. Vin = VIL or VIH2.4—— V
1) The leakage current is due to the internal pull-up on all pins. See Input Buffer section for more information.
2) One output at a time for a maximum duration of one second. Vout = 0.5V was selected to avoid test problems caused by tester
ground degradation. Characterized but not 100% tested.
3) Typical values are at Vcc = 5V and TA = 25 °C
toggle = 15MHz Outputs Open
6
Page 7
AC Switching Characteristics
Specifications GAL18V10B
Over Recommended Operating Conditions
COMCOMCOM
-10
MIN. MAX.
-15
MIN. MAX.
-20
MIN. MAX.
PARAM.
TEST
COND.
DESCRIPTION
1
COM
-7
MIN. MAX.
tpdAInput or I/O to Comb. Output—7.5—10—15—20ns
tcoAClock to Output Delay—5.5—7—10—12ns
2
tcf
—Clock to Feedback Delay—3.5—3.5—7—10ns
tsu—Setup Time, Input or Fdbk before Clk↑5.5—6—8—12—ns
th—Hold Time, Input or Fdbk after Clk ↑0—0—0—0—ns
AMaximum Clock Frequency with90.9—76.9—55.5—41.6—MHz
External Feedback, 1/(tsu + tco)
3
fmax
AMaximum Clock Frequency with1 11—105—66.7—45.4—MHz
Internal Feedback, 1/(tsu + tcf)
AMaximum Clock Frequency with1 11—105—66.7—62.5—MHz
No Feedback
twh—Clock Pulse Duration, High4—4—6—8—ns
twl—Clock Pulse Duration, Low4—4—6—8—ns
tenBInput or I/O to Output Enabled—8—10—15—20ns
tdisCInput or I/O to Output Disabled—8—9—15—20ns
UNITS
tarAInput or I/O to Asynch. Reset of Reg.—13—13—20—20ns
tarw—Asynch. Reset Pulse Duration8—8—10—15—ns
tarr—Asynch. Reset to Clk↑ Recovery Time8—8—10—15—ns
tspr—Synch. Preset to Clk↑ Recovery T ime10—10—10—12—ns
1) Refer to Switching T est Conditions section.
2) Calculated from fmax with internal feedback. Refer to fmax Description section.
3) Refer to fmax Description section.
Capacitance (TA = 25°C, f = 1.0 MHz)
SYMBOLPARAMETERMAXIMUM*UNITSTEST CONDITIONS
C
I
C
I/O
*Characterized but not 100% tested.
Input Capacitance8pFVCC = 5.0V , VI = 2.0V
I/O Capacitance8pFVCC = 5.0V , V
= 2.0V
I/O
7
Page 8
Specifications GAL18V10
Absolute Maximum Ratings
(1)
Supply voltage VCC....................................... -0.5 to +7V
Input voltage applied ...........................-2.5 to VCC +1.0V
Off-state output voltage applied ..........-2.5 to VCC +1.0V
Storage Temperature .................................-65 to 150°C
Recommended Operating Conditions
Commercial Devices:
Ambient T emperature (TA) .............................0 to +75°C
Supply voltage (VCC)
with Respect to Ground ..................... +4.75 to +5.25V
Ambient T emperature with
Power Applied.........................................-55 to 125°C
1.Stresses above those listed under the “Absolute Maximum
Ratings” may cause permanent damage to the device. These
are stress only ratings and functional operation of the device
at these or at any other conditions above those indicated in
the operational sections of this specification is not implied
(while programming, follow the programming specifications).
DC Electrical Characteristics
Over Recommended Operating Conditions (Unless Otherwise Specified)
3
SYMBOLPARAMETERCONDITIONMIN.TYP.
MAX.UNITS
VILInput Low Voltage Vss – 0.5—0.8V
VIHInput High Voltage2.0—Vcc+1V
1
IIL
Input or I/O Low Leakage Current0V ≤ VIN≤ VIL (MAX.)——–100µA
IIHInput or I/O High Leakage Current3.5V ≤ VIN≤ VCC——10µA
VOLOutput Low VoltageIOL = MAX. Vin = VIL or VIH——0.5V
VOHOutput High VoltageIOH = MAX. Vin = VIL or VIH2.4——V
1) The leakage current is due to the internal pull-up on all pins. See Input Buffer section for more information.
2) One output at a time for a maximum duration of one second. Vout = 0.5V was selected to avoid test problems caused by tester
ground degradation. Characterized but not 100% tested.
3) T ypical values are at Vcc = 5V and TA = 25 °C
toggle = 15MHz Outputs Open
8
Page 9
AC Switching Characteristics
Specifications GAL18V10
Over Recommended Operating Conditions
COM
PARAMETERUNITS
TEST
COND.
DESCRIPTION
1
-15
MIN. MAX.
COM
-20
MIN. MAX.
tpdAInput or I/O to Combinatorial Output—15—20ns
tcoAClock to Output Delay—10—12ns
2
tcf
—Clock to Feedback Delay—7—10ns
tsu—Setup T ime, Input or Feedback before Clock↑10—12—ns
th—Hold Time, Input or Feedback after Clock↑0—0—ns
AMaximum Clock Frequency with50—41.6—MHz
External Feedback, 1/(tsu +tco)
3
fmax
AMaximum Clock Frequency with58.8—45.4—MHz
Internal Feedback, 1/(tsu + tcf)
AMaximum Clock Frequency with62.5—62.5—MHz
No Feedback
twh—Clock Pulse Duration, High8—8—ns
twl—Clock Pulse Duration, Low8—8—ns
tenBInput or I/O to Output Enabled—15—20ns
tdisCInput or I/O to Output Disabled—15—20ns
tarAInput or I/O to Asynchronous Reset of Register—20—20ns
tarw—Asynchronous Reset Pulse Duration10—15—ns
tarr—Asynchronous Reset to Clock Recovery T ime15—15—ns
tspr—Synchronous Preset to Clock Recovery Time10—12—ns
1) Refer to Switching Test Conditions section.
2) Calculated from fmax with internal feedback. Refer to fmax Description section.
3) Refer to fmax Description section.
Capacitance (TA = 25°C, f = 1.0 MHz)
SYMBOLPARAMETERMAXIMUM*UNITSTEST CONDITIONS
C
I
C
I/O
*Characterized but not 100% tested.
Input Capacitance8pFVCC = 5.0V , VI = 2.0V
I/O Capacitance10pFVCC = 5.0V , V
I/O
= 2.0V
9
Page 10
(
)
Switching Waveforms
Specifications GAL18V10
INPUT or
I/O FEEDBACK
COMBINA TORIAL
OUTPUT
INPUT or
I/O FEEDBACK
OUTPUT
Input or I/O to Output Enable/Disable
VALID INPUT
Combinatorial Output
dis
t
t
pd
INPUT or
I/O FEEDBACK
CLK
REGISTERED
OUTPUT
VALID INPUT
t
su
(exter nal fdbk)
1/ fmax
t
t
co
h
Registered Output
en
t
CLK
1/ fmax (internal fdbk)
cf
t
REGISTERED
FEEDBACK
t
su
CLK
INPUT or
I/O FEEDBACK
DRIVING SP
CLK
REGISTERED
OUTPUT
fmax with Feedback
t
wh
Clock Width
t
su
Synchronous PresetAsynchronous Reset
f
max
1/
w/o fdbk
t
wl
INPUT or
I/O FEEDBACK
DRIVING AR
t
h
t
spr
CLK
t
co
REGISTERED
OUTPUT
t
arw
t
ar
t
arr
10
Page 11
TEST POINT
C *
L
FROM OUTPUT (O/Q)
UNDER TEST
+5V
*C
L
INCLUDES TEST FIXTURE AND PROBE CAPACITANCE
R
2
R
1
fmax Descriptions
Specifications GAL18V10
CLK
CLK
LOGIC
ARRAY
t
su
REGISTER
t
co
fmax with External Feedback 1/(tsu+tco)
Note: fmax with external feedback is cal-
culated from measured tsu and tco.
CLK
LOGIC
ARRAY
t
su + th
REGISTER
fmax with No Feedback
Note: fmax with no feedback may be less
than 1/(twh + twl). This is to allow for a
clock duty cycle of other than 50%.
LOGIC
ARRAY
REGISTER
t
cf
t
pd
fmax with Internal Feedback 1/(tsu+tcf)
Note: tcf is a calculated value, derived by sub-
tracting tsu from the period of fmax w/internal
feedback (tcf = 1/fmax - tsu). The value of tcf is
used primarily when calculating the delay from
clocking a register to a combinatorial output
(through registered feedback), as shown above.
For example, the timing from clock to a combinatorial output is equal to tcf + tpd.
3-state levels are measured 0.5V from steady-state active
level.
Output Load Conditions (see figure)
Test ConditionR
A300Ω390Ω50pF
BActive High∞390Ω50pF
CActive High∞390Ω5pF
1R2CL
Active Low300Ω390Ω50pF
Active Low300Ω390Ω5pF
11
Page 12
Specifications GAL18V10
Electronic Signature
An electronic signature is provided in every GAL18V10 device. It
contains 64 bits of reprogrammable memory that can contain userdefined data. Some uses include user ID codes, revision numbers,
or inventory control. The signature data is always available to the
user independent of the state of the security cell.
Security Cell
A security cell is provided in every GAL18V10 device to prevent
unauthorized copying of the array patterns. Once programmed,
this cell prevents further read access to the functional bits in the
device. This cell can only be erased by re-programming the device, so the original configuration can never be examined once this
cell is programmed. The Electronic Signature is always available
to the user, regardless of the state of this control cell.
Latch-Up Protection
GAL18V10 devices are designed with an on-board charge pump
to negatively bias the substrate. The negative bias is of sufficient
magnitude to prevent input undershoots from causing the circuitry
to latch. Additionally , outputs are designed with n-channel pullups
instead of the traditional p-channel pullups to eliminate any possibility of SCR induced latching.
Device Programming
GAL devices are programmed using a Lattice Semiconductorapproved Logic Programmer, available from a number of manufacturers (see the the GAL Development Tools section). Complete
programming of the device takes only a few seconds. Erasing of
the device is transparent to the user, and is done automatically as
part of the programming cycle.
Output Register Preload
When testing state machine designs, all possible states and state
transitions must be verified in the design, not just those required
in the normal machine operations. This is because certain events
may occur during system operation that throw the logic into an
illegal state (power-up, line voltage glitches, brown-outs, etc.). To
test a design for proper treatment of these conditions, a way must
be provided to break the feedback paths, and force any desired (i.e.,
illegal) state into the registers. Then the machine can be sequenced
and the outputs tested for correct next state conditions.
The GAL18V10 device includes circuitry that allows each registered
output to be synchronously set either high or low. Thus, any present
state condition can be forced for test sequencing. If necessary,
approved GAL programmers capable of executing test vectors
perform output register preload automatically.
Input Buffers
GAL18V10 devices are designed with TTL level compatible input
buffers. These buffers have a characteristically high impedance,
and present a much lighter load to the driving logic than bipolar TTL
devices.
The input and I/O pins also have built-in active pull-ups. As a result,
floating inputs will float to a TTL high (logic 1). However, Lattice
Semiconductor recommends that all unused inputs and tri-stated
I/O pins be connected to an adjacent active input, Vcc, or ground.
Doing so will tend to improve noise immunity and reduce Icc for the
device.
T ypical Input Current
0
12
-20
-40
Input Current (uA)
-60
0
1.02.03.04.05.0
Input Voltage (Volts)
Page 13
Power-Up Reset
Specifications GAL18V10
Vcc
CLK
INTERNAL REGISTER
Q - OUTPUT
ACTIVE LOW
OUTPUT REGISTER
ACTIVE HIGH
OUTPUT REGISTER
Vcc (min.)
Circuitry within the GAL18V10 provides a reset signal to all registers during power-up. All internal registers will have their Q
outputs set low after a specified time (tpr, 1µs MAX). As a result,
the state on the registered output pins (if they are enabled) will
be either high or low on power-up, depending on the programmed
polarity of the output pins. This feature can greatly simplify state
machine design by providing a known state on power-up. Because of the asynchronous nature of system power-up, some
t
su
t
wl
pr
t
Internal Register
Reset to Logic "0"
Device Pin
Reset to Logic "1"
Device Pin
Reset to Logic "0"
conditions must be met to provide a valid power-up reset of the
device. First, the V
CC rise must be monotonic. Second, the clock
input must be at static TTL level as shown in the diagram during
power up. The registers will reset within a maximum of tpr time.
As in normal system operation, avoid clocking the device until all
input and feedback path setup times have been met. The clock
must also meet the minimum pulse width requirements.
Input/Output Equivalent Schematics
PIN
(Vref Typical = 3.2V)
ESD
Protection
Circuit
PIN
ESD
Protection
Circuit
Active Pull-up
Circuit
Vcc
Vref
T ypical InputT ypical Output
Vcc
Vcc
Data
Output
Feedback
Tri-State
Control
Active Pull-up
Circuit
Vcc
Feedback
(To Input Buffer)
PIN
(Vref Typical = 3.2V)
Vref
PIN
13
Page 14
Specifications GAL18V10
GAL18V10B: Typical AC and DC Characteristic Diagrams
Normalized Tpd vs Vcc
1.2
1.1
1
0.9
Normalized Tpd
0.8
4.504.755.005.255.50
PT H->L
PT L->H
Supply Voltage (V)
Normalized Tpd vs Temp
1.3
1.2
1.1
1
0.9
Normalized Tpd
0.8
0.7
PT H->L
PT L->H
-55-250255 07 5100 125
Temperature (deg. C)
Normalized Tco vs Vcc
1.2
1.1
1
0.9
Normalized Tco
0.8
4.504.755.005.255.50
RISE
FALL
Supply Voltage (V)
Normalized Tco vs Temp
1.3
1.2
1.1
1
0.9
Normalized Tco
0.8
0.7
-55-250255075100 125
RISE
FALL
Temperature (deg. C)
Normalized Tsu vs Vcc
1.2
1.1
1
0.9
Normalized Tsu
0.8
4.504.755.005.255.50
PT H->L
PT L->H
Supply Voltage (V)
Normalized Tsu vs Temp
1.4
1.3
1.2
1.1
1
0.9
Normalized Tsu
0.8
0.7
-55-250255075100 125
PT H->L
PT L->H
Temperature (deg. C)
Delta Tpd vs # of Outputs
Switching
0
-0.5
-1
-1.5
Delta Tpd (ns)
-2
12345678910
Number of Outputs Switching
Delta Tpd vs Output Loading
10
8
6
4
2
0
Delta Tpd (ns)
-2
-4
050100150200250300
RISE
FALL
Output Loading (pF)
RISE
FALL
Delta Tco vs # of Outputs
Switching
0
-0.5
-1
-1.5
Delta Tco (ns)
-2
12345678910
Number of Outputs Switching
Delta Tco vs Output Loading
10
8
6
4
2
0
Delta Tco (ns)
-2
-4
050100150200250300
RISE
FALL
Output Loading (pF)
RISE
FALL
14
Page 15
Specifications GAL18V10
GAL18V10B: Typical AC and DC Characteristic Diagrams
Vol vs Iol
1
0.75
0.5
Vol (V)
0.25
0
0 10203040
Iol (mA)
Normalized Icc vs Vcc
1.2
1.1
1
0.9
Normalized Icc
0.8
4.504.755.005.255.50
Supply Voltage (V)
Voh vs Ioh
5
4
3
2
Voh (V)
1
0
0 102030405060
Ioh(mA)
Normalized Icc vs Temp
1.2
1.1
1
0.9
Normalized Icc
0.8
-55-250255075100 125
Temperature (deg. C)
Voh vs Ioh
5.25
5
4.75
4.5
4.25
4
Voh (V)
3.75
3.5
3.25
3
01234
Ioh(mA)
Normalized Icc vs Freq.
1.4
1.3
1.2
1.1
1
Normalized Icc
0.9
0.8
0255075100
Frequency (MHz)
Delta Icc vs Vin (1 input)
8
7
6
5
4
3
Delta Icc (mA)
2
1
0
0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00
Vin (V)
Input Clamp (Vik)
0
-20
-40
-60
Iik (mA)
-80
-100
-120
-2.00-1.50-1.00-0.500.00
Vik (V)
15
Page 16
Specifications GAL18V10
GAL18V10B: Typical AC and DC Characteristic Diagrams
1.3
1.2
1.1
1
0.9
Normalized Tpd
0.8
0.7
Normalized Tpd vs. Vcc
PT H -> L
PT L -> H
4.54.7555.255.5
Supply Voltage (V)
1.3
1.2
1.1
0.9
Normalized Tpd
0.8
0.7
0
Normalized Tpd vs. Temperature
1
-50
0255075100125
-25
Ambient Temperature (°C)
Delta Tpd vs. # of Outputs Switching
1.3
Normalized Tsu vs. Vcc
1.2
1.1
1
0.9
Normalized Tsu
0.8
PT L -> H
PT H -> L
0.7
4.54.7555.255.5
Supply Voltage (V)
1.3
1.2
1.1
1
0.9
Normalized Tsu
0.8
0.7
10
Normalized Tsu vs. Temperature
-55-250255075100125
Ambient Temperature (°C)
Delta Tpd vs. Output Loading
1.3
1.2
1.1
1
0.9
Normalized Tco
0.8
0.7
4.54.7555.255.5
1.3
1.2
1.1
1
0.9
Normalized Tco
0.8
0.7
-55-250255075100125
Normalized Tco vs. Vcc
Supply Voltage (V)
Normalized Tco vs. Temperature
Ambient Temperature (°C)
1.3
Normalized Icc vs. Vcc
-1
-2
Delta Tpd (ns)
-3
0
Max. - 8
# of Outputs
250
200
150
IOL vs. V
(mA)
OL
100
I
50
0
012
VOL (V)
Max. - 4
OL
8
6
4
2
Delta Tpd (ns)
0
-2
Max.
0100200300400
Output Loading Capacitance (pf)
IOH vs. V
-150
-100
OH
(mA)
OH
I
-50
3
0
4
0123
4
VOH (V)
1.2
1.1
1
0.9
Normalized Icc
0.8
0.7
4.54.7555.255.5
1.3
1.2
1.1
1
0.9
Normalized Icc
0.8
0.7
-55-250255075100125
Supply Voltage (V)
Normalized Icc vs. Temperature
Icc vs. Temperature
Isb vs. Temperature
Ambient Temperature (°C)
16
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