Datasheet GA200SA60UP DataSheet (Vishay)

Page 1
Insulated Gate Bipolar Transistor
(Ultrafast Speed IGBT), 100 A
FEATURES
• Ultrafast: Optimized for minimum saturation voltage and speed up to 40 kHz in hard switching, > 200 kHz in resonant mode
• Very low conduction and switching losses
• Fully isolate package (2500 V
• Very low internal inductance ( 5 nH typical)
• Industry standard outline
SOT-227
• UL approved file E78996
• Compliant to RoHS directive 2002/95/EC
• Designed and qualified for industrial level
GA200SA60UP
Vishay Semiconductors
)
AC/RMS
PRODUCT SUMMARY
V
CES
V
(typical) 1.92 V
CE(on)
V
GE
I
C
600 V
15 V
100 A
BENEFITS
• Designed for increased operating efficiency in power conversion: UPS, SMPS, welding, induction heating
• Lower overall losses available at frequencies = 20 kHz
• Easy to assemble and parallel
• Direct mounting to heatsink
• Lower EMI, requires less snubbing
• Plug-in compatible with other SOT-227 packages
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS MAX. UNITS
Collector to emitter breakdown voltage V
Continuous collector current I
Pulsed collector current I
Clamped inductive load current I
Gate to emitter voltage V
Reverse voltage avalanche energy E
RMS isolation voltage V
Maximum power dissipation P
Operating junction and storage temperature range
Mounting torque 6-32 or M3 screw 1.3 (12)
CES
C
CM
LM
GE
ARV
ISOL
D
, T
T
J
Stg
TC = 25 °C 200
T
= 100 °C 100
C
VCC = 80 % (V L = 10 μH, R See fig. 13a
Repetitive rating; pulse width limited by maximum junction temperature
Any terminal to case, t = 1 minute 2500 V
TC = 25 °C 500
T
= 100 °C 200
C
), VGE = 20 V,
CES
= 2.0 ,
G
600 V
400
400
± 20 V
160 mJ
W
- 55 to + 150 °C
N m
(lbf in)
A
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TYP. MAX. UNITS
Junction to case R
Case to sink, flat, greased surface R
Weight of module 30 - g
Document Number: 94364 For technical questions within your region, please contact one of the following: www.vishay.com Revision: 22-Jul-10 DiodesAmericas@vishay.com
thJC
thCS
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-0.25
0.05 -
°C/W
Page 2
GA200SA60UP
Vishay Semiconductors
Insulated Gate Bipolar Transistor
(Ultrafast Speed IGBT), 100 A
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Collector to emitter breakdown voltage V
Emitter to collector breakdown voltage V
Temperature coeff. of breakdown
V
(BR)CES
(BR)ECS
(BR)CES
Collector to emitter saturation voltage V
Gate threshold voltage V
Temperature coeff. of threshold voltage V
GE(th)
Forward transconductance g
Zero gate voltage collector current I
Gate to emitter leakage current I
CE(on)
GE(th)
/TJVCE = VGE, IC = 2.0 mA - - 11 - mV/°C
fe
CES
GES
VGE = 0 V, IC = 250 μA 600 - -
VGE = 0 V, IC = 1.0 A Pulse width 80 μs; duty factor 0.1
18 - -
/TJVGE = 0 V, IC = 10 mA - 0.38 - V/°C
IC = 100 A
V
= 15 V
I
= 200 A - 1.92 -
C
= 100 A, TJ = 150 °C - 1.54 -
I
C
GE
See fig. 2, 5
- 1.60 1.9
VCE = VGE, IC = 250 μA 3.0 - 6.0
VCE = 100 V, IC = 100 A Pulse width 5.0 μs, single shot
79 - - S
VGE = 0 V, VCE = 600 V - - 1.0
V
= 0 V, VCE = 600 V, TJ = 150 °C - - 10
GE
VGE = ± 20 V - - ± 250 nA
V
V
mA
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Total gate charge (turn-on) Q
Gate-collector charge (turn-on) Q
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
Turn-on switching loss E
Total switching loss E
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
Total switching loss E
Internal emitter inductance L
Input capacitance C
Reverse transfer capacitance C
ge
gc
d(on)
r
d(off)
f
on
off
ts
d(on)
r
d(off)
f
ts
E
ies
oes
res
g
IC = 100 A
= 400 V
V
CC
= 15 V; See fig. 8
V
GE
TJ = 25 °C
= 100 A
I
C
V
= 480 V
CC
= 15 V
V
GE
R
= 2.0
g
Energy losses include “tail” See fig. 9, 10, 14
TJ = 150 °C
= 100 A, VCC = 480 V
I
C
= 15 V, Rg = 2.0
V
GE
Energy losses include “tail” See fig. 10, 11, 14
Measured 5 mm from package - 5.0 - nH
VGE = 0 V V
= 30 V
CC
f = 1.0 MHz; See fig. 7
- 770 1200
- 100 150
nCGate-emitter charge (turn-on) Q
- 260 380
-54-
-79-
- 130 200
ns
- 300 450
-0.98-
-3.48-
mJTurn-off switching loss E
- 4.46 7.6
-56-
-75-
-160-
ns
-460-
-7.24- mJ
- 16 500 -
- 1000 -
pFOutput capacitance C
-200-
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Page 3
10
1000
100
0.5 1.0 1.5 2.0 2.5 3.0 3.5
I
C
- Collector to Emitter Current (A)
VCE - Collector to Emitter Voltage (V)
TJ = 150 °C
TJ = 25 °C
VGE = 15 V 20 µs pulse width
10
1000
100
5.0 6.0 7.0 8.0
I
C
- Collector to Emitter Current (A)
VGE - Gate to Emitter Voltage (V)
TJ = 150 °C
TJ = 25 °C
VGE = 25 V 5 µs pulse width
25 50 75 100 125 150
0
50
100
150
200
TC - Case Temperature (°C)
Maximum DC Collector Current (A)
1
2
3
- 60 - 40 - 20 0 20 40 60 80 100 120 140 160
TJ - Junction Temperature (°C)
V
CE
- Collector to Emitter Voltage (V)
VGE = 15 V 80 µs pulse width
IC = 400 A
IC = 100 A
I
C
= 200 A
GA200SA60UP
200
Triangular wave:
160
120
80
Load Current (A)
Square wave:
40
0
0.1
I
Clamp voltage: 80 % of rated
Insulated Gate Bipolar Transistor
(Ultrafast Speed IGBT), 100 A
60 % of rated voltage
I
Ideal diodes
1 10 100
f - Frequency (kHz)
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = I
of Fundamental)
RMS
Vishay Semiconductors
For both:
Duty cycle: 50 %
= 125 °C
T
J
= 90 °C
T
sink
Gate drive as specified Power dissipation = 140 W
Fig. 2 - Typical Output Characteristics
Document Number: 94364 For technical questions within your region, please contact one of the following: www.vishay.com Revision: 22-Jul-10 DiodesAmericas@vishay.com
Fig. 3 - Typical Transfer Characteristics
Fig. 4 - Maximum Collector Current vs.
Case Temperature
Fig. 5 - Typical Collector to Emitter Voltage vs.
Junction Temperature
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Page 4
GA200SA60UP
0.001
0.01
0.1
1
0.00001 0.0001 0.001 0.01 0.1 1
t1 - Rectangular Pulse Duration (s)
Z
thJC
- Thermal Response
P
DM
t
1
t
2
Notes:
1. Duty factor D = t
1/t2
2. Peak TJ = PDM x Z
thJC
+ T
C
Single pulse
(thermal resistance)
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
0 200 400 600 800
0
4
8
12
16
20
QG - Total Gate Charge (nC)
V
GE
- Gate to Emitter Voltage (V)
VCC = 400 V I
C
= 110 A
Total Switching Losses (mJ)
- 60 - 40 - 20 0 20 40 60 80 100 120 140 160
1
10
100
TJ - Junction Temperature (°C)
IC = 200 A
IC = 100 A
IC = 350 A
RG = 2.0 Ω V
GE
= 15 V
V
CC
= 480 V
Vishay Semiconductors
Fig. 6 - Maximum Effektive Transient Thermal Impedance, Junction to Case
30 000
25 000
20 000
C
ies
15 000
C
10 000
C - Capacitance (pF)
5000
C
res
0
1 10 100
VCE - Collector to Emitter Voltage (V)
Fig. 7 - Typical Capacitance vs.
VGE = 0 V, f = 1 MHz
= Cge + Cgc, Cce shorted
C
ies
= C
C
res
C
= Cce + C
oes
oes
Collector to Emitter Voltage
Insulated Gate Bipolar Transistor
(Ultrafast Speed IGBT), 100 A
gc
gc
60
VCC = 480 V
= 15 V
V
GE
50
= 25 °C
T
J
= 200 A
I
C
40
30
20
10
Total Switching Losses (mJ)
0
0 102030405060
RG - Gate Resistance (Ω)
Fig. 9 - Typical Switching Losses vs. Gate Resistance
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Fig. 8 - Typical Gate Charge vs. Gate to Emitter Voltage
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Fig. 10 - Typical Switching Losses vs.
Junction Temperature
Page 5
Total Switching Losses (mJ)
IC - Collector Current (A)
0 100 200 300 400
0
10
20
30
40
50
60
RG = 2.0 Ω T
J
= 150 °C
V
CC
= 480 V
V
GE
= 15 V
I
C
- Collector Current (A)
10
100
1000
1 10 100 1000
VCE - Collector to Emitter Voltage (V)
Safe operating area
VGE = 20 V T
J
= 125 °C
D.U.T.
50 V
L
V
C
*
* Driver same type as D.U.T.; V
C
= 80 % of VCE (max)
Note: Due to the 50 V power supply, pulse width and inductor will increase to obtain rated I
d
1000 V
121
2
480 V
4 x I
C
at 25 °C
480 µF 960 V
0 V to 480 V
RL ==
50 V
Driver*
1000 V
D.U.T.
I
C
V
C
L
* Driver same type as D.U.T., V
C
= 480 V
3
1
2
GA200SA60UP
Insulated Gate Bipolar Transistor
(Ultrafast Speed IGBT), 100 A
Fig. 11 - Typical Switching Losses vs. Collector Current
Vishay Semiconductors
Fig. 13a - Clamped Inductive Load Test Circuit
Fig. 13b - Pulsed Collector Current Test Circuit
Fig. 12 - Turn-Off SOA
Document Number: 94364 For technical questions within your region, please contact one of the following: www.vishay.com Revision: 22-Jul-10 DiodesAmericas@vishay.com
1
2
3
V
C
I
C
5 %
90 %
10 %
10 %
t
t
d(on)
r
E
on
Ets = (Eon + E
Fig. 14b - Switching Loss Waveforms
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Fig. 14a - Switching Loss Test Circuit
90 %
t
d(off)
t
f
E
off
)
off
t = 5 µs
Page 6
GA200SA60UP
1 - Insulated Gate Bipolar Transistor (IGBT)
2 - Generation 4, IGBT silicon, DBC construction
3 - Current rating (200 = 200 A)
4 - Single switch, no diode
5 - SOT-227
6 - Voltage rating (60 = 600 V)
8 - None = Standard production
P = Lead (Pb)-free
7 - Speed/type (U = Ultrafast)
Device code
51324678
G A 200 S A 60 U P
3 (C)
2 (G)
1, 4 (E)
Lead assignment
E
C
G
E
3
2
4
1
n-channel
Vishay Semiconductors
Insulated Gate Bipolar Transistor
ORDERING INFORMATION TABLE
CIRCUIT CONFIGURATION
(Ultrafast Speed IGBT), 100 A
LINKS TO RELATED DOCUMENTS
Dimensions www.vishay.com/doc?95036
Packaging information www.vishay.com/doc?95037
www.vishay.com For technical questions within your region, please contact one of the following: Document Number: 94364 6 DiodesAmericas@vishay.com
, DiodesAsia@vishay.com, DiodesEurope@vishay.com Revision: 22-Jul-10
Page 7
DIMENSIONS in millimeters (inches)
38.30 (1.508)
37.80 (1.488)
-A-
4
12
3
12.50 (0.492)
7.50 (0.295)
Ø 4.40 (0.173) Ø 4.20 (0.165)
30.20 (1.189)
29.80 (1.173)
15.00 (0.590)
6.25 (0.246)
25.70 (1.012)
25.20 (0.992)
-B-
R full
Chamfer
2.00 (0.079) x 45°
2.10 (0.082)
1.90 (0.075)
8.10 (0.319)
7.70 (0.303)
4 x
2.10 (0.082)
1.90 (0.075)
-C-
0.12 (0.005)
12.30 (0.484)
11.80 (0.464)
MMM
0.25 (0.010)
CA B
4 x M4 nuts
Outline Dimensions
Vishay Semiconductors
SOT-227
Notes
• Dimensioning and tolerancing per ANSI Y14.5M-1982
• Controlling dimension: millimeter
Document Number: 95036 For technical questions, contact: indmodules@vishay.com Revision: 28-Aug-07 1
www.vishay.com
Page 8
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