Datasheet GA1085MC1000 Datasheet (TriQuint Semiconductor Inc)

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T R I Q U I N T S E M I C O N D U C T O R , I N C .
SYSTEMS TIMING
SYSTEM TIMING
PRODUCTS
1
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GA1085
11-Output Configurable Clock Buffer
Features
• Wide frequency range: 24 MHz to 105 MHz
• Output configurations: Four outputs at f
REF
Four outputs at f
REF
/2
Two outputs at f
REF
/2 ␣␣␣␣with adjustable phase ␣␣␣␣␣␣␣␣␣␣␣or Five outputs at 2x f
REF
Three outputs at f
REF
Two outputs at f
REF
␣␣␣␣with adjustable phase
• Selectable Phase Shift: –2t, –t, +t, and +2t (t = 1/f
VCO
)
• Low output-to-output skew: 150 ps (max) within a group
• Near-zero propagation delay: –350 ps
+1000 ps (max)
• TTL-compatible with 30 mA output drive
• 28-pin J-lead surface-mount package
Figure 1. Block Diagram
Output Buffers
VCO
Phase
Detector
VDD
Q10
Q9
GND
Q8
Q7
VDD
TEST
VDD
Q0
GND
Q1
Q2
VDD
FBIN S1 REFCLK S0 F1 F0 GND
GND Q3 Q4 VDD Q5 Q6 GND
1
2
14
13
12
11 10
9
8765
4
3
22212019
18
17
16
15
27
28
252423
26
Phase Select
MUX
Divide Logic ÷4, ÷5, or ÷6
Group
B
Group A
Group
C
TriQuint’s GA1085 is a configurable clock buffer which generates 11 outputs and operates over a wide range of frequencies—from 24 MHz to 105 MHz. The outputs are available at either 1x and 2x or at 1x and
1
/2 x the reference
clock frequency, f
REF
. When one of the Group A outputs (Q4–Q8) is used as
feedback to the PLL, all Group A outputs will be at f
REF
, and all Group B
(Q0–Q3) and Group C (Q9, Q10) outputs will be at
1
/2 x f
REF
. When one of the Group B outputs is used as feedback to the PLL, all Group A outputs will be at 2x
REF
and all Group B and Group C outputs will be at f
REF
. The Shift Select pins select the phase shift (–2t, –t, +t or +2t) for Group C outputs (Q9, Q10) with respect to REFCLK. The phase shift increment (t) is equivalent to the VCO’s period (1/f
VCO
).
A very stable internal Phase-Locked Loop (PLL) provides low-jitter operation. This completely self-contained PLL requires no external capacitors or resistors. The PLL’s Voltage-Controlled Oscillator (VCO) has a frequency range from 280 MHz to 420 MHz. By feeding back one of the output clocks to FBIN, the PLL continuously maintains frequency and phase synchron-ization between the reference clock (REFCLK) and each of the outputs.
TriQuint’s patented output buffer design delivers a very low output-to-output skew of 150 ps (max). The GA1085’s symmetrical TTL outputs are capable of sourcing and sinking 30 mA.
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GA1085
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2
Functional Description
The core of the GA1085 is a Phase-Locked Loop (PLL) that continuously compares the reference clock (REFCLK) to the feedback clock (FBIN), maintaining a zero frequency difference between the two. Since one of the outputs (Q0–Q8) is always connected to FBIN, the PLL keeps the propagation delay between the outputs and the reference clock within –350 ps
+1000 ps.
The internal Voltage-Controlled Oscillator (VCO) has an operating range of 280 MHz to 420 MHz. The combination of the VCO and the Divide Logic enables the GA1085 to operate between 24 MHz and 105 MHz. The device features six divide modes: ÷4, ÷5, ÷6, ÷8, ÷10, and ÷12. The Frequency Select pins, F0 and F1, and the output used as feedback to FBIN set the divide mode as shown in Table 1.
The Shift Select pins, S0 and S1, control the phase shift of Q9 and Q10 relative to the other outputs. The user can select from four incremental phase shifts as shown in Table 2.
The phase-shift increment (t) is calculated using the following equation:
where
n
is the divide mode.
In the test mode, the PLL is bypassed and REFCLK is connected directly to the Divide Logic block via the MUX, as shown in Figure 1. This mode is useful for debug and test purposes. The various test modes are outlined in Table 3. In the test mode, the frequency of the reference clock is divided by 4, 5, or 6.
The maximum rise and fall time at the output pins is
1.4 ns. All outputs of the GA1085 are TTL-compatible with 30 mA symmetric drive and a minimum VOH of 2.4 V.
Power-Up/Reset Synchronization
After power-up or reset, the PLL requires time before it achieves synchronization lock. The maximum time required for synchronization (TSYNC) is 500 ms.
Table 1. Frequency Mode Selection
Feedback: Any Group B Output (Q0 – Q3)
Select Pins Reference Clock Output Frequency Range
Test F0 F1 Mode Frequency Range Group A: Q4–Q8 B: Q0–Q3, C: Q9–Q10
01 0 ÷ 4 70 MHz – 105 MHz 70 MHz – 105 MHz 35 MHz – 52 MHz 00 0 ÷ 5 56 MHz – 84 MHz 56 MHz – 84 MHz
1
28 MHz – 42 MHz
00 1 ÷ 6 48 MHz – 70 MHz 48 MHz – 70 MHz 24 MHz – 35 MHz 0 1 1 Not Used N.A. N.A. N.A.
Feedback: Any Group A Output (Q4 – Q8)
Select Pins Reference Clock Output Frequency Range
Test F0 F1 Mode Frequency Range Group A: Q4–Q8 B: Q0–Q3, C: Q9–Q10
01 0 ÷ 8 35 MHz – 52 MHz 70 MHz – 105 MHz 35 MHz – 52 MHz 00 0 ÷ 10 28 MHz – 42 MHz 56 MHz – 84 MHz
1
28 MHz – 42 MHz
00 1 ÷ 12 24 MHz – 35 MHz 48 MHz – 70 MHz 24 MHz – 35 MHz 0 1 1 Not Used N.A. N.A. N.A.
t =
1
(f ) (n)
REF
Note: 1. This mode produces outputs with 40/60 duty cycle for Q4 – Q8 only.
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GA1085
SYSTEM TIMING
SYSTEM TIMING
PRODUCTS
3
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S0 S1 Phase Difference (Q9, Q10)
0 0 +2t
01 +t
10 t
1 1 –2t
Table 2. Phase Shift Selection
Table 3. Test Mode Selection
Group A: Groups B, C:
Test F0 F1 Mode Ref. Clock Outputs Q4–Q8 Q0–Q3, Q9, Q10
11 0 ÷ 4f
REF
f
REF
÷ 4f
REF
÷ 8␣ ␣
10 0 ÷ 5f
REF
f
REF
÷ 5f
REF
÷ 10
10 1 ÷ 6f
REF
f
REF
÷ 6f
REF
÷ 12
11 1 — —
Layout Guidelines
Multiple ground and power pins on the GA1085 reduce ground bounce. Good layout techniques, however, are necessary to guarantee proper operation and to meet the specifications across the full operating range. TriQuint recommends bypassing each of the V
DD
supply pins to the nearest ground pin, as close to the chip as possible.
Figure 2 shows the recommended power layout for the GA1085. The bypass capacitors should be located on the same side of the board as the GA1085. The V
DD
traces connect to an inner-layer VDD plane. All of the ground pins (GND) are connected to a small ground plane on the surface beneath the chip. Multiple through-holes connect this small surface plane to an inner-layer ground plane. The capacitors (C1–C5) are
0.1 µF. TriQuint’s test board uses X7R temperature­stable capacitors in 1206 SMD cases.
Figure 2. Top Layer Layout of Power Pins
(magnified approximately 3.3x)
C4
C5
C1
C2
C3
Pin 1
Pin 15
Ground
Plane
V
DD
V
DD
V
DD
V
DD
V
DD
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GA1085
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4
Storage temperature
–65 °C to +150 °C
Ambient temperature with power applied
2
–55 °C to +100 °C
Supply voltage to ground potential
–0.5 V to +7.0 V
DC input voltage
–0.5 V to (VDD + 0.5) V
DC input current
–30 mA to +5 mA
Package thermal resistance (MQuad)
θJA = 45 °C/W
Die junction temperature
T
J
= 150 °C␣␣␣␣
Symbol Description Test Conditions Min
3
Typ Max
3
Unit
V
OHT
Output HIGH voltage VDD = Min IOH = –30 mA 2.4 3.4 V
VIN = VIH or V
IL
V
OHC
Output HIGH voltage VDD = Min IOH = –1 mA 3.2 4.1 V
VIN = VIH or V
IL
V
OL
Output LOW voltage VDD = Min IOL = 30 mA 0.27 0.5 V
VIN = VIH or V
IL
V
IH
4
Input HIGH level Guaranteed input logical 2.0 V
HIGH voltage for all Inputs
V
IL
4
Input LOW level Guaranteed input logical 0.8 V
LOW voltage for all inputs
I
IL
Input LOW current VDD = Max VIN = 0.40 V –156 –400 µA
I
IH
Input HIGH current VDD = Max VIN = 2.7 V 0 25 µA
I
I
Input HIGH current VDD = Max VIN = 5.5 V 2 1000 µA
I
DDS
5
Power supply current VDD = Max 119 160 mA
V
I
Input clamp voltage VDD = Min IIN = –18 mA –0.70 –1.2 V
Notes: 1. Exceeding these parameters may damage the device.
2. Maximum ambient temperature with device not switching and unloaded.
3. Typical limits are at V
DD
= 5.0 V and TA = 25 °C.
4. These are absolute values with respect to device ground and all overshoots due to system or tester noise are included.
5. This parameter is measured with device not switching and unloaded.
6. These parameters are not 100% tested, but are periodically sampled.
Symbol Description Test Conditions Min Typ Max Unit
C
IN
6
Input capacitance VIN = 2.0 V at f = 1 MHz 6 pF
DC Characteristics (VDD = +5 V + 5%, TA = 0 °C to +70 °C)
Absolute Maximum Ratings
1
Capacitance
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GA1085
SYSTEM TIMING
SYSTEM TIMING
PRODUCTS
5
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Notes:
Q0 Q1 Q2
Q10
FBIN
CLK
R1
R2
+5 V
R1
R2
+5 V
R1
R2
+5 V
R1
R2
+5 V
R1
R2
+5 V
Y
X
50
Z
Z
R1 = 160 R2 = 71 Y + Z = X
Symbol Input Clock (REFCLK) Test Conditions (Figure 3)
1
Min Typ Max Unit
t
CPWH
CLK pulse width HIGH Figure 4 3 --- ns
t
CPWL
CLK pulse width LOW Figure 4 3 --- ns
t
IR
Input rise time (0.8 V – 2.0 V) 2.0 ns
Output Clocks (Q0–Q10)
t
OR, tOF
Rise/fall time (0.8 V–2.0 V) Figure 4 350 — 1400 ps
t
PD
2
CLK Î to FBIN Î (GA1085-MC1000) Figure 4 –1350–350 +650 ps
t
SKEW1
3
Rise–rise, fall–fall (within group) Figure 5 60 150 ps
t
SKEW2
3
Rise–rise, fall–fall Figure 6 75 350 ps (group-to-group, aligned) (skew2 takes into account skew1)
t
SKEW3
3
Rise–rise, fall–fall Figure 7 650 ps (group-to-group, non-aligned) (skew3 takes into account skew1, skew2)
t
SKEW4
3
Rise–fall, fall–rise Figure 8 1200 ps
(skew4 takes into account skew3)
t
CYC
4
Duty-cycle Variation Figure 4 –1000 0 +1000 ps
t
JP
5
Period-to-Period Jitter Figure 4 80 200 ps
t
JR
5
Random Jitter Figure 4 — 190 400 ps
t
SYNC
6
Synchronization Time 10 500 µs
AC Characteristics (VDD = +5 V + 5%, TA = 0 °C to +70 °C)
Notes: 1. All measurements are tested with a REFCLK having a rise time of 0.5 ns (0.8 V to 2.0 V).
2. The PLL maintains alignment of CLK and FBIN at all times. This specification applies to the rising edge only because the input duty cycle can vary while the output duty cycle is typically 50/50. The delay t
PD
is measured at the 1.5 V level between CLK and FBIN.
3. Skew
specifies the width of the window in which outputs switch, and is measured at 1.5 V.
4. This specification represents the deviation from 50/50 on the outputs.
5. Jitter specifications refer to peak-to-peak value. t
JR
is the jitter on the output with respect to the reference clock.
t
JP
is the jitter on the output with respect to the output’s previous rising edge.
6. t
SYNC
is the time required for the PLL to synchronize; this assumes the presence of a CLK signal and
a connection from one of the outputs to FBIN.
Figure 3. AC Test Circuit
Page 6
GA1085
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6
t
1
Group A
Period =
1
f
REFCLK
t
SKEW3 =
Period
2
– t
f = 2x f
REF
1
Group A
Group C
t
SKEW3 =
n – t
4
t
4
Group B
Group C
t
SKEW3 =
n – t
4
t
4
Switching Waveforms
Figure 3. General Timing
t
PD1,2
t
JR
t
CPW
(INDIVIDUALLY)
REFCLK
FBIN
Q0 – Q10
t
CPW
t
PERIOD
t
JP
Figure 6. t
SKEW3
Figure 4. t
SKEW1
Group A
Group A
Group B
Group B
Group C
Group C
t
SKEW1
t
SKEW1
t
SKEW1
t
SKEW1
t
SKEW1 tSKEW1
t
SKEW2
Group B
Group A
t
SKEW4 =
Period
2
– t
=
Period
4
– t
=
Period
4
– t
t
3
t
4
Groups B, C
Group A
Period =
1
f
REFCLK
t
2
f = f
f = 2x f
REF
REF
2
3
4
(For Group B Feedback)
(For Group A or B Feedback)
Note:“n” is the phase-shift increment: 2t, t, –t, –2t.
Figure 7. t
SKEW4
Figure 5. t
SKEW2
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GA1085
SYSTEM TIMING
SYSTEM TIMING
PRODUCTS
7
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28-Pin MQuad Pin Description
Pin # Pin Name Description I/O
1 GND Ground — 2 Q9 Output Clock 9 (C1) O 3 Q10 Output Clock 10 (C2) O 4 VDD +5 V — 5 GND Ground — 6 F0 Frequency Select 0 I 7 F1 Frequency Select 1 I 8 S0 Shift Select 0 I
9 REFCLK Reference Clock I 10 S1 Shift Select 1 I 11 FBIN Feedback In I 12 TEST Test I 13 VDD +5 V — 14 Q0 Output Clock 0 (B1) O
PIN 1
.050 TYP.
NON-ACCUM.
.445 ±.005
.490 ±.005
.445
±.005
.490
±.005
.045
X 45°°
.132 ±.005
.050 TYP.
.410
±.015
.018
.104
±.005
.172 ±.005
8
15
22
.445
±.005
.040 MIN
.015
X 45°°
0.125
VENT PLUG
.028
.060
(All dimensions are in inches)
28-Pin MQuad J-Leaded Package Mechanical Specification
Pin # Pin Name Description I/O
15 GND Ground — 16 Q1 Output Clock 1 (B2) O 17 Q2 Output Clock 2 (B3) O 18 VDD +5 V — 19 GND Ground — 20 Q3 Output Clock 3 (B4) O 21 Q4 Output Clock 4 (A1) O 22 VDD +5 V — 23 Q5 Output Clock 5 (A2) O 24 Q6 Output Clock 6 (A3) O 25 GND Ground — 26 VDD +5 V — 27 Q7 Output Clock 7 (A4) O 28 Q8 Output Clock 8 (A5) O
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GA1085
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8
Output Characteristics
Figure 9. IOH vs.V
OH
Table 4. IOH vs.V
OH
V
OH
IOH min (mA) IOH max (mA)
0.0 –70 –160
0.5 –70 –157
1.0 –68 –152
1.5 –65 –142
2.0 –59 –130
2.5 –48 –106
3.0 –29 –79
3.5 0 –42
4.0 0 0
4.5 0 0
5.0 0 0
6.0 0 0
7.0 0 0
8.0 0 0
9.0 0 1
10.0 0 5
Table 5. IOL vs.V
OL
Figure 10. IOL vs.V
OL
0.0 1.0 2.0 3.0 4.0 5.0
Volts
0
-20
-40
-60
-80
-100
-120
-140
-160
I (mA)
OH
V max
OH
V min
OH
HIGH
0.0 1.0 2.0 3.0 4.0 5.0
Volts
160
140
120
100
80
60
40
20
0
I (mA)
OL
V max
OL
V min
OL
LOW
The IV characteristics, transition times, package characteristics, device and bond-wire characteristics for the GA1085 are described in Tables 4 through 9 and Figures 9 through 11.
These output characteristics are provided for modelling purposes only. TriQuint does not guarantee the information in these tables and figures.
Notes: 1. These are worst-case corners for process, voltage,
and temperature.
2. Includes diode to ground current.
V
OL
IOL min (mA) IOL max (mA)
–2.5 –145 –435 –2.0 –135 –410 –1.5 –115 –350 –1.0 –90 –265 –0.5 –40 –120
0.0 0 0
0.5 37 97
1.0 49 140
1.5 53 155
2.0 54 157
2.5 54 159
3.0 54 160
3.5 54 160
4.0 54 160
4.5 54 160
5.0 54 160
10.0 54 160
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GA1085
SYSTEM TIMING
SYSTEM TIMING
PRODUCTS
9
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Diode to GND␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣ Diode Stack to VDD
V I (mA) V I (mA)
0.0 0 5.0 0 –0.4 0 6.0 0 –0.5 0 7.0 0 –0.6 –5 8.0 0 –0.7 –15 9.0 0 –0.8 –35 10.0 1 –0.9 –55 11.0 5 –1.0 –75 12.0 9 –2.0 –300 –2.5 –350 –3.0 –360
Note: TriQuint does not guarantee diode operation for purposes other
than ESD protection.
Table 6. Characteristics Above VDD and Below Ground
L2 C2
1.85 nH 0.40 pF
Table 9. Rise and Fall Times
Figure 11. Output Model
C2
DIE
C1
L2L1
OUTPUT
Time (ns) TR min (V) TR max (V) TF min (V) TF max (V)
0.0 0.15 0.32 3.20 3.04
0.1 0.15 0.32 3.20 3.04
0.2 0.16 0.32 3.06 2.95
0.3 0.18 0.32 2.86 2.90
0.4 0.23 0.32 2.62 2.68
0.5 0.26 0.32 2.38 2.50
0.6 0.34 0.32 2.17 2.36
0.7 0.46 0.34 2.00 2.22
0.8 0.67 0.39 1.85 2.09
0.9 0.89 0.49 1.69 1.95
1.0 1.12 0.63 1.52 1.86
1.1 1.32 0.86 1.38 1.68
1.2 1.50 1.09 1.26 1.59
1.3 1.73 1.27 1.12 1.49
1.4 1.93 1.45 0.96 1.36
1.5 2.15 1.64 0.83 1.23
1.6 2.75 2.23 0.52 0.95
1.7 2.58 2.00 0.61 1.00
1.8 2.75 2.23 0.52 0.95
1.9 2.90 2.41 0.45 0.91
2.0 3.02 2.50 0.39 0.86
2.1 3.12 2.64 0.33 0.77
2.2 3.17 2.77 0.29 0.73
2.3 3.19 2.86 0.24 0.68
2.4 3.20 2.95 0.21 0.64
2.5 3.20 2.99 0.19 0.59
2.6 3.20 3.02 0.17 0.55
2.7 3.20 3.02 0.16 0.53
2.8 3.20 3.04 0.16 0.50
2.9 3.20 3.04 0.15 0.45
3.0 3.20 3.04 0.15 0.41
3.1 3.20 3.04 0.15 0.40
3.2 3.20 3.04 0.15 0.37
3.3 3.20 3.04 0.15 0.36
3.4 3.20 3.04 0.15 0.32
3.5 3.20 3.04 0.15 0.32
Table 7. Device and Bond-Wire Characteristics
(Estimates)
L1 C1
2 nH 10 pF
Table 8. 28-Pin MQuad Package Characteristics
(Into 0 pF, 50 Ohms to 1.5 V)
Page 10
GA1085
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10
Ordering Information
To order, please specify as shown below:
GA1085-MC nnnn
11-Output Configurable Clock Buffer
Propagation delay skew:
1000
= –350 ps ± 1000 ps
Temperature range: Commercial (0 °C to 70 °C)
Package: MQuad
For latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint:
Web: www.triquint.com Tel: (503) 615-9000 Email: sales@tqs.com Fax: (503) 615-8900
For technical questions and additional information on specific applications:
Email: applications@tqs.com
The information provided herein is believed to be reliable; TriQuint assumes no liability for inaccuracies or omissions. TriQuint assumes no responsibility for the use of this information, and all such information shall be entirely at the user's own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. TriQuint does not authorize or warrant any TriQuint product for use in life-support devices and/or systems.
Copyright © 1997 TriQuint Semiconductor, Inc. All rights reserved. Revision 1.1.A November 1997
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