Datasheet G950T55U, G950T55T, G950T55D, G950T45U, G950T45T Datasheet (GMT)

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Page 1
Ver: 1.6
Dec 31, 2002
TEL: 886-3-5788833
http://www.gmt.com.tw
1
G950
Global Mixed-mode Technology Inc.
2.5V 1A Regulator
Features

Output current in excess of 1A

Output voltage accuracy +3%/-1%

Quiescent current, typically 600µA

Internal short circuit current limit

Internal over temperature protection
Applications

PC motherboard

ADSL/Cable Modem

Set-Top-Box

LAN switch/Hub

Router
General Description
The G950 positive 2.5V voltage regulator features the ability to source 1A of output current. The typical quiescent current is 0.6mA.
Familiar regulator features such as over tempera­ture and over current protection circuits are pro­vided to prevent it from being damaged by ab­normal operating conditions.
Ordering Information
PIN OPTION
ORDER NUMBER PACKAGE TYPE
1 2 3
G950T45U TO 252 V
IN
GND V
OUT
G950T55U TO 263 V
IN
GND V
OUT
G950T63U SOT 223 GND V
OUT
V
IN
G950T64U SOT 223 GND VIN V
OUT
G950T65U SOT 223 V
IN
GND V
OUT
G950T66U SOT 223 VIN V
OUT
GND
* For other package types and pin options, please contact us at sales @gmt.com.tw
Order Number Identification
GXXX XX X X
Packing Type Pin Option Package Type Part Number
PACKAGE TYPE PIN OPTION PACKING
T3 : TO 220
1 2 3
U & D : Tape & Reel Direction
T4 : TO 252 1 : V
OUT
GND VIN T : Tube
T5 : TO 263 2 : V
OUT
VIN GND
T6 : SOT 223 3 : GND V
OUT
VIN
4 : GND V
IN
V
OUT
5 : V
IN
GND V
OUT
6 : V
IN
V
OUT
GND
Typical Application Package Type
[Note 4] : Type of C
OUT
G950
C1 1µF
IQ
V
IN
V
OUT
I
O
C
OUT
10µF
Top View
1
3
TO 220
2
Top View
1
2
3
SOT 223
Top View
1
2
3
TO252
、、、、
263
Top View
1
3
TO 220
2
Top View
1
3
TO 220
2
Top View
1
2
3
SOT 223
Top ViewTop View
1
2
3
SOT 223
Top View
1
2
3
TO252
、、、、
263
Top View
1
2
3
TO252
、、、、
263
Page 2
Ver: 1.6
Dec 31, 2002
TEL: 886-3-5788833
http://www.gmt.com.tw
2
G950
Global Mixed-mode Technology Inc.
Absolute Maximum Ratings
(Note 1) Input Voltage……………………………………..…..…7V Power Dissipation Internally Limited …. (Note 2) Maximum Junction Temperature…..…………… …..150°C Storage Temperature Range….…..-65°C ≤ T
J
≤+150°C Lead Temperature, Time for Wave Soldering TO 220 Package………………………………260°C, 10s TO 252, TO 263, SOT 223 Package…….…...260°C, 4s Continuous Power Dissipation (T
A
= + 25°C)
SOT 223
(1)
……………………….….……….………..0.8W
TO 252
(1)
………..……………….……….….………..1.0W
TO 263
(1)
………..……………….……….….………..1.6W
Note
(1)
: See Recommended Minimum Footprint.
Operating Conditions
(Note 1) Input Voltage…………………………………….3.3V~6V Temperature Range……………………0°C ≤ T
J
≤125°C
Electrical Characteristics
VIN =5V, IO = 1A, CIN = 1µF, C
OUT
=10 µF, All specifications apply for TA = TJ = 25°C. [Note 3]
PARAMETER CONDITIONS MIN TYP MAX UNITS
V
IN
= 5V, 10mA < IO < 1A
Output Voltage
V
IN
= 3.3V, 10mA < IO < 500mA
2.475 2.50 2.575 V
Line Regulation 3.3V < VIN < 6V, IO = 10mA 3 30 mV
V
IN
= 5V, 10mA < IO < 1A 35 50 mV
Load Regulation
V
IN
= 3.3V, 10mA < IO < 500mA 25 mV
Output Impedance 200mA DC and 100mA AC, fo = 120Hz 80
mΩ
Quiescent Current V
IN
= 5V 0.6 mA
Ripple Rejection fi = 120Hz,V
ripple
=2V
P-P,
Io = 100mA 46 dB IO = 1A 1.15 V IO = 500mA 420 mV
Dropout Voltage
I
O
= 100mA 200 mV Short Circuit Current 1.6 A Over Temperature 150
°C
Note 1:
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics.
Note 2:
The maximum power dissipation is a function of the maximum junction temperature, T
Jmax
; total thermal re-
sistance,
θ
JA
, and ambient temperature TA. The maximum allowable power dissipation at any ambient tem-
perature is T
jmax-TA
/
θ
JA
. If this dissipation is exceeded, the die temperature will rise above 150°C and IC
will go into thermal shutdown. For the G950 in SOT 223 package,
θ
JA
is 156°C/W; in TO 263 package,
θ
JA
is 75°C/W, and in the TO 252 package,
θ
JA
is 125°C/W (See recommend minimum footprint). The safe operation in SOT 223,TO 252 & TO 263 package, it can see “Typical Performance Characteristics” (Safe Operating Area).
Note3:
Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
Note4:
The type of output capacitor should be tantalum or aluminum.
Definitions
Dropout Voltage
The input/output Voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100mV below its nominal value. Dropout voltage is affected by junction temperature, load cur­rent and minimum input supply requirements.
Line Regulation
The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly af­fected.
Load Regulation
The change in output voltage for a change in load current at constant chip temperature. The measure­ment is made under conditions of low dissipation or by using pulse techniques such that average chip tem­perature is not significantly affected.
Maximum Power Dissipation
The maximum total device dissipation for which the regulator will operate within specifications.
Quiescent Bias Current
Current which is used to operate the regulator chip and is not delivered to the load.
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3
G950
Global Mixed-mode Technology Inc.
Typical Performance Characteristics
(VIN= +5V, CIN=1µF, C
OUT
=10µF, TA=25°C, unless otherwise noted.)
Ground Current vs. Load Current
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
1.60
1.80
2.00
0 100 200 300 400 500 600 700 800 900 1000
Load Current (mA)
Ground Current (mA)
Output Voltage vs. Load Current
2.480
2.500
2.520
2.540
2.560
2.580
2.600
0 100 200 300 400 500 600 700 800 900 1000
Load Current (mA)
Ootput Voltage (V)
Dropout Voltage vs. Load Current
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
0 100 200 300 400 500 600 700 800 900 1000
Load Current (mA)
Dropout Voltage (mV)
Line Transient Load Transient
Ch1: Vin (offset=5.0V) Ch2: Vout (offs et=2.50V) CIN = 1uF Iout=100mA
Ch1: Iout (1A/div) Ch2: Vout (offs et=2.50V)
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TEL: 886-3-5788833
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4
G950
Global Mixed-mode Technology Inc.
Typical Performance Characteristics
(VIN= +3.3V, CIN=1µF, C
OUT
=10µF, TA=25°C, unless otherwise noted.)
Output Voltage vs. Load Current
2.500
2.505
2.510
2.515
2.520
2.525
2.530
2.535
2.540
2.545
2.550
0 50 100 150 200 250 300 350 400 450 500 550 600
Load Current (mA)
Ootput Voltage (V)
Dropout Voltage vs. Load Current
0
50
100
150
200
250
300
350
400
450
500
0 50 100 150 200 250 300 350 400 450 500 550 600
Load Current (mA)
Dropout Voltage (mV)
Ground Current vs. Load Current
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
1.60
1.80
2.00
0 100 200 300 400 500 600
Load Current (mA)
Ground Current (mA)
Line Transient
Load Transient
Ch1: Vin (offset=3.3V) Ch2: Vout (offset=2.50V) CIN = 1uF Iout=100mA
Ch1: Iout (400mA/div) Ch2: Vout is AC coupled
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5
G950
Global Mixed-mode Technology Inc.
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
25 35 45 55 65 75 85 95 105 115 125
Amibent Temperature TA (°C)
Power Dissipation (W)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
25 35 45 55 65 75 85 95 105 115 125
Amibent Temperature TA (°C)
Power Dissipation (W)
Still Air 1oz Copper on SOT-223 Package Mounted on recommend mimimum footprint (R
θ
JA
=156°C/W)
Still Air 1oz Copper on TO-252 Package Mounted on recommend mimimum
footprint (R
θ
JA
=125°C/W)
Note: V
IN
(max)
<= 6.5V
0
200
400
600
800
1000
1200
1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0
Input-Output Voltage Differential VIN-V
OUT
(V)
Output Current (mA)
TA=25
TA=55
TA=85
TA=25°C,Still Air
1oz Copper on SOT-223 Package Mounted on recommended mimimum footprint (R
θ
JA
=156°C/W)
Maximum Recommend ed Output Current
0
200
400
600
800
1000
1200
1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0
Input-Output Voltaage Differential VIN-V
OUT
(V)
Output Current (mA)
TA=25
TA=55
TA=85
Maximum Recommend ed Output Current
Power Dissipation of TO-252
Safe Operating Area of SOT-223
Safe Operating Area of TO-252
Note: V
IN
(max)
<= 6.5V
Power Dissipation of SOT-223
TA=25°C,Still Air
1oz Copper on TO-252 Package Mounted on recommended mimimum footprint (R
θ
JA
=125°C/W)
Page 6
Ver: 1.6
Dec 31, 2002
TEL: 886-3-5788833
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6
G950
Global Mixed-mode Technology Inc.
0
200
400
600
800
1000
1200
1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0
Input-Output Voltaage Differential V
IN-VOUT
(V)
Output Current (mA)
TA=25
TA=55
TA=85
TA=25°C,Still Air
Maximum Recommend ed Output Current
1oz Copper on TO-263 Package Mounted on recommended mimimum footprint (R
θ
JA
=75°C/W)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
25 35 45 55 65 75 85 95 105 115 125
Amibent Temperature T
A
(°C)
Power Dissipation (W)
Still Air 1oz Copper on TO-263 Package Mounted on recommend mimimum footprint (R
θ
JA
=75°C/W)
Safe Operating Area of TO-263
Power Dissipation of TO-263
Note: V
(max)
<= 6.5V
Recommend Minimum Footprint
Page 7
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Dec 31, 2002
TEL: 886-3-5788833
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7
G950
Global Mixed-mode Technology Inc.
Package Information
TO-220 (T3) Package
MILLIMETERS INCHES
SYMBOLS
MIN MAX MIN MAX
A 4.318 4.826 0.170 0.190
A1 2.46 2.72 0.097 0.107
b 0.69 0.94 0.027 0.037
b1 1.143 1.397 0.045 0.055
C 0.304 0.460 0.012 0.018
D 3.429 3.683 0.135 0.145
D1 8.53 9.04 0.336 0.356
d 2.62 2.87 0.103 0.113
E 9.906 10.40 0.390 0.410
E1 2.84 5.13 0.112 0.202
e 2.29 2.79 0.090 0.110
e1 4.83 5.33 0.190 0.210
F 1.143 1.397 0.045 0.055
I 3.454 3.962 0.136 0.156
L 13.589 14.351 0.535 0.565
E
R
E1 E1
D
d
I
L
e
b
b1
e1
A
F
D1
C
A1
Page 8
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Dec 31, 2002
TEL: 886-3-5788833
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8
G950
Global Mixed-mode Technology Inc.
TO-252 (T4) Package
Notes:
1. Dimensioning and tolerancing per ansi y14.5m, 1982.
2.
Controlling dimension : inch
INCHES MILLIMETERS
DIM
MIN MAX MIN MAX
A 0.235 0.250 5.97 6.35
B 0.250 0.265 6.35 6.73
C 0.086 0.094 2.19 2.38
D 0.027 0.035 0.69 0.88
E 0.033 0.040 0.84 1.01
F 0.037 0.047 0.94 1.19
G 0.180BSC 4.58BSC
H 0.034 0.040 0.87 1.01
J 0.018 0.023 0.46 0.58
K 0.102 0.114 2.60 2.89
L 0.090BSC 2.29BSC
R 0.175 0.215 4.45 6.46
S 0.020 0.050 0.51 1.27
U 0.020 --- 0.51 ---
V 0.030 0.050 0.77 1.27
Z 0.138 --- 3.51 ---
R
B
V
A
K
S
12
3
F
L
D
G
4
2 PL
0.13 (0.005)MT
Z
E
C
T
SEATING PLANE
U
J
H
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Dec 31, 2002
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9
G950
Global Mixed-mode Technology Inc.
TO-263 (T5) Package
MILLIMETERS INCHES
SYMBOLS
MIN MAX MIN MAX
A 4.30 4.70 0.169 0.185
A1 1.22 1.32 0.048 0.055
A2 2.45 2.69 0.104 0.106
b 0.69 0.94 0.027 0.037
b1 1.22 1.40 0.048 0.055
C 0.36 0.56 0.014 0.022
D 8.64 9.652 0.340 0.380
E 9.70 10.54 0.382 0.415
e 2.29 2.79 0.090 0.110
e1 4.83 5.33 0.190 0.210
H 14.60 15.78 0.575 0.625
L 4.70 5.84 0.185 0.230
L1 1.20 1.778 0.047 0.070
L2 2.24 2.84 0.088 0.111
L3 1.40MAX 0.055MAX
e
L3
D
H
e1
b1
b
E
A
A1
C
A2
L2
L
L1
e
L3
D
H
e1
b1
b
E
A
A1
C
A2
L2
L
L1
Page 10
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TEL: 886-3-5788833
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10
G950
Global Mixed-mode Technology Inc.
SOT-223 (T6) Package
MILLIMETERS INCHES
SYMBOLS
MIN MAX MIN MAX
A 1.55 1.80 0.061 0.071
A1 0.02 0.12 0.0008 0.0047
B 0.60 0.80 0.024 0.031
B1 2.90 3.10 0.114 0.122
C 0.24 0.32 0.009 0.013
D 6.30 6.70 0.248 0.264
E 3.30 3.70 0.130 0.146
e 2.30 BSC 0.090 BSC
e1 4.60 BSC 0.181 BSC
H 6.70 7.30 0.264 0.287
L 0.90 MIN 0.036 MIN
L2 0.06 BSC 0.0024 BSC
α
0º 10º 0º 10º
Package Orientation
GMT Inc. d oes not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
A
B
13°(4X)
A1
e1
e
E
B1
D
H
C
α
13°(4X)
L2
L
Feed Direction
SOT 223 P ackage Orientation
Feed Direction
TO252
、、、、
263 Package Orientation
Feed Direction
SOT 223 P ackage Orientation
Feed Direction
TO252
、、、、
263 Package Orientation
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