Datasheet G949T73U, G949T73T, G949T73D, G949T73B, G941T24U Datasheet (GMT)

Ver: 5.5

May 13, 2002

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1

G940/G941

Global Mixed-mode Technology Inc.

3.7V 400mA Low Dropout Regulator

Features



Dropout voltage typically 0.8V @ IO = 400mA



Output current in excess of 400mA



Output voltage accuracy +3%/-2%



Quiescent current, typically 600µA



Internal short circuit current limit



Internal over temperature protection

General Description

The G940/G941 positive 3.7V voltage regulator fea­tures the ability to source 400mA of output current
with a dropout voltage of typically 0.8V over the en­tire operating temperature range. A low quiescent
current is provided over the entire output current
range. The typical quiescent current is 0.6mA. Fur­thermore, the quiescent current is smaller when the
regulator is in the dropout mode (V

IN

< 3.7V).
Familiar regulator features such as over temperature
and over current protection circuits are provided to
prevent it from being damaged by abnormal operating
conditions.

Ordering Information

PIN OPTION

ORDER NUMBER PACKAGE TYPE

1 2 3

G940T21U SOT 89 V

OUT

GND V

IN

G941T24U SOT 89 GND VIN V

OUT

G940T73U SOT 23 GND V

OUT

V

IN

*For other package types, pin options and package, please contact us at sales @gmt.com.tw

Order Number Identification

GXXX XX X X

Packing Type
Pin Option
Package Type
Part Number

PACKAGE TYPE PIN OPTION PACKING

T2 : SOT 89

1 2 3

U & D : Tape & Reel D Direction

T6 : SOT 223 1 : V

OUT

GND VIN T : Tube

T7 : SOT 23 2 : V

OUT

VIN GND B : Bag

T8 : µTO92 3 : GND V

OUT

VIN

4 : GND V

IN

V

OUT

5 : V

IN

GND V

OUT

6 : V

IN

V

OUT

GND

Typical Application Package Type

[Note 4] : Type of C

OUT

Top View

1

2

3

Top View

1

3

µTO 92

Top View

SOT 23

1

3

2

Top ViewTop View

1

2

3

SOT 89

、、、、

223

Top View

2

V

IN

G940

C1

0.47µF

IQ

V

OUT

I

O

C

OUT

10µF

Top ViewTop View

1

2

3

Top View

1

3

µTO 92

Top View

SOT 23

1

3

2

Top ViewTop View

1

2

3

SOT 89

、、、、

223

Top View

2

V

IN

G940

C1

0.47µF

IQ

V

OUT

I

O

C

OUT

10µF

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G940/G941

Global Mixed-mode Technology Inc.

Absolute Maximum Ratings

(Note 1)
Input Voltage……………………………..……..…..…10V
Power Dissipation Internally Limited ..(Note 2)
Maximum Junction Temperature………….….…...150°C
Storage Temperature Range…..…..…..-65°C ≤ T

J

≤+150°C
Lead Temperature, Time for Wave Soldering

SOT 89, SOT23 Package….….…..……..…....260°C, 4s

Continuous Power Dissipation (T

A

= + 25°C)

SOT 23

(1)

…….…………………….….……….……...0.3W

SOT 89

(1)

……………………….………..………..…0.42W

Note

(1)

: See Recommended Minimum Footprint.

Operating Conditions

(Note 1)
Input Voltage………………………….…………….4V~7V
Temperature Range………………….…0°C ≤ T

J

≤125°C

Electrical Characteristics

VIN =5V, IO = 400mA, CIN = 1 µF, C

OUT

=10 µF, All specifications apply for TA = TJ = 25°C. [Note 3]

PARAMETER CONDITIONS MIN TYP MAX UNITS

Output Voltage Accuracy IO = 10mA -2 - +3 %

Line Regulation VIN = 4V to 7V, IO = 50mA - 0.08 0.9 %/V

Load Regulation IO = 10mA to 400mA - - 2.2 %

Output Impedance 100mA DC and 100mA AC, fo = 120Hz - 100 - mΩ

Quiescent Current VIN=5V - 0.6 - mA

Ripple Rejection fi = 120 Hz, 1V

P-P

, Io = 100mA - 42 - dB

IO = 400mA - 0.8 0.9 V Dropout Voltage

I

O

= 100mA - 130 150 mV

Short Circuit Current - 0.76 - A

Over Temperature - 125 -

°C

Note 1:

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Condi­tions are conditions under which the device functions but the specifications might not be guaranteed. For
guaranteed specifications and test conditions see the Electrical Characteristics.

Note 2:

The maximum power dissipation is a function of the maximum junction temperature, T

Jmax

; total thermal re-

sistance,

θ

JA

, and ambient temperature TA. The maximum allowable power dissipation at any ambient tem-

perature is T

jmax-TA

/

θ

JA

. If this dissipation is exceeded, the die temperature will rise above 130°C and IC

will go into thermal shutdown. For the G940/G941 in SOT 23 package,

θ

JA

is 350°C/W and in the SOT 89
package is 250°C/W (See Recommend Minimum Footprint). The safe operation in SOT 23 & SOT 89
package, it can see “Typical Performance Characteristics” (Safe Operating Area).

Note3:

Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as
possible.

Note4:

The type of output capacitor should be tantalum or aluminum.

Definitions

Dropout Voltage

The input/output Voltage differential at which the
regulator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100mV below its nominal value, dropout
voltage is affected by junction temperature, load cur­rent and minimum input supply requirements.

Line Regulation

The change in output voltage for a change in input
voltage. The measurement is made under conditions
of low dissipation or by using pulse techniques such
that average chip temperature is not significantly af­fected.

Load Regulation

The change in output voltage for a change in load
current at constant chip temperature. The measure­ment is made under conditions of low dissipation or by
using pulse techniques such that average chip tem­perature is not significantly affected.

Maximum Power Dissipation

The maximum total device dissipation for which the
regulator will operate within specifications.

Quiescent Bias Current

Current which is used to operate the regulator chip
and is not delivered to the load.

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G940/G941

Global Mixed-mode Technology Inc.

Typical Performance Characteristics

(VIN=5V, CIN=1µF, C

OUT

=10µF, TA=25°C, unless otherwise noted.)

Ch1: Vout (offset=3.70V) Ch1: Iout (400mA/div)
Ch2: Vin (offset=5.0V) Ch2: Vout (offset=3.70V)
Iout=100mA

Ground Current vs. Load Current

Line Transient Load Transient

Output Voltage Accuracy vs. Load Curren

t

Dropout Voltage vs. Load Current

0

100

200

300

400

500

600

700

800

900

0 50 100 150 200 250 300 350 400 450

Load Current (mA)

Dropout Voltage (mV)

-1.000%

-0.500%

0.000%

0.500%

1.000%

1.500%

2.000%

0 50 100 150 200 250 300 350 4 00 4 50 500 550 600

Load Current (mA)

Output Voltage Accuracy

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

0 50 1 00 150 200 250 300 350 400

Load Current (mA)

Ground Current (mA)

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G940/G941

Global Mixed-mode Technology Inc.

Recommend Minimum Footprint

Note: V

IN(max)

<= 6.5V

Safe Operating Area

[Power Dissipation Limit]

0

50

100

150

200

250

300

350

400

450

500

0.0 0. 4 0.8 1.2 1.6 2. 0 2.4 2.8

Input-Output V oltage Differenti al VIN-V

OUT

(V)

Output Current (mA)

TA=25

℃

TA=55

℃

TA=85

℃

Maximum Recommended Output Cur rent

Maximum Power Dissipation of SOT 89

0

0.1

0.2

0.3

0.4

0.5

0.6

25 35 45 55 65 75 85 95 105 115 12 5

Amibent Temperature TA (°C)

Power Dissipation (W)

Note: V

IN(max)

<= 6.5V

Safe Operating Area

[Power Dissipation Limit]

0

50

100

150

200

250

300

350

400

450

500

0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8

Input-Output V oltage Differenti al VIN-V

OUT

(V)

Output Current (mA)

TA=25

℃

TA=55

℃

TA=85

℃

Maximum Recommended Output Cur rent

0.0

0.1

0.2

0.3

0.4

0.5

25 35 45 55 65 75 85 95 105 115 125

Amibent Temperature TA (°C)

Power Dissipation (W)

Maximum Power Dissipation of SOT 23

TA=25°C,Still Air

1oz Copper on SO T 23 Package
Mounted on recommended mimimum footprint (RθJA=350°C/W )

Still Air
1oz Copper on SO T 23 Package
Mounted on recommend mi mimum footprint (RθJA=350°C/W)

TA=25°C,Still Air

1oz Copper on SO T 89 Package
Mounted on recommended mimimum footprint (RθJA=250°C/W)

Still Air
1oz Copper on SO T 89 Package
Mounted on recommend mi mimum footprint (RθJA=250°C/W)

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G940/G941

Global Mixed-mode Technology Inc.

Package Information

SOT-89 (T2) Package

DIMENSIONS IN MILLIMETERS DIMENSIONS IN INCHES

SYMBOLS

MIN NOM MAX MIN NOM MAX

A 1.40 1.50 1.60 0.055 0.059 0.063

A1 0.80 1.04 ----- 0.031 0.041 -----

b 0.36 0.42 0.48 0.014 0.016 0.048

b1 0.41 0.47 0.53 0.016 0.018 0.020

C 038 0.40 0.43 0.014 0.015 0.017

D 4.40 4.50 4.60 0.173 0.177 0.181

D1 1.40 1.60 1.75 0.055 0.062 0.069

HE ----- ----- 4.25 ----- ----- 0.167

E 2.40 2.50 2.60 0.094 0.098 0.102

e 2.90 3.00 3.10 0.114 0.118 0.122

D

D1

E

A1

HE

e

b

b

b1

A

POLISH

MATTE FINISH

C

POLISH

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G940/G941

Global Mixed-mode Technology Inc.

SOT-223 (T6) Package

MILLIMETERS INCHES

SYMBOLS

MIN MAX MIN MAX

A 1.55 1.80 0.061 0.071

A1 0.02 0.12 0.0008 0.0047

B 0.60 0.80 0.024 0.031

B1 2.90 3.10 0.114 0.122

C 0.24 0.32 0.009 0.013

D 6.30 6.70 0.248 0.264

E 3.30 3.70 0.130 0.146

e 2.30 BSC 0.090 BSC

e1 4.60 BSC 0.181 BSC

H 6.70 7.30 0.264 0.287

L 0.90 MIN 0.036 MIN

L2 0.06 BSC 0.0024 BSC

α

0º 10º 0º 10º

A

B

13°(4X)

A1

e1

e

E

B1

D

H

C

α

13°(4X)

L2

L

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G940/G941

Global Mixed-mode Technology Inc.

SOT-23 (T7) Package

Note:

1.

Package body sizes exclude mold flash protrusions or gate burrs

2.

Tolerance ±0.1000 mm (4mil) unless otherwise specified

3.Coplanarity: 0.1000mm

4.Dimension L is measured in gage plane

DIMENSIONS IN MILLIMETERS

SYMBOLS

MIN NOM MAX

A 1.00 1.10 1.30

A1 0.00 ----- 0.10

A2 0.70 0.80 0.90

b 0.35 0.40 0.50

C 0.10 0.15 0.25

D 2.70 2.90 3.10

E 1.40 1.60 1.80

e ----- 1.90(TYP) -----

H 2.60 2.80 3.00

L 0.37 ------ -----

θ

1

1º 5º 9º

H

D

e

E

L

C

θ

1

b

A2

A

A1

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G940/G941

Global Mixed-mode Technology Inc.

µTO-92 (T8) Package

DIMENSIONS IN MILLIMETERS

DIMENSIONS IN INCHES

SYMBOLS

MIN NOM MAX MIN NOM MAX

A 2.40 2.50 2.60 0.094 0.098 0.102

A1 0.70 0.80 0.90 0.028 0.032 0.036

b 0.35 0.45 0.55 0.014 0.018 0.022

C ----- 0.40 ----- ----- 0.016 -----

D 2.80 3.00 3.20 0.110 0.118 0.126

E 3.80 4.00 4.20 0.149 0.157 0.165

e ----- 1.27 ----- ----- 0.050 -----

F 1.91 2.11 2.31 0.075 0.083 0.091

G 3.35 3.55 3.75 0.132 0.140 0.148

H 0.00 ----- 0.15 0.000 ----- 0.006

L 13.80 14.00 14.20 0.543 0.551 0.559

θ

1

----- 2° ----- ----- 2° -----

θ

2

----- 5° ----- ----- 5° -----

Package Orientation

GMT Inc. d oes not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.

Feed Direction

SOT 23 Package Orientation

Feed Direction

SOT 23 Package Orientation

Feed Direction

SOT 89

、、、、

223 Package Orientation

Feed Direction

SOT 89

、、、、

223 Package Orientation

E

D

L

H

e

b

θ

2 (2 X)

θ

1(2 X)

C

G

A1

A

R2.00

E

D

L

H

e

b

θ

2 (2 X)

θ

1(2 X)

C

G

A1

A

R2.00