Datasheet G931T24U, G931T24T, G931T24D, G931T24B, G930T21U Datasheet (GMT)

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Page 1
Ver: 4.5
May 13, 2002
TEL: 886-3-5788833
http://www.gmt.com.tw
1
G930/G931
Global Mixed-mode Technology Inc.
3.5V 400mA Low Dropout Regulator
Features

Dropout voltage typically 0.8V @ IO = 400mA

Output current in excess of 400mA

Output voltage accuracy +3%/-2%

Quiescent current, typically 600
µµµµ
A

Internal short circuit current limit

Internal over temperature protection
General Description
The G930/G931 positive 3.5V voltage regulator fea­tures the ability to source 400mA of output current with a dropout voltage of typically 0.8V over the en­tire operating temperature range. A low quiescent current is provided over the entire output current range. The typical quiescent current is 0.6mA. Fur­thermore, the quiescent current is smaller when the regulator is in the dropout mode (V
IN
< 3.5V). Familiar regulator features such as over temperature and over current protection circuits are provided to prevent it from being damaged by abnormal operating conditions.
Ordering Information
PIN OPTION
ORDER NUMBER PACKAGE TYPE
1 2 3
G930T21U SOT 89 V
OUT
GND V
IN
G931T24U SOT 89 GND V
IN
V
OUT
* For other package types, pin options and package, please contact us at sales @gmt.com.tw
Order Number Identification
GXXX XX X X
Packing Type Pin Option Package Type Part Number
PACKAGE TYPE PIN OPTION PACKING
T2 : SOT 89
1 2 3
U & D : Tape & Reel Direction
T6 : SOT 223 1 : V
OUT
GND VIN T : Tube
T7 : SOT 23 2 : V
OUT
VIN GND B : Bag
T8 : µTO92 3 : GND V
OUT
VIN
4 : GND V
IN
V
OUT
5 : V
IN
GND V
OUT
6 : V
IN
V
OUT
GND
Typical Application Package Type
[Note 4] : Type of C
OUT
Top View
1
2
3
Top View
1
3
µTO 92
Top View
SOT 23
1
3
2
Top ViewTop View
1
2
3
SOT 89、223
Top View
2
V
IN
G930
C1
0.47µF
IQ
V
OUT
I
O
C
OUT
10µF
Top ViewTop View
1
2
3
Top View
1
3
µTO 92
Top View
SOT 23
1
3
2
Top ViewTop View
1
2
3
SOT 89、223
Top View
2
V
IN
G930
C1
0.47µF
IQ
V
OUT
I
O
C
OUT
10µF
Page 2
Ver: 4.5
May 13, 2002
TEL: 886-3-5788833
http://www.gmt.com.tw
2
G930/G931
Global Mixed-mode Technology Inc.
Absolute Maximum Ratings
(Note 1)
Input Voltage…………………………..……….………10V
Power Dissipation Internally Limited (Note 2)
Maximum Junction Temperature……………....……..150°C
Storage Temperature Range…..…..-65°C ≤ T
J
≤+150°C Lead Temperature, Time for Wave Soldering SOT-89 Package……………..………………...260°C, 4s Continuous Power Dissipation (T
A
= +25°C)
SOT89
(1)
:…………………………………..……..…0.42W
Note
(1)
:See Recommended Minimum Footprint.
Operating Conditions
(Note 1) Input Voltage……………………………………….4V~7V Temperature Range……………………0°C ≤ T
J
≤125°C
Electrical Characteristics
VIN =5V, IO = 400mA, CIN = 1µF, C
OUT
=10 µF, All specifications apply for TA = TJ = 25°C. [Note 3]
PARAMETER CONDITIONS MIN TYP MAX UNITS
Output Voltage 5mA < IO <400mA 3.43 3.5 3.605 V
Line Regulation 4V < VIN < 7V, IO = 10mA 22 mV
Load Regulation 50mA < IO < 400mA 30 mV
Output Impedance 100mA DC and 100mA AC, fo = 120Hz 103 mΩ
Quiescent Current V
IN
= 5V 0.6 mA
Ripple Rejection fi = 120Hz, 1V
P-P,
Io = 100mA 42 dB
IO = 400mA 0.8 0.9 V
Dropout Voltage
I
O
= 100mA 125 150 mV
Short Circuit Current 0.77 A
Over Temperature 125
°C
Note 1:
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics.
Note 2:
The maximum power dissipation is a function of the maximum junction temperature, T
Jmax
; total thermal re-
sistance,
θ
JA
, and ambient temperature TA. The maximum allowable power dissipation at any ambient tem-
perature is T
jmax-TA
/
θ
JA
. If this dissipation is exceeded, the die temperature will rise above 130°C and IC
will go into thermal shutdown. For the G930/G931 in SOT 89 package,
θ
JA
is 250°C/W. (See Recom­mended Minimum Footprint). The safe operation in SOT 89, it can see “Typical Performance Characteris­tics” (Safe Operating Area).
Note3:
Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as pos­sible.
Note4:
The type of output capacitor should be tantalum or aluminum.
Definitions
Dropout Voltage
The input/output Voltage differential at which the regu­lator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100mV below its nominal value, dropout voltage is affected by junction temperature, load cur­rent and minimum input supply requirements.
Line Regulation
The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly af­fected.
Load Regulation
The change in output voltage for a change in load current at constant chip temperature. The measure­ment is made under conditions of low dissipation or by using pulse techniques such that average chip tem­perature is not significantly affected.
Maximum Power Dissipation
The maximum total device dissipation for which the regulator will operate within specifications.
Quiescent Bias Current
Current which is used to operate the regulator chip and is not delivered to the load.
Page 3
Ver: 4.5
May 13, 2002
TEL: 886-3-5788833
http://www.gmt.com.tw
3
G930/G931
Global Mixed-mode Technology Inc.
Typical Performance Characteristics
(VIN=5V, CIN=1µF , C
OUT
=10µF, TA=25°C , unless otherwise noted.)
Ch1: Vout (offset=3.50V) Ch1: Iout (400mA/div)
Ch2: Vin (offset=5.0V) Ch2: Vout (offset=3.50V)
Iout=100mA
Ground Current vs. Load Current
Line Transient Load Transient
Output Voltage vs. Load Current Dropout Voltage vs. Load Current
3.49
3.50
3.51
3.52
3.53
3.54
3.55
3.56
0 100 200 300 400 500 600
Load Current (mA)
Output Voltage (V)
0
100
200
300
400
500
600
700
800
0 100 200 300 400
Load Current (mA)
Dropout Voltage (mV)
0.60
0.70
0.80
0.90
1.00
1.10
1.20
1.30
1.40
1.50
1.60
0 100 200 300 400
Load Current (mA)
Ground Current (mA)
Page 4
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TEL: 886-3-5788833
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4
G930/G931
Global Mixed-mode Technology Inc.
Recommended Minimum Footprint
Note: V
IN(max)
<= 6.5V
0
50
100
150
200
250
300
350
400
450
500
0.0 0.5 1.0 1. 5 2.0 2.5 3.0
Input-Output Volt age Differential VIN-V
OUT
(V)
Output Current (mA)
TA=25
TA=55
TA=85
Maximu m Recommen ded Out put Cur rent
0
0.1
0.2
0.3
0.4
0.5
0.6
25 35 45 55 65 75 85 95 105 115 125
Amibent Tem perature TA (°C)
Power Dissipation (W)
TA=25°C,Still Air
Safe Operating Area
[Power Dissipation Limit]
1oz Copper on SOT-8 9 Package Mounted on recommended mimimum foot
p
rint (RθJA=250°C/W
)
Still Air 1oz Copper on SOT89 P ackage Mount ed on r ecommend mi mimum foo tprin t (RθJA=250°C/W)
Maximum Power Dissipation of SOT-89
Page 5
Ver: 4.5
May 13, 2002
TEL: 886-3-5788833
http://www.gmt.com.tw
5
G930/G931
Global Mixed-mode Technology Inc.
Package Information
SOT- 89 (T2) Package
DIMENSIONS IN MILLIMETERS DIMENSIONS IN INCHES
SYMBOLS
MIN NOM MAX MIN NOM MAX
A 1.40 1.50 1.60 0.055 0.059 0.063
A1 0.80 1.04 ----- 0.031 0.041 -----
b 0.36 0.42 0.48 0.014 0.016 0.048
b1 0.41 0.47 0.53 0.016 0.018 0.020
C 038 0.40 0.43 0.014 0.015 0.017
D 4.40 4.50 4.60 0.173 0.177 0.181
D1 1.40 1.60 1.75 0.055 0.062 0.069
HE ----- ----- 4.25 ----- ----- 0.167
E 2.40 2.50 2.60 0.094 0.098 0.102
e 2.90 3.00 3.10 0.114 0.118 0.122
D
D1
E
A1
HE
e
b
b
b1
A
POLISH
MATTE FINISH
C
POLISH
Page 6
Ver: 4.5
May 13, 2002
TEL: 886-3-5788833
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6
G930/G931
Global Mixed-mode Technology Inc.
SOT-223 (T6) Package
MILLIMETERS INCHES
SYMBOLS
MIN MAX MIN MAX
A 1.55 1.80 0.061 0.071
A1 0.02 0.12 0.0008 0.0047
B 0.60 0.80 0.024 0.031
B1 2.90 3.10 0.114 0.122
C 0.24 0.32 0.009 0.013
D 6.30 6.70 0.248 0.264
E 3.30 3.70 0.130 0.146
e 2.30 BSC 0.090 BSC
e1 4.60 BSC 0.181 BSC
H 6.70 7.30 0.264 0.287
L 0.90 MIN 0.036 MIN
L2 0.06 BSC 0.0024 BSC
α
0º 10º 0º 10º
A
B
13°(4X)
A1
e1
e
E
B1
D
H
C
α
13°(4X)
L2
L
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May 13, 2002
TEL: 886-3-5788833
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7
G930/G931
Global Mixed-mode Technology Inc.
SOT 23 (T7) Package
Note:
1. Package body sizes exclude mold flash protrusions or gate burrs
2. Tolerance ±0.1000 mm (4mil) unless otherwise specified
3. Coplanarity: 0.1000mm
4. Dimension L is measured in gage plane
DIMENSIONS IN MILLIMETERS
SYMBOLS
MIN NOM MAX
A 1.00 1.10 1.30
A1 0.00 ----- 0.10
A2 0.70 0.80 0.90
b 0.35 0.40 0.50
C 0.10 0.15 0.25
D 2.70 2.90 3.10
E 1.40 1.60 1.80
e ----- 1.90(TYP) -----
H 2.60 2.80 3.00
L 0.37 ------ -----
θ
1
1º 5º 9º
H
D
e
E
L
C
θ
1
b
A2
A
A1
H
D
e
E
L
C
θ
1
b
A2
A
A1
Page 8
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May 13, 2002
TEL: 886-3-5788833
http://www.gmt.com.tw
8
G930/G931
Global Mixed-mode Technology Inc.
µTO-92 (T8) Package
DIMENSIONS IN MILLIMETERS
DIMENSIONS IN INCHES
SYMBOLS
MIN NOM MAX MIN NOM MAX
A 2.40 2.50 2.60 0.094 0.098 0.102
A1 0.70 0.80 0.90 0.028 0.032 0.036
b 0.35 0.45 0.55 0.014 0.018 0.022
C ----- 0.40 ----- ----- 0.016 -----
D 2.80 3.00 3.20 0.110 0.118 0.126
E 3.80 4.00 4.20 0.149 0.157 0.165
e ----- 1.27 ----- ----- 0.050 -----
F 1.91 2.11 2.31 0.075 0.083 0.091
G 3.35 3.55 3.75 0.132 0.140 0.148
H 0.00 ----- 0.15 0.000 ----- 0.006
L 13.80 14.00 14.20 0.543 0.551 0.559
θ
1
----- 2° ----- ----- 2° -----
θ
2
----- 5° ----- ----- 5° -----
Package Orientation
GMT Inc. d oes not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
Feed Direction
SOT 23 Package Orientation
Feed Direction
SOT 23 Package Orientation
Feed Direction
SOT 89、223 Package Orientation
Feed Direction
SOT 89、223 Package Orientation
E
D
L
H
e
b
θ
2 (2 X)
θ
1(2 X)
C
G
A1
A
R2.00
E
D
L
H
e
b
θ
2 (2 X)
θ
1(2 X)
C
G
A1
A
R2.00
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