Page 1
Global Mixed-mode Technology Inc.
150mA Low-Noise LDO Regulators
Features
Ultra Low Output Noise
Ultra Low 55µA No-Load Supply Current
Ultra Low Dropout 70mV @ 50mA Load
Guarantee 150mA Output Current
Over-Temperature and Short-Circuit Protection
Fixed: 2.70V (G914A), 2.80V (G914B)
3.00V (G914C), 3.30V (G914D)
2.50V (G914E), 2.85V (G914F)
1.50V(G914G), 1.80V(G914H)
Max. Supply Current in Shutdown Mode < 1µA
Stable with low cost ceramic capacitors
Applications
Notebook Computers
Cellular Phones
PDA
Hand-Held Devices
Battery-Powered Application
Pin Configuration
30µV (rms)
G914X
General Description
The G914X is a low supply current, low dropout linear
regulator that comes in a space saving SOT23-5
package. The supply current at no-load is 55µA. In the
shutdown mode, the maximum supply current is less
than 1µA. Operating voltage range of the G914X is
from 2.5V to 5.5V. The over-current protection limit is
set at 350mA typical and 200mA minimum. An
over-temperature protection circuit is built-in in the
G914X to prevent thermal overload. These power
saving features make the G914X ideal for use in the
battery-powered applications such as notebook computers, cellular phones, and PDA’s.
Ordering Information
PART MARKING VOLTAGE
G914A 4Axx 2.70V -40°C~ +85°C SOT 23-5
G914B 4Bxx 2.80V -40°C~ +85°C SOT 23-5
G914C 4Cxx 3.00V -40°C~ +85°C SOT 23-5
G914D 4Dxx 3.30V -40°C~ +85°C SOT 23-5
G914E 4Exx 2.50V -40°C~ +85°C SOT 23-5
G914F 4Fxx 2.85V -40°C~ +85°C SOT 23-5
G914G 4Gxx 1.50V -40°C~ +85°C SOT 23-5
G914H 4Hxx 1.80V -40°C~ +85°C SOT 23-5
TEMP.
RANGE
PIN-
PACKAGE
Typical Operating Circuit
IN
IN
1
1
2
2
GND
GND
3
SHDN
SHDN
Ver: 1.1
Sep 18, 2002
3
G914X
G914X
SOT23-5
SOT23-5
OUTPUT
OUT
OUT
5
5
＋
＋
C
C
IN
IN
_
_
1µF
BATTERY
BATTERY
4
4
BYP
BYP
1µF
IN OUT
IN OUT
G914X
G914X
SHDN
SHDN
GND
GND
Fixed mode
Fixed mode
BYP
BYP
C
C
BYP
BYP
10nF
10nF
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OUTPUT
VOLTAGE
VOLTAGE
C
C
OUT
OUT
1µF
1µF
Page 2
Global Mixed-mode Technology Inc.
Absolute Maximum Ratings
VIN to GND……..………………..….….………-0.3V to +7V
Output Short-Circuit Duration.…..….……..…….….Infinite
All Other Pins to GND……….……….-0.3V to (V
Continuous Power Dissipation (T
= +25°C)
A
SOT23-5 …………………………..…………...…..520 mW
+ 0.3V)
IN
G914X
Operating Temperature Range….…..... -40°C to +85°C
Junction Temperature………………...…….……+150°C
(1)
…....……………….………………..…..240°C/Watt
θ
JA
Storage Temperature Range………….-65°C to +160°C
Lead Temperature (soldering, 10sec)….….……+300°C
Note (1): See Recommended Minimum Footprint (Figure 2)
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress rat-
ings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of
the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Electrical Characteristics
(VIN=V
OUT(STD)
+1V, V
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Input Voltage (Note 2) VIN Note2 5.5 V
Output Voltage Accuracy V
Maximum Output Current 300 mA
Current Limit (Note 3) I
Ground Pin Current IQ VIN =3.6V
Dropout Voltage (Note 4) V
Line Regulation
Load Regulation (Note 5)
Power Supply Rejection Ratio PSRR I
Output Voltage Temperature Coefficient
Output Voltage Noise
(10Hz to 100kHz)
(G914H)
SHUTDOWN
SHDN
Input Threshold
SHDN
Input Bias Current
Shutdown Supply Current I
THERMAL PROTECTION
Thermal Shutdown Temperature T
Thermal Shutdown Hysteresis
Note 1: Limits is 100% production tested at T
maintain junction temperature as close to ambient as possible.
Note 2: V
IN (min)=VOUT (STD)+VDROPOUT
Note 3: Not tested. For design purposes, the current limit should be considered 150mA minimum to 420mA maximum.
Note 4: The dropout voltage is defined as (V
The performance of every G914X version, see “Typical Performance Characteristics”.
Note 5: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested
for load regulation in the load range from 0mA to 150mA. Changes in output due to heating effects are covered by the thermal regulation specification.
SHDN
=VIN, TA=TJ =25°C, unless otherwise noted.) (Note 1)
Variation from specified V
For G914H, I
OUT
For G914G, I
350 mA
LIM
I
= 1mA 2
OUT
I
= 50mA, V
OUT
DROP
= 150mA
I
OUT
V
Δ
∆
∆
V
VIN=V
LNR
V
I
LDR
/ΔT
O
VIN=V
e
n
I
+100mV to 5.5V, I
OUT
= 0mA to 150mA 1 %
OUT
= 30mA C
OUT
= 50mA, TJ = 25°C to 125°C 30 ppm/°C
OUT
+1V
OUT
=1mA -3 3
OUT
=1mA -4 4
OUT
I
LOAD
I
LOAD
OUT
V
O (NOM)
2.5V≤VO
V
O (NOM)
V
O (NOM)
= 10nF, f = 120HZ 57 dB
BYP
C
OUT
C
OUT
C
OUT
C
OUT
, I
OUT
OUT
= 0mA 55 120
= 50mA 145
2.7V Version 70
≥
≥ 3.0V 230 300
≤
(NOM)
= 1.8V 380 480
= 1.5V 510 610
= 1mA 0.1 0.28 %/V
OUT
= 1µF, I
= 1µF, I
= 1µF, I
= 1µF, I
OUT
OUT
OUT
OUT
VIH Regulator enabled V
V
Regulator shutdown 0.4
IL
T
= VIN
V
I
SHDN
Q SHDN
SHDN
T
∆
SHDN
SHDN
V
= 0V TA = +25°C 1
OUT
150 °C
15 °C
= +25°C. Low duty pulse techniques are used during test to
A
= +25°C
A
- V
IN
) when V
OUT
is 100mV below the value of V
OUT
=1mA,V
2.5V version -2 2
≥
OUT
%
µA
mV
2.85V 250 330
= 150mA, C
= 150mA, C
= 150mA, C
= 1mA, C
=1nF 52
BYP
=10nF 35
BYP
= 100nF 30
BYP
= 10nF 26
BYP
- 0.7
IN
0.003 0. 1
for VIN = V
OUT
OUT
mV
µV
RMS
V
µA
+1V.
Ver: 1.1
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics
(V
IN
= V
O(STD)
+1V, V
Output Voltage vs. Load Current Ground Current vs. Load Current
SHDN
= VIN, CIN=1µF, C
=1µF, G914D, TA =25°C, unless otherwise noted.)
OUT
G914X
3.340
3.330
3.320
3.310
3.300
3.290
3.280
3.270
3.260
Output Voltage (V)
3.250
3.240
0 102030405060708090100110120130140150
Load Current (mA)
250
200
150
100
50
Ground Current (µA)
0
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
Load Current (mA)
Output Voltage vs. Input Voltage Supply Current vs. Input Voltage
3.50
3.00
2.50
2.00
1.50
1.00
Output Voltage (V)
0.50
0.00
0123456
No Load
Input Voltage (V)
130
120
110
100
90
80
70
60
50
40
30
20
Supply Current (µA)
10
0
01234567
ILOAD=0A
Input Voltage (V)
ILOAD=50mA
Dropout Voltage vs. Loading by G914X Ouptut Noise 10HZ to 100KHZ
800
700
600
500
400
300
200
Dropout Voltage (mV)
100
0
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
G914G
Loading (mA)
G914H
TA=25°C
G914E
G914A
G914B
G914F
G914C
G914D
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics
Line Transient Load Transient
Load Transient Power Supply Rejection Ripple
(continued)
G914X
80
70
60
50
40
30
20
10
Power Supply Rejection Ratio(db)
0
0.1 1 10 100
Frequency(KHZ)
G914F
V
=5V +2V(p-p)
IN
RL=100
Ω
CBYP=10nF
Output Noise vs. Bypass Capacitance Output Noise vs. Load Current
70
60
50
C
40
30
OUT
=1µF
G914H
V
=2.8V
IN
=25°C
T
A
70
60
50
C
=1µF
40
30
OUT
G914H
=2.8V
V
IN
T
=25°C
A
20
Output Noise (µVrms)
10
0
0.001 0.01 0.1
Ver: 1.1
Sep 18, 2002
Bypass Capacitance (µF)
4
20
Output Noise (µVrms)
10
0
1 10 100 1000
Load Current (mA)
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics
Turn On Response Time Turn Off Response Time
Shutdown Pin Delay Shutdown Response Time
(continued)
G914X
Turn-On Time vs. Bypass Capacitance Turn-Off Time vs. Bypass Capacitance
100000
10000
Prop Delay
1000
100
Time (µs)
10
1
0.1 1 10 100
Rise Tim e
Bypass Capactor (nF)
G914D
I
LOAD
C
IN=COUT
=150mA
=1µF
1000
Prop Delay
100
Fall Time
Time (µs)
10
1
0.1 1 10 100
Bypass Capacitor (nF)
G914D
I
LOAD
C
IN=COUT
=150mA
=1µF
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics
100
G914D
V
=4.3V
IN
80
=0A
I
OUT
60
40
(continued)
G914X
SHDN Input Bias Current vs. TemperatureGround Current vs. Temperature
0.2
G914D
=4.3V
V
IN
0.1
0
Ground Current (µA)
20
0
-40-30-20-10 0 102030405060708090100110120130
Junction Temperature TJ (°C)
Shutdown Supply Current vs. Temperature
1
0.8
G914D
V
=4.3V
IN
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
Shutdown Supply Current (µA)
-1
-40-30-20-10 0 102030405060708090100110120130
Junction Temperature TJ (°C)
-0.1
SHDN Input Bias Current (µA)
-0.2
-40-30-20-10 0 102030405060708090100110120130
Junction Temperature TJ (°C)
Output Voltage vs. Temperature
3.34
G914D
I
=1mA
LOAD
3.33
3.32
3.31
3.3
Output Voltage (V)
3.29
3.28
-40-30-20-10 0 102030405060708090100110120130
VIN=5.5V
V
VIN=3.4V
Junction Temperature TJ (°C)
=4.3V
Dropout Voltage vs. Temperature
400
G914D
350
300
250
200
150
Dropout Voltage (mV)
100
50
0
-40-30-20-100 102030405060 708090100110120130
I
LOAD
=150mA
I
LOAD
=50mA
I
LOAD
Junction Temperature TJ (°C)
Ver: 1.1
Sep 18, 2002
=0mA
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Global Mixed-mode Technology Inc.
Pin Description
G914X
PIN
NAME
FUNCTION
1 IN Regulator Input. Supply voltage can range from +2.5V to +5.5V. Bypass with 1µF to GND.
2 GND
3
SHDN
4 BYP
5 OUT
Ground. This pin also functions as a heatsink. Solder to large pads or the circuit board ground
plane to maximize thermal dissipation.
Active-High Enable Input. A logic low reduces the supply current to less than 1µA. Connect to IN for
normal operation.
This is a reference bypass pin. It should connect external 10nF capacitor to GND to reduce output noise. Bypass capacitor must be no less than 1nF. (C
BYP
1nF)
≥
Regulator Output. Sources up to 150mA. Bypass with a 1µF, ＜0.2Ω typical ESR capacitor to
GND.
Detailed Description
Similarly, when the feedback voltage is less than
1.25V, the error amplifier causes the output PMOS to
The block diagram of the G914X is shown in Figure 1.
It consists of an error amplifier, 1.25V bandgap reference, PMOS output transistor, internal feedback voltage divider, shutdown logic, over current protection
circuit, and over temperature protection circuit.
The internal feedback voltage divider’s central tap is
connected to the non-inverting input of the error amplifier. The error amplifier compares non-inverting input
with the 1.25V bandgap reference. If the feedback
voltage is higher than 1.25V, the error amplifier’s output becomes higher so that the PMOS output transistor has a smaller gate-to-source voltage (V
). This
GS
reduces the current carrying capability of the PMOS
output transistor, as a result the output voltage decreases until the feedback voltage is equal to 1.25V.
conduct more current to pull the feedback voltage up
to 1.25V. Thus, through this feedback action, the error
amplifier, output PMOS, and the voltage divider effectively form a unity-gain amplifier with the feedback
voltage force to be the same as the 1.25V bandgap
reference. The output voltage, V
, is then given by
OUT
the following equation:
V
= 1.25 (1 + R1/R2). (1)
OUT
Alternatively, the relationship between R1 and R2 is
given by:
R1 = R2 (V
/ 1.25 + 1). (2)
OUT
For the output voltage versions of G914X, the output
voltages are 2.7V for G914A, 2.8V for G914B, 3.0V for
G914C, 3.3V for G914D, and 2.5V for G914E, 2.85V
for G914F, 1.50V for G914G and 1.80V for G914H.
IN
IN
SHDN
SHDN
－
GND
GND
SHUTDOWN
SHUTDOWN
LOGIC
LOGIC
OVER TEMP.
OVER TEMP.
PROTECT
PROTECT
－
ERROR
ERROR
AMP
AMP
＋
＋
1.25V
1.25V
Vref
Vref
Figure 1. Functional Diagram
OVER CURRENT
OVER CURRENT
PROTECT & DYNAMIC
PROTECT & DYNAMIC
FEEDBACK
FEEDBACK
R1
R1
R2
R2
OUT
OUT
BYP
BYP
C
C
BYP
BYP
Ver: 1.1
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Page 8
Over Current Protection
The G914X use a current mirror to monitor the output
current. A small portion of the PMOS output transistor’s
current is mirrored onto a resistor such that the voltage
across this resistor is proportional to the output current.
This voltage is compared against the 1.25V reference.
Once the output current exceeds the limit, the PMOS
output transistor is turned off. Once the output transistor
is turned off, the current monitoring voltage decreases
to zero, and the output PMOS is turned on again. If the
over current condition persist, the over current protection circuit will be triggered again. Thus, when the output
is shorted to ground, the output current will be alternating between 0 and the over current limit. The typical
over current limit of the G914X is set to 350mA. Note
that the input bypass capacitor of 1µF must be used in
this case to filter out the input voltage spike caused by
the surge current due to the inductive effect of the
package pin and the printed circuit board’s routing wire.
Otherwise, the actual voltage at the IN pin may exceed
the absolute maximum rating.
Over Temperature Protection
To prevent abnormal temperature from occurring, the
G914X has a built-in temperature monitoring circuit.
When it detects the temperature is above 150
output transistor is turned off. When the IC is cooled
down to below 135
this way, the G914X will be protected against abnormal junction temperature during operation.
Shutdown Mode
When the
the G914X enters shutdown mode. All the analog circuits are turned off completely, which reduces the current consumption to only the leakage current. The output is disconnected from the input. When the output has
no load at all, the output voltage will be discharged to
ground through the internal resistor voltage divider.
Operating Region and Power Dissipation
Since the G914X is a linear regulator, its power dissipation is always given by P = I
maximum power dissipation is given by:
P
DMAX
Where (T
G914X die and the ambient air,
resistance of the chosen package to the ambient air.
For surface mount device, heat sinking is accomplished by using the heat spreading capabilities of the
PC board and its copper traces. In the case of a
SOT23-5 package, the thermal resistance is typically
o
240
C/Watt. (See Recommended Minimum Footprint)
[Figure 2]. Refer to Figure 3 is the G914X valid operating region (Safe Operating Area) & refer to Figure 4
is maximum power dissipation of SOT 23-5.
Global Mixed-mode Technology Inc.
o
C, the
o
C, the output is turned on again. In
SHDN pin is connected a logic low voltage,
(VIN – V
OUT
= (TJ – TA)/
– TA) is the temperature difference the
J
= (150-25) / 240 = 520mW
θ
JA
, is the thermal
θ
JA
OUT
). The
G914X
The die attachment area of the G914X’s lead frame is
connected to pin 2, which is the GND pin. Therefore,
the GND pin of G914X can carry away the heat of the
G914X die very effectively. To improve the power dissipation, connect the GND pin to ground using a large
ground plane near the GND pin.
Applications Information
Capacitor Selection and Regulator Stability
Normally, use a 1µF capacitor on the input and a 1µF
capacitor on the output of the G914X. Larger input capacitor values and lower ESR provide better supply-noise rejection and transient response. A highervalue input capacitor (10µF) may be necessary if large,
fast transients are anticipated and the device is located
several inches from the power source. For stable operation over the full temperature range, with load currents
up to 120mA, a minimum of 1µF is recommended.
Power-Supply Rejection and Operation from
Sources Other than Batteries
The G914X is designed to deliver low dropout voltages
and low quiescent currents in battery powered systems. Power-supply rejection is 57dB at low frequencies as the frequency increases above 20kHz; the
output capacitor is the major contributor to the rejection of power-supply noise.
When operating from sources other than batteries,
improve supply-noise rejection and transient response
by increasing the values of the input and output capacitors, and using passive filtering techniques.
Load Transient Considerations
The G914X load-transient response graphs show two
components of the output response: a DC shift of the
output voltage due to the different load currents, and
the transient response. Typical overshoot for step
changes in the load current from 0mA to 100mA is
12mV. Increasing the output capacitor's value and
decreasing its ESR attenuates transient spikes.
Input-Output (Dropout) Voltage
A regulator's minimum input-output voltage differential
(or dropout voltage) determines the lowest usable
supply voltage. In battery-powered systems, this will
determine the useful end-of-life battery voltage. Because the G914X use a P-channel MOSFET pass
transistor, their dropout voltage is a function of R
multiplied by the load current cause the G914X use a
P-channel MOSFET pass transistor, their dropout
voltage is a function of R
current.
multiplied by the load
DS(ON)
DS(ON)
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Page 9
Layout Guide
An input capacitance of ≅ 1µF is required between the
G914X input pin and ground (the amount of the capacitance may be increased without limit), This capacitor must be located a distance of not more than
1cm from the input and return to a clean analog
ground.
Input capacitor can filter out the input voltage spike
caused by the surge current due to the inductive effect
of the package pin and the printed circuit board’s
Global Mixed-mode Technology Inc.
G914X
routing wire. Otherwise, the actual voltage at the IN
pin may exceed the absolute maximum rating.
The output capacitor also must be located a distance
of not more than 1cm from output to a clean analog
ground. Because it can filter out the output spike
caused by the surge current due to the inductive effect
of the package pin and the printed circuit board’s
routing wire. Figure 5 is G914X PCB recommended
layout.
Safe Operating Area [Power Dissipation Limit]
200
Maximum Recom mended Output Current
150
100
50
Output Current (mA)
TA=25°C,Still Air
1oz Copper on SOT-23-5 Package
Mounted on recommended mimimum footprint (RθJA=240°C/W)
0
0.0 0. 5 1.0 1.5 2. 0 2.5 3.0 3.5 4.0 4.5
Input-Output Voltage Differential VIN-V
Note : V
IN(max)
<=5.5V
Figure 2. Recommended Minimum Footprint
Maximum Power Dissipation of SOT-23-5
0.7
0.6
0.5
TA=25
℃
TA=55
℃
TA=85
℃
(V)
OUT
0.4
0.3
0.2
Power Dissipation (W)
0.1
0
25 35 45 55 65 75 85 95 105 115 125
Figure 4 Power Dissipation vs. TemperatureFigure 3 Safe Operating Area
Figure 4 Safe Operating Area
Still Air
1oz Copper on SOT-23-5 Package
Mounted on recommended mimimum footprint (RθJA=240°C/W)
Amibent Temperature TA (°C)
Ver: 1.1
Sep 18, 2002
Figure 5. Fixed Mode
*Distance between pin & capacitor mus t no more than 1cm
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Global Mixed-mode Technology Inc.
Package Information
A2
A2
e1
e1
G914X
C
D
D
H
H
E
E
e
e
A
A
C
L
L
1
1
θ
θ
A1
b
b
A1
Note:
1. Package body sizes exclude mold flash protrusions or gate burrs
2. Tolerance ±0.1000 mm (4mil) unless otherwise specified
3. Coplanarity: 0.1000mm
Dimension L is measured in gage plane
4.
SYMBOLS
A 1.00 1.10 1.30
A1 0.00 ----- 0.10
A2 0.70 0.80 0.90
b 0.35 0.40 0.50
C 0.10 0.15 0.25
D 2.70 2.90 3.10
E 1.40 1.60 1.80
e ----- 1.90(TYP) -----
e1 ----- 0.95 -----
H 2.60 2.80 3.00
L 0.37 ------ -----
1
θ
MIN
1º 5º 9º
DIMENSIONS IN MILLIMETERS
NOM MAX
Taping Specification
Feed Direction
Feed Direction
SOT23-5 Package Orientation
SOT23-5 Package Orientation
GMT Inc. d oes not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
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