Datasheet G913D, G913C, G913B, G913A Datasheet (GMT)

Page 1
Global Mixed-mode Technology Inc.
150mA Low-Dropout Linear Regulators
Features
Low, 55µA No-Load Supply Current

Guaranteed 150mA Output Current

Dropout Voltage is 70mV @ 50mA Load

Over-Temperature Protection and Short-Circuit

Protection Two Modes of Operation ----

Fixed Mode: 2.84V (G913A), 3.15V (G913B),
3.30V (G913C), 3.00V (G913D) Adjustable Mode: from 1.25V to 5.5V Max. Supply Current in Shutdown Mode < 1µA

Low Output Noise at 220µV

Stable with low cost ceramic capacitors

Applications
Notebook Computers

Cellular Phones

PDAs

Digital still Camera and Video Recorders

Hand-Held Devices

Bar Code Scanners

RMS
G913
General Description
The G913 is a low supply current, low dropout linear regulator that comes in a space saving SOT23-5 pack­age. The supply current at no-load is 55µA. In the shutdown mode, the maximum supply current is less than 1µA. Operating voltage range of the G913 is from
2.5V to 5.5V. The over-current protection limit is set at 250mA typical and 150mA minimum. An overtem­perature protection circuit is built-in in the G913 to prevent thermal overload. These power saving fea­tures make the G913 ideal for use in the bat­tery-powered applications such as notebook com­puters, cellular phones, and PDA’s.
The G913 has two modes of operation. When the SET pin is connected to ground, its output is a pre-set value: 2.84V for G913A, 3.15V for G913B, and 3.30V for G913C, and 3.00V for G913D. There is no external components needed to decide the output voltage. When an output other than the preset value is needed, two external resistors should be used as a voltage divider. The output voltage is then decided by the re­sistor ratio. The G913 comes in a space saving SOT23-5 package.
Pin Configuration
1
1
1
SHDN
SHDN
SHDN
2
2
2
GND
GND
GND
IN
IN
IN
3
3
3
G963
G963
G963
G913
G913
G913
SOT23-5
SOT23-5
SOT23-5
Ordering Information
PART MARKING VOLTAGE
TEMP.
RANGE
G913A 3A 2.84 -40°C~ +85°C SOT 23-5
G913B 3B 3.15 -40°C~ +85°C SOT 23-5
G913C 3C 3.30 -40°C~ +85°C SOT 23-5
G913D 3D 3.00 -40°C~ +85°C SOT 23-5
OUTPUT
OUTPUT
C
C
C
OUT
OUT
OUT
1µF
1µF
1µF
OUTPUT
OUTPUT
OUTPUT VOLTAGE
VOLTAGE
VOLTAGE
C
C
C
OUT
OUT
OUT
1µF
1µF
1µF
OUTPUT VOLTAGE
VOLTAGE
VOLTAGE
IN OUT
IN OUT
IN OUT
G913
G913
C
C
C
IN
IN
5
5
5
SET
SET
SET
BATTERY
BATTERY
BATTERY
4
4
4
OUT
OUT
OUT
1µF
1µF
1µF
_
_
_
BATTERY
BATTERY
BATTERY
IN
IN
IN
IN
C
C
C
SHDN
SHDN
SHDN
IN
IN
IN
1µF
1µF
1µF
G913
SHDN
SHDN
SHDN
GND
GND
GND
Fixed mode
Fixed mode
Fixed mode
OUT
OUT
OUT
G913
G913
G913
SET
SET
SET
GND
GND
GND
SET
SET
SET
R1
R1
R1
R2
R2
R2
PIN-
PACKAGE
Ver: 1.0
Apr 25, 2002
1
Adjustable mode
Adjustable mode
Adjustable mode
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Page 2
Absolute Maximum Ratings
VIN to GND……………………………………-0.3V to +7V Output Short-Circuit Duration………………….….Infinite SET to GND.……………………………..…..-0.3V to +7V
SHDN to GND…………………..………….-0.3V to +7V
SHDN to IN….…………………..…………..-7V to +0.3V
OUT to GND…………………………-0.3V to (V
Note (1): See Recommended Minimum Footprint (Figure 3)
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress rat-
ings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of
the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Global Mixed-mode Technology Inc.
Continuous Power Dissipation (T SOT23-5……………………………………...…..520 mW Operating Temperature Range………...-40°C to +85°C Junction Temperature……………………….……+150°C
(1)
….…..…………….…………….…..…..240°C/Watt
θ
JA
Storage Temperature Range………….-65°C to +160°C Lead Temperature (soldering, 10sec)..…………+300°C
+ 0.3V)
IN
= +25°C)
A
G913
Electrical Characteristics
(V
=+3.6V, V
IN
Input Voltage (Note 2) VIN 2.5 5.5 V Output Voltage Accuracy V Adjustable Output Voltage Range (Note 3) V Maximum Output Current 150 mA Current Limit (Note 4) I
Ground Pin Current IQ SET = GND
Dropout Voltage (Note 5) V
Line Regulation
Load Regulation
Output Voltage Noise (10Hz to 100kHz) en
SHUTDOWN
SHDN
Input Threshold
SHDN
Input Bias Current
Shutdown Supply Current I
SET INPUT
SET Reference Voltage (Note 3) V
SET Input Leakage Current (Note 3) I
THERMAL PROTECTION
Thermal Shutdown Temperature T Thermal Shutdown Hysteresis
Note 1: Limits is 100% production tested at T
Note 2: Guaranteed by line regulation test. Note 3: Adjustable mode only. Note 4: Not tested. For design purposes, the current limit should be considered 150mA minimum to 420mA maximum. Note 5: The dropout voltage is defined as (V
SHDN
=VIN, TA =TJ =+25°C, unless otherwise noted.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Variation from specified V
OUT
V
OUT
250 mA
LIM
I
= 1mA 2
OUT
I
= 50mA 70
OUT
I
=150mA 230 300
OUT
SET=GND, VIN=V SET tied to OUT, V
I
= 0mA to 150mA
OUT
V
=4.2V,
IN
=150mA
I
OUT
+0.1V,to 5.5V I
(STD)
=2.5V to 5.5V, I
IN
DROP
V
LNR
V
LDR
VIH Regulator enabled VIN-0.7 V
Regulator shutdown 0.4
IL
I
SHDN
QSHDN
V
V
= VIN
SHDN
= 0V TA = +25°C 0.2 1 µA
OUT
V
= 2.5V to 5.5V,
IN
SHDN
T
SET
V
SET
SHDN
= 1mA
I
OUT
= 1.3V TA = +25°C 5 30 nA
SET
150 °C
15 °C
= +25°C. Low duty pulse techniques are used during test to
A
, I
=1mA -2 2 %
OUT
5.5 V
SET
= 0mA 55 120 = 50mA 145
= 1mA 0.1 0.28
OUT
= 1mA 0.08 0.4
OUT
I
LOAD
I
LOAD
OUT
SET tied to OUT 0.02 0.8
SET = GND 1.0
C
= 1µF 220 µV
OUT
T
= +25°C
A
0.003 0.1 µA
TA = +25°C 1.225 1.25 1.275
= T
to T
T
A
MIN
1.25
MAX
µA
mV
%/V
%
RMS
V
V
maintain junction temperature as close to ambient as possible.
IN-VOUT
) when V
is 100mV below the value of V
OUT
for VIN = V
OUT
OUT
+2V,
The performance of every G913 part, see “Typical Performance Characteristics”.
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics
(VIN= +3.6V, CIN=1µF, C
Output Voltage vs. Load Current Ground Current vs. Load Current
=1µF, G913B, TA=25 °C, unless otherwise noted.)
OUT
G913
3.160
3.150
300
250
A)
3.140
3.130
3.120
Output Voltage (V)
3.110
3.100
0 102030405060708090100110120130140150
Load Current (mA)
μ
200
150
100
50
Ground Current (
0
0 102030405060708090100110120130140150
Load Current (mA)
Output Voltage vs. Load Current Supply Current vs. Input Voltage
3.50
3.00
2.50
2.00
1.50
1.00
Output Voltage (V)
0.50
0.00 0123456
Input Voltage (V)
No Load
130
120
110
100
A)
90
μ
80
70
60
50
40
30
20
Supply Current (
10
0
01234567
Input Voltage (V)
I
LOAD
I
LOAD
= 50mA
= 0A
Dropout Voltage vs. Load Current Output Noise 10HZ to 100KHZ
300
250
200
150
100
50
Dropout Voltage (mV)
0
0 102030405060708090100110120130140150
Load Current (mA)
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Typical Performance Characteristics
(VIN= +3.6V, CIN=1µF, C
Line Transient Load Transient
=1µF, G913B, TA=25 °C, unless otherwise noted.)
OUT
G913
Load Transient
Dropout Voltage vs. Load Current by G913
300
TA=25°C
250
200
150
100
Dropout Voltage (mV)
50
0
0 102030405060708090100110120130140150
Load Current (mA)
Top to Bottom G913C G913B G913D
G913A
Load Transient
Dropout Voltage vs. Temperature
400
350
G913C
300
250
200
I
150
100
Dropout Voltage (mV)
50
0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120
LOAD
Junction Temperature TJ (℃)
=50mA
I
LOAD
I
LOAD
=0mA
=150mA
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Typical Performance Characteristics
(VIN= +3.6V, CIN=1µF, C
Turn on Response Time Turn off Response Time
=1µF, G913B, TA=25 °C, unless otherwise noted.)
OUT
G913
Shutdown Pin Delay
Shutdown Pin Delay Shutdown Response Time
Shutdown Response Time
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e
Global Mixed-mode Technology Inc.
Typical Performance Characteristics
(VIN= +3.6V, CIN=1µF, C
Shutdown Supply Current SHDN Input Bias Current vs. Temperature
=1µF, G913B, TA=25 °C, unless otherwise noted.)
OUT
G913
1.00
0.80
G913C
A)
0.60
μ
0.40
0.20
0.00
-0.20
-0.40
-0.60
Shutdown Supply Current (
-0.80
-1.00
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120
Juncti on Temperature TJ (℃)
SET Input Leakage Current vs. Temperatur
60
55
G913C
50
45
40
35
30
25
20
15
10
5
0
SET Input Leakage Current (nA)
-5
-10
-40 -30 - 20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120
Juncti on Temperature TJ (℃)
0.20
G913C
A)
μ
0.10
0.00
-0.10
SHDN Input Bias Current (
-0.20
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120
Juncti on Temperature TJ (℃)
SET Reference Voltage vs. Temperature
1.260
G913C
1.255
1.250
1.245
1.240
SET Reference Voltage (V)
1.235
1.230
=1mA
I
LOAD
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120
=5.5V
V
IN
V
=3.6V
IN
=2.5V
V
IN
Junction Temperature TJ (℃)
Output Voltage vs. Temperature Ground Current vs. Temperature
3.340
G913C
=1mA
I
LOAD
3.330
V
=5.5V
3.320
3.310
3.300
Output Voltage (V)
3.290
3.280
-40-30-20-100 102030405060708090100110120
IN
=3.6V
V
IN
V
=3.4V
IN
Juncti on Temperature TJ (℃)
100
G913C
=0A
I
80
LOAD
A)
μ
60
40
Ground Current (
20
0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120
Junction Temperature TJ (℃)
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Pin Description
PIN
1
2 GND
3 IN Regulator Input. Supply voltage can range from +2.5V to +5.5V. Bypass with 1µF to GND
4 OUT
5 SET
Detailed Description
The block diagram of the G913 is shown in Figure 1. It consists of an error amplifier, 1.25V bandgap refer­ence, PMOS output transistor, internal feedback volt­age divider, mode comparator, shutdown logic, over current protection circuit, and over temperature protec­tion circuit.
The mode comparator compares the SET pin voltage with an internal 120mV reference. If the SET pin volt­age is less than 120mV, the internal feedback voltage divider’s central tap is connected to the non-inverting input of the error amplifier. The error amplifier com­pares non-inverting input with the 1.25V bandgap ref­erence. If the feedback voltage is higher than 1.25V, the error amplifier’s output becomes higher so that the PMOS output transistor has a smaller gate-to-source voltage (V bility of the PMOS output transistor, as a result the output voltage decreases until the feedback voltage is equal to 1.25V. Similarly, when the feedback voltage is less than 1.25V, the error amplifier causes the out­put PMOS to conductor more current to pull the feed­back voltage up to 1.25V. Thus, through this feedback
NAME
SHDN
). This reduces the current carrying capa-
GS
Active-Low Shutdown Input. A logic low reduces the supply current to less than 1µA. Connect to IN for normal operation.
Ground. This pin also functions as a heatsink. Solder to large pads or the circuit board ground plane to maximize thermal dissipation.
Regulator Output. Fixed or adjustable from 1.25V to +5.5V. Sources up to 150mA. Bypass with a 1µF,
0.2Ω typical ESR capacitor to GND.
Feedback Input for Setting the Output Voltage. Connect to GND to set the output voltage to the preset
2.84V or 3.15V or 3.30V or 3.00V. Connect to an external resistor divider for adjustable-output operation.
FUNCTION
action, the error amplifier, output PMOS, and the volt­age divider effectively form a unity-gain amplifier with the feedback voltage force to be the same as the
1.25V bandgap reference. The output voltage, V then given by the following equation: V
= 1.25 (1 + R1/R2). (1)
OUT
Alternatively, the relationship between R1 and R2 is given by: R1 = R2 (V
/1.25 + 1). (2)
OUT
For the reasons of reducing power dissipation and loop stability, R2 is chosen to be 100KΩ. For G913A, R1 is 128KΩ, and the pre-set V G913B, R1 is 152KΩ, and the pre-set V For G913C, R1 is 164KΩ, and the pre-set V
3.30V. For G913D, R1 is 140KΩ, and the pre-set V is 3.00V.
When external voltage divider is used, as shown in Figure 2, the SET pin voltage will be larger than 600mV. The non-inverting input of the amplifier will be connected to the external voltage divider. However, the operation of the feedback loop is the same, so that the conditions of Equations 1 and 2 are still true. The output voltage is still given by Equation 1.
G913
is 2.84V. For
OUT
is 3.15V.
OUT
OUT
OUT
, is
is
OUT
Ver: 1.0
Apr 25, 2002
SHDN
SHDN
GND
GND
IN
IN
SHUTDOWN
SHUTDOWN
LOGIC
LOGIC
OVER TEMP.
OVER TEMP.
PROTECT
PROTECT
1.25V
1.25V Vref
Vref
ERROR
ERROR
AMP
AMP
MODE COMPARATOR
MODE COMPARATOR
OVER CURRENT
OVER CURRENT
PROTECT & DYNAMIC
PROTECT & DYNAMIC
FEEDBACK
FEEDBACK
120mV
120mV
P
P
OUT
OUT
SET
SET
R1
R1
R2
R2
Figure 1. Functional Diagram
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Page 8
BATTERY
BATTERY
Figure 2. Adjustable Output Using External
Over Current Protection
The G913 use a current mirror to monitor the output cur­rent. A small portion of the PMOS output transistor’s cur­rent is mirrored onto a resistor such that the voltage across this resistor is proportional to the output current. This voltage is compared against the 1.25V reference. Once the output current exceeds the limit, the PMOS output transistor is turned off. Once the output transistor is turned off, the current monitoring voltage decreases to zero, and the output PMOS is turned on again. If the over current condition persist, the over current protection circuit will be triggered again. Thus, when the output is shorted to ground, the output current will be alternating between 0 and the over current limit. The typical over current limit of the G913 is set to 250mA. Note that the input bypass capacitor of 1µF must be used in this case to filter out the input voltage spike caused by the surge current due to the inductive effect of the package pin and the printed circuit board’s routing wire. Otherwise, the actual voltage at the IN pin may exceed the absolute maximum rating.
Over Temperature Protection
To prevent abnormal temperature from occurring, the G913 has a built-in temperature monitoring circuit. When it detects the temperature is above 150 transistor is turned off. When the IC is cooled down to below 135 the G913 will be protected against abnormal junction temperature during operation.
Shutdown Mode
When the the G913 enters shutdown mode. All the analog circuits are turned off completely, which reduces the current consumption to only the leakage current. The output is disconnected from the input. When the output has no load at all, the output voltage will be discharged to ground through the internal resistor voltage divider.
Operating Region and Power Dissipation
Since the G913 is a linear regulator, its power dissipation is always given by P = I power dissipation is given by:
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OUTPUT
OUTPUT VOLTAGE
OUT
OUT
IN
IN
R1
R1
G913
G913
SET
SHDN
SHDN
GND
GND
OUT
SET
(VIN – V
R2
R2
OUT
C
C
IN
IN
1µF
1µF
Feedback Resistors
o
C, the output is turned on again. In this way,
pin is connected a logic low voltage,
SHDN
VOLTAGE
R
R
L
OUT
OUT
L
C
C 1µF
1µF
o
C, the output
). The maximum
G913
Where (T and the ambient air,
chosen package to the ambient air. For surface mount device, heat sinking is accomplished by using the heat spreading capabilities of the PC board and its copper traces. In the case of a SOT23-5 package, the thermal resistance is typically 240 Minimum Footprint) [Figure 3] Refer to Figure 4 is the G913 valid operating region (Safe Operating Area) & refer to Figure 5 is maximum power dissipation of SOT 23-5.
The die attachment area of the G913’s lead frame is connected to pin 2, which is the GND pin. Therefore, the GND pin of G913 can carry away the heat of the G913 die very effectively. To improve the power dissipation, connect the GND pin to ground using a large ground plane near the GND pin.
Applications Information
Capacitor Selection and Regulator Stability
Normally, use a 1µF capacitor on the input and a 1µF capacitor on the output of the G913. Larger input capaci­tor values and lower ESR provide better supply-noise rejection and transient response. A higher- value input capacitor (10µF) may be necessary if large, fast tran­sients are anticipated and the device is located several inches from the power source.
Power-Supply Rejection and Operation from Sources Other than Batteries
The G913 is designed to deliver low dropout voltages and low quiescent currents in battery powered systems. Power-supply rejection is 42dB at low frequencies. As the frequency increases above 20kHz, the output capacitor is the major contributor to the rejection of power-supply noise. When operating from sources other than batteries, im­prove supply-noise rejection and transient response by increasing the values of the input and output capacitors, and using passive filtering techniques.
Load Transient Considerations
The G913 load-transient response graphs show two components of the output response: a DC shift of the output voltage due to the different load currents, and the transient response. Typical overshoot for step changes in the load current from 0mA to 100mA is 12mV. Increasing the output capacitor's value and decreasing its ESR attenuates transient spikes.
Input-Output (Dropout) Voltage
A regulator's minimum input-output voltage differential (or dropout voltage) determines the lowest usable supply voltage. In battery-powered systems, this will determine the useful end-of-life battery voltage. Because the G913 use a P-channel MOSFET pass transistor, their dropout voltage is a function of R rent.
) is the temperature difference the G913 die
J–TA
, is the thermal resistance of the
θ
JA
o
C/Watt. (See Recommended
multiplied by the load cur-
DS(ON)
= (TJ–TA)/
P
D(MAX)
Ver: 1.0
Apr 25, 2002
,=150oC-25oC/240oC/W= 520mW
θ
JA
8
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Layout Guide
An input capacitance of ≅ 1µF is required between the G913 input pin and ground (the amount of the capaci­tance may be increased without limit), This capacitor must be located a distance of not more than 1cm from the input and return to a clean analog ground.
Input capacitor can filter out the input voltage spike caused by the surge current due to the inductive effect of the package pin and the printed circuit board’s routing wire. Otherwise, the actual voltage at the IN pin may exceed the absolute maximum rating.
Global Mixed-mode Technology Inc.
G913
The output capacitor also must be located a distance of not more than 1cm from output to a clean analog ground. Because it can filter out the output spike caused by the surge current due to the inductive effect of the package pin and the printed circuit board’s routing wire. Figure 6 is adjustable mode of G913 PCB layout. Figure 7 is a PCB layout of G913 fixed mode.
Safe Operating Area of G913 [Power Dissipation Limit]
200
Maximum Recommended Output Current
150
100
TA=25°C,Still Air
1oz Copper on SO T-23-5 Package
50
Mounted on recomm ended mimimum f ootprint (RθJA=240°C/W)
Output Current (mA)
0
0.0 0.5 1.0 1.5 2.0 2. 5 3.0 3.5 4.0 4.5
Input-Output Voltage Diff erential VIN-V
IN(max)
<=5.5V
Note : V
OUT
(V)
Figure 3. Recommended Minimum Footprint
Maximum Power Dissipation of SOT-23-5
0.7
0.6
TA=25
TA=55
TA=85
Figure 4 Safe Operating Area
0.5
0.4
0.3
0.2
Power Dissipation (W)
0.1
0
25 35 45 55 65 75 85 95 105 115 125
Figure 5 Power Dissipation vs. TemperatureFigure 4 Safe Operating Area
Still Air 1oz Copper on SOT-23-5 Package
Mounted on recommend mimimum footprint (RθJA=240°C/W
Amibent Temperat ure TA (°C)
)
Ver: 1.0
Apr 25, 2002
Figure 6. Adjustable Mode Figure 7. Fixed Mode
*Distance be tween pin & capaci tor must no m ore than 1cm *Distance between pin & capacitor m ust no more tha n 1cm
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Package Information
A2
A2
e1
e1
G913
C
D
D
H
H
E
E
e
e
A
A
C
L
L
1
1
θ
θ
A1
b
b
A1
Note:
1. Package body sizes exclude mold flash protrusions or gate burrs
2. Tolerance ±0.1000 mm (4mil) unless otherwise specified
3. Coplanarity: 0.1000mm Dimension L is measured in gage plane
4.
SYMBOLS
A 1.00 1.10 1.30
A1 0.00 ----- 0.10
A2 0.70 0.80 0.90
b 0.35 0.40 0.50
C 0.10 0.15 0.25
D 2.70 2.90 3.10
E 1.40 1.60 1.80
e ----- 1.90(TYP) -----
e1 ----- 0.95 -----
H 2.60 2.80 3.00
L 0.37 ------ -----
1
θ
MIN
1º 5º 9º
DIMENSIONS IN MILLIMETERS
Taping Specification
NOM MAX
Feed Direction
Feed Direction
SOT23-5 Package Orientation
SOT23-5 Package Orientation
GMT Inc. d oes not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
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