Datasheet FT0816DH, FT0816BH, FT0814MH, FT0814DH, FT0814BH Datasheet (FAGOR)

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Page 1
On-State Current
8 Amp
FT08...H
HIGH COMMUTATION TRIAC
This series of TRIACs uses a high performance PNPN technology.
These par ts are intended for general purpose AC switching applications with highly inductive loads.
Jun - 02
Absolute Maximum Ratings, according to IEC publication No. 134
TO220-AB
Gate Trigger Current
25 mA to 50 mA
Off-State Voltage
200 V ÷ 600 V
MT1
MT2
G
MT2
RMS On-state Current
Non-repetitive On-State Current
Non-repetitive On-State Current
Fusing Current
Peak Gate Current
Average Gate Power Dissipation
Critical rate of rise of on-state current
Operating Temperature
Storage Temperature
I
T(RMS)
PARAMETER CONDITIONS Min. Max. UnitSYMBOL
I
TSM
I2t I
GM
P
G(AV)
T
j
T
stg
All Conduction Angle, TC = 110 ºC
Full Cycle, 60 Hz
Full Cycle, 50 Hz
t
p
= 10 ms, Half Cycle
20 µs max. T
j
=125ºC
T
j
=125ºC
I
G
= 2x IGT, t
r
100ns
f= 120 Hz, T
j
=125ºC
8
84
80
36
50
-40
-40
A
A
A
A
2
s
A
W
A/µs
ºC
ºC
4
1
+125
+150
di/dt
I
TSM
Repetitive Peak Off State
Voltage
PARAMETER VOLTAGE UnitSYMBOL
V
DRM
V
RRM
B
200 V
M
600
D
400
Page 2
FT08...H
HIGH COMMUTATION TRIAC
Jun - 02
Electrical Characteristics
Gate Trigger Current
Off-State Leakage Current
Threshold Voltage
Dynamic Resistance
On-state Voltage
Gate Trigger Voltage
Gate Non Trigger Voltage
Holding Current
Latching Current
Critical Rate of Voltage Rise
PARAMETER CONDITIONS SENSITIVITY
Unit
SYMBOL
I
GT
(1)
I
DRM
VD = 12 V
DC
, R
L
= 30
mA
1
5
0.85
1.55
1.3
0.2
1.6
60
mA
mA
µA
V
m
V
V
V
mA
mA
V/µs
A/ms
MAX
MAX
MAX
MAX
MAX
MAX
MAX
MIN
MAX
MAX
MAX
MIN
MIN
MIN
MIN
/I
RRM
V
TM
(2)
V
GT
V
GD
I
H
(2)
I
L
dv / dt
(2)
R
th(j-a)
Thermal Resistance Junction-Ambient
Tj = 25 ºC
V
R
= V
RRM
,
IT = 11 Amp, tp = 380 µs, Tj = 25 ºC
VD = 12 V
DC
, R
L
= 30, T
j
= 25 ºC
I
T
= 100 mA , Gate open, Tj = 25 ºC
I
G
= 1.2 IGT,
Tj
= 25 ºC
V
D
= 0.67 x V
DRM
, Gate open
T
j
= 125 ºC
Quadrant
Q1÷Q3
Q1÷Q3
Q1÷Q3
Q1,Q3
Q2
V
D
= V
DRM
, R
L
= 3.3K, T
j
= 125 ºC
ºC/W
ºC/W
16
50
50
70
80
1000
-
-
7
(1) Minimum IGT is guaranted at 5% of IGT max.
(2) For either polarity of electrode MT2 voltage with reference to electrode MT1.
R
th(j-c)
Thermal Resistance Junction-Case
(dI/dt)c
(2)
Critical Rate of Current Rise
(dv/dt)c= 0.1 V/µs T
j
= 125 ºC
(dv/dt)c= 10 V/µs T
j
= 125 ºC
without snubber Tj = 125 ºC
V
to
(2)
R
d
(2)
Tj = 125 ºC
T
j
= 125 ºC
PART NUMBER INFORMATION
FAGOR
TRIAC
CURRENT
CASE
VOLTAGE
SENSITIVITY
F T 08 11 B H 00
FORMING
TU
PACKAGING
14
35
35
50
60
400
-
-
4.5
50
11
25
25
40
50
200
-
-
4
Tj = 125 ºC
Tj = 25 ºC
Page 3
Jun - 02
FT08...H
HIGH COMMUTATION TRIAC
1 10 100 1000
90
80
60
40
20
0
I
TSM
(A)
Number of cycles
1E+0
1E-1
1E-2
K=[Zth / Rth]
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
tp (s)
I
T(RMS)
(A)
Fig. 1: Maximum power dissipation versus RMS on-state curren (full cycle).
0 25 50 75 100 125
Fig. 2: RMS on-state current versus case temperature (full cycle).
Fig. 3: : Relative variation of thermal impedance versus pulse duration.
Fig. 5: Surge peak on-state current versus number of cycles
Fig. 6: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp<10ms, and corresponding value of I
2
t.
Fig. 4: On-state characteristics (maximum values)
P (W)
Tc (ºC)
I
T(RMS)
(A)
0 2 4 6 8
0
2
4
6
8
10
0
2
4
6
8
10
100
10
1
ITM (A)
0.5 1.0 1.5 2.0 2.5 3.0 5.0
VTM (V)
Zth(j-c)
Zth(j-a)
3.5 4.0 4.5
Tj max Vto = 0.85 V Rt = 35m
0.01 0.10 1.00 10.00
1000
100
10
I
TSM
(A), I2 t (A2s)
tp (ms)
Non repetitive Tj initial = 25 ºC
Tj initial = 25 ºC
dl/dt limitation 50A/µs
1 3 5 7
1
3
5
7
9
Tj max
Tj = 25 ºC
t=20ms
One cycle
I2t
I
TSM
Repetitive Tc = 100 ºC
Page 4
FT08...H
HIGH COMMUTATION TRIAC
PACKAGE MECHANICAL DATA
TO-220AB (Plastic)
A a1 a2
B
b1 b2
C c1 c2
e
F
I
I4
L I2 I3 M
REF.
DIMENSIONS
Milimeters
Min. Nominal Max.
15.20
13.00
10.00
0.61
1.23
4.40
0.49
2.40
2.40
6.20
3.75
15.80
2.65
1.14
1.14
3.75
16.40
2.60
15.90
14.00
10.40
0.88
1.32
4.60
0.70
2.72
2.70
6.60
3.85
16.80
2.95
1.70
1.70
14
a1
L
A
e
a2
b1
12
13
øI
B
c
F
b2
c2
c1
M
0
0.5
2.0
1.0
1.5
2.5
I
GT,IH,IL
[Tj]/I
GT,IH,IL
.[Tj=25ºC]
Fig. 7: Relative variation of gate trigger current, holding current and latching versus junction temperature (typical values)
Tj(ºC)
-40 -20 0 20 40 60 80 100 120 140
I
GT
IH&I
L
Jun - 02
0 25 50 75
Fig. 8: Relative variation of critical rate of decrease of main current versus junction temperature
(dI/dt)c [Tj]/(dI/dc)c [Tj specified]
100
6
5
4
3
2
1
0
Tj(ºC)
125
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