FSUSB31
Low-Power 1-Port Hi-Speed USB 2.0 (480Mbps) Switch
FSUSB31 — Low-Power 1-Port Hi-Speed USB 2.0 (480 Mbps) Switch
Features
■ Low On Capacitance: 3.7pF (Typical)
■ Low On Resistance: 6.5Ω (Typical)
■ Low Power Consumption: 1µA (Maximum)
– 10µA Maximum I
Volt age Range: V
■ Wide -3dB Bandwidth: > 720MHz
■ 8kV I/O to GND ESD Protection
■ Power-off Protection W hen V
Over an Expanded Control
CCT
=
IN
2.6V, V
=
4.3V
CC
= 0V , D+ / D- Pins Can
CC
Tolerate up to 4.3V
■ Packaged in:
– 8-lead MicroPak™ (1.6 x 1.6mm)
– 8-lead US8
– 8-lead Ultrathin MLP (1.2 x 1.4mm)
Applications
■ Cell Phone, PDA, Digital Camera, an d Notebook
■ LCD Monitor, TV, and Set-top Box
Related Resources
■ AN-6022 Using the FSUSB30/31 to Comply with
USB 2.0 Fault Condition Requirements
Description
The FSUSB31 is a low-power, single-port, high-speed
USB 2.0 switch. This p a rt is con figu red as a d oub le-pole,
single-throw switch and is optimized for switching or isolating a high-speed (480Mbps) source or a high-speed
and full-sp eed (12Mb ps) source. T he FSUSB3 1 is compatible with t he r eq uirem ents o f USB 2. 0 and f eat ures an
extremely low on capacitance (C
bandwidth of th is device (>720 MHz) exceeds the bandwidth needed to pass the third harmonic, resulting in signals with minimum edge and phase distortion. Superior
channel-to-channel crosstalk minimizes interference.
The FSUSB31 contains special circuitry on the D+
pins that allows the device to withstand an over-voltage
condition. This device is also designed to minimize current consumption even when the control voltage applied
to the OE
pin is lower than the supply voltage (VCC). This
feature is especially valuable for mobile applications,
such as cell phones, allowing direct interface with the
general-purpose I/Os of the baseband processor. Other
applications include port isolation and switching in portable cell phones, PDAs, digital cameras, printers, and
notebook computers.
) of 3.7pF. The wide
ON
/D-
Ordering Information
Part NumberPackagePackage Description
FSUSB31K8XMAB08A8-Lead US8, JEDEC MO-187, Variat ion CA 3.1mm Wide
FSUSB31L8X MAC08A8-Lead MicroPak, 1.6mm Wide
FSUSB31UMX (Preliminary )UMLP08A8-Lead, Ultrathin Mold ed Leadless Package (UMLP), 1.2 x 1.4mm
All packages are lead free per JEDEC: J-STD-020B standard.
Application Diagram
V
CC
Base Band
Processor
or FS USB
Controller
HS USB
Controller
Figure 1. Typical Application Diagram
MicroPak™ is a trademark of Fairchild Semiconductor Corporation.
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommend ed op erati ng cond iti ons and stres si ng the p arts to these levels is not reco mm en ded. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only.
Symbol Parameter MinimumMaximumUnit
V
CC
V
S
V
IN
I
IK
I
OUT
T
STG
ESDHuman Body Model
Note:
1.The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are
observed. DC swit ch vo ltage may never exce ed 4.6 V.
Supply Voltage-0.54.6 V
DC Input Voltage
DC Switch Voltage
(1)
(1)
-0.54.6 V
HSD-0.5VCC+0.3V
D+, D−-0.5+4.6V
DC Input Diode Current-50mA
DC Output Current50mA
Storage Temperature-65+150°C
All Pins7.5kV
I/O to GND8kV
FSUSB31 — Low-Power 1-Port Hi-Speed USB 2.0 (480 Mbps) Switch
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol Parameter Minimum MaximumUnit
V
CC
V
IN
T
A
Note:
2. Control input must be held HIGH or LOW and it must not float.
Supply V oltage3.04.3 V
Control Input Voltage
Switch Input Voltage0 V
All typical values are at 25°C unless otherwise specified.
T
= −40°C to +85°C
V
SymbolParameterConditions
V
IK
V
IH
V
IL
I
IN
I
OZ
I
OFF
R
ON
ΔR
ON
Flatness RON Flatness
R
ON
I
CC
Clamp Diode VoltageIIN = −18mA3.0-1.2V
Input Voltage HIGH
Input Voltage LOW
Control Input LeakageVIN = 0V to V
OFF State Leakage0 ≤ HSD ≤ V
Power OFF Leakage
Current (D+, D–)
Switch On Resistance
ON
(4)
(3)
Delta R
Quiescent Supply Current
VIN = 0.0V to 4.3V,
= 0V
V
CC
(3)
VIN = 0.4V, ION = −8mA3.06.510.0Ω
VIN = 0.4V, ION = −8mA3.00.35Ω
VIN = 0.0V −1.0V,
= −8mA
I
ON
= 0.0V or VCC,
V
IN
= 0
I
OUT
CC
CC
(V)
CC
3.0 to 3.61.3V
4.31.7
3.0 to 3.60.5V
4.30.7
4.3-1.01.0μA
4.3-2.02.0μA
0-2.02.0μA
3.02.0Ω
4.31.0μA
Increase in ICC Current
I
CCT
per Control Voltage and
Levels
V
CC
V
= 2.6V, VCC = 4.3V4.310.0μA
IN
Notes:
3. Measured by the voltage drop between Dn, HSD, and Dn pins at the indicated current through the switch.
On resistance is determined by the lower of the voltage on the two ports.
4. Guaranteed by characterization.
A
Min.Typ.Max.
FSUSB31 — Low-Power 1-Port Hi-Speed USB 2.0 (480 Mbps) Switch
Unit
AC Electrical Characteristics
All typical values are for VCC = 3.3V are at 25°C unless otherwise specified.
Application Guidance: Meeting USB 2.0 Vbus Short Requirements
FSUSB31 — Low-Power 1-Port Hi-Speed USB 2.0 (480 Mbps) Switch
In section 7.1.1 of the USB 2.0 specification, it notes that
USB devices must be able to withstand a Vbus short to
D+ or D- when the USB devices is either powered off or
powered on. The FSUSB31 can be successfully configured to meet both these requirements.
Power-Off Protection
For a Vbus short circuit, the switch is expected to withstand such a condition for at least 24 hours. The
FSUSB31 has specially designed circuitry which prevents unintended signal bleed through as well as guaranteed system reliability during a power-down, overvoltage condition. The protection has been added to the
common pins (D+, D-).
VCC= 3.6 V
100 Ohms
Power-On Protection
The USB 2.0 specification also notes that the USB
device shoul d be capable of withs tanding a Vbus short
during transmission of data. Fairchild recommends adding a 100Ω series resister between the switch VCC pin
and supply rail to protect against this case. This modification works by limiting current flow back into the VCC
rail during the over-voltage event so current remains
within th e safe operati ng range. In this applicat ion, the
switch passes the full 5.25V input signal through to the
selected output, while maintaining specified off isolation
on the un-selected pins.
HSD+
D+ = 5.25V
FSUSB31
HSD-
Figure 21. A 100Ω resistor in series with the VCC supply allows the FSUSB31 to withstand a Vbus
short when powered up
For more information, see Applications Note AN-6022 — Using the FSUSB30/FSUSB31 to Comply with
USB 2.0 Fault Condition Requirements at www.fairchildsemi.com
FSUSB31 — Low-Power 1-Port Hi-Speed USB 2.0 (480 Mbps) Switch
Figure 22. 8-Lead US8, JEDEC MO-187, Variation CA 3.1mm Wide
For MicroPak™ tape and reel specifications, please visit Fairchild’s website: http://www.fairchildsemi.com/ms/MS/MS-522.pdf
Package drawings are provided as a service to customers considering Fairchild com ponents. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semic onduct or representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
Package drawings are provided as a service to customers considering Fairchild com ponents. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semic onduct or representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
Package drawings are provided as a service to customers considering Fairchild com ponents. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semic onduct or representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: