Datasheet FSUSB30 Datasheet (Fairchild)

Page 1
Click to see this datasheet in Simplified Chinese!
January 2007
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
■ Low On Capacitance, 3.7pF (typical)
■ Low On Resistance, 6.5Ohm (typical)
■ Low power consumption (1µA maximum)
– 10µA maximum I
voltage range (V
■ Wide -3dB bandwidth, >720MHz
■ 8KV ESD protection
■ Power-Off protection when V
over an expanded control
CCT
= 2.6V, VCC = 4.3V)
IN
= 0V; D+/D- pins can
CC
tolerate up to 5.25V
■ Packaged in:
– Pb-Free 10-lead MicroPak™ (1.6 x 2.1mm) – Pb-Free 14-lead DQFN – Pb-Free 10-lead MSOP – Pb-Free 10-lead UMLP (1.4 x 1.8mm)
Applications
■ Cell phone, PDA, Digital Camera, and Notebook LCD
Monitor, TV, and Set-top Box
Related Application Notes
■ AN-6022 Using the FSUSB30 / FSUSB31 to Comply
with USB 2.0 Fault Condition Requirements
Ordering Information
General Description
The FSUSB30 is a low-power, two-port, high-speed USB
2.0 switch. Configured as a double-pole double-throw (DPDT) swit ch, it is optimized for switching between two high-speed (480Mbps) sources or a Hi-Speed a nd Full­Speed (12Mbps) source. The FSUSB30 is compatible with the requirements of USB2.0 and features an extremely low on capacitance (C bandwidth of this device (720MHz), exceeds the band­width needed to pass the third harmonic, resulting in sig­nals with minimum edge and phase di stortion. Superior channel-to-channel crosstalk minimizes interference.
The FSUSB30 contains special circuitry on the D+/ D­pins which allows the device to withstand an overvoltage condition when powered off. This device is also designed to minimize current consumption even when the control voltage applied to the S pin, is lower than the supply volt­age (V
). This feature is especially valuable to ultra-
CC
portable applications such as cell phones, allowing for direct interface with the general purpose I/Os of the baseband processor. Other applications include switch­ing and connector sharing in portable cell phones, PDAs, digital cameras, printers, and notebook computers.
) of 3.7pF. The wide
ON
Order
Number
Package
Number
Product Code
Top Mark Pb-Free Package Description
FSUSB30L10X MAC010A FJ Yes 10-Lead MicroPak, 1.6 x 2.1mm FSUSB30BQX MLP014A USB30 Yes
FSUSB30MUX MUA10A FSUSB30 Yes
14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm
10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm Wide
FSUSB30UMX MLP010A GJ Yes 10-Lead, Quad, Ultrathin, MLP (UMLP) 1.4 x 1.8mm
Pb-Free package per JEDEC J-STD-020B.
Application Diagram
FSUSB30
V
CC
1D+
OE
D+
D–
USB
Connector
USB2.0
Set Top Box
(STB) CPU
or
DSP
Processor
MicroPak™ is a trademark of Fairchild Semiconductor Corporation.
© 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FSUSB30 Rev. 1.1.5
Controller
DVR or
Mass Storage
Controller
1D–
2D+
2D–
Control
S
Page 2
Connection Diagrams Analog Symbol
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Pad Assignments for MicroPak
OE
HSD1–
HSD2–
D–
9
876
V
CC
2
134
S
HSD1+
510
HSD2+
GND
D+
(Top View)
Pad Assignments for DQFN
V
NC
CC
14
1
HSD1+
NC
HSD2+
D+
2
S
3
4
5
6
13
OE
12
HSD1–
11
NC
10
HSD2–
9
D–
87
NCGND
(Top Through View)
Pin Assignment for MSOP
HSD1+
D+
HSD2+
HSD1–
D–
HSD2–
S
OE
Control
Pin Descriptions
Pin Name Description
OE
S Select Input
D+, D−, HSDn+, HSDn− Data Ports
NC No Connect
Bus Switch Enable
Truth Table
S
OE
X HIGH Disconnect
LOW LOW D+, D− = HSD1
HIGH LOW D+, D− = HSD2
Function
n n
10
V
CC
9
OE
8
HSD1–
7
HSD2–
6
D–
HSD1+
HSD2+
D+
GND
1
S
2
3
4
5
(Top Through View)
Pad Assignments for µMLP
HSD2–
HSD1–
7
6
1
HSD1+
2
HSD2+
5
D–
4
GND
3
D+
8
OE
9
V
CC
10
Sel
(Top Through View)
© 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSUSB30 Rev. 1.1.5 2
Page 3
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera­ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi­tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.
Symbol Parameter Minimum Maximum Unit
V
CC
V
CNTRL
V
SW
I
IK
I
OUT
T
STG
ESD Human Body Model
Note:
1. The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are observed. DC switch voltage may never exceed 4.6V.
Supply Voltage -0.5 +4.6 V DC Input Voltage
(1)
-0.5 +4.6 V
HSDnX 0.5 VCC + 0.3 V
DC Switch Voltage
(1)
D+,D- when V D+,D- when V
> 0 0.5 VCC + 0.3 V
CC
= 0 -0.50 5.25 V
CC
DC Input Diode Current -50 mA DC Output Current 50 mA Storage Temperature -65 +150 °C
All Pins 8 kV I/O to GND 8 kV
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings.
Symbol Parameter Minimum Maximum Unit
V
CC
V
IN
V
SW
T
A
ΘJ
Note:
2. Control input must be held HIGH or LOW and it must not float.
Supply Voltage 3.0 4.3 V Control Input Voltage 0 V Switch Input Voltage 0 V Operating Temperature -40 +85 °C Thermal Resistance, 10 MicroPak 250 °C/W
A
(2)
CC CC
V V
© 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSUSB30 Rev. 1.1.5 3
Page 4
DC Electrical Characteristics
All typical values are at 25°C unless otherwise specified.
Symbol Parameter Conditions
V
IK
V
IH
V
IL
I
IN
I
OZ
I
OFF
R
ON
ΔR
ON
RON Flatness RON Flatness
I
CC
I
CCT
Clamp Diode Voltage IIN = -18mA 3.0 -1.2 V
Input Voltage HIGH
Input Voltage LOW
Control Input Leakage VSW = 0.0V to V OFF State Leakage 0 ≤ Dn, HSD1n, HSD2n ≤ V Power OFF Leakage
Current (D+, D–)
Switch On Resistance
ON
(4)
(3)
Delta R
V
= 0V to 4.3V, VCC = 0V 0 -2.0 2.0 µA
SW
VSW = 0.4V, ION = -8mA 3.0 6.5 10.0
(3)
V
= 0V, IO = 30mA at 25°C 3.6 7.0
SW
VSW = 0.4V, ION = -8mA 3.0 0.35 Ω VSW = 0.0V - 1.0V,
ION = -8mA
= 0.0V or VCC,
V
Quiescent Supply Current Increase in ICC Current
per Control Voltage
CNTRL
= 0
I
OUT
(control input) = 2.6V 4.3 10.0 µA
V
CNTRL
CC
T
= −40°C to +85°C
A
(V)
V
CC
Min. Typ. Max.
3.0 to 3.6 1.3 V
4.3 1.7 V
3.0 to 3.6 0.5 V
4.3 0.7 V
4.3 -1.0 1.0 µA
CC
4.3 -2.0 2.0 µA
3.0 2.0 Ω
4.3 1.0 µA
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Unit
Ω
Ω
Notes:
3. Measured by the voltage drop between Dn, HSD1
, HSD2n pins at the indicated current through the switch.
n
On resistance is determined by the lower of the voltage on the two ports.
4.Guaranteed by characterization.
AC Electrical Characteristics
All typical values are for VCC = 3.3V at 25°C unless otherwise specified.
(V)
Symbol Parameter Conditions
t
t
OFF
t
t
BBM
O
Xtalk
Turn-On Tim e S,
ON
OE
to Output
Turn-Off Time S, OE
to Output
Propagation Delay
PD
Break-Before-Make Off Isolation
IRR
(Non-Adjacent) Non-Adjacent Channel
Crosstalk
BW −3dB Bandwidth
(4)
, HD2n = 0.8V,
HD1
n
R
= 50Ω, CL = 5pF
L
, HD2n = 0.8V,
HD1
n
R
= 50Ω, CL = 5pF
L
RL = 50Ω, CL = 5pF 3.3 0.25 ns
= 50Ω, CL = 5pF,
R
L
V
= 0.8V
IN
f = 240MHz, R
R
= 50Ω, f = 240MHz 3.0 to 3.6 -45.0 dB Figure 13
T
R
= 50Ω, CL = 0pF
T
= 50Ω, CL = 5pF 550
R
T
= 50Ω 3.0 to 3.6 -30.0 dB Figure 12
T
V
CC
3.0 to 3.6 13.0 30.0 ns Figure 8
3.0 to 3.6 12.0 25.0 ns Figure 8
3.0 to 3.6 2.0 6.5 ns Figure 9
3.0 to 3.6
T
= −40°C to +85°C
A
Min. Typ. Max.
720
Unit
Figure
Number
Figure 6 Figure 7
MHz Figure 11
© 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSUSB30 Rev. 1.1.5 4
Page 5
USB Hi-Speed Related AC Electrical Characteristics
(V)
Symbol Parameter Conditions
t
SK(O)
Channel-to-Channel
(5)
Skew
RL = 50Ω, CL = 5pF 3.0 to 3.6 50 ps
V
CC
Skew of Opposite
t
SK(P)
Transitions of the Same Output
Total Jitter
t
J
(5)
(5)
RL = 50Ω, CL = 5pF 3.0 to 3.6 20 ps
RL = 50Ω, CL = 5pF, t
= tF = 500ps at 480 Mbps
R
(PRBS = 2
15
− 1)
3.0 to 3.6 200 ps
Note:
5. Guaranteed by characterization.
Capacitance
Symbol Parameter Conditions
C
C
C
OFF
Control Pin Input Capacitance VCC = 0V 1.5 pF Figure 15
IN
D1n, D2n, Dn On Capacitance VCC = 3.3, OE = 0V 3.7 pF Figure 14
ON
D1n, D2n Off Capacitance VCC and OE = 3.3 2.5 pF Figure 15
T
Min. Typ. Max.
T
= −40°C to +85°C
A
Min. Typ. Max.
= −40°C to +85°C
A
Units
Units
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Figure
Number
Figure 6
Figure 10
Figure 6
Figure 10
Figure
Number
© 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSUSB30 Rev. 1.1.5 5
Page 6
Typical Characteristics
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
0
-1
-2
-3
-4
-5
Gain (dB)
-6
-7
-8 1 10 100 1000 10000
Frequency Response
Frequency (MHz)
CL = 0pF, VCC = 3.3V
Figure 1. Gain vs. Frequency
Frequency Response
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
Off Isolation (dB)
-100
-110
-120 1 10 100 1000
Frequency (MHz)
Figure 2. Off Isolation
0
-10
-20
-30
-40
-50
-60
-70
-80
Crosstalk (dB)
-90
-100
-110
-120 1 10 100 1000
Frequency (MHz)
VCC = 3.3V
Figure 3. Crosstalk
Frequency Response
© 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSUSB30 Rev. 1.1.5 6
Page 7
Test Diagrams
T
V
FSUSB30
HSDn
V
IN
GND
RON = VON / I
Figure 4. On Resistance Figure 5. Off Leakage
ON
ON
Select
= 0 to V
V
S
Dn
CC
GND
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
FSUSB30
ID
NC
n(OFF)
A
V
I
ON
Select
VS = 0 or V
CC
Each switch port is tested separately.
IN
GND
FSUSB30
GND
HSDn
V
IN
R
S
D+, D–
C
L
V
R
OU
L
GND
V
Sel
GND
RL, RS, and CL are functions of the application environment (see AC Electrical tables for specific values).
CL includes test fixture and stray capacitance.
Figure 6. AC Test Circuit Load Figure 7. Switch Propagation Delay Waveforms
t
= 2.5ns
RISE
V
CC
Input – S, OE
GND
10% 10%
Input:
Output: D+, D–
90%
/2 VCC/2
V
CC
t
RISE
800mV
HSDn+, HSDn–
400mV
90%
= 500ps
90%
50% 50%
10% 10%
V
OH
50%
V
OL
t
t
= 2.5ns
FALL
PLH
90%
50%
t
FALL
t
PHL
= 500ps
V
Output – V
OUT
OH
V
OL
t
ON
90%90%
t
OFF
Figure 8. Turn-On / Turn-Off Waveform
© 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSUSB30 Rev. 1.1.5 7
Page 8
V
CC
V
CC
V
O
HSDn
D+, D–
HSDn
S
Control Input
GND
*CL includes test fixture and stray capacitance.
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
V
OUT
R
C
L
L
Control Input
*
V
CC
0V
V
OUT
50%
tR = tF = 2.5ns (10–90%)
t
D
0.9 x V
OUT
t
RISE
800mV
Input:
HSDn+ HSDn–
400mV
Output: D+, D–
= 500ps
V
OH
V
OL
50%
10%
T
= | t
SK(P)
Pulse Skew, T
t
FALL
90% 90%
50%
t
PLH
– t
PHL
PLH
SK(P)
Figure 9. Break-Before-Make (t
t
RISE
800mV
Input: D+, D–
400mV
= 500ps
50%
|
10%
50%
t
Output1:
Output1: D2+, D2–
PHL
HSD1+ HSD1–
Figure 10. Switch Skew Tests
BBM
= 500ps
V
OH
V
OL
V
OH
V
OL
T
Output Skew, T
)
10%
SK(O)
50%
= | t
90% 90%
50%
t
PLH1
50%
t
PLH2
– t
PLH1
PLH2
SK(OUT)
50%
| or | t
PHL1
10%
50%
t
– t
FALL
t
50%
PHL1
t
PHL2
PHL2
= 500ps
|
Network Analyzer
FSUSB30
GND
V
Sel
R
S
V
IN
V
S
GND
GND
V
OUT
T
GND
RS and RT are functions of the application environment (See AC Electrical Tables for specific values).
R
GND
Figure 11. Bandwidth
© 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSUSB30 Rev. 1.1.5 8
Page 9
FSUSB30
V
Sel
GND
OFF-Isolation = 20 Log (V
R
T
GND
GND
GND
/ VIN)
OUT
Figure 12. Channel Off Isolation
Network Analyzer
R
S
V
IN
V
GND
V
OUT
R
T
GND
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
S
Capacitance
Meter
f = 240MHz
V
Sel
GND
D1n, D2n
NC
FSUSB30
GND
R
T
GND
GND
R
and RT are functions of the application environment
S
(50, 75 or 100Ω)
Crosstalk = 20 Log (V
OUT
/ VIN)
Figure 13. Non-Adjacent Channel-to-Channel Crosstalk
FSUSB30
Dn
S
V
Sel
= 0 or V
CC
Capacitance
Meter
f = 240MHz
Network Analyzer
R
S
V
IN
V
GND
R
T
GND
FSUSB30
Dn
D1n, D2n
S
V
OUT
S
= 0 or V
V
Sel
CC
Figure 14. Channel On Capacitance Figure 15. Channel Off Capacitance
© 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSUSB30 Rev. 1.1.5 9
Page 10
Application Guidance: Meeting USB 2.0 Vbus Short Requirements
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
In section 7.1.1 of the USB 2.0 specification, it notes that USB devices must be able to withstand a Vbus short to D+ or D- when the USB devices is either powered off or powered on. The FSUSB30 can be successfully config­ured to meet both these requirements.
Power-Off Protection
For a Vbus short circuit, the switch is expected to with­stand such a condition for at least 24 hours. The FSUSB30 has specially designed circuitry which pre­vents unintended signal bleed through as well as guar­anteed system reliability during a power-down, over­voltage condition. The protection has been added to the common pins (D+, D-).
VCC= 3.6 V
100 Ohms
Power-On Protection
The USB 2.0 specification also notes that the USB device should be capable of withstanding a Vbus short during transmission of data. Fairchild recommends add­ing a 100Ω series resister between the switch VCC pin and supply rail to protect against this case. This modifi­cation works by limiting current flow back into the V rail during the over-voltage event so current remains within the safe operating range. In this application, the switch passes the full 5.25V input signal through to the selected output, while maintaining specified off isolation on the un-selected pins.
CC
HSD+ HSD+
HSD-
FSUSB30
D+ = 5.25V
D- = 5.25V
HSD-
Figure 16. Adding 100Ω resistor in series with the VCC supply allows the FSUSB30 to withstand a
Vbus short when powered up
For more information, see Applications Note AN-6022 Using the FSUSB30 to Comply with USB 2.0 Fault Condition Requirements at www.fairchildsemi.com
© 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSUSB30 Rev. 1.1.5 10
Page 11
Tape and Reel Specifications
Tape Format for MircoPak
Package
Designator
L10X
Tape Dimension
Dimensions are in millimeters unless otherwise specified.
Tape
Section
Leader (Start End) 125 (typ) Empty Sealed
Carrier 5000 Filled Sealed
Trailer (Hub End) 75 (typ) Empty Sealed
Number Cavities
Cavity Status
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Cover Tape
Status
© 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FSUSB30 Rev. 1.1.5 11
Page 12
Reel Dimension for MircoPak
Dimensions are in inches (millimeters) unless otherwise specified.
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Tape SizeABCDN W1 W2 W3
(8mm)
7.0
(177.8)
0.059
(1.50)
0.512
(13.00)
0.795
(20.20)
2.165
(55.00)
0.331 + 0.059/−0.000 (8.40 + 1.50/−0.00)
0.567
(14.40)
W1 + 0.078/−0.039
(W1 + 2.00/−1.00)
© 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FSUSB30 Rev. 1.1.5 12
Page 13
Tape Format for DQFN
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Package
Designator
BQX
Tape
Section
Leader (Start End) 125 (typ) Empty Sealed
Carrier 2500/3000 Filled Sealed
Trailer (Hub End) 75 (typ) Empty Sealed
Tape Dimensions
Dimenions are in millimeters unless otherwise specified.
Number Cavities
Cavity Status
Cover Tape
Status
© 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSUSB30 Rev. 1.1.5 13
Page 14
Reel Dimensions for DQFN
Dimensions are in inches (millimeters) unless otherwise specified.
Tape SizeABCDNW1W2
(12mm)
13.0
(330)
0.059
(1.50)
0.512
(13.00)
0.795
(20.20)
7.008 (178)
0.488 (12.4)
0.724 (18.4)
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
© 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSUSB30 Rev. 1.1.5 14
Page 15
Tape Dimensions for MSOP
Dimensions are in inches (millimeters) unless otherwise specified.
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Reel Dimensions for MSOP
Dimensions are in inches (millimeters) unless otherwise specified
Tape SizeABCDNW1W2W3
(12mm)
13
(330)
0.059 (1.5)
0.512 (13)
0.795
(20.2)
7.008 (178)
0.448
(12.4)
0.724
(18.4)
0.468-0.606 (11.9 -15.4)
© 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FSUSB30 Rev. 1.1.5 15
Page 16
Physical Dimensions
Dimensions are in millimeters unless otherwise specified.
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Figure 17. 10-Lead MicroPak, 1.6 x 2.1mm
© 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FSUSB30 Rev. 1.1.5 16
Page 17
Physical Dimensions
Dimensions are in millimeters unless otherwise specified.
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Figure 18. 14-Terminal De-populated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm
© 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSUSB30 Rev. 1.1.5 17
Page 18
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Physical Dimensions
Dimensions are in millimeters unless otherwise specified.
Figure 19. 10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm Wide
© 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSUSB30 Rev. 1.1.5 18
Page 19
Physical Dimensions
Dimensions are in millimeters unless otherwise specified.
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Figure 20. 10-Lead, Quad, Ultrathin Molded Leadless Package (UMLP), 1.4 x 1.8mm
© 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FSUSB30 Rev. 1.1.5 19
Page 20
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
© 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FSUSB30 Rev. 1.1.5 20
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