4Ω Switch Connection between Two Ports
Minimal Propagation Delay through the Switch
Low I
CC
Zero Bounce in Flow-through Mode
Control Inputs Compatible with TTL Level
Description
The FST3245 switch provides eight-bits of high-speed
CMOS TTL-compatible bus switching in a standard ’245
pin-out. The low on resistance allows inputs to be
connected to outputs without adding propagation delay
or generating additional ground bounce noise.
The device is organized as an eight-bit switch. When
/OE is LOW, the switch is ON and port A is connected
to port B. When /OE is HIGH, the switch is OPEN and a
high-impedance state exists between the two ports.
Ordering Information
Operating
Part Number
Temperature
Package
Range
FST3245WMX
FST3245QSC
FST3245QSCX
FST3245MTC
FST3245MTCX
All packages are lead free per JEDEC: J-STD-020B standard.
The Fairchild switch fami l y deri ves from and embodies Fairchild ’ s proven switch technology used for several years in its
74LVX3L384 (FST3384) bus switch product.
-40 to +85°C
-40 to +85°C
-40 to +85°C
-40 to +85°C
-40 to +85°C
20-Lead, Small Outline Integrated Circuit (SOIC), JEDEC
MS-013, 0.300-inch Wide
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
Symbol Parameter Min. Max. Unit
VCC Supply Voltage -0.5 7.0 V
VS DC Switch Voltage -0.5 7.0 V
VIN DC Input Voltage
IIK DC Input Diode Current, V
I
DC Output Sink Current 128 mA
OUT
I
/ I
CC
DC V
GND
T
Storage Temperature Range -65 +150 °C
STG
/ GND Current ±100 mA
CC
Note:
1. The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are
observed.
(1)
-0.5 7.0 V
< 0V -50 mA
IN
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol Parameter Min. Max. Unit
VCC Power Supply Operating 4.0 5.5 V
VIN Input Voltage 0 5.5 V
V
Output Voltage 0 5.5 V
OUT
tr, tf Input Rise and Fall Time
Switch Control Input
Switch I/O 0 DC
TA Operating Temperature, Free Air -40 +85 °C
Note:
2. Unused control inputs must be held HIGH or LOW. They may not float.
VIK Clamp Diode Voltage I
VIH High-Level Input Voltage 4.0 to 5.52.0 V
VIL Low-Level Input Voltage 4.0 to 5.50.8 V
IIN Input Leakage Current
IOZ
RON Switch On Resistance
Off-state Leakage
Current
(3)
ICC Quiescent Supply Current
ΔICC
Increase in ICC per Input
Note:
3. Measured by the voltage drop between the A and B pins at the indicated current through the switch. On
resistance is determined by the lower of the voltages on the A or B pins.
4. This parameter is guaranteed by design, but is not tested. The bus switch contributes no propagation delay
other than the RC delay of the typical on resistance of the switch and the 50pF load capacitance when driven by
an ideal voltage source (zero output impedance).
Figure 3
Figure 4
Figure 3
Figure 4
Figure 3
Figure 4
Capacitance
TA = +25°C, f = 1MHz. Capacitance is characterized, but not tested.
Symbol Parameter Conditions Typ. Units
CIN Control Pin Input Capacitance VCC = 5.0V 3 pF
C
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Pl ease note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to v er ify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Pl ease note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to v er ify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Pl ease note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to v er ify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: