Datasheet FS6128-06, FS6128-05, FS6128-04 Datasheet (AMIS)

FS6128-04 / FS6128-05 / FS6128-06

FS6128-04 / FS6128-05 / FS6128-06FS6128-04 / FS6128-05 / FS6128-06

AMERICAN MICROSYSTEMS, INC.

April 2000

1.0 Features

• Phase-locked loop (PLL) device synthesizes output

clock frequency from crystal oscillator or external reference clock

• On-chip tunable voltage-controlled crystal oscillator

(VCXO) allows precise system frequency tuning

• Typically used for generation of MPEG-2 decoder

clock

• 3.3V supply voltage

• Very low phase noise PLL

• Use with “pullable” 14pF crystals – no external pad-

ding capacitors required

• Small circuit board footprint (8-pin 0.150″ SOIC)

• Custom frequency selections available - contact your

local AMI Sales Representative for more information

PLL Clock Generator IC with VCXO

PLL Clock Generator IC with VCXOPLL Clock Generator IC with VCXO

2.0 Description

The FS6128 is a monolithic CMOS clock generator IC designed to minim ize cost a nd com ponen t coun t i n d igital video/audio systems.

At the core of the FS6128 is circu itry that implements a voltage-controlle d crystal oscillator (VCXO) when an external resonator (nominally 13.5MHz) is attached. The VCXO allows device f requenc ies to b e precis el y adjusted for use in systems that have frequency matching requirements, such as digital satellite receivers.

A high-resolution ph ase-locked loop gener ates an output clock (CLK) through a pos t-divider. T he CLK f requenc y is ratiometrically derived from the VCXO frequency. The locking of the CLK frequency to other system reference frequencies can el iminate unpredicta ble artifacts in video systems and reduce electromagnetic interference (EMI) due to frequency harmonic stacking.

Figure 1: Pin Configuration

1 8

XIN

VDD

XTUNE

VSS

2

3

4

8-pin (0.150″) SOIC

FS6128

Figure 2: Block Diagram

XIN

VCXO

XOUT

XTUNE

7

6

5

XOUT

VSS

n/c

CLK

Table 1: Crystal / Output Frequencies

DEVICE f

FS6128-04 13.500 27.000 FS6128-05 13.500 13.500 FS6128-06 13.500 54.000

NOTE: Contact AMI for custom PLL frequencies

PLL

DIVIDER

(MHz) CLK (M Hz)

XIN

CLK

FS6128-04 FS6128-05 FS6128-06

American Microsystems, Inc. reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.

ISO9001

ISO9001ISO9001

4.24.00

FS6128-04 / FS6128-05 / FS6128-06

FS6128-04 / FS6128-05 / FS6128-06FS6128-04 / FS6128-05 / FS6128-06

PLL Clock Generator IC with VCXO

PLL Clock Generator IC with VCXOPLL Clock Generator IC with VCXO

AMERICAN MICROSYSTEMS, INC.

April 2000

Table 2: Pin Descriptions

Key: AI = Analog Input; AO = Analog Output; DI = Digital Input; DIU = Input with Internal Pull-Up; DID = Input with Internal Pull-Down; DIO = Digital Input/Output; DI-3 = Three-Level Digital Input, DO = Digital Output; P = Power/Ground; # = Active Low pin

PIN TYPE NAME DESCRIPTION

1 AI XIN VCXO Feedback 2 P VDD Power Supply (+3.3V) 3 AI XTUNE VCXO Tune 4 P VSS Ground 5 DO CLK Cl ock Output 6 - n/c No Connection 7 DO VSS Ground 8 AO XOUT VCXO Drive

3.0 Functional Block Description

3.1 Voltage-Controlled Crystal Oscillator (VCXO)

The VCXO provides a tunab le, low-jitter frequenc y reference for the rest of the FS6128 system components. Loading capacitance for the crystal is internal to the FS6128. No external components (other than the resonator itself) are required for operation of the VCXO.

Continuous fine-tuning of the VCXO f requency is accom plished by varying the voltage on the XTUNE pin. The value of this voltage controls the effective capacitance presented to the crystal. The actual amount that this loa d capacitance change will alter the oscillat or frequency depends on the characteris tics of the crystal as well as the oscillator circuit itself.

It is important that the cr ystal load capacitance is spec ified correctly to “center” the tuning range. See Table 5.

A simple formula to obtain the “pulling” capability of a crystal oscillator is:

6

ppmf

)(

=∆

2

where: C

the shunt (or holder) capacitance of the crystal

0 =

C

the motional capacitance of the crystal

1 =

C

and CL2 = the two extremes (minimum and maximum)

L1

of the applied load capacitance presented by the FS6128.

()

()()

×−×

CCC

10

LL

121

+×+×

CCCC

LL

1020

EXAMPLE: A crystal with the following parameters is used: C and maximum C range (peak-to-peak) is:

= 0.025pF and C0 = 6pF. Using the minim um

1

f 300

=∆

= 10pF, and CL2 = 20pF, the tuning

L1

()

.

10200250

()()

6

×−×

10 1062062

+×+×

ppm

=

.

3.2 Phase-Locked Loop (PLL)

The on-chip PLL is a standard frequency- and phaselocked loop architecture. The PLL multiplies the r ef er ence oscillator frequenc y to the desired out put frequency b y a ratio of integers. The frequency multiplication is exact with a zero synthesis error (unless otherwise specified).

ISO9001

ISO9001ISO9001

2

4.24.00

FS6128-04 / FS6128-05 / FS6128-06

FS6128-04 / FS6128-05 / FS6128-06FS6128-04 / FS6128-05 / FS6128-06

AMERICAN MICROSYSTEMS, INC.

PLL Clock Generator IC with VCXO

PLL Clock Generator IC with VCXOPLL Clock Generator IC with VCXO

April 2000

4.0 Electrical Specifications

Table 3: Absolute Maximum Ratings

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These conditions represent a stress rating only, and functional operation of the device at these or any other conditions above the operational limits noted in this specification is not implied. Exposure to maximum rating conditions for extended conditions may affect device performance, functionality, and reliability.

PARAMETER SYMBOL MIN. MAX. UNITS

Supply Voltage (VSS = ground) V Input Voltage, dc V Output Voltage, dc V Input Clamp Current, dc (VI < 0 or VI > VDD)I Output Clamp Current, dc (VI < 0 or VI > VDD)I Storage Temperature Range (non-condensing) T Ambient Temperature Range, Under Bias T Junction Temperature T Lead Temperature (soldering, 10s) 260 °C Input Static Discharge Voltage Protection (MIL-STD 883E, Method 3015.7) 2 kV

DD

I

O

IK

OK

S

A

J

VSS-0.5 7 V VSS-0.5 VDD+0.5 V VSS-0.5 VDD+0.5 V

-50 50 mA

-65 150 °C

-55 125 °C 125 °C

CAUTION: ELECTROSTATIC SENSITIVE DEVICE

Permanent damage resulting in a loss of functionality or performance may occur if this device is subject ed to a high-energy electrostatic discharge.

Table 4: Operating Conditions

PARAMETER SYMBOL CONDITIONS/DESCRIPTION MIN. TYP. MAX. UNITS

Supply Voltage V Ambient Operating Temperature Range T Crystal Resonator Frequency f

DD

XTAL

3.3V ± 10% 3.0 3.3 3.6 V

A

Fundamental Mode 12 13.5 18 MHz

070°C

ISO9001

ISO9001ISO9001

3

4.24.00

FS6128-04 / FS6128-05 / FS6128-06

FS6128-04 / FS6128-05 / FS6128-06FS6128-04 / FS6128-05 / FS6128-06

PLL Clock Generator IC with VCXO

PLL Clock Generator IC with VCXOPLL Clock Generator IC with VCXO

AMERICAN MICROSYSTEMS, INC.

April 2000

Table 5: DC Electrical Specifications

Unless otherwise stated, VDD = 3.3V ± 10%, no load on any output, and ambient temperature range TA = 0°C to 70°C. Parameters denoted with an asterisk ( * ) represent nominal characterization data and are not production tested to any specific limits. Where given, MIN and MAX characterization data are ± 3σ from typical. Negative currents indicate current flows out of the device.

PARAMETER SYMBOL CONDITIONS/DESCRIPTION MIN. TYP. MAX. UNITS

Overall

Supply Current, Dynamic, with Loaded Outputs

Supply Current, Static I

Voltage Controlled Crystal Oscillator (contact factory for approved crystal sources or other application assistance)

Crystal Loading Capacitance at Center Tuning Voltage

Crystal Resonator Motional Capacitance C XTUNE Effective Range 03V

Synthesized Load Capacitance Min. C Synthesized Load Capacitance Max. C

VCXO Tuning Range

VCXO Tuning Characteristic Crystal Drive Level

Clock Output (CLK)

High-Level Output Source Current * I Low-Level Output Sink Current * I

Output Impedance *

Short Circuit Source Current * I Short Circuit Sink Current * I

C

I

DD

L(xtal)

OH

OL

z

OH

z

OL

OSH

OSL

f

= 13.5MHz; CL = 10pF, VDD = 3.6V 30 mA

XTAL

XIN = 0V, VDD = 3.6V 3 mA

Order crystal for this capacitance (parallel load) at desired center frequency

Specified motional capacitance of the

1

crystal will affect pullability (see text)

L1

L2

@V(XTUNE)=minimum value @V(XTUNE)=maximum value f

= 13.5MHz; C

XTAL

(peak-to-peak)

Note: positive change of XTUNE = positive change of VCXO frequency

R

=20Ω; CL = 20pF

XTAL

VO = 2.0V -40 mA VO = 0.4V 17 mA VO = 0.1VDD; output driving high 25 VO = 0.1VDD; output driving low 25 VO = 0V; shorted for 30s, max. -55 mA VO = 3.3V; shorted for 30s, max. 55 mA

L(xtal)

= 14pF; C

1(xtal)

= 25fF

14 pF

25 fF

10 pF 20 pF

300 ppm

150 ppm/V 200 uW

Ω

ISO9001

ISO9001ISO9001

4

4.24.00

FS6128-04 / FS6128-05 / FS6128-06

FS6128-04 / FS6128-05 / FS6128-06FS6128-04 / FS6128-05 / FS6128-06

AMERICAN MICROSYSTEMS, INC.

PLL Clock Generator IC with VCXO

PLL Clock Generator IC with VCXOPLL Clock Generator IC with VCXO

April 2000

Table 6: AC Timing Specifications

Unless otherwise stated, VDD = 3.3V ± 10%, no load on any output, and ambient temperature range TA = 0°C to 70°C. Parameters denoted with an asterisk ( * ) represent nominal characterization data and are not production tested to any specific limits. Where given, MIN and MAX characterization data are ± 3σ from typical.

PARAMETER SYMBOL CONDITIONS/DESCRIPTION MIN. TYP. MAX. UNITS

Overall

VCXO Stabilization Time * t PLL Stabilization Time * t Synthesis Error (unless otherwise noted in Frequency Table) 0 ppm

Clock Output (CLK)

Duty Cycle *

Jitter, Period (peak-peak) *

Jitter, Long Term (σy(τ)) * Rise Time * t

Fall Time * t

VCXOSTB

PLLSTB

t

j(∆P)

t

j(LT)

r

f

From power valid 10 ms From VCXO stable 100 us

Ratio of high pulse width (as measured from rising edge to next falling edge at V

From rising edge to next rising edge at VDD/2, CL = 10pF

From 0-500µs at VDD/2, CL = 10pF compared to ideal clock source

VDD = 3.3V; VO = 0.3V to 3.0V; CL = 10pF 1.7 ns VDD = 3.3V; VO = 3.0V to 0.3V; CL = 10pF 1.7 ns

/2) to one clock period

DD

45 55 %

200 ps

100 ps

ISO9001

ISO9001ISO9001

5

4.24.00

FS6128-04 / FS6128-05 / FS6128-06

FS6128-04 / FS6128-05 / FS6128-06FS6128-04 / FS6128-05 / FS6128-06

PLL Clock Generator IC with VCXO

PLL Clock Generator IC with VCXOPLL Clock Generator IC with VCXO

5.0 Package Information

Table 7: 8-pin SOIC (0.150") Package Dimensions

DIMENSIONS

INCHES MILLIMETERS

MIN. MAX. MIN. MAX.

A 0.061 0.068 1.55 1.73 A1 0.004 0.0098 0.102 0.249 A2 0.055 0.061 1.40 1.55

B 0.013 0.019 0.33 0.49

C 0.0075 0.0098 0.191 0.249

D 0.189 0.196 4.80 4.98

E 0.150 0.157 3.81 3.99

e 0.050 BSC 1.27 BSC

H 0.230 0.244 5.84 6.20

h 0.010 0.016 0.25 0.41

L 0.016 0.035 0.41 0.89

Θ 0° 8° 0° 8°

8

AMERICAN MICROSYSTEMS, INC.

1

B

D

BASE PLANE

e

R

A

SEATING

PLANE

HE

ALL RADII:

0.005" TO 0.01"

A

2

1

AMERICAN MICROSYSTEMS, INC.

7° typ.h x 45°

C

L

April 2000

θ

Table 8: 8-pin SOIC (0.150") Package Characteristics

PARAMETER SYMBOL CONDITIONS/DESCRIPTION TYP. UNITS

Thermal Impedance, Junction to Free-Air 8-pin 0.150” SOIC

Lead Inductance, Self L

Lead Inductance, Mutual L Lead Capacitance, Bulk C

Θ

JA

11

12

11

Air flow = 0 m/s 110 °C/W Corner lead 2.0

Center lead 1.6 Any lead to any adjacent lead 0.4 nH Any lead to V

SS

nH

0.27 pF

ISO9001

ISO9001ISO9001

6

4.24.00

FS6128-04 / FS6128-05 / FS6128-06

FS6128-04 / FS6128-05 / FS6128-06FS6128-04 / FS6128-05 / FS6128-06

AMERICAN MICROSYSTEMS, INC.

April 2000

6.0 Ordering Information

Table 9: Device Ordering Codes

ORDERING CODE DEVICE NUMBER PACKAGE TYPE

11640-825

11640-835

11640-102

11640-112

11640-103

11640-113

FS6128-04

FS6128-05

FS6128-06

8-pin (0.150”) SOIC

(Small Outline Package)

8-pin (0.150”) SOIC

(Small Outline Package)

8-pin (0.150”) SOIC

(Small Outline Package)

8-pin (0.150”) SOIC

(Small Outline Package)

8-pin (0.150”) SOIC

(Small Outline Package)

8-pin (0.150”) SOIC

(Small Outline Package)

PLL Clock Generator IC with VCXO

PLL Clock Generator IC with VCXOPLL Clock Generator IC with VCXO

OPERATING

TEMPERATURE RANGE

0°C to 70°C (Commer cial)

SHIPPING

CONFIGURATION

Tape and Reel

Tubes

Tape and Reel

Tubes

Tape and Reel

Tubes

7.0 Revision Information

DATE PAGE DESCRIPTION

1/21/00 1 Fixed typographical error 4/24/00 5 Fixed formatting error

Devices sold by AMI are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMI makes no warranty, express, statutory implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMI makes no warranty of merchantability or fitness for any purposes. AMI reserves the right to discontinue production and change specifications and prices at any time and without notice. AMI’s products are intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without additional processing by AMI for such applications.

American Microsystems, Inc., 2300 Buckskin Rd., Pocatello, ID 83201, (208) 233-4690, FAX (208) 234-6796, WWW Address: http://www.amis.com E-mail: [email protected]

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4.24.00