Page 1
MITSUBISHI Nch POWER MOSFET
FS3KM-10
HIGH-SPEED SWITCHING USE
FS3KM-10
¡VDSS ................................................................................ 500V
¡r
DS (ON) (MAX) .................................................................4.4Ω
¡I
D ............................................................................................ 3A
¡V
iso ................................................................................ 2000V
OUTLINE DRAWING Dimensions in mm
10 ± 0.3 2.8 ± 0.2
3 ± 0.33.6 ± 0.3
15 ± 0.314 ± 0.5
123
w
q
e
6.5 ± 0.3
φ 3.2 ± 0.2
1.1 ± 0.2
1.1 ± 0.2
0.75 ± 0.15
2.54 ± 0.252.54 ± 0.25
2.6 ± 0.2
q GATE
w DRAIN
e SOURCE
0.75 ± 0.15
4.5 ± 0.2
TO-220FN
APPLICATION
SMPS, DC-DC Converter, battery charger, power
supply of printer, copier, HDD, FDD, TV, VCR, personal computer etc.
MAXIMUM RATINGS (Tc = 25°C)
Symbol
VDSS
VGSS
ID
IDM
PD
Tch
Tstg
Viso
—
Drain-source voltage
Gate-source voltage
Drain current
Drain current (Pulsed)
Maximum power dissipation
Channel temperature
Storage temperature
Isolation voltage
Weight
Parameter Conditions Ratings Unit
VGS = 0V
VDS = 0V
AC for 1minute, Terminal to case
Typical value
500
±30
3
9
30
–55 ~ +150
–55 ~ +150
2000
2.0
V
V
A
A
W
°C
°C
Vrms
g
Feb.1999
Page 2
ELECTRICAL CHARACTERISTICS (Tch = 25°C)
Symbol UnitParameter Test conditions
V
(BR) DSS
V
(BR) GSS
IGSS
IDSS
VGS (th)
rDS (ON)
VDS (ON)
yfs
Ciss
Coss
Crss
td (on)
tr
td (off)
tf
VSD
Rth (ch-c)
Drain-source breakdown voltage
Gate-source breakdown voltage
Gate-source leakage current
Drain-source leakage current
Gate-source threshold voltage
Drain-source on-state resistance
Drain-source on-state voltage
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Source-drain voltage
Thermal resistance
ID = 1mA, VGS = 0V
IG = ±100µA, VDS = 0V
VGS = ±25V , VDS = 0V
VDS = 500V, VGS = 0V
ID = 1mA, VDS = 10V
ID = 1A, VGS = 10V
ID = 1A, VGS = 10V
ID = 1A, VDS = 10V
VDS = 25V, VGS = 0V, f = 1MHz
VDD = 200V, ID = 1A, VGS = 10V, RGEN = RGS = 50Ω
IS = 1A, VGS = 0V
Channel to case
MITSUBISHI Nch POWER MOSFET
FS3KM-10
HIGH-SPEED SWITCHING USE
Limits
Min. Typ. Max.
500
±30
—
—
2
—
—
1.0
—
—
—
—
—
—
—
—
—
—
—
—
—
3
3.4
3.4
1.5
300
35
6
13
10
30
30
1.5
—
—
—
±10
4.4
4.4
—
—
—
—
—
—
—
—
2.0
4.17
V
V
µA
mA
1
V
4
Ω
V
S
pF
pF
pF
ns
ns
ns
ns
V
°C/W
PERFORMANCE CURVES
POWER DISSIPATION DERATING CURVE
50
(W)
40
D
30
20
10
POWER DISSIPATION P
0
CASE TEMPERATURE T
OUTPUT CHARACTERISTICS
10
PD = 30W
8
(A)
D
6
(TYPICAL)
C
(°C)
TC = 25°C
Pulse Test
VGS = 20V
10V
8V
MAXIMUM SAFE OPERATING AREA
1
10
7
5
3
2
(A)
D
0
10
7
5
3
2
–1
10
7
5
DRAIN CURRENT I
200150100500
TC = 25°C
Single Pulse
3
2
–2
10
23 5710123 5710223 571032
DRAIN-SOURCE VOLTAGE V
tw=10µs
100µs
1ms
10ms
DC
DS
(V)
OUTPUT CHARACTERISTICS
(TYPICAL)
5
(A)
D
PD = 30W
4
TC = 25°C
3
Pulse Test
V
GS
= 20V
10V
8V
6V
4
2
DRAIN CURRENT I
0
0 1020304050
DRAIN-SOURCE VOLTAGE VDS (V)
6V
5V
2
1
DRAIN CURRENT I
0
0 4 8 12 16 20
DRAIN-SOURCE VOLTAGE VDS (V)
5V
Feb.1999
Page 3
MITSUBISHI Nch POWER MOSFET
FS3KM-10
HIGH-SPEED SWITCHING USE
ON-STATE VOLTAGE VS.
GATE-SOURCE VOLTAGE
(TYPICAL)
40
32
(V)
24
DS (ON)
16
VOLTAGE V
8
DRAIN-SOURCE ON-STATE
0
0 4 8 12 16 20
GATE-SOURCE VOLTAGE V
TRANSFER CHARACTERISTICS
(TYPICAL)
10
TC = 25°C
VDS = 50V
8
(A)
D
Pulse Test
6
4
2
DRAIN CURRENT I
TC = 25°C
Pulse Test
ID = 4A
3A
2A
1A
GS
(V)
ON-STATE RESISTANCE VS.
DRAIN CURRENT
(TYPICAL)
10
TC = 25°C
Pulse Test
8
(Ω)
6
DS (ON)
4
2
RESISTANCE r
DRAIN-SOURCE ON-STATE
0
–2
5710–123 5710023 5710
2310
DRAIN CURRENT I
FORWARD TRANSFER ADMITTANCE
VS.DRAIN CURRENT
(TYPICAL)
1
10
VDS = 10V
7
Pulse Test
5
(S)
3
fs
2
0
10
7
5
3
ADMITTANCE y
FORWARD TRANSFER
2
TC = 25°C
75°C
125°C
VGS = 10V
D
(A)
20V
1
0
0 4 8 12 16 20
GATE-SOURCE VOLTAGE V
DRAIN-SOURCE VOLTAGE
7
5
3
2
2
10
7
5
3
2
CAPACITANCE
1
10
Ciss, Coss, Crss (pF)
7
Tch = 25°C
5
f = 1MHz
VGS = 0V
3
2
23 5710
DRAIN-SOURCE VOLTAGE V
CAPACITANCE VS.
(TYPICAL)
0
23 5710
1
23 571022
GS
Coss
Crss
DS
(V)
Ciss
(V)
–1
10
10–123 5710
DRAIN CURRENT I
SWITCHING CHARACTERISTICS
(TYPICAL)
5
3
t
f
2
2
10
7
t
d(off)
5
3
2
t
10
d(on)
1
t
r
SWITCHING TIME (ns)
7
5
–1
23 5710
10
DRAIN CURRENT ID (A)
0
23 5710
D
(A)
Tch = 25°C
DD
= 200V
V
VGS = 10V
GEN
= R
R
GS
0
23 5710
1
= 50Ω
1
Feb.1999
Page 4
MITSUBISHI Nch POWER MOSFET
FS3KM-10
HIGH-SPEED SWITCHING USE
GATE-SOURCE VOLTAGE
VS.GATE CHARGE
(TYPICAL)
20
16
Tch = 25°C
ID = 3A
VDS = 100V
(V)
GS
200V
12
400V
8
4
GATE-SOURCE VOLTAGE V
0
0 4 8 12 16 20
GATE CHARGE Q
g
(nC)
ON-STATE RESISTANCE VS.
CHANNEL TEMPERATURE
(t°C)
(25°C)
DS (ON)
DS (ON)
10
1
7
5
VGS = 10V
ID = 1/2I
Pulse Test
(TYPICAL)
D
3
2
0
10
7
5
3
2
–1
10
–50
DRAIN-SOURCE ON-STATE RESISTANCE r
DRAIN-SOURCE ON-STATE RESISTANCE r
CHANNEL TEMPERATURE Tch (°C)
0 50 100 150
SOURCE-DRAIN DIODE
FORWARD CHARACTERISTICS
(TYPICAL)
10
TC = 125°C
8
(A)
S
6
4
2
SOURCE CURRENT I
0
0 0.8 1.6 2.4 3.2 4.0
SOURCE-DRAIN VOLTAGE V
THRESHOLD VOLTAGE VS.
CHANNEL TEMPERATURE
(TYPICAL)
5.0
VDS = 10V
ID = 1mA
4.0
(V)
3.0
GS (th)
2.0
VOLTAGE V
1.0
GATE-SOURCE THRESHOLD
0
–50 0 50 100 150
CHANNEL TEMPERATURE Tch (°C)
75°C
VGS = 0V
Pulse Test
25°C
SD
(V)
BREAKDOWN VOLTAGE VS.
(t°C)
(25°C)
CHANNEL TEMPERATURE
(TYPICAL)
1.4
BR (DSS)
BR (DSS)
VGS = 0V
ID = 1mA
1.2
1.0
0.8
0.6
0.4
–50 0 50 100 150
DRAIN-SOURCE BREAKDOWN VOLTAGE V
CHANNEL TEMPERATURE Tch (°C)
DRAIN-SOURCE BREAKDOWN VOLTAGE V
TRANSIENT THERMAL IMPEDANCE
(°C/W)
1
10
7
D=1
(ch–c)
5
th
3
0.5
2
0.2
0
10
0.1
7
5
3
2
–1
10
7
5
3
2
–2
10
–4
23 57
10
10
TRANSIENT THERMAL IMPEDANCE Z
CHARACTERISTICS
0.05
0.02
0.01
Single Pulse
–3
–2
23 57 23 57 23 57
10
10
–1
PULSE WIDTH t
P
10023 57
w
(s)
DM
tw
D=
T
tw
T
10123 57
2
10
Feb.1999
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