Page 1
On-State Current
8 Amp
FS0809.H
STANDARD SCR
These series of Silicon Controlled
R ectifier use a high performance
PNPN technology.
These parts are intended for general
purpose applications where high gate
sensitivity is required using surface
mount technology.
Dec - 02
Absolute Maximum Ratings, according to IEC publication No. 134
On-state Current
Average On-state Current
Non-repetitive On-State Current
Non-repetitive On-State Current
Fusing Current
Peak Reverse Gate Voltage
Peak Gate Current
Peak Gate Dissipation
Gate Dissipation
Operating Temperature
Storage Temperature
Soldering Temperature
I
T(RMS)
PARAMETER CONDITIONS Min. Max. Unit
Gate Trigger Current
> 2 mA to < 15 mA
Off-State Voltage
200 V ÷ 600 V
SYMBOL
I
T(AV)
I
TSM
I
TSM
I2t
V
GRM
I
GM
P
GM
P
G(AV)
T
j
T
stg
T
sld
180º Conduction Angle, Tc = 110 ºC
Half Cycle, Θ = 180 º, T
C
= 110 ºC
Half Cycle, 60 Hz
Half Cycle, 50 Hz
t
p
= 10ms, Half Cycle
I
GR
= 10 µA
20 µs max.
20 µs max.
20ms max.
10s max.
-40
-40
A
A
A
A
A
2
s
V
A
W
W
ºC
ºC
ºC
8
5
100
95
45
5
4
5
1
+125
+150
260
Repetitive Peak Off State
Voltage
PARAMETER CONDITIONS VOLTAGE UnitSYMBOL
V
DRM
V
RRM
R
GK
= 1 KΩ
B
200 V
D
400
M
600
TO220-AB
K
A
G
Page 2
FS0809.H
STANDARD SCR
Dec - 02
PART NUMBER INFORMATION
FAGOR
SCR
CURRENT
CASE
VOLTAGE
SENSITIVITY
F S 08 09 B H 00
FORMING
TU
PACKAGING
Electrical Characteristics
Gate Trigger Current
Off-State Leakage Current
On-state Voltage
Gate Trigger Voltage
Gate Non Trigger Voltage
Holding Current
PARAMETER CONDITIONS SENSITIVITY
Unit
SYMBOL
I
GT
I
DRM
VD = 12 V
DC
, R
L
= 140Ω. T
j
= 25 ºC
mA
09
2
15
2
5
1.6
1.3
0.2
mA
µA
V
V
V
MIN
MAX
MAX
MAX
MAX
MAX
MIN
50
60
MAX
/ I
RRM
V
TM
V
GT
V
GD
I
H
di / dt
R
th(j-a)
Critical Rate of Current Rise
Thermal Resistance
Junction-Amb for DC
ºC/W
V
D
= V
DRM
, R
GK
= 220Ω T
j
= 125 ºC
T
j
= 25 ºC
V
R
= V
RRM
,
at IT = 16 Amp, tp = 380 µs, Tj = 25 ºC
IT = 100 mA , Gate open
Tr ≤ 100 ns, F = 60 Hz,
T
j
= 125 ºC
VD = 12 V
DC
, R
L
= 140Ω, T
j
= 25 ºC
V
D
= V
DRM
, R
L
= 3.3KΩ, RGK = 220Ω
T
j
= 125 ºC
mA
MIN
A/µs
R
d
T
j
= 125 ºC
R
d
Dynamic resistance
MAX
46
mΩ
30
MAX
I
L
mA
70
Latching Current
I
G
= 1.2 I
GT
V/µs
dv / dt
Critical Rate of Voltage Rise
V
D
= 0.67 x V
DRM
, Gate open
MIN
150
20
R
th(j-c)
Thermal Resistance
Junction-Case for DC
ºC/W
V
t0
T
j
= 125 ºC
Threshold Voltage MAX
0.85
V
Tj = 25 ºC
I
G
= 2 x I
GT
Tj = 125 ºC
Page 3
Dec - 02
Fig. 1: Maximum average power dissipation
versus average on-state current.
FS0809.H
STANDARD SCR
0 2
10
8
6
4
2
0
4 6
P (W)
I
T(av)
(A)
1 3 5 7
1.0
K = [Zth(j-c) / Rth (j-c)]
Fig. 3: Relative variation of thermal impedance
junction to case versus pulse duration.
1E-3 1E-2 1E-1 1E+0
tp (s)
0.5
0.2
0.1
α
360 º
Fig. 2: Average and D.C. on-state current
versus case temperature.
I
T(av)
(A)
T case (ºC)
10
8
6
4
2
0
0 25 50 75 100 125
α = 180 º
D.C.
IGT, IH (Tj) / IGT, IH (Tj = 25 ºC)
Fig. 4: Relative variation of gate trigger
current, holding and latching current versus
junction temperature.
Tj (ºC)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40 -20 20 60 80 1000 40 120 140
IGT
IH & IL
1 10 100 1000
Fig. 5: Non repetitive surge peak on-state
current versus number of cycles.
80
70
60
50
40
30
20
10
0
I
TSM
(A)
Number of
cycles
Tj initial = 25 ºC
F = 50 Hz
300
1 10
I
TSM
(A). I2t (A2s)
Fig. 6: Non repetitive surge peak on-state
current for a sinusoidal pulse with width:
tp < 10 ms, and corresponding value of I
2
t.
tp(ms)
2 5
100
10
I
TSM
20
50
I2 t
Tj initial = 25 ºC
Page 4
Dec - 02
FS0809.H
STANDARD SCR
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
Fig. 7: On-state characteristics (maximum
values).
ITM(A)
4.0
100.0
VTM(V)
4.5
10.0
1.0
0.1
5.0
Tj = Tj max.
Tj = 25 ºC
Tj max
Vto = 0.85 V
Rt = 46 mΩ
PACKAGE MECHANICAL DATA
TO-220AB
A
a1
a2
B
b1
b2
C
c1
c2
e
F
I
I4
L
I2
I3
M
REF.
DIMENSIONS
Milimeters
Min. Nominal Max.
15.20
13.00
10.00
0.61
1.23
4.40
0.49
2.40
2.40
6.20
3.75
15.80
2.65
1.14
1.14
3.75
16.40
2.60
15.90
14.00
10.40
0.88
1.32
4.60
0.70
2.72
2.70
6.60
3.85
16.80
2.95
1.70
1.70
14
a1
L
A
e
a2
b1
12
13
øI
B
c
F
b2
c2
c1
M
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