Datasheet FS0802MI, FS0802DI, FS0802BI Datasheet (FAGOR)

Page 1
On-State Current
8 Amp
FS0802.I
SENSITIVE GATE SCR
These series of Silicon Controlled R ectifier use a high performance
PNPN technology.
Feb - 03
Absolute Maximum Ratings, according to IEC publication No. 134
On-state Current
Average On-state Current
Non-repetitive On-State Current
Non-repetitive On-State Current
Fusing Current
Peak Reverse Gate Voltage
Peak Gate Current
Peak Gate Dissipation
Gate Dissipation
Operating Temperature
Storage Temperature
Soldering Temperature
I
T(RMS)
PARAMETER CONDITIONS Min. Max. Unit
Gate Trigger Current
< 200 µA
Off-State Voltage
200 V ÷ 600 V
SYMBOL
I
T(AV)
I
TSM
I
TSM
I2t V
GRM
I
GM
P
GM
P
G(AV)
T
j
T
stg
T
sld
180º Conduction Angle, Tc = 110 ºC
Half Cycle, Θ = 180 º, T
C
= 110 ºC
Half Cycle, 60 Hz
Half Cycle, 50 Hz
t
p
= 10ms, Half Cycle
I
GR
= 10 µA
20 µs max.
20 µs max.
20ms max.
10s max.
-40
-40
A
A
A
A
A
2
s
V
A
W
W
ºC
ºC
ºC
8
5
73
70
24.5
8
4
5
1
+125
+150
260
Repetitive Peak Off State
Voltage
PARAMETER CONDITIONS VOLTAGE UnitSYMBOL
V
DRM
V
RRM
R
GK
= 1 K
B
200 V
D
400
M
600
IPAK
(Plastic)
K
A
G
A
Page 2
FS0802.I
SENSITIVE GATE SCR
Feb - 03
PART NUMBER INFORMATION
FAGOR
SCR
CURRENT
CASE
VOLTAGE
SENSITIVITY
F S 08 02 B I 00
FORMING
TR
PACKAGING
Electrical Characteristics
Gate Trigger Current
Off-State Leakage Current
On-state Voltage
Gate Trigger Voltage
Gate Non Trigger Voltage
Holding Current
PARAMETER CONDITIONS SENSITIVITY
Unit
SYMBOL
I
GT
I
DRM
VD = 12 V
DC
, R
L
= 140. T
j
= 25 ºC
µA
02
200
1
5
1.6
0.8
0.1
mA
µA
V
V
V
MIN
MAX
MAX
MAX
MAX
MAX
MIN
50
100
MAX
/ I
RRM
V
TM
V
GT
V
GD
I
H
di / dt
R
th(j-a)
Critical Rate of Current Rise
Thermal Resistance Junction-Amb for DC
ºC/W
V
D
= V
DRM
, Tj = 125 ºC
T
j
= 25 ºC
V
R
= V
RRM
,
at IT = 16 Amp, tp = 380 µs, Tj = 25 ºC
IT = 50 mA ,
Tr 100 ns, T
j
= 125 ºC
VD = 12 V
DC
, R
L
= 140, T
j
= 25 ºC
V
D
= V
DRM
, R
L
= 3.3K,
T
j
= 125 ºC
mA
MIN
A/µs
R
d
T
j
= 125 ºC
R
d
Dynamic resistance MAX
46
m
5
MAX
I
L
mA6
Latching Current
I
G
= 1 mA
V/µs
dv / dt
Critical Rate of Voltage Rise
V
D
= 0.67 x V
DRM
, MIN
5
20
R
th(j-c)
Thermal Resistance Junction-Case for DC
ºC/W
V
t0
T
j
= 125 ºC
Threshold Voltage MAX
0.85
V
R
GK
= 220
R
GK
= 220
R
GK
= 220
R
GK
=1K
T
j
= 25 ºC
R
GK
=1K
I
G
= 2 x I
GT
Tj = 125 ºC
Page 3
Feb - 03
FS0802.I
SENSITIVE GATE SCR
Fig. 1: Maximum average power dissipation versus average on-state current.
0 2
10
8
6
4
2
0
4 6
P (W)
I
T(av)
(A)
1 3 5 7
α
360 º
Fig. 2: Average and D.C. on-state current versus case temperature.
I
T(av)
(A)
T case (ºC)
10
8
6
4
2
0
0 25 50 75 100 125
α = 180 º
D.C.
1.0
K = [Zth(j-c) / Rth (j-c)]
Fig. 3: Relative variation of thermal impedance junction to case versus pulse duration.
1E-3 1E-2 1E-1 1E+0
tp (s)
0.5
0.2
0.1
IGT, IH (Tj) / IGT, IH (Tj = 25 ºC)
Fig. 4: Relative variation of gate trigger current, holding and latching current versus junction temperature.
Tj (ºC)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40 -20 20 60 80 1000 40 120 140
IGT
IH & IL
1 10 100 1000
Fig. 5: Non repetitive surge peak on-state current versus number of cycles.
80
70
60
50
40
30
20
10
0
I
TSM
(A)
Number of cycles
Tj initial = 25 ºC F = 50 Hz
300
1 10
I
TSM
(A). I2t (A2s)
Fig. 6: Non repetitive surge peak on-state current for a sinusoidal pulse with width: tp < 10 ms, and corresponding value of I
2
t.
tp(ms)
2 5
100
10
I
TSM
20
50
I2 t
Tj initial = 25 ºC
Page 4
Feb - 03
FS0802.I
SENSITIVE GATE SCR
PACKAGE MECHANICAL DATA
IPAK TO 251-AA
Marking: type number Weight: 0.2 g
ø1x0.15
E
D
L3
L1
L
be
b1
H
±2º
A
±2º
±2º
±2º
c2
c
A1
D1
E1
±2º
A
A1
b
b1
c
c2
D
D1
E
E1
e
L L1 L3
REF.
DIMENSIONS
Milimeters
Min. Nominal Max.
2.19
0.89
0.64
0.76
0.46
5.97
5.21
6.35
5.21
8.89
1.91
0.89
2.3±0.08
1.067±0.01
0.75±0.1
0.95
0.8±0.013
6.1±0.1
6.58±0.14
5.36±0.1
2.28BSC
9.2±0.2 2±0.1
2.38
1.14
0.89
1.14
0.58
6.22
5.52
6.73
5.46
9.65
2.28
1.27
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
Fig. 9: On-state characteristics (maximum values).
ITM(A)
4.0
100.0
VTM(V)
4.5
10.0
1.0
0.1
5.0
Tj = Tj max.
Tj = 25 ºC
Tj max Vto = 0.85 V Rt = 46 m
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