FREQUENCY COMPENSATION COEFFICIENT ……………….……….. 6
PART NUMBER ……………………………………….………………………. 6
DIMENSIONS …………..……………………………………………..………. 6
DETAILED TAPING SPECIFICATION ………………………………………. 7
LEAD FORMING & CUT…………….…………………………………………... 7
V -CHIP TYPE SPECIFICATIONS 8 - 9
■■ SSEERRIIEESS
SSEERRIIEESS
PSH
Ultra Low ESR, High ripple current, High reliability
Durability :1000 hours at 125℃…………………………………………
Ultra Low ESR<7mΩ, High ripple current, High reliability
Durability :2000 hours at 105℃…………………………………………
Ultra Low ESR, High ripple current, High reliability
Standard , Durability :2000 hours at 105℃ ..…. ……………………
V -CHIP TYPE
Ultra Low ESR, High ripple current, High reliability
Durability :1000 hours at 125℃…………………………………………
V -CHIP TYPE
Ultra Low ESR, High ripple current, High reliability,
Durability :2000 hours at 105℃…………………………………………
1122--1133
1144--1155
1166--1177
1188--1199
2200--2211
Page 2
F
P
C
O
N
F
P
C
C
O
O
F
P
N
N
CAUTION FOR PROPER USE OF FP-CON
Upon using FP-CON, please pay attention to the points listed below.
When the following types of electrical loads applied to FP-CON of electrical property occurs:
z reverse voltage
z voltage exceeds rated working voltage
z allowable ripple current is exceeded
z severe charging / discharging
1、CAUTION DURING CIRCUIT DESIGN
1.1 PROHIBITED CIRCUITS
Leakage current may increase, capacitance may also fluctuate after soldering. Therefore, FP-CON cannot
be used on the following circuits.
z High impedance voltage retention circuits.
z Coupling circuits
z Time constant circuits
1.2 OPERATIONAL ENVIRONMENT, MOUNTINGENVIRONMENT AND CONDITIONS.
z Ensure that operational and mounting conditions low the specified conditions detailed in the catalog
specification sheets.
1.3 OPERATING TEMPERATURE, RIPPLE CURRENT AND LOAD LIFE.
1.3.1 Operating temperature and applied ripple current should be within the specified value in the catalog
or specification sheets.
z Do not use FP-CON at temperature which exceeds the specified operating temperature range.
z Do not apply excessive current to the FP-CON, which exceeds the specified maximum permissible
ripple current.
1.3.2
During circuit design, please ensure that FP-CON are selected to match with the lifetime
requirements of the application.
1.4 APPLICATION
z FP-CON are normally polarized. Reverse voltage or AC voltage should not be applied. When polarity
applied voltage is uncertain or when the polarity may flip over, non-polar type FP-CON should be used, but
of
the non-polar type cannot be used for AC circuit.
z Standard FP-CON are net suitable for rapid charge and discharge applications. Consult with Cushy
about specially designed FP-CON for rapid charge and discharge.
1.5 APPLIED VOLTAGE
z Do not exceed the rated voltage of FP-CON
z The combined value of D.C. voltage and the peak A.C. voltage shall not exceed the rated voltage
and shall not be reverse voltage.
z When DC voltage is low, negative ripple voltage peak value must not become a reverse voltage that
exceeds.
z Use the within 20 % of the rated voltage for applications which may cause the reverse voltage during
the transient phenomena when the power is turned off or the source is switched.
1.6 INSULATION
The PVC sleeve of FP-CON is not recognized as an insulator, and therefore, the standard FP-CON
should not be used in a place where insulation function is needed. Please consult with Cushy should you
require a higher grade of insulating sleeve.
1.7 CONDITIONS OF USE
The following environment should be avoided when using FP-CON.
z Damp conditions such as water, saltwater spray, or oil spray or fumes. High humidity or humidity
condensation situations.
z Hazardous gas/fumes such as hydrogen sulfide, sulfurous acid gas, nitrous acid, chlorine gas or
ammonia.
z Exposure to ozone, ultraviolet rays or radiation.
1.8 CONSIDERATION TO ASSEMBLY CONDITION.
Design the appropriate hole spacing to match the lead pitch of FP-CON.
1
Page 3
F
P
C
O
N
F
P
C
O
F
P
C
O
N
N
CAUTION FOR PROPER USE OF FP-CON
1.9 CONSIDERATION TO CIRCUIT DESIGN
z Any copper lines or circuit patterns should not be laid under the FP-CON.
z Parts which radiate heat should not be placed close to or reverse side of the FP-CON on the PCB
board.
1.10 THERS
z Performance of electrical characteristics of FP-CON are affected by variation of operating temperature
frequency. Consider this variation when designing the circuit.
and
z Excessive holes and connection hole between both sides on the PW board should be avoided around or
under the mounting area of the FP-CON on double sided or multiplayer PW board.
z Consider current balance when 2 or more FP-CON are connected in parallel.
z Use bleeder resistors when 2 or more FP-CON are connected in series. In this case, the resistors should
be connected parallel to the FP-CON.
2、CAUTION FOR ASSEMBLING FP-CON
2.1 CAUTION BEFORE ASSEMBLY
2.1.1 Polarity Marking of FP-CON
Please confirm the polarity to avoid applying any reverse voltage or AC voltage to the FP-CON.
Polarity is indicated as below:
z Negative polarity is indicated on the side of body by means of a stripe or an arrow.
z On radial leadedFP-CON, the shorter lead is the negative terminal.
z On Surface Mount FP-CON, the mark ﹝﹞indicates the direction of Negative Polarity.
2.1.2 Voltage Treatment
The following voltage treatment should be done on the FP-CON that have been stored for a long
time.
z Voltage Treatment
Leakage current may increase when FP-CON are stored for a long period of time. In this case, apply
rated voltage for 1 hour at 60 to 70 ℃ with load of 1 kΩ resistor, and then discharged through a
resistor of about lΩ/Volt.
z FP-CON cannot be recycled after mounting and applying electricity in unit. The FP-CON which are
removed from PW board for the purpose of measuring electrical characteristics at the periodical
inspection should only be recycled for the same position.
z FP-CON may accumulate charge naturally during storage. In this case, discharge through a 1kΩ
resistor before use.
z Leakage current of FP-CON may be increased during long storage time. In this case, the FP-CON
should be subject to voltage treatment through a l kΩ resistor before use.
2.2 IN THE ASSEMBLY PROCESS - 1
z Ensure rated voltage and nominal capacitance of the FP-CON before mounting.
z Ensure the FP-CON polarity before mounting.
z Do not use a FP-CON which has been dropped onto a hard surface.
z Do not use FP-CON with damaged or dented cases or seals.
2.3 IN THE ASSEMBLY PROCESS - 2
z FP-CON should be mounted after confirmation that hole spacing on PCB board matches the lead pitch
of the FP-CON.
z Avoid excessive force when clinching lead wire during auto-insertion process.
z Avoid excessive shock to FP-CON by automatic insertion machine, during mounting, parts inspection
or centering operations.
2.4 SOLDERING
z Soldering conditions (temperatures, times) should be within the specifi ed conditions which are
described in the catalog or specification sheets.
z In case lead wire reforming is needed due to inappropriate pitch between FP-CON and holes on PCB
board, stress to the FP-CON should be avoided.
z In case soldered capacitor has to be withdrawn from the PCB board by soldering irons, the FP-CON
should be removed after solder has melted sufficiently in order to avoid stress to the FP-CON or lead
wires.
z Soldering iron should never touch the FP-CON body.
2
Page 4
F
P
C
O
N
F
P
C
C
O
O
F
P
N
N
CAUTION FOR PROPER USE OF FP-CON
2.5 FLOW SOLDERING
z Do not dip FP-CON body into melted solder.
z Soldering condition (preheat, soldering temperature, dipping time) should be within the specified
standard which is described in the catalog or specification sheets.
z Other devices which are mounted near FP-CON should not touch the FP-CON.
2.6 REFLOW SOLDERING
z Reflow soldering conditions (preheat, soldering temperature, reflow time) should follow the specified
standard which are described in the catalog or specification sheets.
z Heating standard should depend on surface of the FP-CON color or materials when infrared rays is used
because the
z Standard FP-CON cannot with stand two or more reflow processes. Consult with Cushy when two or
more reflow processes are needed.
2.7 HANDLING AFTER SOLDERING
z Do not bend or twist the FP-CON body after soldering on PCB board.
z Do not pick-up or move PCB board by holding the soldered FP-CON.
z Do not hit the FP-CON and isolate FP-CON from the PCB board or other device when stacking PCB
boards in store.
3、 OARD CLEANING
3.1 The use of ozone depleting cleaning agents are not recommended in the interest of protecting the
environment.
3.2 PCB board can be immersed or ultrasonically cleaned using suitable cleaning solvents for up to 5 minutes
(5L and 7L is up to 3 minutes) and up to 60℃ maximum temperatures.
3.3 Avoid using the following splvent groups unless specifically allowed for in the specification:
z Alkali solvents: could attack and dissolve the aluminum case.
z Petroleum based solvents: deterioration of the rubber seal could result.
z Xylene: deterioration of the rubber seal could result.
z Acetone: removal of the ink markings on the vinyl sleeve could result.
3.4 A thorough drying after cleaning is required to remove residual cleaning solvents which may be trapped
between the FP-CON and the circuit board. Avoid drying temperatures which exceed the maximum rated
temperature of the FP-CON.
3.5 Monitor the contamination levels of the cleaning solvents during use by electrical conductivity, pH, specific
gravity, or water content. Chlorine levels can rise with contamination and adversely affect the performance
of the FP-CON.
3.6 Electrolyte and Separator paper are Flammable.
Electrolyte and separator paper used in FP-CON are flammable. Also, Electrolyte is electrically conductive.
Therefore, in case Electrolyte gets contact with PC board, it may cause corrosion of circuit pattern, or
tracking or short circuit between patterns, and may lead to smoke generation or ignition at the worst cases.
Please make considerations to the above risk in designing circuit patterns and determining the mounting
method and mounting location of FP-CON
3.7 ADHESIVES AND COATING MATERIALS
z Do not use halogenated adhesives and coating materials to fix FP-CON.
z Solvents should be dried up before using adhesives or coating materials. Do not cover up all the
sealing area of FP-CON with adhesives or coating materi als, make coverage only partial.
FP-CON heat absorption depends on the surface color or materials. Check heat condition.
4、 CAUTION DURING USE Of FP-CON IN SETS
z Do not touch the terminals of FP-CON.
z Do not connect electrical terminals of the FP-CON. Keep the FP-CON free from conductive solution,
such as acid, alkali and so on.
z Ensure the operational environment of the equipment in which the FP-CON has been built is within the
specified condition mentioned in the catalog or specification sheets.
3
Page 5
F
P
C
O
N
F
P
C
O
F
P
C
O
N
N
CAUTION FOR PROPER USE OF FP-CON
5、 EMERGENCY ACTION
z If a short circuit occurs and odorous gas is released, either turn off the main power of the equipment
or unplug the power cord from the outlet.
z Do not stand close to the capacitors. In case of eye contact, flush the open eye with large amount of
clean water immediately. In case of ingestion, gargle with water immediately, do not swallow.
z Do not touch electrolyte but wash skin with soap and water in case of skin contact.
6、 STORAGE CONDITION
z FP-CON should not be stored in high temperatures or where there is a high level of humidity. The
suitable storage condition is 5℃-35℃ and less than 75% in relative humidity.
ITEM Before unseal After unseal
Taping product
(SMD)
Bag packing product
(radial type)
Radial taping product
z FP-CON should not be stored in damp conditions such as water, saltwater spray or oil spray.
z Do not store FP-CON in an environment full of hazardous gas (hydrogen sulfide, sulfurous acid gas,
nitrous acid, chlorine gas or ammonia).
z FP-CON should not be stored under exposure to ozone, ultraviolet rays or radiation.
Within 6 months after
delivery
(Unopened condition)
Within 1 year after delivery
(Unopened condition)
Within 6 months after
delivery
(Unopened condition
Within 30 days from opening
(Packaged condition with carrier
tape)
Within 7 days from opening
(1 week)
Within 7 days from opening
(1 week)
7、 DISPOSAL
z FP-CON comprises solid organic compounds, various metals, resin, rubber, etc. Treat it as industrial
waste when disposing of it. In case of disposing a large amount of FP-CON, CUSHY can dispose on
behalf.
For further details
Please refer to: EIAJ RCR-2367 (Technical report published Electronic
Industries Association of Japan in march 1995).
4
Page 6
F
P
C
O
N
F
P
C
P
C
O
O
F
N
N
RULE FOR PROPER USE
■ SERIES CHART
1、Standard Radial
PSB
Standard
105℃
2000Hrs
High
Reliability
Low
Impedance
PSR
Low Impedance
105℃
< 7 mΩ
High Reliability
2、V-Chip Type
Standard
PSH
PVR
105℃
125℃
1000Hrs
2000Hrs
High
Reliability
PVH
High Reliability
125℃
1000Hrs
5
Page 7
R
F
P
C
O
N
F
P
C
O
F
P
C
O
N
N
RULE FOR PROPER USE
■ FREQUENCY COMPENSATION COEFFICIENT
Frequency 120 1K 10K 100K 300K
■ PART NUMBERING SYSTEM
Coefficient 0.05 0.30 0.50 1.00 1.00
2 PS
5M 0808
Case code
Cap tolerance(±20%)
Nominal cap code
Series name
■ DIMENSIONS (mm)
φD+0.5 MAX
Case code 0605 0607
ψD
L 5.2 7.6
6.3 6.3
Rated voltage in volt
F
L+1.5 MAX
0808
8
8
15MIN
0809 0812 1010 1012
8 8 10 10
9 12 10 12
ψd
4MIN
F 2.5 2.5
ψd
0.45 0.45
3.5
0.6
3.5 3.5 5.0 5.0
0.6 0.6 0.6 0.6
6
Page 8
F
P
C
O
N
F
P
C
P
C
O
O
F
N
N
RULE FOR PROPER USE
■ DETAILED TAPING SPECIFICATIONS
Fig.1 Formed Lead — (Code T ) Fig. 2 Straight Lead — (Code TS)